CA1239671A - Single-in-line pin hybrid circuit mounting device - Google Patents
Single-in-line pin hybrid circuit mounting deviceInfo
- Publication number
- CA1239671A CA1239671A CA000485608A CA485608A CA1239671A CA 1239671 A CA1239671 A CA 1239671A CA 000485608 A CA000485608 A CA 000485608A CA 485608 A CA485608 A CA 485608A CA 1239671 A CA1239671 A CA 1239671A
- Authority
- CA
- Canada
- Prior art keywords
- printed wiring
- terminal device
- terminal
- wiring card
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Abstract
AN IMPROVED SINGLE-IN-LINE
PIN HYBRID MOUNTING DEVICE
ABSTRACT OF THE INVENTION
An improved terminal device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film circuit to a printed wiring card. The terminal device is characterized by a substrate accepting section arranged to engage a metallic contact pad on an edge of the substrate, a compliant section for buffering any flexure or displacement imparted to the terminal device and a terminal section including a standoff wing arranged for insertion into a hole on a printed wiring card. The improvement comprising the forming of a V-shaped knee on the terminal section arranged to have a portion of the knee extending outward of the printed wiring card hole when the terminal section is fully inserted into the printed wiring card.
PIN HYBRID MOUNTING DEVICE
ABSTRACT OF THE INVENTION
An improved terminal device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film circuit to a printed wiring card. The terminal device is characterized by a substrate accepting section arranged to engage a metallic contact pad on an edge of the substrate, a compliant section for buffering any flexure or displacement imparted to the terminal device and a terminal section including a standoff wing arranged for insertion into a hole on a printed wiring card. The improvement comprising the forming of a V-shaped knee on the terminal section arranged to have a portion of the knee extending outward of the printed wiring card hole when the terminal section is fully inserted into the printed wiring card.
Description
~N DMPRoVED SINGLE-IN-LINE
_ PIN HYBRID CIRCUIT MCUNTING DEVI OE
-BACRGROUND OF THE INVENTICN
This invention relates in general to Single-In-Line Pin (SIP) hybrid circuit unting devices and more particularly to a SIP
device which fir~ly retains hybrid circuits in an upright p~sition in printed wiring cards during oomponent insertion and subsequent soldering operations.
Typically, electrical connections to thick/thin film hybrid circuits are made through wires or terminal devices such as SIP
devices. These devices are soldered onto a hybrid circui~s edge with an opposite end plugged into a socket or more likely, into holes in a Printed Wiring d (PWC).
This method finds disadvantage in that the hybrid circuits are not firmly retained in the PWC during the assembly operation and are therefore susceptible to dislodging from the PWC. Further, in many cases the hybrid circuits are not retained in an upright position (perpendicular to the PWC) and are soldered in a angular or displaced position interfering with the other components populating the PWC.
The final inspection of assembled PWC's required straightening those hybrid circuits not in a upright position in order to view and inspect the solder connections. The straightening of the hybrid circuit deformed the SIP device material exceeding its elastic limit and thereby increasing the susceptibility of the SIP leads to early failure as a result of other induced external stresses.
Accordingly, it is the object of the present invention to prcvide SIP device with a retentive feature which rigidly retains the hybrid circuit to the PWC during assembly, handling and soldering operations.
. ~
` lZ3~671 SUMM~RY OF THE INVEN~TIoN
In accomplishing the object of the present invention there is provided on improved terminal device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film hybrid circuit to a printed wiring card. The planar substrate includes at least one terminal pad located adjacent an edge of the substrate. The printed wiring card includes a top and a bottcm surface and at least one plated through hole extending between the printed wiring card top and bottom Æ faces.
The terminal device includes a substrate accepting section arranged to accept the edge of the substrate and engage the term mal pad; retaining and connecting the terminal device to the substrate. A
terminal section including standoff means extends from the terminal section.
The improvement comprises, retentive means formed on the terminal section in spaced relationship to the standoff means. m e terminal section is fully inserted into the printed wiring card hole allcwm g the standoff means to rest on the printed wiring card top surface and a portion of the retentive means to extend outward of the printed wiring card hole engaging the printed wiring card kottom surface, retaining and connecting the te i l device to the printed wiring card.
BRIEF DESCRI TICN OF THE DR~ING
FIG. 1 is an elevational view of a Single-In-Line Pin (SIP) terminal device including the present invention and embodying a retentive form in a first direction.
~;~3~67~
FIG. 2 is an elevational view of the SIP terminal device of FIG. 1 embodying a retentive form in a secor~d direction.
FIG. 3 is an elevational view of the SIP terminal devices of FIG. 1 ard FIG. 2 as would be used to advantage in a hybrid circuit assembly.
DESCRIPTICN OF THE PFE~3~gED E~D~DIMENT
Turning now to FIG. l, a Single-In-Line (SIP) terminal device of the type to which the present invention may be used to advantage is illustrated. m e SIP terminal is characterized by three major sections defined generally as the hybrid accepting section lO, the compliant section 20 and the terminal sectio~ 30.
The hybrid accepting section comprises a U-shaped member having parallel arms 11 and 12 arranged to accept an edge of a hybrid circuit therebetween. It should be noted that the hybrid circuit in this embodiment is a thick/thin fi~m circuit formed on a ceramic substrate which includes metalized contact pads formPd adjacent one edge of the substrate. Contact surfaces 13 and 14 of arms 11 and 12 respectively normally make intimate contact with the metalized contact pads of the hybrid circuit electrically connecting the hybrid circuit to the SIP terminal.
The compliant section 20, also comprises a U-shaped member disposed perpendicularly to the hybrid accepting section 10. The cc~pliant section buffers any flexuxe or displacement of the printed wiring card (PWC) relative to an installed ~ybrid circuit and thus prevents the full induction of forces to the ceramic substrate material.
lZ3967~
The terminal section 30 which is normally configured as a vertical strip member embodies the present invention. The present invention is realized by forming a lower portion of the terminal section 30 into an indented form or knee 31. A standoff wing 32 extends from a side ~11 of the upper portion of terminal section 30.
A second standoff wing may also be included extending from an opposite side wall.
It should be noted that the SIP terminal device just described is oonstructed from a single stamping of a phosphor bronze material which is finished in a 60/40 tin lead electroplate. The stamping is then formed into the shape described and shown.
In order to use the invention to advantage two different knee orientations are formed. On a first group of SIP terminals the knee is formed in the direction as shown by knee 31 in Fig. 1. On a second group of SIP terminals the knee is formed in a second opposite direction as shcwn by knee 31' in FIG. 2. The other terminal sections as well as standoff wing 32 re~ain in the same configuration for both groups of SIP terminals.
Turning now to FIG. 3 of the included drawings, an explanation of the way by which the invention is used to advantage will be given. The SIP terminals are first assembled to the hybrid circuit by sliding each hybrid circuit accepting section 10 along the edge of hybrid circuit 50 until surfaces 13 and 14 contact respective contact pads.
The SIP terminals are arranged on the hybrid circuit 50 by placing the SIP terminal shown by FIG. 1 adjacent to a SIP terminal shown by FIG. 2. This arrangement orients half the SIP terminals with ` lZ~9671 each knee 31 in a first direction and the other half with each kn e 31' in a second direction. m is arrangement equalizes termlnal lateral pressure applied to the hybrid circuit when the SIP terminals are installed on the painted wiring card (PWC).
The hybrid circuit 50 including the SIP terminals is then installed on the PWC 60 by inserting each terminal section 10 into a respective .042 inch. diameter hole 61. During the insertion the apex of knee 31 and 31' contacts the internal wall of hole 61 and slides down the wall until the apex projects slightly outward of the bottom periphery of PWC hole 61 and stand off wing 32 rests on the PwC. When fully inserted the slight outward projection of each knee 31 and 31' locks the SIP terminal in place retaining the asse~bly perpendicular to PWC 60. Solder may then be applied to each PWC hole 61 fixing as well as electrically connecting the hybrid circuit to the PWC.
Although the preferred embodlment of the invention has been illustrated, and that form described in detail, it will be readily apparent to those skilled in the art that various modifications may be made therein without departing from the spirit of the invention or from the scope of the appended claims.
_ PIN HYBRID CIRCUIT MCUNTING DEVI OE
-BACRGROUND OF THE INVENTICN
This invention relates in general to Single-In-Line Pin (SIP) hybrid circuit unting devices and more particularly to a SIP
device which fir~ly retains hybrid circuits in an upright p~sition in printed wiring cards during oomponent insertion and subsequent soldering operations.
Typically, electrical connections to thick/thin film hybrid circuits are made through wires or terminal devices such as SIP
devices. These devices are soldered onto a hybrid circui~s edge with an opposite end plugged into a socket or more likely, into holes in a Printed Wiring d (PWC).
This method finds disadvantage in that the hybrid circuits are not firmly retained in the PWC during the assembly operation and are therefore susceptible to dislodging from the PWC. Further, in many cases the hybrid circuits are not retained in an upright position (perpendicular to the PWC) and are soldered in a angular or displaced position interfering with the other components populating the PWC.
The final inspection of assembled PWC's required straightening those hybrid circuits not in a upright position in order to view and inspect the solder connections. The straightening of the hybrid circuit deformed the SIP device material exceeding its elastic limit and thereby increasing the susceptibility of the SIP leads to early failure as a result of other induced external stresses.
Accordingly, it is the object of the present invention to prcvide SIP device with a retentive feature which rigidly retains the hybrid circuit to the PWC during assembly, handling and soldering operations.
. ~
` lZ3~671 SUMM~RY OF THE INVEN~TIoN
In accomplishing the object of the present invention there is provided on improved terminal device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film hybrid circuit to a printed wiring card. The planar substrate includes at least one terminal pad located adjacent an edge of the substrate. The printed wiring card includes a top and a bottcm surface and at least one plated through hole extending between the printed wiring card top and bottom Æ faces.
The terminal device includes a substrate accepting section arranged to accept the edge of the substrate and engage the term mal pad; retaining and connecting the terminal device to the substrate. A
terminal section including standoff means extends from the terminal section.
The improvement comprises, retentive means formed on the terminal section in spaced relationship to the standoff means. m e terminal section is fully inserted into the printed wiring card hole allcwm g the standoff means to rest on the printed wiring card top surface and a portion of the retentive means to extend outward of the printed wiring card hole engaging the printed wiring card kottom surface, retaining and connecting the te i l device to the printed wiring card.
BRIEF DESCRI TICN OF THE DR~ING
FIG. 1 is an elevational view of a Single-In-Line Pin (SIP) terminal device including the present invention and embodying a retentive form in a first direction.
~;~3~67~
FIG. 2 is an elevational view of the SIP terminal device of FIG. 1 embodying a retentive form in a secor~d direction.
FIG. 3 is an elevational view of the SIP terminal devices of FIG. 1 ard FIG. 2 as would be used to advantage in a hybrid circuit assembly.
DESCRIPTICN OF THE PFE~3~gED E~D~DIMENT
Turning now to FIG. l, a Single-In-Line (SIP) terminal device of the type to which the present invention may be used to advantage is illustrated. m e SIP terminal is characterized by three major sections defined generally as the hybrid accepting section lO, the compliant section 20 and the terminal sectio~ 30.
The hybrid accepting section comprises a U-shaped member having parallel arms 11 and 12 arranged to accept an edge of a hybrid circuit therebetween. It should be noted that the hybrid circuit in this embodiment is a thick/thin fi~m circuit formed on a ceramic substrate which includes metalized contact pads formPd adjacent one edge of the substrate. Contact surfaces 13 and 14 of arms 11 and 12 respectively normally make intimate contact with the metalized contact pads of the hybrid circuit electrically connecting the hybrid circuit to the SIP terminal.
The compliant section 20, also comprises a U-shaped member disposed perpendicularly to the hybrid accepting section 10. The cc~pliant section buffers any flexuxe or displacement of the printed wiring card (PWC) relative to an installed ~ybrid circuit and thus prevents the full induction of forces to the ceramic substrate material.
lZ3967~
The terminal section 30 which is normally configured as a vertical strip member embodies the present invention. The present invention is realized by forming a lower portion of the terminal section 30 into an indented form or knee 31. A standoff wing 32 extends from a side ~11 of the upper portion of terminal section 30.
A second standoff wing may also be included extending from an opposite side wall.
It should be noted that the SIP terminal device just described is oonstructed from a single stamping of a phosphor bronze material which is finished in a 60/40 tin lead electroplate. The stamping is then formed into the shape described and shown.
In order to use the invention to advantage two different knee orientations are formed. On a first group of SIP terminals the knee is formed in the direction as shown by knee 31 in Fig. 1. On a second group of SIP terminals the knee is formed in a second opposite direction as shcwn by knee 31' in FIG. 2. The other terminal sections as well as standoff wing 32 re~ain in the same configuration for both groups of SIP terminals.
Turning now to FIG. 3 of the included drawings, an explanation of the way by which the invention is used to advantage will be given. The SIP terminals are first assembled to the hybrid circuit by sliding each hybrid circuit accepting section 10 along the edge of hybrid circuit 50 until surfaces 13 and 14 contact respective contact pads.
The SIP terminals are arranged on the hybrid circuit 50 by placing the SIP terminal shown by FIG. 1 adjacent to a SIP terminal shown by FIG. 2. This arrangement orients half the SIP terminals with ` lZ~9671 each knee 31 in a first direction and the other half with each kn e 31' in a second direction. m is arrangement equalizes termlnal lateral pressure applied to the hybrid circuit when the SIP terminals are installed on the painted wiring card (PWC).
The hybrid circuit 50 including the SIP terminals is then installed on the PWC 60 by inserting each terminal section 10 into a respective .042 inch. diameter hole 61. During the insertion the apex of knee 31 and 31' contacts the internal wall of hole 61 and slides down the wall until the apex projects slightly outward of the bottom periphery of PWC hole 61 and stand off wing 32 rests on the PwC. When fully inserted the slight outward projection of each knee 31 and 31' locks the SIP terminal in place retaining the asse~bly perpendicular to PWC 60. Solder may then be applied to each PWC hole 61 fixing as well as electrically connecting the hybrid circuit to the PWC.
Although the preferred embodlment of the invention has been illustrated, and that form described in detail, it will be readily apparent to those skilled in the art that various modifications may be made therein without departing from the spirit of the invention or from the scope of the appended claims.
Claims (4)
1. In improved terminal device for mechanically retaining and electrically connecting a planar substrate to a printed wiring card, said planar substrate including at least one terminal pad located adjacent one edge of said substrate and said printed wiring card including a top and a bottom surface, said terminal device including a substrate accepting section arranged to accept said edge of said substrate engaging said terminal pad retaining and connecting said terminal device to said substrate and a terminal section including standoff means extending from said terminal section, the improvement comprising:
retentive means formed on said terminal section in spaced relationship to said standoff means wherein said terminal section is inserted into said printed wiring card hole and said standoff means rests on said printed wiring card top surface and a portion of said retentive means extends outward of said printed wiring card hole engaging said printed wiring card bottom surface retaining and connecting said terminal device to said printed wiring card.
retentive means formed on said terminal section in spaced relationship to said standoff means wherein said terminal section is inserted into said printed wiring card hole and said standoff means rests on said printed wiring card top surface and a portion of said retentive means extends outward of said printed wiring card hole engaging said printed wiring card bottom surface retaining and connecting said terminal device to said printed wiring card.
2. An improved first terminal device for mechanically connecting a planar substrate to a printed wiring card, said planar substrate including at least a first terminal pad located adjacent one edge of said substrate and said printed wiring and including a top and a bottom surface and at least a first plated through hole extending between said printed wiring card top and bottom surfaces, said first terminal device including a substrate accepting section arranged to accept said edge of said substrate engaging said terminal pad, retaining and connecting said first terminal device to said substrate and a terminal section including at least one standoff wing extending from said terminal section, the improvement comprising:
a V-shaped knee extending in a first direction formed on said terminal section in spaced relationship to said standoff wing, wherein said terminal section is inserted into said printed wiring card hole and said standoff wing rests on said printed wiring card top surface and a portion of said knee extends outward of said printed wiring card hole engaging said printed wiring card bottom surface retaining and connecting said first terminal device to said printed wiring card.
a V-shaped knee extending in a first direction formed on said terminal section in spaced relationship to said standoff wing, wherein said terminal section is inserted into said printed wiring card hole and said standoff wing rests on said printed wiring card top surface and a portion of said knee extends outward of said printed wiring card hole engaging said printed wiring card bottom surface retaining and connecting said first terminal device to said printed wiring card.
3. An improved terminal device as claimed in Claim 2, wherein: there is further provided a second terminal device substantially identical to said first terminal device and said knee extends in a second opposite direction and said substrate further includes a second terminal pad adjacent said first terminal pad arranged to accept said second terminal device substrate accepting section and said printed wiring card further includes a second plated through hole arranged to accept said second terminal device terminal section with a portion of said second terminal device knee extending outward of said printed wiring card second hole engaging said printed wiring card bottom surface retaining and connecting said second terminal device to said printed wiring card.
4. An improved terminal device as claimed in Claim 2, wherein:
said first terminal device and said second terminal device each are constructed of a conductive material as a one piece unit.
said first terminal device and said second terminal device each are constructed of a conductive material as a one piece unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66467384A | 1984-10-25 | 1984-10-25 | |
| US664,673 | 1984-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1239671A true CA1239671A (en) | 1988-07-26 |
Family
ID=24666962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000485608A Expired CA1239671A (en) | 1984-10-25 | 1985-06-27 | Single-in-line pin hybrid circuit mounting device |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1239671A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064379A (en) * | 1989-10-30 | 1991-11-12 | Amp Incorporated | Printed circuit board contact |
-
1985
- 1985-06-27 CA CA000485608A patent/CA1239671A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064379A (en) * | 1989-10-30 | 1991-11-12 | Amp Incorporated | Printed circuit board contact |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |