JP2018037464A - Mounting device, calibration method, and calibration program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To implement a calibration of a mounting operation of a nozzle at high precisely.SOLUTION: In a mounting device (1), a component shape is recognized by rising a component to a recognition height (H1) of a sensor unit (43) by a nozzle (41) and the nozzle is declined to a mounting height (H2) and is mounted to a substrate (W). The mounting device comprises: a lifting mechanism (70) that lifts the sensor unit at a position where the sensor unit can be declined until to the mounting height during calibration; a measurement part (81) that measures a tip position of the nozzle by making the sensor unit recognition a tip shape of the nozzle at the recognition height and the mounting height; and a calculation part (82) that calculates a correction value from a deviation of a horizontal direction of the tip position of the nozzle at the tip position and the mounting height of the nozzle at the recognition height. The mounting device is constructed so that the deviation of the horizontal direction of the nozzle in accordance with the movement to the mounting height from the recognition height is corrected.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a mounting apparatus, a calibration method, and a calibration program for performing nozzle calibration.

  In the mounting device, after the component lifted by the nozzle is recognized by the sensor unit or the like, the component is mounted on the substrate by lowering the nozzle from the recognition height of the sensor unit to the mounting height on the substrate. . However, the nozzle shaft of the mounting apparatus has a deviation in the mounting position of components due to a problem of processing accuracy or assembly accuracy. For this reason, in the mounting apparatus, calibration is performed before actual production of the substrate is started in order to correct a deviation caused by bending of the nozzle shaft or the like (see, for example, Patent Document 1).

Japanese Patent Laying-Open No. 2015-002230

  By the way, in normal calibration, a component is actually mounted on a substrate, and the component mounting position correction value is determined by imaging the component on the substrate from above. However, in this calibration, the correction value is secondarily determined from the captured image of the component on the board, and many measurement errors such as variations in the component outer shape are included.

  SUMMARY An advantage of some aspects of the invention is that it provides a mounting apparatus, a calibration method, and a calibration program capable of accurately performing calibration of nozzle mounting operation.

  A mounting apparatus according to one aspect of the present invention is a mounting apparatus that lifts and recognizes a component to a recognition height of a sensor unit by a nozzle, lowers the nozzle to a mounting height, and mounts the board on a substrate. An elevating mechanism that elevates and lowers the sensor unit at a position where the sensor unit can be lowered; and a measurement unit that causes the sensor unit to recognize the tip shape of the nozzle at the recognition height and the mounting height, and to measure the tip position of the nozzle; A calculation unit that calculates a correction value from a horizontal shift between the nozzle tip position at the recognition height and the nozzle tip position at the mounting height, and the mounting height from the recognition height. The horizontal displacement of the nozzle accompanying the movement to is corrected.

  A calibration method according to an aspect of the present invention is a calibration method for a mounting apparatus in which a component is lifted and recognized to a recognition height of a sensor unit by a nozzle, and the nozzle is lowered to a mounting height and mounted on a substrate. Measuring the tip position of the nozzle by causing the sensor unit to recognize the tip shape of the nozzle at the recognition height at a position that can be lowered to a height position, and the sensor at a position that can be lowered to a mounting height position. Lowering the unit to the mounting height, causing the sensor unit to recognize the tip shape of the nozzle and measuring the tip position of the nozzle, and the tip position of the nozzle at the recognized height and the mounting height A correction value is calculated from a horizontal deviation from the tip position of the nozzle at a position, and the movement from the recognition height to the mounting height And correcting the misalignment of the nozzle with.

  According to these configurations, the tip position of the nozzle is directly measured at the recognition height by the sensor unit for component recognition, and the tip position of the nozzle is directly measured at the mounting height corresponding to the upper surface of the substrate. For this reason, the measurement error of the nozzle tip position at the recognition height and the mounting height is reduced, and the correction value is accurately calculated from the horizontal displacement of the nozzle when the nozzle descends from the recognition height to the mounting height. The Thus, by using the sensor unit, calibration can be performed with high accuracy with a simple configuration.

  In the mounting apparatus described above, the sensor unit is arranged such that an irradiation unit that emits light and a recognition unit that recognizes a component are opposed to each other in the horizontal direction. According to this configuration, it is possible to measure the tip position of the nozzle on the recognition reference plane and the upper surface of the substrate.

  In the mounting apparatus described above, the components are classified into categories for each height dimension, and the elevating mechanism varies the recognition height of the sensor unit according to the category of the components mounted on the board. According to this configuration, it is possible to improve the production efficiency of the substrate by minimizing the nozzle stroke during actual production by appropriately adjusting the recognition height of the sensor unit in accordance with the height dimension of the component. it can.

  In the mounting apparatus, the nozzle is a nozzle for actual production. According to this configuration, since the nozzle for actual production is used for calibration, the nozzle is not exchanged, and the displacement due to the attachment / detachment of the nozzle can be eliminated. In particular, since the microchip component is strongly affected even by a slight shift caused by the attachment / detachment of the nozzle, the actual production nozzle is effective for calibration when mounting the microchip component.

  In the mounting apparatus, the nozzle is a calibration jig nozzle. According to this configuration, by using the calibration jig nozzle, it is possible to calculate an average deviation of the tip positions of a plurality of types of nozzles. Therefore, it is not necessary to perform calibration for each nozzle, and work efficiency can be improved.

  In the mounting apparatus, the calculation unit calculates a correction value from a horizontal shift in a horizontal direction of the tip position of the nozzle in a state where the nozzle is horizontally moved to the mounting area. The horizontal displacement of the nozzle accompanying the movement to the mounting height and the horizontal movement to the mounting area is corrected. According to this configuration, the horizontal displacement of the nozzle can be accurately corrected based on the dynamic displacement considering the inertial force when the nozzle is mounted and operated.

  In the mounting apparatus, the mounting area includes a substrate imaging unit that images a reference mark on the substrate from above, and a backup pin that supports the substrate from below is provided in the mounting area. A reference mark is attached, and in a state where there is no substrate in the mounting area, the measurement unit causes the sensor unit to recognize the pin shape of the backup pin and measure the position of the backup pin, and the substrate imaging unit By imaging the reference mark of the backup pin, the coordinate system set for the sensor unit is associated with the coordinate system set for the substrate based on the reference mark. According to this configuration, the coordinate system set on the sensor unit is associated with the coordinate system set on the substrate, and the horizontal deviation of the nozzle tip position measured by the sensor unit is set on the substrate based on the reference mark. It is converted into the shift of the coordinate system.

  In the mounting apparatus described above, calibration is automatically performed during production stoppage. According to this configuration, since the nozzle is automatically corrected during a non-operating time such as during maintenance, the burden of calibration work by the operator can be reduced.

  A calibration program according to one aspect of the present invention is a calibration program for a mounting apparatus in which a component is lifted and recognized by a nozzle to a recognition height of a sensor unit, and the nozzle is lowered to a mounting height and mounted on a board. Measuring the tip position of the nozzle by causing the sensor unit to recognize the tip shape of the nozzle at a position where the sensor unit can be lowered to a height; and mounting the sensor unit at a position where the sensor unit can be lowered to a mounting height. Lowering the height, causing the sensor unit to recognize the tip shape of the nozzle and measuring the tip position of the nozzle, and the tip position of the nozzle at the recognized height and the nozzle at the mounting height Calculating a correction value from a horizontal deviation from the tip position of the mounting device, and And correcting the misalignment of the nozzle caused by the movement to the mounting height from. According to this configuration, a simple and accurate calibration function can be added to the mounting apparatus by installing the program in the mounting apparatus.

  According to the present invention, the nozzle tip position at the recognition height and the nozzle tip position at the mounting height are directly measured by the sensor unit, so that the mounting operation of the nozzle is easily and accurately calibrated. can do.

It is a schematic diagram which shows the whole mounting apparatus of this Embodiment. It is explanatory drawing of the calibration of a comparative example. It is a perspective view of the mounting head of this Embodiment. It is a perspective view of the mounting head which removed the head main body of this Embodiment. It is a perspective view of the sensor unit of this Embodiment. It is a control block diagram of the mounting apparatus of this Embodiment. It is a figure which shows the positional relationship of the recognition height of this Embodiment, and a nozzle. It is a flowchart which shows the calibration method of this Embodiment. It is explanatory drawing of the dynamic calibration of this Embodiment.

  Hereinafter, the mounting apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the entire mounting apparatus of the present embodiment. FIG. 2 is an explanatory diagram of the calibration of the comparative example. In addition, the mounting apparatus of this Embodiment is only an example, and can be changed suitably.

  As shown in FIG. 1, the mounting apparatus 1 is configured to mount various components supplied by the feeder 10 at predetermined positions on the substrate W by the mounting head 40. A substrate transport unit 21 that transports the substrate W in the X-axis direction is disposed substantially at the center of the base 20 of the mounting apparatus 1. The substrate transport unit 21 carries the substrate W before component mounting from one end side in the X-axis direction to the lower side of the mounting head 40 and positions the substrate W after component mounting from the other end side in the X-axis direction outside the apparatus. I am carrying it out. On the base 20, a large number of feeders 10 are arranged side by side in the X-axis direction on both sides of the substrate transport unit 21.

  A tape reel 11 is detachably mounted on the feeder 10, and a carrier tape in which various components are packaged is wound around the tape reel 11. Each feeder 10 feeds out components in order toward a delivery position picked up by the mounting head 40 by rotation of a sprocket wheel provided in the apparatus. At the delivery position of the mounting head 40, the cover tape on the surface is peeled from the carrier tape, and the components in the pocket of the carrier tape are exposed to the outside. The components are not particularly limited to electronic components as long as they can be mounted on the substrate W.

  A horizontal movement mechanism 30 that horizontally moves the mounting head 40 in the X-axis direction and the Y-axis direction is provided on the base 20. The horizontal movement mechanism 30 has a pair of Y-axis drive units 31 extending in the Y-axis direction and an X-axis drive unit 32 extending in the X-axis direction. The pair of Y-axis drive units 31 are supported by support units (not shown) erected at the four corners of the base 20, and the X-axis drive unit 32 is movable in the Y-axis direction by the pair of Y-axis drive units 31. is set up. A mounting head 40 is installed on the X-axis drive unit 32 so as to be movable in the X-axis direction. The mounting head 40 is connected to the feeder 10 and the substrate W by the X-axis drive unit 32 and the Y-axis drive unit 31. Is reciprocated between.

  The mounting head 40 is provided with a plurality of nozzles 41 for simultaneously sucking a plurality of components from the side-by-side feeder 10. The mounting head 40 is provided with a height sensor 42 that detects the height from the substrate W, and a sensor unit 43 (see FIG. 3) that recognizes the suction state of the component by the nozzle 41. The height sensor 42 detects the height from the substrate W to the nozzle 41 and controls the amount of movement of the nozzle 41 in the vertical direction. In the sensor unit 43, the suction state of the component is recognized by light (LED light, laser light) irradiated from the horizontal direction on the component, and the suction position and suction direction of the nozzle 41 are corrected.

  Further, the mounting head 40 is provided with a substrate imaging unit 44 that images a BOC mark as a reference mark on the substrate W from directly above, and a nozzle imaging unit 45 that images a component mounting operation by the nozzle 41 from an obliquely upward direction. It has been. The substrate imaging unit 44 sets a coordinate system for the substrate W based on the captured image of the BOC mark, and recognizes the position and warpage of the substrate W. The nozzle imaging unit 45 images before and after the component is attracted to the feeder 10 and also images before and after the component is mounted on the mounting surface of the substrate W, and whether or not the component is attracted by the nozzle 41 and whether or not the component is mounted on the substrate W. Is inspected.

  On the base 20 of the mounting apparatus 1, an automatic changer (ATC: Automatic Tool Changer) 13 having a nozzle 41 for each type of component is provided. In addition to the nozzle 41 used in actual production, a jig nozzle (not shown) that can be used for calibration is prepared in the automatic changer 13. The jig nozzle has a rigid tip and is formed with higher accuracy than the nozzle 41 for actual production. By moving the mounting head 40 to the automatic changer 13, it is possible to remove the nozzle 41 being mounted and replace it with another nozzle 41. Details of the mounting head 40 and calibration will be described later.

  In addition, the mounting apparatus 1 is provided with a control unit 80 that performs overall control of each part of the apparatus. The control unit 80 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. In addition to the control program for the entire mounting apparatus 1, the memory stores a calibration program for causing the mounting apparatus 1 to execute a calibration method described later. In the mounting apparatus 1 configured in this manner, the nozzle mounting operation is calibrated before actual production of mounting components on the substrate W.

  By the way, as shown in the comparative example of FIG. 2A, the nozzle shaft is bent due to the processing accuracy, so that the mounting position of the component P is displaced while the nozzle 90 moves up and down. In this case, in order to detect the mounting position (XY coordinate) at the mounting height of the component P, the component P is actually mounted on an inspection board (not shown), and the mounting position of the component P is imaged from above. Thus, calibration is performed. However, in this calibration, a board for inspection and a component P must be prepared and a mounting operation must be performed, and the substrate and the component P after calibration are wasted.

  On the other hand, as shown in another comparative example in FIG. 2B, the component P sucked by the nozzle 90 is positioned at the mounting height at a position away from the substrate W, and calibration is performed by imaging the component P from below. A way to do this is also possible. However, in order to image the component P positioned at the mounting height by the nozzle 90 from below, the imaging device 91 must be arranged at a low position to ensure a sufficient focal length. As described above, although the mounting position of the component P can be detected by the mounting height by the imaging device 91, there is a problem that the configuration of the mounting device becomes complicated due to the restriction of the arrangement height of the imaging device 91.

  Therefore, in the mounting apparatus 1 of the present embodiment, calibration is performed using the sensor unit 43. In this case, the sensor unit 43 can be moved up and down, the tip position of the nozzle 41 positioned at the recognition height and the mounting height is directly measured, and the tip of the nozzle 41 is lowered from the recognition height to the mounting height. A horizontal shift is detected. Thereby, it is not necessary to prepare a substrate for inspection and a part P at the time of calibration, and the apparatus configuration is not complicated due to restrictions on the focal length.

  Hereinafter, the configuration of the mounting head according to the present embodiment will be described with reference to FIGS. FIG. 3 is a perspective view of the mounting head of the present embodiment. FIG. 4 is a perspective view of the mounting head from which the head body of the present embodiment is removed. FIG. 5 is a perspective view of the sensor unit of the present embodiment.

  As shown in FIGS. 3 and 4, the mounting head 40 is slidably installed on a rail-shaped X-axis drive unit 32 via a base 51, and a head main body 52 and a sensor unit 43 are attached to the front surface of the base 51. It is configured. The head main body 52 is provided with a plurality of nozzles 41 (see FIG. 1) arranged in a horizontal row. A Z-axis motor 53 and a θ motor (not shown) are connected to each nozzle 41. The nozzle 41 is moved up and down by the Z-axis motor 53, and the nozzle 41 is rotated around the axis by the θ motor. The head main body 52 is formed with a pipe line and a joint that connect each nozzle 41 to a suction source.

  The sensor unit 43 is attached to the front surface of the base 51 via an elevating mechanism 70 so as to be able to elevate and supports the irradiation unit 57 and the recognition unit 58 at a lower part of a support member 56 connected to the elevating mechanism 70. . The irradiation unit 57 and the recognition unit 58 face each other in the horizontal direction, and light (LED light, laser light, etc.) is irradiated from the irradiation unit 57. In the irradiation unit 57, LEDs are arranged along one horizontal direction (X direction). In addition, a camera is disposed in the recognition unit 58, and an image is taken and the image is analyzed to recognize the shape of the part as the measurement target, the shape of the nozzle 41, and the like. As the sensor unit 43 is moved up and down by the lifting mechanism 70, the recognition height of the sensor unit 43 is varied. In actual production, a part lifted by the nozzle 41 is recognized by the sensor unit 43, and at the time of calibration, the tip shape of the nozzle 41 is recognized by the sensor unit 43.

  As shown in FIGS. 4 and 5, the support member 56 includes a front plate 61 that supports the irradiation unit 57 on the front side of the base 51 and a rear plate 62 that supports the recognition unit 58 on the rear side of the base 51. They are connected by side plates 63 at both ends. A diffuser 64 for suppressing light reflection is attached to the lower surfaces of the front plate 61 and the rear plate 62. An opening 65 into which the nozzle 41 enters is formed between the front plate 61 and the rear plate 62, and a circular hole 66 through which the nozzle 41 is inserted is formed in the diffuser 64 exposed from the opening 65. A connection base 67 is provided on the upper surface of the rear plate 62 via a pair of pillars, and the sensor unit 43 is connected to the lifting mechanism 70 on the front surface of the base 51 via the connection base 67.

  A nut portion 68 that is screwed into the ball screw 73 of the elevating mechanism 70 is formed at the center of the coupling base 67. The left and right sides of the connection base 67 are connected to the front surface of the base 51 via a pair of return springs 75, and the sensor unit 43 is supported via the connection base 67 by the spring force of the return springs 75. The pair of left and right side plates 63 are provided with rails 69 extending upward, and each rail 69 is sandwiched between a pair of guides 76 fixed to the front surface of the base 51. Each rail 69 slides while being sandwiched between the pair of guides 76, whereby the sensor unit 43 is guided up and down by the pair of guides 76.

  A ball screw 73 is connected to a drive motor 71 (servo motor) of the elevating mechanism 70 via a coupling 72, and the elevating mechanism 70 is connected to the sensor unit 43 by screwing the ball screw 73 into the nut portion 68. ing. In the elevating mechanism 70, the ball screw 73 is rotated by the drive motor 71, so that the sensor unit 43 is lowered along the pair of guides 76 against the spring force of the return spring 75. Further, in the lifting mechanism 70, the sensor unit 43 is lifted along the pair of guides 76 by reversely rotating the ball screw 73 by the drive motor 71. When the sensor unit 43 is moved up and down, the return spring 75 suppresses fine vibration during movement of the sensor unit 43.

  When the drive motor 71 is driven, the sensor unit 43 must be lowered against the spring force of the return spring 75, so that power consumption during driving of the drive motor 71 increases. However, the sensor unit 43 is only moved temporarily during calibration, and the sensor unit 43 is normally stopped at a certain height. In order to keep the sensor unit 43 from stopping so as not to drop, it is necessary to supply power to the drive motor 71. However, since the sensor unit 43 is supported by the pair of return springs 75, power consumption is reduced. Therefore, the power consumption of the drive motor 71 is reduced as a whole.

  Further, in the normal mode, the mounting head 40 has a movement range limited by software control, and is not moved to a place where there is a projection such as a tray. However, since the mounting head 40 (see FIG. 3) can be manually moved during an emergency stop, if the mounting head 40 lowered to a low position is moved horizontally, the sensor unit 43 may collide with an obstacle. For this reason, the elevating mechanism 70 raises the sensor unit 43 when the mounting head 40 is in an emergency stop so as to suppress interference with an obstacle. In this case, the drive of the drive motor 71 is stopped and the power of the drive motor 71 is lost, so that the sensor unit 43 is pulled up by the spring force of the return spring 75.

  The control configuration of the mounting apparatus will be described with reference to FIGS. FIG. 6 is a control block diagram of the mounting apparatus according to the present embodiment. FIG. 7 is a diagram illustrating the positional relationship between the recognition height and the nozzles according to the present embodiment. Note that the control block diagram of the mounting apparatus shown in FIG. 6 is simplified to explain the present invention, and it is assumed that the mounting apparatus normally includes a configuration.

  As shown in FIGS. 6A and 6B, the mounting apparatus 1 recognizes the component by lifting the component to the recognition height H1 of the sensor unit 43 by the nozzle 41, and lowers the nozzle 41 to the mounting height H2. It is configured to be implemented. This mounting apparatus 1 raises and lowers the sensor unit 43 by the elevating mechanism 70 at a position where the board W does not exist, that is, a position where the board W can be lowered to the mounting height before actual production of mounting components on the board W. Calibration is performed by causing the sensor unit 43 to measure the tip position of the nozzle 41 at H1 and the mounting height H2. The control unit 80 of the mounting apparatus 1 is provided with a measurement unit 81, a calculation unit 82, and a correction unit 83 as a configuration for realizing calibration.

  The measurement unit 81 measures the tip position of the nozzle 41 by causing the sensor unit 43 to recognize the tip shape of the nozzle 41 at the recognition height H1 and the mounting height H2. In this case, the light (visible light (LED light), laser light) of the irradiation unit 57 of the sensor unit 43 is positioned at the recognition height H1 and the mounting height H2 by the lifting mechanism 70, and the recognition height H1 by the irradiated light. In addition, a substrate reference surface is virtually formed at a recognition reference surface and a mounting height H2. And the tip shape of the nozzle 41 at the recognition height H1 and the mounting height H2 is recognized by lowering the tip of the nozzle 41 with respect to the virtual recognition reference plane and the upper surface of the substrate.

  The measuring unit 81 measures the tip position of the nozzle 41 based on the tip shape of the nozzle 41 at the recognition height H1, and measures the tip position of the nozzle 41 based on the tip shape of the nozzle 41 at the mounting height H2. . In the present embodiment, the rotation center (XY coordinate) is measured as the tip position of the nozzle 41. However, if the tip position of the nozzle 41 is a position where the tip of the nozzle 41 can be specified in the horizontal plane, the rotation of the nozzle 41 is performed. It is not limited to the center. In this way, by virtually creating the upper surface of the substrate by the irradiated light at the position where the substrate W does not exist, it is possible to directly measure the tip position of the nozzle 41 at the mounting height H2. .

  The calculation unit 82 calculates a correction value from a horizontal shift between the tip position of the nozzle 41 at the recognition height H1 and the tip position of the nozzle 41 at the mounting height H2. In this case, the nozzle 41 is moved from the recognition height H1 to the mounting height H2 by subtracting the XY coordinate of the tip position of the nozzle 41 at the recognition height H1 from the XY coordinate of the nozzle 41 at the mounting height H2. The displacement of the nozzle 41 when lowered is obtained as a correction value. The correction unit 83 moves the horizontal position of the nozzle 41 at the recognition height H1 by the amount of the XY coordinate shift, thereby shifting the horizontal displacement of the nozzle 41 accompanying the movement from the recognition height H1 to the mounting height H2. to correct.

  The calibration may be performed using a calibration jig nozzle (not shown), or may be performed using a nozzle 41 for actual production. By performing calibration using the jig nozzle, it is possible to calculate the average deviation of the tip positions of the plurality of types of nozzles 41 and to correct the deviation of the nozzles 41 in the horizontal direction. Therefore, it is not necessary to perform calibration for each of the plurality of types of nozzles 41, and work efficiency can be improved. However, when the jig nozzle is used, the replacement work of the nozzle 41 occurs, so that there is a possibility that a deviation due to the attachment / detachment of the nozzle 41 occurs.

  In this regard, by performing calibration using the nozzle 41 for actual production, the replacement work of the nozzle 41 does not occur, and the deviation due to the attachment / detachment of the nozzle 41 or the like can be eliminated. In particular, since the microchip component is strongly affected even by a slight deviation due to the attachment / detachment of the nozzle 41, the nozzle 41 for actual production is effective for calibration when mounting the microchip component. Further, calibration may be automatically performed during production stop. As a result, the nozzle 41 is automatically corrected during a non-operating time such as during maintenance, so that the burden of calibration work by the operator can be reduced.

  Further, since the sensor unit 43 is lowered to the mounting height H2 at the time of calibration, the sensor unit 43 may collide with the substrate W and other apparatus parts unless attention is paid to the lowered position of the sensor unit 43. For this reason, the execution authority may be set for the calibration, and only the operator who is given the execution authority may perform the calibration. In this case, the lowering of the sensor unit 43 is normally restricted by a stopper (not shown), and the restriction of the sensor unit 43 is released only when an operator with the execution authority performs calibration.

  Further, as shown in FIG. 7, the parts P are categorized for each height dimension, and the recognition height corresponding to the category of the parts P is obtained by raising and lowering the sensor unit 43 by the elevating mechanism 70 (see FIG. 5). The height H1 is variable. For example, the part Pa-Pc having a small height dimension and the part Pd-Pf having a large height dimension are categorized, and the recognition height H1 of the sensor unit 43 is varied between the part Pa-Pc and the part Pd-Pf. ing. Thus, the recognition height H1 of the sensor unit 43 is varied for each category of the component P, so that the sensor unit 43 is brought close to the substrate W at a height that does not interfere with the component P or the like.

  When the component Pa-Pc is mounted, the recognition height H1 of the sensor unit 43 is adjusted so that it is lower than the height of the component Pd-Pf and does not interfere with the component Pa-Pc. When the component Pd-Pf is mounted, the recognition height H1 of the sensor unit 43 is adjusted to be high so as not to interfere with the component Pd-Pf. It is not necessary to keep the recognition height H1 of the component Pa-Pc having a small height away from the substrate W in accordance with the component Pd-Pf having a large height. For this reason, the stroke of the nozzle 41 when mounting the component P having a small height can be shortened, and the tact time required for the mounting operation is shortened.

  A calibration method by the mounting apparatus will be described with reference to FIG. FIG. 8 is a flowchart showing the calibration method of the present embodiment. The calibration method shown below is an example, and can be changed as appropriate. Further, it is assumed that no substrate is carried into the mounting apparatus. In addition, here, for convenience of explanation, description will be made using the reference numerals in FIG. 6 as appropriate.

  As shown in FIG. 8, when calibration is performed, the mounting head 40 (see FIG. 1) is moved directly above the pair of rails of the substrate transport unit 21 (step S01). The substrate W is not transported between the pair of rails of the substrate transport unit 21 and does not collide with the substrate W even if the sensor unit 43 is lowered to the mounting height H2. Next, the recognition height H1 of the sensor unit 43 is set according to the components mounted on the substrate W in actual production (step S02). In this case, the recognition height H1 corresponding to the category of the height dimension of the part is selected from a plurality of (for example, four) recognition heights prepared in advance.

  Next, the tip shape of the nozzle 41 is recognized by the sensor unit 43 by positioning the tip of the nozzle 41 at the recognition height H1 of the sensor unit 43 (step S03). In this case, the light from the illumination unit 57 of the sensor unit 43 is blocked by the tip of the nozzle 41, and the tip of the nozzle 41 is recognized when the nozzle 41 rotates once around the axis at the recognition height H1. Next, based on the recognition result of the tip shape of the nozzle 41, the rotation center of the nozzle 41 is measured as the tip position of the nozzle 41 at the recognition height H1 (step S04).

  Next, the sensor unit 43 is lowered to the mounting height H2 by the lifting mechanism 70, and the tip of the nozzle 41 is positioned at the mounting height H2, so that the tip shape of the nozzle 41 is recognized by the sensor unit 43 (step). S05). In this case, the light from the light projecting portion 57 of the sensor unit 43 is blocked by the tip of the nozzle 41, and the tip shape of the nozzle 41 is recognized by the nozzle 41 rotating once around the axis at the mounting height H2. Next, based on the recognition result of the tip shape of the nozzle 41, the rotation center of the nozzle 41 is measured as the tip position of the nozzle 41 at the mounting height H2 (step S06).

  Next, a correction value is calculated from a horizontal deviation between the tip position of the nozzle 41 at the recognition height H1 and the tip position of the nozzle 41 at the mounting height H2 (step S07). Thereby, the correction value in the horizontal direction when the nozzle 41 is lowered from the recognition height H1 to the mounting height H2 is obtained. Then, the movement of the nozzle 41 from the recognized height H1 to the mounting height H2 is corrected based on the correction value during actual production (step S08). In this way, the mounting operation of the nozzle 41 can be accurately calibrated by virtually creating the upper surface of the substrate with light at the position where the substrate W does not exist.

  By the way, in the static calibration described above, the inertial force acting during the mounting operation of the mounting head (nozzle) is not taken into consideration. Since the mounting head is heavy, the nozzle and the nozzle shaft are inclined when the mounting head moves at high speed in the horizontal direction. Therefore, in the present embodiment, dynamic calibration may be performed in consideration of the inertial force acting on the nozzle. FIG. 9 is an explanatory diagram of the dynamic calibration of the present embodiment.

  As shown in FIG. 9A, in the dynamic calibration, the tip position of the nozzle 41 having the recognition height H1 and the tip position of the nozzle 41 having the mounting height H2 are measured while the mounting head 40 is horizontally moved to the mounting area. Deviation is required. That is, as in the actual mounting operation, the nozzle 41 is moved from the recognition area to the mounting area, and the horizontal displacement of the tip of the nozzle 41 when the nozzle 41 is lowered from the recognition height H1 to the mounting height H2. From this, a correction value is calculated. Based on the correction value considering the inertial force, the horizontal displacement of the nozzle 41 accompanying the movement from the recognized height H1 to the mounting height H2 and the horizontal movement to the mounting area is corrected.

  As shown in FIG. 9B, the horizontal displacement of the nozzle 41 is obtained by the coordinate system set by the sensor unit 43, and the horizontal displacement of the nozzle 41 cannot be specified on the actual substrate W. . For this reason, by attaching a reference mark M similar to the BOC mark to the upper end surface of the backup pin 15 that supports the substrate W from below in the mounting area, the coordinate system set by the sensor unit 43 via the backup pin 15 and the substrate W Is associated with the coordinate system set to. In this case, the sensor unit 43 is caused to recognize the shape of the backup pin 15 in a state where the substrate W is not present in the mounting area, and the substrate imaging unit 44 (see FIG. 1) is caused to image the reference mark M of the backup pin 15.

  Then, by measuring the position of the backup pin 15 from the pin shape of the backup pin 15 and measuring the position of the backup pin 15 from the captured image of the reference mark M, the coordinate system set in the sensor unit unit 43 and the substrate W are measured. The set coordinate system is related. In this way, the horizontal deviation of the tip position of the nozzle 41 measured by the sensor unit 43 is converted into a coordinate system deviation set on the substrate W based on the reference mark M. Then, by correcting the dynamic displacement of the nozzle 41 in the coordinate system set on the substrate W, it is possible to perform more accurate calibration.

  As described above, in the mounting apparatus 1 of the present embodiment, the tip position of the nozzle 41 is directly measured at the recognition height H1 by the sensor unit 43 for component recognition, and the mounting height corresponding to the upper surface of the board. The tip position of the nozzle 41 is directly measured at H2. Therefore, the measurement error of the tip position of the nozzle 41 at the recognition height H1 and the mounting height H2 is reduced, and the horizontal displacement of the nozzle 41 when the nozzle 41 is lowered from the recognition height H1 to the mounting height H2. The correction value is calculated with high accuracy. In this way, by using the sensor unit 43, calibration can be performed with a simple configuration and high accuracy. In addition, it is not necessary to prepare a calibration board or component P, and the apparatus configuration is not complicated due to restrictions on the focal length of the imaging apparatus or the like.

  In the present embodiment, the elevating mechanism 70 is configured by a ball screw type moving mechanism, but is not limited to this configuration. The lifting mechanism only needs to be able to position the sensor unit at the recognition height and the mounting height. For example, the lifting mechanism may be configured by a linear motor type moving mechanism or a rack and pinion type moving mechanism.

  Moreover, in this Embodiment, it was set as the structure by which the front-end | tip position of the nozzle 41 is measured by the sensor unit 43 in the state in which the nozzle 41 is not adsorb | sucking components, However, It is not limited to this structure. The tip position of the nozzle 41 may be measured in a state where the component is attracted to the nozzle 41.

  In the present embodiment, the recognition height H1 of the sensor unit 43 is variable. However, the present invention is not limited to this configuration. The recognition height H1 of the sensor unit 43 may be fixed.

  Moreover, in this Embodiment, the board | substrate W should just be what can mount various components, and is not limited to a printed circuit board, The flexible board mounted on the jig | tool board | substrate may be sufficient.

  In the present embodiment, the calibration is performed before the substrate W is carried into the mounting apparatus 1. However, the present invention is not limited to this configuration. Calibration may be performed at a position avoiding the substrate W in a state where the substrate W is carried into the mounting apparatus 1.

  In the present embodiment, the calibration program may be stored in a storage medium. The recording medium is not particularly limited, but may be a non-transitory recording medium such as an optical disk, a magneto-optical disk, or a flash memory.

  Moreover, although embodiment and modification of this invention were demonstrated, what combined the said embodiment and modification as the other embodiment of this invention entirely or partially may be sufficient.

  The embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

In the present embodiment, the configuration in which the present invention is applied to a mounting apparatus has been described. However, the present invention can be applied to an apparatus that performs nozzle calibration.
Further, the position where the substrate can be lowered to the mounting height in the present embodiment includes a position where the substrate is not present in the substrate transport unit 21, and the position where the nozzle 41 can be lowered without colliding with the mounting height on the mounting device. It is.

  Furthermore, in the above-described embodiment, the mounting device 1 is configured to recognize the component P by lifting the nozzle 41 to the recognition height H1 of the sensor unit 43, and lowering the nozzle 41 to the mounting height H2 and mounting it on the substrate W. The elevation mechanism 70 that raises and lowers the sensor unit 43 at the position where the substrate W does not exist at the time of measurement, and the sensor unit 43 recognizes the tip shape of the nozzle 41 at the recognition height H1 and the mounting height H2, and measures the tip position of the nozzle 41 And a calculating unit 82 that calculates a correction value from a horizontal displacement between the tip position of the nozzle 41 at the recognition height H1 and the tip position of the nozzle 41 at the mounting height H2. The horizontal displacement of the nozzle 41 accompanying the movement from the height H1 to the mounting height H2 is corrected. According to this configuration, the tip position of the nozzle at the recognition height H1 and the tip position of the nozzle 41 at the mounting height H2 are directly measured by the sensor unit 43, so that the mounting operation of the nozzle 41 is simple and accurate. Can be calibrated.

  As described above, the present invention has an effect that calibration of the mounting operation of the nozzle can be performed with high accuracy. In particular, the mounting apparatus, the calibration method, and the calibration for mounting a large number of electronic components on the substrate. This is useful for a training program.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 15 Backup pin 40 Mounting head 41 Nozzle 43 Sensor unit 44 Board | substrate imaging part 57 Irradiation part 58 Recognition part 70 Lifting mechanism 81 Measuring part 82 Calculation part 83 Correction | amendment part M Reference mark P Component W Board | substrate

Claims (10)

A mounting device that recognizes the component by lifting the component to the recognition height of the sensor unit with the nozzle, lowers the nozzle to the mounting height, and mounts it on the board,
An elevating mechanism that elevates and lowers the sensor unit at a position where it can be lowered to the mounting height during calibration;
A measurement unit that causes the sensor unit to recognize the tip shape of the nozzle at the recognition height and the mounting height, and measures the tip position of the nozzle;
A calculation unit that calculates a correction value from a horizontal shift between the nozzle tip position at the recognition height and the nozzle tip position at the mounting height;
A mounting apparatus that corrects a horizontal displacement of the nozzle accompanying a movement from the recognized height to the mounting height. The sensor unit has an irradiation unit that emits light and a recognition unit that recognizes a component facing each other in a horizontal direction,
The mounting apparatus according to claim 1, wherein the irradiated light is positioned at the recognition height and the mounting height. Parts are categorized by height dimension,
The mounting apparatus according to claim 1, wherein the elevating mechanism varies a recognition height of the sensor unit according to a category of components mounted on the board.   The mounting apparatus according to claim 1, wherein the nozzle is a nozzle for actual production.   The mounting apparatus according to claim 1, wherein the nozzle is a calibration jig nozzle. The calculation unit calculates a correction value from a horizontal displacement of the tip position of the nozzle in a state where the nozzle is horizontally moved to the mounting area;
6. The horizontal displacement of the nozzle associated with the movement from the recognized height to the mounting height and the horizontal movement to the mounting area is corrected. 6. Mounting device. A board imaging unit for imaging a reference mark on the board from above in the mounting area;
The mounting area is provided with backup pins that support the substrate from below,
A reference mark is attached to the upper end surface of the backup pin,
In a state where there is no substrate in the mounting area, the measurement unit causes the sensor unit to recognize the pin shape of the backup pin and measure the position of the backup pin, and the substrate imaging unit images the reference mark of the backup pin. The mounting apparatus according to claim 6, wherein a coordinate system set on the sensor unit is associated with a coordinate system set on a substrate based on the reference mark.   8. The mounting apparatus according to claim 1, wherein calibration is automatically performed during production stop. A method for calibrating a mounting device that recognizes a nozzle by lifting a component to a recognized height of a sensor unit, lowers the nozzle to a mounting height, and mounts it on a board,
Measuring the tip position of the nozzle by causing the sensor unit to recognize the tip shape of the nozzle at the recognition height at a position that can be lowered to the mounting height; and
Lowering the sensor unit to the mounting height at a position that can be lowered to the mounting height, causing the sensor unit to recognize the tip shape of the nozzle, and measuring the tip position of the nozzle;
Calculating a correction value from a horizontal deviation between the tip position of the nozzle at the recognized height and the tip position of the nozzle at the mounting height;
A calibration method, wherein a displacement of the nozzle accompanying a movement from the recognized height to the mounting height is corrected. It is a calibration program for a mounting apparatus that recognizes by lifting a component to the recognition height of the sensor unit by a nozzle, lowers the nozzle to the mounting height, and mounts it on a board,
Measuring the tip position of the nozzle by causing the sensor unit to recognize the tip shape of the nozzle at the recognition height at a position that can be lowered to a mounting height; and
Lowering the sensor unit to the mounting height at a position where it can be lowered to a mounting height, causing the sensor unit to recognize the tip shape of the nozzle and measuring the tip position of the nozzle;
Calculating a correction value from a horizontal shift between the nozzle tip position at the recognition height and the nozzle tip position at the mounting height; and from the recognition height, A calibration program for correcting a displacement of the nozzle accompanying the movement to the mounting height.

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