JPH06192894A - Soluble electrode - Google Patents

Abstract

PURPOSE:To pass a material to be plated stably between soluble anodes at a high speed by providing a through-hole in both sides of a plating material housing basket in the soluble anode of an electroplating device. CONSTITUTION:A steel strip as a cathode is passed between soluble anodes at a high speed, and a current is applied between the strip and the anodes to electroplate the strip with a metal. In this case, the pellet of a plating metal is placed in a basket 7 formed by an electrode frame 2 as a soluble anode 6, a Ti lath 1 is stuck to the surface opposed to the strip, hence a plating soln. is freely brought into contact with the pellet in the basket 7, and the plating metal ion is replenished. Plural through-holes 5 are formed in the lath, the plating soln. sucked up by a pump P is passed through a nozzle 4 and supplied to the lath surface, hence a negative pressure is not generated even when the strip passes between the soluble electrodes 6 at a high speed, and the strip is not fluttered but stably plated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fusible electrode provided in an immersion type vertical plating line such as an electroplated steel strip.

[0002]

2. Description of the Related Art A method in which a plating material such as nickel (Ni) or zinc (Zn) is made into a pellet and the soluble electrode in which the pellet-like plating material is housed in a basket is used as a soluble anode (positive electrode) is known. It is currently widely used in a batch plating process in which a metal is immersed in a plating solution for plating, which is used for plating caps and ornaments. Further, the above-mentioned method has come to be applied to a continuous plating treatment in which a strip is immersed in a plating solution and is passed at a high speed while plating is performed (Japanese Patent Publication No. Sho 5).
9-33679 gazette).

FIG. 4 is a diagram showing a part of the layout of the soluble anode described in Japanese Patent Publication No. 59-33679. As shown in FIG. 4, the strip 22 is guided by the plurality of deflector rolls 21 and passes through the plating solution (not shown) between the soluble anodes 20 at a high speed of 500 to 600 mpm or more.

FIG. 5 is a perspective view showing the soluble anode described in Japanese Patent Publication No. 59-33679 in section, with a part thereof omitted. The soluble anode 20 contains a pellet-shaped plating material 26 therein, and an opening 29 having a grid 28 is provided on one surface thereof, and a plating solution (not shown) is freely transmitted inside the opening 29. The membrane 27 is fixed. The soluble anode 20 is provided with an energization terminal 25, and a pellet-shaped plating material 26 is supplied from a pellet-shaped plating material tank (not shown).

The two soluble anodes 20 are arranged so that their openings 29 face each other, and the openings 29 face each other.
Guide the strip between and pass at high speed. At this time, by applying a positive current to the current-carrying terminal 25 of the soluble anode 20, the pellet-shaped plating material 26 is electrically dissolved into metal ions (not shown). The metal ions pass through the film 27 and are electrodeposited on the surface of the strip 22 to plate the strip 22.

[0006]

In the prior art described above, the continuous plating process is performed while continuously passing the strips 22 between the soluble anodes 20 at a high speed of 500 to 600 mpm or more. Negative pressure is generated between the strip 20 and the strip 22 to generate a strong flow of the plating solution. Due to this strong flow, the strip 22 is agitated, and a pressure imbalance occurs in the plating tank that acts on the front and back surfaces of the strip 22 to cause the strip 22.
There is a problem that fluttering occurs, which makes it difficult to stably pass the strip 22.

In view of the above circumstances, it is an object of the present invention to provide a fusible electrode in which a strip stably passes between them even at a high speed.

[0008]

The fusible electrode of the present invention for achieving the above object is a fusible electrode of an immersion type vertical plating line, which is formed from one surface of a basket for accommodating a plating material facing a strip. It is characterized in that it has a through-hole penetrating the other surface facing the one surface.

Here, it is preferable to provide a pump for spraying the plating solution to the strip through the through hole.

[0010]

Since the fusible electrode of the present invention is provided with the through hole on the surface of the basket facing the strip, the negative pressure generated when the strip passes between the fusible electrodes causes the through hole toward the strip. The plating solution flows from the plate, and the flowing plating solution reduces the negative pressure generated between the soluble electrode and the strip by passing the strip at a high speed to reduce the pressure imbalance in the plating tank.

It is more effective if the soluble electrode of the present invention is provided with a pump and the plating solution is sprayed onto the strip.

[0012]

EXAMPLES Examples of the present invention will be described below. FIG. 1 is a front view of a soluble electrode of an example of the present invention, FIG. 2 is a view seen from the AA direction of FIG. 1, and FIG. 3 is a view seen from the BB direction of FIG. The soluble electrode 6 includes a basket 7 for accommodating a plating material (not shown), a titanium lath 1 provided on one surface of the basket 7 facing a strip (not shown), through which the plating material melts and penetrates. 16 through holes 5 opened on the same surface as the titanium lath 1,
The electrode frame 2 is provided above and below the titanium lath 1. Further, the plating solution supply duct 3 is provided on the right side of the soluble electrode 6 in FIG. 2, and the nozzle 4 is provided on the right side of the plating solution supply duct 3. A plating liquid (not shown) is fed into the nozzle 4 by a pump P via a pipe 8 shown by a dotted line. The effective plating surface is the titanium lath 1.

The soluble electrode 6 is supplied with a plating solution pumped up from a plating tank by a pump P installed outside a plating tank (not shown) to a nozzle 4 to pass through the plating solution supply duct 3 and through holes. It is sprayed from No. 5 and sprayed on the strip. The fusible electrodes 6 were placed in a plating bath (not shown) as a pair as shown in FIG. 4 so that the titanium laths 1 face each other, and were used in a continuous nickel plating facility (not shown). In this case, even if a strip (not shown) passed between the soluble electrodes 6 at a high speed of 800 mpm or higher, stable stripping was possible with almost no fluttering.

Also, for comparison, a fusible electrode without through holes 5 was used in a continuous nickel plating facility (not shown). In this case, a strip (not shown) between the fusible electrodes having no through holes 5 is 500 mpm to 600 m.
If it passes at pm or more, fluttering occurs and stable striping is difficult. In this embodiment, the through hole 5 has a cylindrical shape, but the present invention is not limited to this, and it is needless to say that an appropriate shape can be selected as necessary.

Further, the plating liquid supply duct 3 and the nozzle 4 are not necessarily required, and a pump P may be connected to each through hole 5. Furthermore, the soluble electrode 19
Even if the pump P is not provided in the
Due to the negative pressure generated when passing through the gap, the plating liquid flows from the nozzle 4 to the titanium lath 1 through the through hole 5.
This flow also has the effect of stabilizing the passage of the strip.

[0016]

As described above, in the soluble electrode of the present invention, since the plating solution flows from the through hole of the basket toward the strip to be plated, the flowing plating solution reduces the negative pressure. It also reduces the pressure imbalance in the plating tank. Therefore, the strip can stably pass between the fusible electrodes even at a high speed, and the efficiency of plating the strip is improved.

It will be more effective if the soluble electrode of the present invention is provided with a pump and the plating solution is sprayed from the through hole to the strip by the pump.

[Brief description of drawings]

FIG. 1 is a front view of an example of a soluble electrode of the present invention.

FIG. 2 is a view seen from the direction AA of FIG.

FIG. 3 is a view as seen from the BB direction in FIG.

FIG. 4 is a diagram showing a part of a layout diagram of a soluble anode described in JP-B-59-33679.

FIG. 5 is a perspective view showing a cross section of a soluble anode described in Japanese Patent Publication No. 59-33679 and a part thereof is omitted.

[Explanation of symbols]

 1 Titanium Lath 2 Electrode Frame 3 Plating Liquid Supply Duct 4 Nozzle 5 Through Hole 6 Soluble Electrode 7 Basket 8 Piping P Pump

Claims (2)

[Claims] 1. A fusible electrode of an immersion type vertical plating line is provided with a through hole penetrating from one surface facing a strip to the other surface facing the strip of a basket containing a plating material. Soluble electrode. 2. The fusible electrode according to claim 1, further comprising a pump for spraying a plating solution onto the strip through the through hole.