JPH06206158A - Double face polishing and device therefor - Google Patents

Abstract

PURPOSE:To permit the continuous double polishing for a thin plate member by interposing the thin plate member between polishing surface plates formed in spiral form, allowing the thin plate member to rotate and revolve, interposing a polishing agent, and allowing the polishing agent to relatively slide between the polishing surface plates. CONSTITUTION:A polishing surface plate 10 is constituted by attaching a polisher 9 on the double faces of a fin 8 which is formed by shaping a plate member in a spiral form, and a carrier 14 on which a thin plate member 13 such as a semiconductor wafer and a magnetic disc substrate is mounted is introduced between the fins 8 by a feeding jig 12. The carrier 14 is shifted upwardly through the rotation and revolution by the meshing between an internal gear 12 and a sun gear 11 which are revolved by the variable motors 17 and 18. During this shift, the fin 8 is compression-deformed by a pressing jig 16, and in the state where each thin member 13 is applied with a polishing pressure, a polishing agent 9 is supplied, and in the state where the polishing agent 19 is interposed, both the surfaces of the thin member 13 are polished by a polisher 9.

Description

Detailed Description of the Invention

[0001]

[Industrial field of use] The present invention relates to double-side polishing of thin plate materials such as silicon, potassium arsenic, and gadolinium / gallium / garnet wafers and magnetic disk substrates, and more particularly to a double-side polishing method and double-side polishing apparatus suitable for continuous polishing. .

[0002]

2. Description of the Related Art Conventionally, a thin plate material such as a silicon or GaAs wafer, a glass plate, a magnetic disk substrate or the like is ground by a polishing agent between a rotary platen and a workpiece as shown in FIG. Then, each is rotated and slid to polish the processed surface. That is, the work piece 2 is placed on the lower turn table 1 together with the carrier 3, the upper turn table 4 is adjusted to a required polishing pressure (the adjusting device is not shown), and the work piece 2 is placed on the work piece. While supplying between the surface plate and the work piece, the upper and lower surface plate, the center key 6, and the internal key are rotated (rotational drive system is not shown) to move the work piece 2 and the carrier 3 into planetary gears for processing. Both sides of the object 2 are simultaneously polished. In this polishing method, since the work piece is interposed between the upper and lower surface plates, the work piece cannot be inserted or removed during the processing, the rotation of the surface plate is stopped, the upper surface plate is raised, and the upper surface plate is raised. The work piece installed in the hole of the carrier must be removed and the work piece must be loaded. Therefore, it was impossible to continuously grind the work piece, and there was a problem that manual work was required to insert and remove the work piece. It is necessary to take measures to prevent the surface plate from falling.
Furthermore, as the upper surface plate after polishing rises, the work piece is adsorbed to the upper surface plate and falls during the ascent, resulting in damage to the work piece, and it is difficult to remove the work piece adsorbed to the surface plate, thus increasing productivity. There was a very bad problem.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and apparatus for polishing both sides of a thin plate material simultaneously and continuously. Therefore, it is necessary to devise a method of automatically supplying the workpiece between the upper and lower surface plates and automatically discharging the workpiece after polishing for a certain period of time. In addition, it is necessary to set the workpiece supplied between the upper and lower surface plates to a required polishing pressure and polish both sides of the workpiece under the same polishing conditions. Further, it is necessary to provide a means for uniformly supplying the abrasive between the surface plate and the workpiece.

[0004]

In order to achieve the above-mentioned object, the present invention uses fins formed of spiral thin plates instead of the conventional upper and lower surface plates of a disc, and between the fins. The mounted work piece is sandwiched, a polishing pressure is applied by applying pressure from the upper part of the fin, and the work piece is rotated and slid by the method described below to simultaneously polish both surfaces of the work piece. The movement of the work piece is performed by rotating the carrier holding the work piece by the rotationally driven gears installed inside and outside the fin. This carrier is supplied from the bottom of the spiral fin to the space between the fins, and it is moved between the fins from the bottom to the top by the rotational drive of the above-mentioned gear, and the work and the carrier are placed in the work take-out section installed above the fins. And are discharged together. Further, the abrasive is supplied from above the fin, and the fin, the carrier, and the workpiece are filled with the abrasive during polishing, and the abrasive is discharged from below the fin together with the processing waste of the workpiece. This polishing agent is supplied from above the fin during polishing and is discharged from below, and the discharged polishing agent can be used by circulating it from above through the filter.

As described above, the workpiece mounted on the carrier is supplied from below the fins, and is fed between the fins while being rotated and slid by the gear, and both sides of the workpieces are simultaneously and continuously polished, It is discharged to the top of the fin.

[0006]

The operation of the processing apparatus for achieving the magnetic disk substrate of the present invention will be described with reference to FIG. The function of the conventional upper and lower surface plates that polish both sides of a thin plate workpiece is that both sides of the spiral fin are used, the workpiece is interposed between the spiral fins, the workpieces are sequentially fed, and a polisher adhered to the surface of the fin is used. Both sides of the workpiece are polished by sliding relative to each other. The workpiece 13 is intermittently inserted onto the fins from below the fins 8 while being mounted on the carrier 14, and moves upward between the fins while rotating and revolving by the sun gear 11 and the internal gear 12. The work piece and the carrier that are successively carried out to the upper end of the fin are taken out. In the pressing method, when a load 16 is applied to the upper end of the spiral fin 8, the fin is compressed and deformed, and a required polishing pressure is applied to the work piece. The abrasive 19 supplied from the upper part of the fins 8 is interposed between the workpiece and the polisher between the fins, and is discharged downward together with the polishing waste.

As described above, it is possible to continuously grind the workpieces one by one, on both sides.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. The present invention is directed to a carrier 14 having a polishing platen 10 in which a polisher 9 is bonded to both sides of a fin 8 formed by spirally forming a thin plate material, and a workpiece 13 that slides between the fins by a sun gear 11 and an internal gear 12. A support plate 15 for supporting the lower ends of the fins, a pressing jig 16 for applying a polishing pressure from the upper ends of the fins, a sun gear 11, and an internal gear 12.
Variable motors 17 and 18 for rotating the polishing machine A device (not shown) for supplying the polishing material 19 from above the polishing platen Workpiece 13
It is composed of a supply jig 20 for intermittently inserting the carrier 14 on which is mounted from below the fin.

Next, the operation of the present invention will be described. Polisher 9 with adhesive tape is adhered to both front and back surfaces of spiral fin 8, and workpieces 13 mounted in holes of carrier 14 are sequentially and intermittently inserted from below the fin, and sun gear 11 and internal gear are inserted. By the rotation of 12, the spiral polishing platen 10 is moved upward between the platens, the work piece 13 is loaded between the platens, a pressing jig 16 is added, and the fins are compressed and deformed to perform the respective processing. Polishing pressure was applied to the object 13. Next, while supplying the abrasive material 19, the sun gear 11 and the internal gear 12 are rotationally driven at a rotational speed at which the workpiece 13 sequentially slides above the fins, and the abrasive material 19 is interposed on both sides of the workpiece 13. Polished with polisher 9.
By removing the carrier 14 and the workpiece 13 discharged from the upper end of the polishing platen 10, the workpiece was continuously polished.

In this embodiment, an aluminum plate having a thickness of 0.3 mm is spirally wound on a fin having three turns, and a polisher having a thickness of about 1 mm of polyester fiber is bonded to the fin. Board thickness 2m
m, outer diameter φ76 mm, ground aluminum alloy disc with a surface roughness of 0.5 μm RZ, loaded into the hole of the epoxy glass carrier, and inserted sequentially from below the fins, surface pressure 0.1 / cm
Polishing pressure was applied to 2. While supplying the abrasive in which the alumina abrasive particles were dispersed, the sun gear was rotated clockwise at 60 rpm and the internal gear was rotated counterclockwise at 55 rpm to polish both sides of the aluminum alloy disc. By inserting the aluminum alloy disc and the carrier at 20-second intervals from the lower side of the spiral polishing platen, the double-sided polished aluminum alloy discs were successively carried out from the upper side of the polishing platen. The processed surface is scratch-free and has a surface roughness of 0.01 μm.
It was possible to obtain a highly accurate surface of RZ or less.

As described above, by sequentially inserting the workpieces from below the spiral polishing platen, the double-sided polished workpieces can be obtained from above the polishing platen without stopping the processing machine. Since it is processed continuously, the productivity is greatly improved.

In this embodiment, an aluminum plate is used as the spiral polishing platen, but the same effect can be obtained with a plate material that can be formed into a spiral shape, and no polisher is used. It is also possible to polish.

[0013]

According to the present invention, both surfaces of a thin plate material can be polished simultaneously and continuously, so that the productivity is greatly improved. In addition, the automation of inserting and unloading the processed material was easy, which had a great economical effect. further,
Since the working fluid flows downward from above the fins, the polishing debris is also discharged downward, so that a highly accurate machined surface with few machining defects such as scratches was obtained on the surface of the machined workpiece.

[Brief description of drawings]

FIG. 1 is a sectional view of a double-sided polishing apparatus of the present invention.

FIG. 2 is a sectional view of a conventional double-side polishing machine.

[Explanation of symbols]

8 ... Spiral fin, 9 ... Polisher, 10 ... Polishing surface plate, 11 ... Sun gear, 12 ... Internal gear, 13 ...
Work piece, 14 ... Carrier, 15 ... Supporting board, 16 ... Pressing jig, 17 ... Motor, 18 ... Motor, 19 ... Abrasive.

Claims (2)

[Claims] 1. In double-sided polishing of a thin plate material, a work piece is interposed between polishing platens formed in a spiral shape, and the work piece is rotated and revolved by a sun gear and an internal gear, and is polished by an abrasive. A double-sided polishing method characterized by relatively sliding between platens to perform double-sided polishing. 2. A polishing platen formed in a spiral shape, a carrier on which a workpiece that rotates and revolves by the rotational drive of a sun gear and an internal gear is mounted between the platens, and a polishing pressure is applied to the upper end of the polishing platen. A double-sided polishing device comprising a pressure jig, a device for supplying an abrasive from above, and a device for supplying a workpiece from the lower end of a polishing platen.