JPH06188583A - Heat dissipating structure of module - Google Patents

Abstract

PURPOSE:To effectively dissipate heat released from modules by a method wherein a heat transfer board is provided to discharge heat generated inside the modules toward a base board, and the base board and a mounting wall are made to serve also as a heat sink. CONSTITUTION:A heat transfer board 25 formed of material such as aluminum or the like high in thermal conductivity is made to transfer heat released from a heat releasing electronic part to a base board 10. In a module 20, heat released from an electronic part is conducted to base board 10 via the heat transfer board 25 and dissipated through a mounting wall. By this setup, heat released from the modules 20 can be effectively dissipated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus in which a system is composed of a large number of modules such as a sequencer, and more particularly to an improvement for efficiently radiating heat inside the modules.

[0002]

2. Description of the Related Art There are various types of module devices, such as a power supply module, a CPU module, an I / O module and a communication module, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2-87596 proposed by the present applicant. These are mounted on a base plate having a bus to form a system. In such a device, if the density of electronic circuits inside the module is increased, the power consumption per module will increase, and unless it is cooled efficiently, the temperature rise will become significant and the operation of electronic parts will be hindered. was there.

[0003]

DISCLOSURE OF THE INVENTION Problem to be Solved by the Invention
As disclosed in Japanese Laid-Open Patent Publication No. 61997, a heat sink is mounted on each module and electronic components that generate heat. However, when the amount of heat generation increases, there is a problem that the heat sink becomes large and becomes an obstacle to the miniaturization of the module. Further, as disclosed in Japanese Utility Model Laid-Open No. 4-47295, there is disclosed a technique for thermally radiating heat by thermally coupling each printed circuit board and a base plate having a bus. However, in the case of a module, the printed circuit board is housed inside a synthetic resin housing,
There has been a problem that it is difficult to thermally bond the printed board and the base board.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat dissipation structure for a module that can efficiently dissipate heat generated in each module and has a simple structure.

[0005]

According to the present invention which achieves the above object, a base plate 10 is provided with an upper locking portion 11 and a lower locking portion 12 to which modules are locked. A connector 13 provided, a backboard 14 having a bus for connecting the respective poles of these connectors, and a module made of a material having a high thermal conductivity provided between the backboard and the upper locking portion or the lower locking portion. Abutment surface 15
It also has a wall abutment surface 16 provided on the back surface of the module abutment surface.

The module 20 has a printed circuit board 21 on which an electronic circuit for generating heat is mounted, a base connector 22 connected to the connector provided on the back side of the printed circuit board, and a heat generating portion of the printed circuit board. The heat transfer plate 25 has a heat receiving surface 251 that is in thermal contact with the base contact surface 253 that is in contact with the module contact surface.

[0007]

In the present invention, the base plate is provided with the module contact surface, and the heat generated inside the module mounted on the connector is received by the base plate side and escaped from the wall contact surface. The module side is provided with a heat transfer plate that collects the heat generated by the printed board on the heat receiving surface and transfers it to the base contact surface. Accordingly, even if heat is generated in the printed circuit board, the heat can be released to the base plate and the base contact surface only needs to be exposed in the housing of the module, which simplifies the structure.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. Figure 1
FIG. 2 is a perspective view showing the structure of an embodiment of the present invention, and FIG. In the figure, a base plate 10 is for mounting a large number of modules 20 and fixing it to another wall such as an instrumentation board. As a main material, a material having a high thermal conductivity such as aluminum and relatively easy to process is used. It is used. The upper locking portion 11 is a convex portion provided on the upper end of the base plate 10, and is formed in the entire width direction of the base plate 10 here. The lower engaging portion 12 is a convex portion provided at the lower end of the base plate 10, and here the module mounting place of the base plate 10 is substantially determined. The connector 13 is connected to each module, and is attached to a printed circuit board called a backboard 14 here at intervals corresponding to the width of the module. The backboard 14 is provided with a bus that connects the respective poles of the connector 13. The module contact surface 15 is formed between the backboard 14 and the lower locking portion 12, and the bulk material of the base plate 10 is processed flat to facilitate heat transfer. The wall abutment surface 16 is provided on the opposite side of the module abutment surface 15, and has a shape that requires less heat resistance with the mounting wall 30 facing the instrumentation board 30 when the wall abutment surface 16 is attached. There is.

The module 20 is shown in FIG. 1 with the housing 27 removed. The printed circuit board 21 is accommodated in the module 20 in a posture perpendicular to the base plate 10, and the heat-generating electronic component 211 is mounted on the front side. The heat generating electronic component 211 includes, for example, an output transistor in a contact signal input / output circuit, and the high-density element includes a surface mount component SMD. The base connector 22 is provided on the back side of the printed board 21, and is connected to the connector 13 on the base plate 10 side. The input / output connector 23 is provided on the front side of the printed circuit board 21, and is equipped with a connector (not shown) that bundles signal lines connected to external devices. The terminals 231 are the terminals of the input / output connector 23 and the printed circuit board 2
1 is a conductor that connects to the circuit provided in FIG. Display unit 2
Reference numeral 4 is provided on the front side of the printed circuit board 21, and has display elements such as LEDs for displaying the signal states of the terminals handled by the input / output connector 23 or the base connector 22.

The heat transfer plate 25 transfers the heat generated by the heat generating electronic component 211 to the base plate 10, and is made of a material having a high thermal conductivity such as aluminum. The heat receiving portion 251 is provided on the back side of the printed circuit board 21 and in the vicinity of the mounting portion of the heat-generating electronic component 211, and the insulating sheet 26 may be interposed when the electrical resistance is kept low and the thermal resistance is kept low. . The radiating fins 252 are provided on the opposite side of the heat receiving portion 251, and are responsible for a part of heat radiation inside the module to reduce the thermal load on the base plate 10. The base contact surface 253 is positioned so as to be exposed on the back surface of the module housing 27, and is in thermal contact with the module contact surface 15. The housing 27 covers the printed circuit board 21 and is provided with locking means (not shown) such as screws and latches for attaching to the upper locking portion 11 and the lower locking portion 12 of the base plate 10.

The operation of the thus constructed device will be described below. FIG. 3 is a block diagram illustrating the heat transfer mechanism.
Here, five modules 20 are mounted on the base plate 10, but one module is a low heat type module 20 'having a low calorific value.
Then, the other four units are the above-mentioned module 20. In the low heat type module 20 ′, the heat transfer plate 25 is not provided because the temperature rise is within the allowable range without transferring heat to the base plate 10. In the other module 20, the heat generated in the electronic component 211 is conducted by the heat transfer plate 25, is transmitted to the base plate 10, and is radiated to the mounting wall 30. In addition,
Although the base plate 10 is attached to the attachment wall 30 using the screws 31, it may be fitted or adhered. The outline of the heat transfer mechanism is as follows. Heat generating electronic component → heat transfer plate 25 → module contact surface 15 → wall contact surface 16 → mounting wall Since the heat is exhausted to the outside of the module by this flow, the temperature rise inside the module can be suppressed within an allowable limit.

[0012]

As described above, according to the present invention, the heat transfer plate is provided and the heat generated inside the module is discharged to the base plate side, and the base plate and the mounting wall are also used as a heat sink. Therefore, even if a large amount of heat is generated inside the module, the temperature rise can be suppressed, and the practical effect is great. For example, in the experiment conducted by the present inventor, the temperature rise ΔT of the electronic component was 100 ° C. without the heat transfer plate, but the temperature rise ΔT was 60 when the heat transfer plate was provided.
Only ° C, the module can be downsized and its effect is great.

[Brief description of drawings]

FIG. 1 is a configuration perspective view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a state where the module is attached to the base plate.

FIG. 3 is a block diagram illustrating a heat transfer mechanism.

[Explanation of symbols]

 10 Base Plate 15 Module Contact Surface 16 Wall Contact Surface 20 Module 21 Printed Circuit Board 25 Heat Transfer Plate

Claims (1)

[Claims] 1. An upper locking part (1) for locking a module.
1) and a lower locking part (12), a connector (13) provided corresponding to each module, a backboard (14) having a bus connecting each pole of these connectors, this backboard and an upper locking part Alternatively, the module abutment surface (1
5) and a base plate (10) having a wall contact surface (16) provided on the back surface of the module contact surface, and a printed circuit board (21) on which a heat generating electronic circuit is mounted,
A base connector (22) connected to the connector provided on the back side of the printed circuit board, and a heat receiving surface (251) for thermally contacting a heat generating portion of the printed circuit board and contacting the module contact surface. Base contact surface (25
A module (20) having a heat transfer plate (25) for conducting heat to 3), and a heat dissipation structure of the module.