JPH06196898A - Electronic component mounter with recognition - Google Patents

Abstract

PURPOSE:To provide a mounter which can easily detect an inclination of a mount head with high precision and precisely mount electronic components on a printed board. CONSTITUTION:A control part 7 compares mount head image A at the component recognition station which can be obtained from the component recognition part with mount head image B at the component mount station which can be obtained from the mount head recognition part 9 to determine a displacement of the mount head and stores it into a memory, and the control part 7 corrects the position of an XY table 1 in a direction of correcting the displacement on the basis of data stored in this memory.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine with recognition for recognizing the shape of electronic components and mounting them on a printed wiring board.

[0002]

2. Description of the Related Art In recent years, electric products have been required to be light, thin, short, small, and have a large variety of products in small quantities, and electronic parts have become small and have a fine pitch. Therefore, the mounting density of electronic components on the printed wiring board is high, and the electronic component mounting machine is required to be mounted with high precision.

Conventionally, in this type of electronic component mounting machine with recognition, a predetermined electronic component is mounted on a printed wiring board 2 set on an XY table 1 as shown in FIG. 5, and the mounted electronic component is mounted. The board recognition unit 3 recognizes the component, and the displacement amount of each mounting head 4 with respect to the reference mounting head (ΔX
_h , ΔY _h ) is calculated and stored in a memory, and the position of the XY table 1 is corrected based on the amount of deviation (ΔX _h , ΔY _h ) when components are mounted.

[0004]

In such a conventional electronic component mounting machine with recognition, the mounted components are recognized and the displacement amount (ΔX _h , ΔY) of each mounting head with respect to the reference mounting head is recognized.
_{Since h} ) was calculated, the deviation amount (ΔX _h , ΔY _h ) included the following elements.

Electronic component displacement (X, Y direction and rotational direction) Electronic component mounting displacement (X, Y direction and rotational direction) Vibration of XY table 1 XY table 1 and printed wiring board 2 Therefore, there is a problem that the mounting accuracy is low, not the accurate tilt of the mounting head 4.

An object of the present invention is to provide an electronic component mounting machine capable of easily detecting the inclination of the mounting head 4 with high precision and mounting electronic components on a printed wiring board with high precision.

[0007]

According to a first aspect of the present invention, there is provided an electronic component mounting machine which recognizes the shape of an electronic component sucked by a suction head which sucks an electronic component and a component recognition station which recognizes the mounting head. And a mounting head recognition unit that recognizes the shape of the head at a component mounting station, and obtains the center of the mounting head from the image of the mounting head obtained by the component recognition unit and the mounting head recognition unit,
A control unit is provided which calculates the amount of deviation of the center, stores it as the inclination of the mounting head, and corrects the XY table for moving the printed wiring board when the electronic component is mounted.

According to a second aspect of the present invention, there is provided an electronic component mounting machine, wherein the mounting head recognition section according to the first aspect is a board recognition section for recognizing a mounting surface of a printed wiring board when mounting an electronic component, and an image of a mounting head of a component recognition station. And an optical system for sending the substrate to the board recognition unit.

[0009]

According to the structure of the present invention, the control unit compares the mounting head image at the component recognition station obtained from the component recognition unit with the mounting head image at the component mounting station obtained from the mounting head recognition unit. The amount of displacement of the mounting head is obtained and stored in the memory, and when the component is mounted, the control unit corrects the position of the XY table in the direction of correcting the amount of displacement based on the data stored in this memory.

According to the structure of claim 2, an existing board recognition unit can be used as the component recognition unit.

[0011]

Embodiments of the present invention will be described below with reference to FIGS. It should be noted that components having the same functions as those of the conventional example shown in FIG.

1 to 3 show a first embodiment. As shown in FIG. 1, the mounting head 4 sucks and holds the electronic component 6 supplied by the component supply unit 5, and ten identical mounting heads 4 rotate 36 ° clockwise at regular intervals. Rotate each time (index operation). In addition, each of the 10 divided stations (A to J) is equipped with a mechanism that performs a function that divides the mounting process, and the mounting head 4 arrives at each station (A to J). Is performing the function of. The component recognition unit 4 provided in the station C is an imaging device that recognizes the shape, position, and angle of the electronic component sucked by the mounting head 4 in the station A. At the mounting station F, electronic components 6 are mounted on the printed wiring board 2 fixed on the XY table 1.
Put on.

The control unit 7 obtains the center of the mounting head 4 from the image A of the component recognizing unit 8 and the center of the mounting head 4 from the image B of the mounting head recognizing unit 9, and obtains the X-centers of both obtained centers.
The shift amount in the Y direction is calculated and stored in a memory (not shown),
When mounting the component, the data of the displacement amount is read from the memory, the XY table is moved to correct the displacement amount, and the component is mounted at an accurate position.

Specifically, when the images A and B obtained by recognizing the mounting head by the component recognizing unit 8 and the mounting head recognizing unit 9 are (a) and (b) of FIG. 2 and the mounting head 4 is tilted. ,
The position of the mounting head 4 is different between the image A and the image B. Therefore, the control unit 7 obtains the centers P1 and P2 of the mounting head 4 in the respective images A and B, obtains the deviation amounts (ΔX _h , ΔY _h ) of the centers, and inputs them into the following formula, and the XY table 1 To correct.

The coordinates (X ',
Y ') is expressed as follows. (X ′, Y ′) = (X, Y) + (ΔX _c , ΔY _c ) + (ΔX _p , ΔY _p ) + (ΔX _h , ΔY _h ) However, the coordinates before correction are: (X, Y) Component suction position deviation: (ΔX _c , ΔY _c ) Printed wiring board deviation: (ΔX _p , ΔY _p ) Mounting head 1 inclination: (ΔX _h , ΔY _h ) Since the control unit 7 corrects the XY table 1 by processing the images A and B as described above, the inclination itself of the mounting head 4 can be accurately and promptly obtained, and highly accurate mounting can be realized.

Although the mounting head recognition unit 9 is provided separately from the substrate recognition unit 3 in the above embodiment, the existing substrate recognition unit 3 can be used instead of the mounting head recognition unit 9. As shown in FIG. 4, the mounting head 4 at the component mounting station
As an optical system 10 that guides the image of the
An image equivalent to the image A is obtained by providing a and 10b, and is processed by the control unit 7. The optical element 10b directly below the board recognition unit 3 is X
It is arranged under the XY table 1 so that it is exposed when the Y table 1 is retracted to the origin position to form the optical path 11 shown in FIG. The optical elements 10a and 10b are reflectors,
A prism can be used.

In each of the above embodiments, the centers P1 and P2 in the images A and B are obtained by the control unit 7, but the centers P1 and P2 are respectively obtained in the component recognition unit 8 and the mounting head recognition unit 9.
It is the same even if the XY table 1 is corrected based on this, and in this case, it is considered that a part of the control unit 7 is incorporated in the component recognition unit 8 and the mounting head recognition unit 9. be able to.

[0018]

According to the first aspect of the invention, the component recognizing section for recognizing the shape of the electronic component adsorbed by the adsorption head for adsorbing the electronic component and the mounting head by the component recognizing station and the component mounting station. The mounting head recognition unit that recognizes the shape of the head, the center of the mounting head is obtained from the image of the mounting head obtained by the component recognition unit and the mounting head recognition unit, and the deviation amount of the center is calculated. An image of the mounting head at the component recognition station and an image of the mounting head at the component mounting station are stored because the controller stores the inclination of the mounting head and corrects the XY table for moving the printed wiring board when mounting the electronic component. The position of the XY table can be corrected based on this, and the tilt of the mounting head itself can be accurately and quickly obtained. It is possible to realize the instrumentation installed.

According to the second aspect of the present invention, the mounting head recognition unit sends the board recognition unit for recognizing the mounting surface of the printed wiring board at the time of mounting the electronic component and the image of the mounting head of the component recognition station to the substrate recognition unit. Because it is composed of an optical system,
The existing board recognition unit can be used as a component recognition unit only by adding an optical system.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component mounting machine with recognition of the present invention

FIG. 2 is an explanatory diagram of each station of the embodiment.

FIG. 3 is an explanatory diagram of image processing of the same embodiment.

FIG. 4 is a configuration diagram of a component recognition unit according to another embodiment.

FIG. 5 is a block diagram of a conventional electronic component mounting machine with recognition.

[Explanation of symbols]

 1 XY Table 2 Printed Wiring Board 3 Board Recognition Section 4 Mounting Head 7 Control Section 8 Component Recognition Section 9 Mounting Head Recognition Section P1 Center of Mounting Head in Image A P2 Center of Mounting Head in Image B 10 Optical System

Claims (2)

[Claims] 1. A component recognition unit for recognizing the shape of an electronic component sucked by a suction head for sucking an electronic component and the mounting head at a component recognition station, and mounting for recognizing the shape of the head at a component mounting station. The center of the mounting head is obtained from the images of the mounting head obtained by the head recognizing unit, the component recognizing unit and the mounting head recognizing unit, and the deviation amount of this center is calculated and stored as the inclination of the mounting head. , An electronic component mounting machine with recognition provided with a control unit for correcting an XY table for moving a printed wiring board when mounting an electronic component. 2. A mounting head recognition unit for recognizing a mounting head at a component mounting station, a board recognition unit for recognizing a mounting surface of a printed wiring board at the time of mounting an electronic component, and an image of the mounting head of the component recognition station for the substrate. The electronic component mounting machine with recognition according to claim 1, which is configured by an optical system for sending to the recognition unit.