JPH0621250Y2 - 集積回路素子の冷却構造 - Google Patents
集積回路素子の冷却構造Info
- Publication number
- JPH0621250Y2 JPH0621250Y2 JP1988059136U JP5913688U JPH0621250Y2 JP H0621250 Y2 JPH0621250 Y2 JP H0621250Y2 JP 1988059136 U JP1988059136 U JP 1988059136U JP 5913688 U JP5913688 U JP 5913688U JP H0621250 Y2 JPH0621250 Y2 JP H0621250Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling structure
- cooling
- heat
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059136U JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059136U JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01163339U JPH01163339U (enExample) | 1989-11-14 |
| JPH0621250Y2 true JPH0621250Y2 (ja) | 1994-06-01 |
Family
ID=31284922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988059136U Expired - Lifetime JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621250Y2 (enExample) |
-
1988
- 1988-04-30 JP JP1988059136U patent/JPH0621250Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01163339U (enExample) | 1989-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6570764B2 (en) | Low thermal resistance interface for attachment of thermal materials to a processor die | |
| US5812374A (en) | Electrical circuit cooling device | |
| JP3946975B2 (ja) | 冷却装置 | |
| JPH0951187A (ja) | 熱の発散装置及び熱の発散方法 | |
| JPH02398A (ja) | 集積回路の冷却構造 | |
| US20040042178A1 (en) | Heat spreader with surface cavity | |
| EP0882385A1 (en) | Heat conductive device | |
| JPH11354954A (ja) | 電子装置 | |
| WO2014140098A1 (en) | Heat spreader with flat pipe cooling element | |
| US20120085527A1 (en) | Heat spreader with mechanically secured heat coupling element | |
| JPH0621250Y2 (ja) | 集積回路素子の冷却構造 | |
| CN110676238A (zh) | 集成电路封装外壳 | |
| JPH04186752A (ja) | 電子装置におけるヒートシンクの取り外し方法 | |
| JP4140138B2 (ja) | プリント基板の冷却構造 | |
| EP4163963B1 (en) | Heat conduction member, single board, computing device and manufacturing method | |
| JPH08148618A (ja) | 放熱構造 | |
| JPS6127189Y2 (enExample) | ||
| JP2000114435A (ja) | ヒートシンクの熱伝導ラバー体 | |
| JPS6092642A (ja) | 半導体装置の強制冷却装置 | |
| JPH0445249Y2 (enExample) | ||
| JPH0543482Y2 (enExample) | ||
| JPH0617307Y2 (ja) | 集積回路の冷却装置 | |
| JPS59155158A (ja) | 半導体装置の冷却構造 | |
| JPS6175137U (enExample) | ||
| JPS6331402Y2 (enExample) |