JP2023168155A - Component mounting device and component mounting method - Google Patents

Abstract

To provide a component mounting device which can suppress reduction in mounting accuracy of a component by suppressing contact between components in the time of component mounting.SOLUTION: A component mounting device comprises: a head movement part which moves a head that holds a component; and a component mounting part which mounts the component to a substrate with the head. The component mounting device comprises: a frame setting part which sets a frame in the periphery of the mounting position where the component is mounted on the substrate on the basis of component mounting information for mounting the component on the substrate including information about an angle error with respect to the mounting posture of the component on the substrate; an overlapping determination part which determines whether or not the frame set by the frame setting part overlaps the mounted component that has been already mounted on the substrate; and a mounting condition decision unit which decides a mounting condition by the component mounting part according to the determination result by the overlapping determination part.SELECTED DRAWING: Figure 7

Description

The present disclosure relates to a component mounting device and a component mounting method.

2. Description of the Related Art Conventionally, there has been known a component mounting apparatus that takes into account the distance between components and sets the moving speed during component mounting. This component mounting device mounts a component onto a circuit board by adjusting the relative position of the nozzle and the circuit board to be mounted horizontally and vertically according to a mounting program using a head having a nozzle that holds the component to be mounted. an adjacent distance calculation means that calculates the adjacent distance between components to be mounted on a circuit board from a mounting program; ) and a mounting machine control means for automatically operating the component mounting means by changing one or more of the adjacent distances from those when the adjacent distance is outside a predetermined range (see Patent Document 1).

Japanese Patent Application Publication No. 2002-252495

The component mounting apparatus of Patent Document 1 does not take into account the orientation of the component when mounting (mounting) the component. That is, when a component is mounted on a circuit board using a head having a nozzle, there is a possibility that the component may be mounted on the circuit board with a change from a predetermined orientation in which the component should be mounted, and the component may be tilted and mounted on the circuit board. In this case, even if the distance between the parts is an allowable distance, the parts may come into contact with each other during mounting, reducing the precision of mounting the parts.

The present disclosure provides a component mounting device and a component mounting method that can suppress contact between components during component mounting and suppress deterioration in component mounting accuracy.

One aspect of the present disclosure is a component mounting device including a head moving unit that moves a head that holds a component, and a component mounting unit that uses the head to mount the component on a board, the component mounting device including: Frame setting for setting a frame around a mounting position on the board at which the component is mounted, based on component mounting information for mounting the component on the board, including information on an angular error with respect to a mounting posture of the component. an overlap determination unit that determines whether or not the frame set by the frame setting unit overlaps with a mounted component already mounted on the board; A component mounting apparatus includes a mounting condition determining section that determines mounting conditions for the mounting section.

One aspect of the present disclosure is a component mounting method of mounting the component on a board using a movable head that holds the component, the method including information on an angular error with respect to the mounting posture of the component on the board. a step of setting a frame around a mounting position on the board where the component is mounted based on component mounting information for mounting the component; and a step of setting a frame around a mounting position where the component is mounted on the board; A component mounting method comprising: a step of determining whether the component overlaps with the mounted component; and a step of determining mounting conditions for mounting the component according to the determination result of whether the component overlaps with the mounted component. be.

According to the present disclosure, it is possible to suppress contact between components during component mounting, thereby suppressing deterioration in component mounting accuracy.

A top view illustrating the mechanical configuration of the component mounting device according to Embodiment 1. A side view illustrating the mechanical configuration of the component mounting device shown in FIG. 1 A perspective view illustrating the operation of the moving head shown in FIG. 2 A block diagram illustrating the functional configuration of the control unit of the component mounting apparatus shown in FIG. 1 Diagram showing an example of information stored in wearing data Diagram showing an example of information stored in parts data A diagram showing an example of a plurality of parts P and a frame mounted on a board. Flowchart showing an example of the operation of the component placement device

Embodiments of the present disclosure will be described in detail below with appropriate reference to the drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of well-known matters and redundant explanations of substantially the same configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter of the claims.

For example, the term "unit" or "device" used in the embodiments is not limited to a physical configuration mechanically realized by hardware, but also includes one whose functions are realized by software such as a program. Moreover, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

<About the mechanical configuration of the component mounting device>
First, the mechanical configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to the first embodiment. FIG. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in FIG. 1. 1 and 2, the front side of the component mounting device 1 (the lower side in the paper of FIG. 1, the left side in the paper of FIG. 2) is the front side, and the back side of the component mounting device 1 (the upper side in the paper of FIG. 1), The right side in the paper of FIG. 2 is also referred to as the rear side.

In FIGS. 1, 2, and some parts to be described later, the two axes perpendicular to each other in the horizontal plane are the X direction of the substrate transport direction (the left-right direction in FIG. vertical direction) is indicated. Further, the Z direction is shown as a height direction perpendicular to the horizontal plane. The Z direction is an up-down direction or an orthogonal direction when the component mounting device 1 is installed on a horizontal surface.

One or more component mounting apparatuses 1 are disposed in a mounting board production line for mounting and manufacturing various components P on a board W, and are used to attach components P to a board W transported from upstream of the mounting board production line. Wear it in the designated position and posture.

As shown in FIGS. 1 and 2, the component mounting apparatus 1 mainly attaches components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, capacitors, etc., BGAs (Ball Grid Arrays), ) A main body mechanism section 10 that mounts (installs) components or CSP (Chip Size Package), etc., and a control section 40 that controls its operation. The main body mechanism section 10 includes a mounting machine main body 11 made up of a base 12 and the like, and a head unit 23 configured to be movable with respect to the mounting machine main body 11. Note that the control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

A substrate transport mechanism 13 is disposed at the center of the base 12 of the mounting machine main body 11 along the X direction (transfer direction of the substrate W) shown in FIG. The substrate transport mechanism 13 has a pair of conveyor sections 14 extending along the X direction, and transports the substrate W placed on the pair of conveyor sections 14 to position it at a predetermined mounting work position. and hold it.

A pair of front and rear component supply mechanisms 15 are disposed facing each other on both front and rear sides of the substrate transport mechanism 13 (both upper and lower sides in the paper of FIG. 1, and both left and right sides in the paper of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are mounted in parallel in the slot 17 as part feeders.

Furthermore, the component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a truck section 20 on the lower side of which a plurality of wheels are arranged, and a plurality of reel stock sections (not shown) arranged on the upper side of the cart section 20. A reel 21 is accommodated in each of the plurality of reel stock sections. A carrier tape 22 in which a component P is accommodated is pulled out from each of the reels 21, and the component P is supplied to the tape feeder 18 of the component supply mechanism 15. Thereby, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feeding direction, so that the component P is picked up by the moving head 26 of the head unit 23, which will be described below. Supply to position.

The head unit 23 is disposed above the base 12 and is configured to be movable between a mounting position and an unloading position where the component supply mechanism 15 and the substrate W are arranged. Specifically, the head unit 23 is linearly moved along the X direction and the Y direction by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are arranged orthogonally to each other on a plane substantially parallel to the surface of the substrate W. It is possible.

A Y-axis table mechanism 24 is arranged on the upper surface of the base 12 along the Y direction. Further, a pair of front and rear X-axis table mechanisms 25 are arranged along the X direction, and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction. Furthermore, a moving head 26 is attached to the tip end of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. Thereby, the moving head 26 is arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Note that both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by a linear guide drive mechanism.

A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the substrate transport mechanism 13. A component holding nozzle 27 (see below) mounted on the moving head 26 moves and passes above the component recognition camera 28 while taking out and holding the component P from the component supply mechanism 15 . At this time, the component recognition camera 28 images the component P sucked and held by the passing component holding nozzle 27 one or more times at a predetermined timing. By performing recognition processing on this imaging result (captured image), identification and position detection of the component P are executed.

Further, a nozzle holder 38 and a waste box 37 are further arranged between the pair of front and rear component supply mechanisms 15 and the substrate transport mechanism 13. The nozzle holder 38 accommodates a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By causing the moving head 26 to access the nozzle holder 38 and performing a predetermined nozzle exchange operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The disposal box 37 is formed in a box shape and has an internal space, in which components P and the like that are determined to be defective as a result of recognizing the imaging results by the component recognition camera 28 are discarded.

<About the configuration and operation of the moving head>
Next, the configuration and operation of the moving head 26 will be described with reference to FIG. 3. FIG. 3 is a perspective view illustrating the operation of the moving head 26 shown in FIG. 2. As shown in FIG.

As shown in FIG. 3, the moving head 26 is a multiple head (not shown) having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged in parallel at the lower end of each moving head 26. .

Each of the component holding nozzles 27 holds the component P from the tape feeder 18 of the component supply mechanism 15 by vacuum suction using air pressure, for example, and moves up and down individually. The moving head 26 also includes a Z-axis lifting mechanism (not shown) that individually raises and lowers each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. ) and further have. By driving the Y-axis table mechanism 24 and the X-axis table mechanism 25, the moving head 26 is arbitrarily positioned on the horizontal plane (XY plane). By this movement, the moving head 26 adsorbs the component P with the component holding nozzle 27 and takes it out from the take-out position of the tape feeder 18 of the component supply mechanism 15 .

A board recognition camera 36 (see FIG. 1), which is disposed on the lower surface side of the X-axis table mechanism 25 and moves together with the moving head 26, is fixed to the moving head 26. As the moving head 26 moves, the substrate recognition camera 36 passes above the substrate W positioned by the substrate transport mechanism 13 and images the substrate W. The position and orientation of the substrate W are detected by similarly performing recognition processing on this imaging result (imaging information).

As a result of detecting the position of the substrate W, the movable head 26 uses its component holding nozzle 27 to move the component P to its mounting point (for example, the mounting position and mounting posture at which the component P is to be mounted on the substrate W) according to instructions from the control unit 40. ) attached to each. This one-time mounting of the components P is performed until all the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are mounted onto the substrate W. In this way, the component P is held and moved by the component holding nozzle 27 of the moving head 26 between the take-out position and the mounting position, and is finally mounted onto the substrate W.

The component mounting device 1 performs a series of operations in which a plurality of components P are taken out by the component holding nozzle 27 of the moving head 26, mounted, and returned to the taken-out position until all the mounting at the plurality of mounting points on the substrate W is completed. Perform tasks repeatedly. By repeating this operation, a large number of parts P are sequentially mounted on each of the substrates W that are sequentially transported, and after mounting, the board W on which all the parts P are mounted is transported to a downstream process. In this way, the mounting machine main body 11 and the head unit 23 operate in cooperation, and this cooperative operation is executed according to instructions from the control section 40.

In addition, in the first embodiment, a series of work units consisting of forward movement from taking out the part P at the take-out position to mounting the part P at the mounting work position, and subsequent movement back to the take-out position is described. It is also called a "one turn" unit of work. The forward movement from the take-out position to the mounting work position in one turn is hereinafter also simply referred to as "the forward movement in one turn."

<About the software configuration of the component placement device>
Next, with reference to FIG. 4, the software configuration (functional configuration) of the control unit 40 of the component mounting apparatus 1 will be described. FIG. 4 is a block diagram illustrating the functional configuration of the control section 40 of the component mounting apparatus 1 shown in FIG. 1.

The control unit 40 of the component mounting apparatus 1 is configured by a general-purpose computer, and a program as software stored in a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory) of the computer is configured. , and is executed by an arithmetic unit such as its CPU (Central Processing Unit). That is, each block illustrated in the control unit 40 in FIG. 4 represents a function realized by software such as a program. However, the functions expressed by each block are not limited to software, and each block may be configured by hardware as a physical configuration of a "device."

As shown in FIG. 4, the control unit 40 includes a storage unit 41, a mechanism drive unit 46, an imaging processing unit 47, a frame setting unit 51, an overlap determination unit 52, and a mounting condition determination unit 53. Consists of. The storage unit 41 stores and holds at least mounting data 42 and parts data 43. The imaging processing section 47 includes a camera control section 48 and a component recognition section 50. The mounting data 42 and the component data 43 are examples of component mounting information for mounting the component P onto the board W.

FIG. 5 is a diagram showing an example of information stored in the mounting data 42. The mounting data 42 includes information regarding mounting of the component P. The mounting data 42 stores, for example, information on each component P to be mounted on each board W, and information such as the mounting position and mounting orientation (mounting posture) of each component P on the board W. In FIG. 5, information on the mounting data 42 is shown in a table format, and may be displayed on a display unit (not shown) of the component mounting apparatus 1.

The mounting data 42 includes, for example, sequence number, component code, mounting position, and mounting orientation information. The sequence number indicates the order of attachment; for example, sequence number 1 indicates that it is attached first. The component code is a code indicating the type of component P to be mounted. Detailed information regarding the part P is stored in the part data 43. The mounting position is information indicating the mounting position where the component P to be mounted is mounted. The mounting position is indicated by, for example, the X and Y coordinates of a two-dimensional plane, and is the relative coordinate of the component P with respect to the substrate W, but the mounting position may be indicated by other coordinates. The mounting orientation is information indicating an inclination with respect to a reference direction (reference posture) (for example, the front direction of the component mounting apparatus 1). The mounting orientation is indicated by, for example, an angle θ1 with respect to a reference orientation. The angle θ1 is an angle indicating the orientation in which the device should be worn, such as 0 degrees or 90 degrees, and is not an unintended angle (angular error). The mounting data 42 may be acquired as production data from an external device through communication or the like.

FIG. 6 is a diagram showing an example of information stored in the parts data 43. The component data 43 includes information regarding the component P to be mounted. The component data 43 stores, for example, information such as the external shape of each type of component P, the presence or absence of electrodes, or the number of electrodes. In FIG. 6, information on the component data 43 is shown in a table format, and may be displayed on a display section (not shown) of the component mounting apparatus 1.

The component data 43 includes, as specific examples, the component code of the component P, the type of the component P (component type), the size of the component P, and the angular error θ2 (assumed angular error) assumed when the component P is mounted. Contains information. The component code is a code indicating the type of component P to be mounted. The component type is a name (for example, BGA) that specifically represents the type of component P corresponding to the component code. The size information includes, for example, information on the length of the part P in the horizontal direction, length in the vertical direction, and length in the height direction. The horizontal direction is one direction in a two-dimensional plane along the surface of the board W when components are mounted, the vertical direction is a direction perpendicular to one direction in the two-dimensional plane, and the height direction is a direction perpendicular to the two-dimensional plane. It is the direction. The angular error θ2 indicates the angular deviation of the component P to be mounted on the board W with respect to the mounting posture (mounting direction). The angular error θ2 may be information determined according to the type of the part P or the size of the part P. As the angular error θ2 in FIG. 6, for example, information on the maximum angular error assumed for the component P to be mounted may be shown.

Returning to FIG. 4, the camera control unit 48 of the imaging processing unit 47 controls the component recognition camera 28, and controls, for example, the timing of imaging by the component recognition camera 28. The component recognition unit 50 recognizes the position, orientation, polarity, etc. of the component P based on the image captured by the component recognition camera 28. Based on the recognition result by the component recognition section 50, the head unit 23 uses its moving head 26 to mount the component P on the substrate W at a predetermined position and orientation.

Note that the imaging information of the board recognition camera 36 is also transmitted to the imaging processing section 47. Similar to the component recognition unit 50, the imaging processing unit 47 recognizes the position and orientation of the board W based on the imaging information (the image taken by the board recognition camera 36), and transmits the recognition result to the mechanism drive unit 46. Send to. The mechanism drive section 46 controls the main body mechanism section 10, and controls the driving of, for example, the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in cooperation with each other. The mechanism driving section 46 may control the main body mechanism section 10 based on the recognition result of the position and orientation of the substrate W recognized by the imaging processing section 47.

The frame setting unit 51 sets a frame WK around the mounting position (mounting area) on the board W where the component P is mounted. That is, a frame WK is set around the unmounted component P1 that has not yet been mounted on the board W. The frame WK is not a physical frame actually installed on the board to be mounted, but is a virtual frame. The frame setting unit 51 sets a frame WK based on the component mounting information. The frame setting unit 51 may set the frame WK based on, for example, the distance between adjacent components or the angular error θ2 assumed when mounting the component P to be mounted. When mounting the component P on the substrate W, there is a possibility that the component P may have some angular variation (error) with respect to a predetermined mounting orientation, and this angular variation is the angular error θ2. The angular error θ2 is, for example, any angle of 10 degrees or less. The frame setting unit 51 may set the frame WK based on the distance between the mounted component P2 that has already been mounted on the board W and the unmounted component P1 that is the mounting target. The area of the frame WK corresponds to the area where each component P is assumed to be mounted on the board W, taking into account positional deviation and angular error θ2.

The frame WK may include an angular error consideration frame WK1, which is a frame that takes into account the angular error θ2, and an angular error non-considered frame WK2, which is a frame that does not take the angular error θ2 into consideration. The frame setting unit 51 may determine the type of frame WK based on the type of part P (ie, the part code). That is, based on the type of part P, it may be determined whether to set the angular error consideration frame WK1 or the angular error non-consideration frame WK2. Further, the frame setting unit 51 may display the frame WK on a display unit (not shown), for example, the frame WK may be displayed together with at least one of the board W and the component P.

Further, the frame setting unit 51 may determine the type of frame WK based on the size of the component P. The frame setting unit 51 may set the angular error consideration frame WK1 when the size of the part P is equal to or larger than a predetermined size threshold. The frame setting unit 51 may set an angular error non-consideration frame WK2 when the size of the part P is less than a predetermined size threshold.

For example, the frame setting unit 51 may determine the type of frame WK based on the type of component P. The frame setting unit 51 may set the angular error consideration frame WK1 when the type of component P is a relatively complicated component (for example, a packaged component such as a BGA or CSP). If the type of component P is a relatively simple component (for example, a simple element such as a resistor or a capacitor, or a chip component), the frame setting unit 51 may set the angular error non-consideration frame WK2.

The overlap determining unit 52 determines whether the frame WK set by the frame setting unit 51 overlaps the mounted component P2 on the board W. The overlap between the frame WK and the mounted part P2 means that the range in which the unmounted part P1 to be mounted is scheduled to be mounted and the range in which the mounted part P2 is to be mounted, which is assumed by taking into account positional deviations and posture deviations (angular errors), are overlapped. This means that the specified range overlaps with the specified range. Therefore, when the frame WK and the mounted part P2 overlap, it is possible that the mounted part P2 and the unmounted part P1 to be mounted may come into contact depending on the positional shift or posture shift during mounting. It means.

The mounting condition determining unit 53 determines mounting conditions when mounting the component P onto the board W. The mounting conditions include, for example, the mounting speed, mounting acceleration, or mounting timing for mounting the component P onto the board W. The mounting speed can also be said to be the operation speed of the component mounting operation. The mounting speed may include at least one of a moving speed of the moving head 26 in the XY direction along the substrate W and a moving speed of the moving head 26 in the Z direction perpendicular to the substrate W. That is, the moving speed of the component P in the XY direction and the Z direction may be adjusted. Thereby, the component mounting apparatus 1 can improve the accuracy of the mounting operation of the component P, and can prevent adjacent components from coming into contact with each other.

The wearing condition determining section 53 determines the wearing condition according to the determination result by the overlap determining section 52. For example, when it is determined that the frame WK and the mounted component P2 overlap, the mounting condition determination unit 53 sets the mounting speed to speed V1 (low speed) and places the component P at a predetermined mounting position. It may be worn in the wearing direction (wearing posture). When it is determined that the frame WK and the mounted component P2 do not overlap, the mounting condition determining unit 53 sets the mounting speed to a speed V2 (high speed) that is faster than the speed V1, and places the component P in a predetermined mounting manner. It may be mounted in a predetermined mounting direction at a certain position.

When the mounting speed is low, the position of the component P is stable when moving the component P using the head unit 23 or when mounting the component P in contact with the substrate W, so that the component mounting device 1 can perform the desired mounting process. It becomes easier to mount the component P while maintaining the mounting posture. When the mounting speed is high, it becomes difficult to stabilize the posture of the component P during movement or mounting, but the time required for mounting can be shortened.

For example, when it is determined that the frame WK and the mounted component P2 overlap, the mounting condition determining unit 53 sets the mounting acceleration to acceleration AC1 (small acceleration) and places the component P at a predetermined mounting position. It may be installed in the direction of installation. When it is determined that the frame WK and the mounted component P2 do not overlap, the mounting condition determination unit 53 sets the mounting acceleration to an acceleration AC2 (large acceleration) larger than the acceleration AC1, and moves the component P to a predetermined level. It may be mounted at a mounting position in a predetermined mounting direction.

When the mounting acceleration is small, the posture when moving the component P using the head unit 23 or when mounting the component P in contact with the substrate W is stable, so that the component mounting device 1 can maintain the desired mounting posture. It becomes easier to mount the part P while maintaining the . If the mounting acceleration is large, it becomes difficult to stabilize the posture of the component P during movement or mounting, but the time required for mounting can be shortened.

For example, when it is determined that the frame WK and the mounted component P2 overlap, the mounting condition determining unit 53 sets the mounting timing to the first timing T1 (late timing) and places the component P at a predetermined mounting position. It may be installed in the specified orientation. When it is determined that the frame WK and the mounted component P2 do not overlap, the mounting condition determination unit 53 sets the mounting timing to a second timing T2 (earlier timing) that is faster than the first timing T1, and P may be mounted at a predetermined mounting position and in a predetermined mounting orientation. The mounting condition determination unit 53 can reduce the mounting speed and acceleration by setting a slow mounting timing, and can increase the mounting speed and mounting acceleration by setting a fast mounting timing.

FIG. 7 is a diagram showing an example of a plurality of components P and a frame WK mounted on the board W. Here, it is exemplified that the frame setting unit 51 determines the type of frame WK in consideration of the size of the part P.

In FIG. 7, three parts P (parts "A", "B", and "C") are shown. "A", "B", and "C" here correspond to, for example, component codes included in the installation data 42 of FIG. 5. In FIG. 7, component "A" is the installed component P2, and component "B" and component "C" are the uninstalled component P1. Components "B" and "C" have not yet been mounted on the board W, so when components "B" and "C" become the mounting targets, a frame WK is created around the components "B" and "C". Set. On the other hand, since the component "A" has already been mounted on the board W, the frame WK is not set around the component "A".

The size of component "B" is approximately the same size as component "A" and is less than the size threshold. Therefore, the frame setting unit 51 sets an angular error non-consideration frame WK2. In this case, the frame setting unit 51 connects each position spaced a predetermined distance from the outer periphery of the component "B" and sets the angular error non-consideration frame WK2 of the component "B" without taking the angular error θ2 into account. The fact that only one region of component "B" is shown indicates that the positional deviation (angular error) when mounting component "B" is not taken into account.

The size of component "C" is larger than component "A" and is larger than the size threshold. Therefore, the frame setting unit 51 sets the angular error consideration frame WK1. In FIG. 7, three states are shown for component "C" in consideration of three inclinations. Specifically, there are a state in which there is no angular error θ2, a state in which the angular error θ2 is maximum in the first rotation direction (for example, clockwise direction), and a state in which the angular error θ2 is opposite to the first rotation direction. maximum in the second direction of rotation (eg, counterclockwise). In each state of component "C", a temporary frame wkt (wkt1, wkt2, wkt3) is generated by connecting each position spaced a predetermined distance from the outer periphery of component "C". The mounting posture of component "C" is divided between a state in which the angular error θ2 is maximum in the first rotation direction and a state in which the angular error θ2 is maximum in the second rotation direction, with a state in which there is no angular error θ2 in between. can vary between Accordingly, the temporary frame wkt can change between the temporary frame wkt2 and the temporary frame wkt3 with the temporary frame wkt1 in between. Therefore, the frame setting unit 51 generates the angular error consideration frame WK1 so as to include the entire range of the temporary frame wkt that can change taking into account the angular error θ2. In this case, the frame setting unit 51 generates and sets the outer periphery of the reachable range of the temporary frame wkt as the angular error consideration frame WK1 within the range of values that the angular error θ2 of the component "C" can take. Note that it is sufficient that the reachable range of the temporary frame wkt is included in the angular error consideration frame WK1, and the shape of the angular error consideration frame WK1 is not limited to this.

In FIG. 7, the component "A" which is the mounted component P2 and the angular error non-consideration frame WK2 of the component "B" do not overlap. Therefore, the component "B" is mounted on the board W, for example, at a high mounting speed. This is because even if part "B" is slightly misaligned during installation, there is a low possibility that it will come into contact with part "A". Further, the component "A" which is the mounted component P2 and the angular error consideration frame WK1 of the component "C" overlap. Therefore, the component "C" is mounted on the board W, for example, at a low mounting speed. This stabilizes the posture of component "C" when it is mounted, and reduces the possibility that component "C" will come into contact with component "A."

Next, the operation of the component mounting apparatus 1 will be explained.
FIG. 8 is a flowchart showing an example of the operation of the component mounting apparatus 1. The process in FIG. 8 may be performed for each component P to be mounted. When the component mounting apparatus 1 mounts a plurality of components P at the same time, the process shown in FIG. 8 may be performed for each component P at the same time.

First, the mechanism drive unit 46 controls the head unit 23 to cause the component holding nozzle 27 to attract and hold the component P to be mounted on the substrate W based on the mounting data 42 (S11). The frame setting unit 51 determines, based on the component data 43 (for example, the size and type of the component P), whether the component P to be mounted is a component that takes into account (adds) the angular error θ2 (S12). If the component P to be mounted is a component that takes into account the angular error θ2 (Yes in step S12), the frame setting unit 51 sets the angular error consideration frame WK1 as the frame WK (S13). On the other hand, if the component P to be mounted is a component that does not take the angular error θ2 into consideration (No in step S12), the frame setting unit 51 sets the angular error non-considered frame WK2 as the frame WK (S14).

After the processing in step S13 or S14, the overlap determining unit 52 determines whether or not the set frame WK and the mounted component P2 overlap (S15). If the set frame WK and the mounted component P2 overlap (Yes in step S15), the mounting condition determining unit 53 sets the mounting speed to V1 (low speed) and places the component P at the predetermined mounting position. It is worn in the wearing posture (S16). On the other hand, if the set frame WK and the mounted component P2 do not overlap (No in step S15), the mounting condition determination unit 53 sets the mounting speed to V2 (high speed) which is higher than V1, and is mounted at a predetermined mounting position and in a predetermined mounting posture (S17).

Note that the mounting condition determining unit 53 may determine the mounting speed in multiple stages of three or more stages instead of determining the mounting speed as either low speed or high speed, that is, in two stages. In this case, the mounting condition determining unit 53 may adjust the mounting speed in multiple stages based on the component data 43 (for example, the size and type of the component P) to be mounted.

Furthermore, in FIG. 7, the angular error consideration frame WK1 or the angular error non-consideration frame WK2 is set depending on whether or not the component P to be mounted is a component that takes into account the angular error θ2. Not limited. For example, the angular error consideration frame WK1 may be set as the frame WK regardless of the size or type of the component P to be mounted.

As described above, the component mounting apparatus 1 of the present embodiment not only determines the scheduled mounting position, component size, and component type of the component P to be mounted, but also allows the component P to be tilted in the horizontal direction from the intended mounting orientation during mounting. (angular error θ2), the frame WK is set and the mounting conditions are determined, and the component P can be mounted. When the angle error θ2 occurs, the actual distance between the adjacent parts may become smaller than the initially assumed distance between the adjacent parts, and the adjacent parts may easily come into contact with each other. On the other hand, for example, in the component mounting apparatus 1, there is a mounted component P2 placed near the scheduled mounting position of the unmounted component P1, and the unmounted component P1 may come into contact with the mounted component P2 when mounting the component. If the error is high, a large angle error consideration frame WK1 can be set. The range of this angular error consideration frame WK1 includes the mounting range of the part P in which the angular error θ2 has occurred, so if the range of the angular error consideration frame WK1 does not overlap with the range of the mounted part P2, when mounting the part The possibility that the unmounted component P1 will come into contact with the mounted component P2 can be reduced. Further, the component mounting apparatus 1 can set a small frame WK2 in which angular error is not considered when there is a low possibility that the unmounted component P1 will come into contact with the mounted component P2 during component mounting. In other words, it can be said that the component mounting apparatus 1 can calculate the distance between the mounted components P2 that are mounted adjacently, taking into account the angular error θ2, and set the frame WK corresponding to this distance.

If the set frame WK overlaps the mounted component P2, for example, by setting the speed of the component mounting operation (mounting speed) to a low speed, the actual mounting posture of the unmounted component P1 can be changed to the planned mounting posture. (Angle θ1), that is, the angle error θ2 is less likely to occur, so the possibility that the unmounted component P1 will come into contact with the mounted component P2 is reduced. Therefore, the component mounting apparatus 1 can suppress contact between components during component mounting, and can suppress deterioration in mounting accuracy of the component P.

Note that if it is assumed that the frame WK will come into contact with another component P (mounted component P2), the takt time may be reduced by lowering the mounting speed. However, if the component mounting operation is performed without reducing the takt time, that is, without reducing the mounting speed, the distance between the mounted component P2 and the component P to be mounted may not be maintained appropriately and they may come into contact. . In this case, there is a possibility that the generated component mounting board (component mounting board) cannot be used. In addition, the mounting data 42 (production data for producing component-mounted boards) may be used to ensure a longer distance between adjacent parts to prevent such contact between adjacent parts using a predetermined device. ) needs to be recreated. Therefore, it takes time to change the production data, and as a result, the time required to produce the target amount of component-mounted boards without changing the mounting speed is the same as the time required to produce the target amount of boards with the mounting speed at a low speed. This will take longer than the time required to produce component-mounted boards. Therefore, the component mounting apparatus 1 can improve the productivity of the component mounting board even when mounting the component P using the frame WK at a low mounting speed.

As described above, the component mounting apparatus 1 of the present embodiment includes the mechanism driving section 46 (an example of a head moving section) that moves the moving head 26 that holds the component P, and the moving head 26 that mounts the component P onto the substrate W. A head unit 23 (an example of a component mounting section) is provided. The component mounting apparatus 1 is based on component mounting information (for example, mounting data 42 and component data 43) for mounting the component on the board W, including information on the angular error θ2 with respect to the mounting posture of the component P on the board W. A frame setting unit 51 is provided for setting a frame WK around a mounting position on a board W at which a component P is mounted. The component mounting apparatus 1 includes an overlap determination section 52 that determines whether the frame WK set by the frame setting section 51 overlaps the mounted component P2 already mounted on the substrate W. The component mounting apparatus 1 includes a mounting condition determining section 53 that determines mounting conditions for the head unit 23 according to the determination result by the overlap determining section 52.

Thereby, the component mounting apparatus 1 can set the frame WK assuming that the component P is tilted more than the intended mounting posture (angular error θ2), and can determine the mounting conditions using this frame WK. For example, if the set frame WK overlaps with the mounted part P2, setting the mounting speed to a low speed will make it easier to mount the part P in a stable mounting position. Deviations from the original schedule can be suppressed. Therefore, the component mounting apparatus 1 can suppress contact between components during component mounting, and can suppress deterioration in mounting accuracy of the component P.

Further, the frame setting unit 51 may determine whether to set an angular error consideration frame WK1 (an example of a first frame) in which the angular error θ2 is taken into account as the frame WK, based on the component mounting information. When it is determined that the angular error consideration frame WK1 is to be set, the frame setting unit 51 sets the angular error consideration frame WK1, and when it is determined that the angular error consideration frame WK1 is not to be set, the frame setting unit 51 sets an angular error that does not take into account the angular error θ2. A non-considered frame WK2 (an example of a second frame) may be set.

As a result, the component mounting apparatus 1 detects that there is a mounted component P2 placed near the scheduled mounting position of the component P to be mounted, and there is a possibility that the component P to be mounted will come into contact with the mounted component P2 when mounting the component. If the angle error consideration frame WK1 is high, for example, a large angle error consideration frame WK1 can be set. Furthermore, if there is a low possibility that the component P to be mounted will come into contact with the mounted component P2 during component mounting, a small angular error non-consideration frame WK2 can be set, for example. Therefore, the component mounting device 1 can determine the type of frame WK according to the characteristics of the component P, and can perform component mounting using the determined type of frame WK while suppressing a decrease in component mounting accuracy. .

Further, the component mounting information may include information on the size of the component P. The frame setting unit 51 may determine whether to set the angular error consideration frame WK1 based on the size of the component P.

It is considered that the stability of holding the component P by the component holding nozzle 27 differs depending on the size of the component P, and the ease with which the angular error θ2 occurs varies. Therefore, the component mounting apparatus 1 can set the frame WK by taking into consideration the stability of holding the component P by determining the type of the frame WK in consideration of the size of the component P.

Further, the component mounting information may include information on the type of component P. The frame setting unit 51 may determine whether to set the angular error consideration frame WK1 based on the type of the part P.

It is considered that the stability of holding the component P by the component holding nozzle 27 differs depending on the type of the component P, and the ease with which the angular error θ2 occurs varies. Therefore, the component mounting apparatus 1 can set the frame WK by taking into consideration the stability of holding the component P by determining the type of the frame WK in consideration of the size of the component P.

Furthermore, the mounting conditions may include the mounting speed at which the component P is mounted. Thereby, the component mounting device 1 can mount the component P on the board W in a state close to the desired mounting position and mounting posture by adjusting the mounting speed, that is, while suppressing deviation from the desired mounting position and mounting posture. .

Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can come up with various changes, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims, and It is understood that it falls within the technical scope of the present disclosure. Further, each component in the embodiments described above may be combined arbitrarily within a range that does not depart from the spirit of the invention.

INDUSTRIAL APPLICABILITY The present disclosure is useful for a component mounting device, a component mounting method, and the like that can suppress contact between components during component mounting and suppress deterioration in component mounting accuracy.

1 Component mounting device 10 Main mechanism section 11 Mounting machine main body 12 Base 13 Board transport mechanism 14 Conveyor section 15 Component supply mechanism 16 Feeder base 17 Slot 18 Tape feeder 19 Feeder cart 20 Dolly section 21 Reel 22 Carrier tape 23 Head unit 24 Y axis table mechanism 25 Camera control unit 50 Component recognition unit 51 Frame setting unit 52 Overlap determination unit 53 Mounting condition determining unit P Component P1 Unmounted component P2 Mounted component W Board WK Frame WK1 Angular error consideration frame WK2 Angular error non-consideration frame wkt Temporary frame

Claims (6)

A component mounting device comprising: a head moving section for moving a head that holds a component; and a component mounting section for mounting the component onto a board using the head;
Based on component mounting information for mounting the component on the board, including information on angular error with respect to the mounting posture of the component on the board, a position around the mounting position where the component is mounted on the board. A frame setting section for setting the frame,
an overlap determination unit that determines whether the frame set by the frame setting unit overlaps with a mounted component already mounted on the board;
a mounting condition determining unit that determines mounting conditions for the component mounting unit according to a determination result by the overlap determining unit;
A component mounting device equipped with. The frame setting section is
Based on the component mounting information, determining whether to set a first frame that takes into account the angular error as the frame;
If it is determined that the first frame is to be set, setting the first frame;
If it is determined that the first frame is not set, a second frame that does not take into account the angular error is set;
The component mounting device according to claim 1. The component mounting information includes information on the size of the component,
The frame setting unit determines whether to set the first frame based on the size of the component.
The component mounting device according to claim 2. The component mounting information includes information on the type of the component,
The frame setting unit determines whether to set the first frame based on the type of the component.
The component mounting device according to claim 2. The mounting condition includes a mounting speed at which the component is mounted.
The component mounting device according to claim 1. A component mounting method in which the component is mounted on a board using a movable head that holds the component, the method comprising:
Based on component mounting information for mounting the component on the board, including information on angular error with respect to the mounting posture of the component on the board, a position around the mounting position where the component is mounted on the board. a step of setting a frame;
determining whether the set frame overlaps with a mounted component already mounted on the board;
determining mounting conditions for mounting the component according to a determination result of whether or not the component overlaps with the mounted component;
A component mounting method with

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