JPS6175137U - - Google Patents

Info

Publication number
JPS6175137U
JPS6175137U JP1984159816U JP15981684U JPS6175137U JP S6175137 U JPS6175137 U JP S6175137U JP 1984159816 U JP1984159816 U JP 1984159816U JP 15981684 U JP15981684 U JP 15981684U JP S6175137 U JPS6175137 U JP S6175137U
Authority
JP
Japan
Prior art keywords
module
semiconductor
cooling
module case
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984159816U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984159816U priority Critical patent/JPS6175137U/ja
Publication of JPS6175137U publication Critical patent/JPS6175137U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/877—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1984159816U 1984-10-24 1984-10-24 Pending JPS6175137U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984159816U JPS6175137U (enExample) 1984-10-24 1984-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984159816U JPS6175137U (enExample) 1984-10-24 1984-10-24

Publications (1)

Publication Number Publication Date
JPS6175137U true JPS6175137U (enExample) 1986-05-21

Family

ID=30717762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984159816U Pending JPS6175137U (enExample) 1984-10-24 1984-10-24

Country Status (1)

Country Link
JP (1) JPS6175137U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235357A (ja) * 1990-01-29 1991-10-21 Internatl Business Mach Corp <Ibm> ヒートシンク構造体
JP2012004358A (ja) * 2010-06-17 2012-01-05 Denso Corp 半導体モジュール実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235357A (ja) * 1990-01-29 1991-10-21 Internatl Business Mach Corp <Ibm> ヒートシンク構造体
JP2012004358A (ja) * 2010-06-17 2012-01-05 Denso Corp 半導体モジュール実装構造

Similar Documents

Publication Publication Date Title
JPS6175137U (enExample)
JPS6214700Y2 (enExample)
JPS59155158A (ja) 半導体装置の冷却構造
JPH073675Y2 (ja) 実装電子部品の冷却構造
JPS58175641U (ja) 半導体部品の取付装置
JPH02301159A (ja) 集積回路の冷却構造
JPS6211012Y2 (enExample)
JPS6113946U (ja) 半導体素子の冷却装置
JPS6088559U (ja) 高周波半導体素子
JPS63167796U (enExample)
JPH0543482Y2 (enExample)
JPS62131492U (enExample)
JPH0385652U (enExample)
JPS6249248U (enExample)
JPH02143594A (ja) 集積回路の冷却構造
JPS6280340U (enExample)
JPS61129397U (enExample)
JPS62122392U (enExample)
JPS6364097U (enExample)
JPS5984848U (ja) 高電力部品を含んだ電子回路ユニツトの実装構造
JPS61119396U (enExample)
JPS5944052U (ja) 半導体装置
JPS63182539U (enExample)
JPS6377398U (enExample)
JPS609227U (ja) 放熱体の取着装置