JPH06194412A - Icテスト用ソケット - Google Patents
Icテスト用ソケットInfo
- Publication number
- JPH06194412A JPH06194412A JP4314404A JP31440492A JPH06194412A JP H06194412 A JPH06194412 A JP H06194412A JP 4314404 A JP4314404 A JP 4314404A JP 31440492 A JP31440492 A JP 31440492A JP H06194412 A JPH06194412 A JP H06194412A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- contact pin
- chip
- contact
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000012528 membrane Substances 0.000 claims description 10
- 239000002985 plastic film Substances 0.000 abstract description 7
- 229920006255 plastic film Polymers 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- -1 but not limited to Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- SYJPAKDNFZLSMV-HYXAFXHYSA-N (Z)-2-methylpropanal oxime Chemical compound CC(C)\C=N/O SYJPAKDNFZLSMV-HYXAFXHYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/786,642 US5158467A (en) | 1991-11-01 | 1991-11-01 | High speed bare chip test socket |
US07/786642 | 1991-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06194412A true JPH06194412A (ja) | 1994-07-15 |
Family
ID=25139193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4314404A Pending JPH06194412A (ja) | 1991-11-01 | 1992-10-30 | Icテスト用ソケット |
Country Status (4)
Country | Link |
---|---|
US (1) | US5158467A (enrdf_load_stackoverflow) |
JP (1) | JPH06194412A (enrdf_load_stackoverflow) |
DE (1) | DE4236822A1 (enrdf_load_stackoverflow) |
FR (1) | FR2683397A1 (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5273440A (en) * | 1992-05-19 | 1993-12-28 | Elco Corporation | Pad array socket |
US5322446A (en) * | 1993-04-09 | 1994-06-21 | Minnesota Mining And Manufacturing Company | Top load socket and carrier |
US5495667A (en) * | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
US5498970A (en) * | 1995-02-06 | 1996-03-12 | Minnesota Mining And Manufacturing | Top load socket for ball grid array devices |
DE69611302T2 (de) * | 1995-07-07 | 2001-08-09 | Minnesota Mining And Mfg. Co., St. Paul | Zusammenbau eines trennbaren elektrischen steckverbenders mit einem matrix leitenden vorsprünge |
US5629837A (en) * | 1995-09-20 | 1997-05-13 | Oz Technologies, Inc. | Button contact for surface mounting an IC device to a circuit board |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
AU3603497A (en) * | 1996-07-05 | 1998-02-02 | Formfactor, Inc. | Floating lateral support for ends of elongate interconnection elements |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3885173A (en) * | 1973-10-09 | 1975-05-20 | Magnavox Co | Apparatus and method for coupling an acoustical surface wave device to an electronic circuit |
US3951495A (en) * | 1974-09-23 | 1976-04-20 | Advanced Memory Systems, Inc. | Leadless package receptacle |
US4189825A (en) * | 1975-06-04 | 1980-02-26 | Raytheon Company | Integrated test and assembly device |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4089575A (en) * | 1976-09-27 | 1978-05-16 | Amp Incorporated | Connector for connecting a circuit element to the surface of a substrate |
US4374003A (en) * | 1980-02-28 | 1983-02-15 | General Dynamics, Pomona Division | Fine line circuitry probes and method of manufacture |
US4426769A (en) * | 1981-08-14 | 1984-01-24 | Amp Incorporated | Moisture getter for integrated circuit packages |
US4513353A (en) * | 1982-12-27 | 1985-04-23 | Amp Incorporated | Connection of leadless integrated circuit package to a circuit board |
US4560826A (en) * | 1983-12-29 | 1985-12-24 | Amp Incorporated | Hermetically sealed chip carrier |
US4684184A (en) * | 1986-01-14 | 1987-08-04 | Amp Incorporated | Chip carrier and carrier socket for closely spaced contacts |
US4699593A (en) * | 1986-01-14 | 1987-10-13 | Amp Incorporated | Connector having contact modules for a substrate such as an IC chip carrier |
US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
US4832612A (en) * | 1986-10-31 | 1989-05-23 | Amp Incorporated | Protective carrier and securing means therefor |
US4744009A (en) * | 1986-10-31 | 1988-05-10 | Amp Incorporated | Protective carrier and securing means therefor |
US4880386A (en) * | 1988-11-18 | 1989-11-14 | Amp Incorporated | Socketing a semiconductor device |
-
1991
- 1991-11-01 US US07/786,642 patent/US5158467A/en not_active Expired - Fee Related
-
1992
- 1992-10-29 FR FR9212953A patent/FR2683397A1/fr active Pending
- 1992-10-30 DE DE4236822A patent/DE4236822A1/de not_active Withdrawn
- 1992-10-30 JP JP4314404A patent/JPH06194412A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US5158467A (en) | 1992-10-27 |
FR2683397A1 (fr) | 1993-05-07 |
DE4236822A1 (enrdf_load_stackoverflow) | 1993-05-06 |
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