JPWO2016103490A1 - Electronic equipment and electronic equipment system - Google Patents

Abstract

The control board on which the electronic components are mounted and the base unit 200 are formed so as to be connected to the ground, and are connected to the frame ground pattern in the control board, and are separated from the frame ground plate 12. The first heat radiating plate 11 is provided and connected to the ground pattern of the control board. The first heat radiating plate 11 is in contact with the base unit 200 independently of the frame ground plate 12. As a result, an electronic device having good heat dissipation and high noise resistance can be obtained.

Description

  The present invention relates to an electronic device and an electronic device system in which an industrial control device is mounted.

  2. Description of the Related Art Conventionally, an electronic device system in which an electronic device unit is attached to a base unit composed of a motherboard and a casing protecting the motherboard, that is, a unit attachment device is used. Among such electronic device systems, in a system using an industrial control device such as a programmable logic controller (PLC), an electronic device system is provided by mounting a large number of units on a base unit serving as a motherboard. Configure. In such an electronic device system, in addition to the stability of the mounting structure of the electronic device unit to the unit mounting device, noise resistance and heat dissipation of the control device are required.

  For example, Patent Document 1 discloses a technique of installing a shield metal plate so as to cover a printed board in an input / output unit of an industrial control device and grounding the base unit sheet metal via the metal plate.

Japanese Patent Laid-Open No. 11-346075

  However, according to the technique disclosed in Patent Document 1, since the shield metal plate is installed so as to cover the printed board, there is a problem that the printed board or the electronic components on the printed board are easily affected by noise. Moreover, heat dissipation was not sufficient.

  This invention is made | formed in view of the above, Comprising: It aims at obtaining an electronic device and an electronic device system with favorable heat dissipation and high noise tolerance.

  In order to solve the above-described problems and achieve the object, the present invention provides a control board on which electronic components are mounted, a frame ground plate connected to a frame ground pattern in the control board, and a frame ground plate. The first heat dissipating plate is provided so as to be spaced apart and connected to the ground pattern of the control board, and the first heat dissipating plate and the frame ground plate are electrically attached to the base unit independently. It is characterized by that.

  According to the present invention, it is possible to obtain an electronic device and an electronic device system having good heat dissipation and high noise resistance.

1 is a perspective view showing an external appearance of an electronic apparatus according to a first embodiment. 1 is an exploded perspective view of an electronic device according to a first embodiment. 2A is a schematic cross-sectional view taken along the line AA in FIG. 2, and FIG. 2B is a schematic cross-sectional view taken along the line BB in FIG. The principal part expansion perspective view of the electronic device concerning Embodiment 1. FIG. FIG. 3 is a top view of the electronic apparatus according to the first embodiment. FIG. 3 is a perspective view showing a first control board of the electronic device according to the first embodiment. 1 is an exploded perspective view of a first control board of an electronic device according to a first embodiment. The perspective view of the 2nd control board of the electronic device concerning Embodiment 1. FIG. (A) And (b) is a perspective view which shows the mounting process to the base unit of the electronic device concerning Embodiment 1. FIG. The principal part enlarged view at the time of mounting to the base unit of the electronic device concerning Embodiment 1 (A) And (b) is a principal part expanded sectional view of the support structure of the mounting part to the base unit of the electronic device concerning Embodiment 1. FIG. FIG. 3 is a schematic cross-sectional view of an electronic apparatus according to a second embodiment, where (a) is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a schematic cross-sectional view of an electronic apparatus according to a third embodiment, where (a) is a cross-sectional view taken along the line AA in FIG. FIG. 5 is a schematic cross-sectional view of an electronic apparatus according to a fourth embodiment, where (a) is a cross-sectional view taken along the line AA in FIG. FIG. 6 is a schematic cross-sectional view of an electronic apparatus according to a fifth embodiment, where (a) is a cross-sectional view taken along the line AA in FIG. The figure which shows the modification of the 2nd thermal radiation plate of Embodiment 1. The figure which shows the modification of the 2nd thermal radiation plate of Embodiment 1.

  Hereinafter, an electronic device and an electronic device system according to embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an external appearance of an electronic apparatus according to Embodiment 1 of the present invention. 2 is an exploded perspective view of the electronic apparatus, FIG. 3A is a schematic cross-sectional view of the main part showing the AA cross section of FIG. 2, and FIG. 3B is a cross section of the electronic device BB of FIG. FIG. 4 is a schematic cross-sectional view of an essential part, and FIG. 4 is an enlarged perspective view of an essential part of the electronic apparatus. FIG. 5 is a top view of the electronic apparatus. 6 is a perspective view illustrating a first control board of the electronic device, FIG. 7 is an exploded perspective view of the first control board of the electronic device, and FIG. 8 is a first view of the electronic device according to the first embodiment. FIGS. 9A and 9B are perspective views showing the mounting process of the electronic device according to the first embodiment to the base unit, and FIG. 10 shows the electronic according to the first embodiment. It is a principal part expansion perspective view at the time of mounting | wearing to the base unit which served as the unit attachment apparatus of the apparatus. FIG. 11 is an enlarged cross-sectional view of a main part of a support structure for a mounting portion to the base unit of the electronic device according to the first embodiment.

  As shown in FIG. 1, an electronic device 100 according to the first embodiment is connected to a base unit 200 and constitutes an electronic device system. In the present embodiment, as shown in FIGS. 2, 3A, and 3B, the first control board 10 that is the control board is connected to the base unit 200 independently of each other. It has a plate 11 and a frame ground plate 12. FIGS. 3A and 3B are diagrams for explaining the concept of the present embodiment, and show only the main part. The first control board 10 which is a control board on which electronic components are mounted is disposed opposite to the second control board 20 and is housed in a resin case housing 50 as shown in FIG. The case lid 51 is attached. Two faceplates 55 constituting the front surface of the case lid 51 are formed with two connector holes 55.

  FIG. 4 is an enlarged perspective view of a main part of the electronic device, and FIG. 5 is a top view of the electronic device. In the electronic apparatus according to the present embodiment, the first control board 10 on which the electronic component 15 constituting the control IC (Integrated Circuit) made up of the power semiconductor device is mounted, and the first control board 10 on which the electronic component 25 is mounted. Two control boards 20 are arranged opposite to each other. The first and second control boards 10 and 20 are fixed by screws 43 penetrating both at the peripheral edge. At this time, if the screw 43 is mounted so as to penetrate a grounding plate (not shown) embedded in the first and second control boards 10 and 20, the first and second control boards 10 and 20 are provided by the screw 43. Common ground potential. Although this ground plate will be described later, it is a conductive plate that is embedded in the multilayer wiring board constituting the first and second control boards 10 and 20 and maintains the ground potential.

  The first and second control boards 10 and 20 are fixed so as to be separated from each other so that the mounting surface of the electronic component 15 such as a control IC is inside with the first heat radiating plate 11 interposed therebetween. As shown in FIG. 5, this fixing is performed by connecting screws 41 and 42 that form conductive columns penetrating the first and second control boards 10 and 20.

  As shown in the enlarged view of the main part in FIG. 4, the first heat radiating plate 11 is fixed to the second heat radiating plate 40 through the insulating heat transfer sheet 30. The second heat radiating plate 40 is inserted into a groove 50 v provided on the back surface of the case housing 50 that houses the first control board 10, and is screwed to the mounting hole 52 of the case housing 50 with a screw 53.

The second heat radiating plate 40 is composed of a rod-shaped body made of a copper plate, has a U-shaped screw insertion hole 40h as a locking portion at the tip, and constitutes a first region _RA connected to the base unit 200. doing. _A first region _RA where the second heat dissipating plate 40 provided at the end of the first control board 10 is connected to the base unit 200, and a second region where the frame grounding plate 12 is connected to the base unit 200. the region R _B, are located at different ends of the upper same end surface of the case housing 50. The end surface of the case housing 50 is a surface facing the base unit 200.

The first region _RA is mounted on the base unit 200 so as to be above the first control board 10. Thereby, it is easy to radiate the heat from the electronic component directly to the outside.

  The second heat dissipating plate 40 is a conductive rod-like body, has a screw insertion hole 40h at one end, does not require positioning when connected to the first heat dissipating plate 11, and the insulating heat transfer sheet 30. It can be mounted very easily by stopping with screws 53 via

  As shown in the perspective view of FIG. 6 and the exploded perspective view of FIG. 7, the first control board 10 is formed of a printed wiring board made of a multilayer wiring board, and a circuit pattern (not shown) is formed. As the multilayer wiring board, there is used a board in which a grounding plate for signal line grounding and a frame grounding plate are disposed and laminated with resin-impregnated fibers called prepreg interposed therebetween. The frame ground plate 12 is connected to the first control board 10 by screws 44 penetrating the first control board 10. The first heat radiating plate 11 is connected to the ground pattern on the first control board 10, and the screw 42 penetrates the first control board 10 to be connected to the internal ground plate. . On the circuit pattern (not shown), the electronic component 15 constituting the control IC, the other IC 16 and the connector 17 are mounted.

  The first heat radiating plate 11 is made of a copper plate and is provided on the first surface 10A side of the first control board 10 so as to face the first surface 10A of the first control board 10. The first heat radiating plate 11 has a plate main body 11 a and a contact piece 11 b that is bent at one end of the plate main body 11 a and contacts the second heat radiating plate 40. The abutting piece 11 b is abutted against the second heat radiating plate 40 via the insulating heat transfer sheet 30. The contact piece 11b is formed of an integrally formed body that is continuously extended from one end of the plate body 11a of the first heat radiating plate 11. The contact piece 11b is bent 90 degrees with respect to the first heat radiating plate 11 so as to follow the shape of the end surface of the case housing 50.

  The frame ground plate 12 is made of a steel plate, is formed so as to be groundable to the base unit 200, and is connected to a frame ground pattern 10c in the first control board 10 as shown in FIG. The first heat radiating plate 11 is provided to be separated from the frame ground plate 12 and is connected to a ground pattern (not shown) of the first control board 10. And as shown to Fig.7 (a) and (b). The electronic component 15 is mounted on the first control board 10, and the back surface of the electronic component 15 is in contact with the first heat radiating plate 11 via the insulating heat transfer sheet 31.

  Insulating heat transfer sheets 30 and 31 may be made of a non-silicone material such as a laminated structure of an adhesive heat conductive low-hardness acrylic layer and a non-adhesive heat conductive acrylic layer. it can. By using a non-silicone material, good heat dissipation is exhibited without generating siloxane gas. In addition to a single-sided adhesive sheet, a non-adhesive thermally conductive acrylic layer sandwiched on both sides by an adhesive thermally conductive low-hardness acrylic layer can also be used.

  As shown in the perspective view of FIG. 8, the second control board 20 is formed of a printed wiring board similarly to the first control board 10, and a circuit pattern (not shown) is formed. The second control board 20 is also a multilayer wiring board in which a grounding plate for signal line grounding and a frame grounding plate are disposed inside and laminated with resin-impregnated fibers called prepregs interposed therebetween. An electronic component 25, another IC 26, and a connector 27 constituting a control IC are mounted on a circuit pattern (not shown).

  Since the first and second control boards 10 and 20 pass through the first heat radiating plate 11 and the second control board heat radiating plate 21 by connecting screws 41 and 42 and are connected and fixed, the first and second control boards 10 and 20 are reduced in size. In addition, the heat dissipation and noise resistance of the first control board 10 and the second control board 20 are further improved while the thickness is reduced.

The electronic device 100 formed in this way is mounted on a base unit 200 that is mounted on a wall surface using a mounting hook (not shown) to constitute an electronic device system. FIG. 9 is a diagram illustrating a mounting process of the electronic device to the base unit. FIG. 9A is a perspective view showing the base unit 200 before the electronic device 100 is mounted. FIG. 9B is a perspective view showing the base unit 200 after the electronic device 100 is mounted. The base unit 200 includes a metal unit casing 201 and a mother board 204 attached to the unit casing 201. A connector 220 is arranged on the first main surface 204A of the motherboard 204. The back surface which is the second main surface 204B of the motherboard 204 is a wall surface. The connector 120 of the electronic device 100 is connected to the connector 220 to complete the electronic device system. As shown in the enlarged view of the main part when the electronic device 100 is attached to the base unit 200 in FIG. 10, the upper side surface portion 201a and the lower side surface portion 201b of the unit housing 201 of the base unit 200 are respectively The integrally formed metal first and second support pieces 202 a and 202 b are provided, and the first and second support pieces 202 a and 202 b are the first region _{RA at} the upper end of the electronic device 100 and the second at the lower end. the region R _B to support and fix.

FIGS. 11A and 11B are enlarged views of a main part of a support structure for mounting the electronic device 100 on the base unit 200. FIG. As shown in FIG. 11A, the first support piece 202a provided on the upper side surface 201a of the unit housing 201 of the base unit 200 is a first region at the upper end of the second heat dissipation plate 40 of the electronic device 100. It is engaged with an engagement piece 40 s provided on _RA , and is reliably thermally connected and fixed. The first heat dissipating plate 11, the insulating heat transfer sheet 30, and the second heat dissipating plate 40 are fixed by screws 53 inserted through the screw insertion holes 40h of the second heat dissipating plate. On the other hand, the second support piece 202b provided on the lower side surface 201b of the unit housing 201 of the base unit 200 is a second region of the frame ground plate 12 at the lower end of the electronic device 100 as shown in FIG. engaged with the engagement spring 13 of R _B, it is reliably electrically and thermally connected fixed.

  In the electronic device system obtained as described above, the heat from the electronic component 15 constituting the control IC of the electronic device 100 connected to the motherboard 204 of the base unit 200 is efficiently obtained, and the insulating heat transfer sheet It is conveyed to the first heat radiating plate 11 via 31, and is conveyed from the first heat radiating plate 11 to the second heat radiating plate 40 via the insulating heat transfer sheet 30. The second heat radiating plate 40 is radiated to the base unit 200 by engaging with the first support piece 202 a of the base unit 200. On the other hand, the frame ground plate 12 is grounded to the ground potential of the base unit 200 by engaging with the second support piece 202 b of the base unit 200 via the engagement spring 13.

  Thus, according to the present embodiment, the first heat radiating plate 11 that is connected to the signal line ground potential of the first control board 10 and radiates heat generated electronic components is connected to the frame ground plate 12 and the electric Insulating and independently connecting to the base unit 200 enables efficient grounding and heat dissipation, and it is possible to obtain an electronic device with good noise resistance and heat dissipation characteristics. That is, since the first heat radiating plate 11 of the first control board 10 is electrically independent of the frame ground plate 12, it is not affected by the mutual noise. In addition, while efficiently dissipating heat from electronic components, it is less susceptible to external noise. Accordingly, it becomes easy to suppress the generation of noise from the electronic component mounted on the control board to the inside and outside.

  In addition, the engagement spring 13 at the tip of the frame ground plate 12 and the second heat dissipation plate 40 connected to the first heat dissipation plate 11 also serve as an engaging portion that engages with the base unit 200 on which the electronic device 100 is mounted. Therefore, the configuration is simple and the mounting workability is good.

  In addition, the electronic device 100 is securely engaged with the base unit 200 by contacting the upper portion with the second heat radiating plate 40 and engaging the engaging spring 13 of the frame grounding plate 12 with the lower portion. The surface can be fixed to the surface, and mounting is easy and stable. Here, the upper part means a part located on the upper side when mounted on the base unit 200, and the lower part means a part located on the lower side.

  The frame grounding plate 12 of the electronic device 100 includes an engagement spring 13 made of a leaf spring, and the engagement spring 13 is spring-joined to the support piece 202b of the base unit 200, so that the electronic device is further added to the electronic device system. Mounting workability can be improved.

  The second heat radiating plate 40 is inserted into a groove 50 v provided on the back surface of the case housing 50 that houses the first control board 10, and is insulated from the first heat radiating plate 11. However, the first heat radiating plate 11 may be screwed with screws 53 via the insulating heat transfer sheet 30. By screwing, the thermal contact property becomes stronger and the heat dissipation is improved.

Further, since the first region _RA is mounted on the base unit 200 so as to be above the first control board 10, the heat from the electronic component is transferred to the upper side of the base unit 200. Easily dissipates heat efficiently.

In the above embodiment, the first region _RA is formed above the first control substrate 10, but the first region _RA is below the first control substrate 10. It may be formed. Thereby, noise resistance is improved. Further, it is easy to efficiently dissipate heat from the electronic components mounted below the first control board 10 to the outside from the lower part of the base unit 200.

  Since the first heat radiating plate 11 is integrally formed with the plate main body 11a and the contact piece 11b that stands 90 degrees with respect to the plate main body 11a, the assembly is easy and the number of components is reduced. Further, the plate body 11a and the contact piece 11b may be configured separately and connected by a connection method such as screwing.

  In addition, although the 1st heat radiating plate 11 was comprised with the contact body 11b which stands 90 degree | times with respect to the plate main body 11a and the plate main body 11a, you may comprise with a flat plate. Since the first heat radiating plate 11 is a plate-like body mainly composed of a flat surface having no fins, the air permeability inside the housing is good and the air flow between the electronic parts is good. High cooling effect. Further, by eliminating the contact piece 11b that stands up from the plate body 11a and forming a flat plate, manufacture is easy and assembly is facilitated.

  Moreover, since the 2nd heat radiating plate 40 is comprised with the electroconductive rod-shaped body which consists of copper plates, an assembly is easy and the heat dissipation from an electronic component improves. The second heat radiating plate 40 is not limited to a copper plate, but may be other conductive material such as aluminum or aluminum alloy. Further, although the insulating heat transfer sheet 30 is interposed between the first and second heat radiation plates 11 and 40, the base unit 200 and the first heat radiation plate 11 can be connected by using a conductive heat conduction sheet. It is possible to connect electrically, and signal line grounding can also be performed on the base unit 200.

  The second heat radiating plate 40 is fixed to the base unit 200 by engaging with the first support piece 202a of the base unit 200. Therefore, the second heat radiating plate 40 is less likely to be displaced, and the electronic device 100 can be attached to the base unit. Easy. The shape of the first support piece 202a may be a groove shape and can be selected as appropriate.

  Further, the first heat radiating plate 11 is connected to the second heat radiating plate 40 via the insulating heat transfer sheet 30, and the second heat radiating plate 40 also serves as the signal line grounding portion of the base unit 200. Although it is engaged with the first support piece 202a of the case, in the case of earthquake resistance, it is fixed more firmly by using screwing for the case earthquake resistance, and the heat dissipation can be improved. .

  As the frame ground plate, a steel plate, or a conductive plate-like body such as stainless steel or phosphor bronze is applicable. Also. As the first and second heat dissipation plates, a conductive plate-like body such as an aluminum plate in addition to a copper plate can be applied. In consideration of workability and assembly, the first and second heat radiating plates may be composed of the same member or may be composed of different members.

  In the above embodiment, the first and second control boards 10 and 20 are used. However, the present invention can also be applied to the case where one control board is used.

As described above, according to the present embodiment, the following effects are achieved.
(1) Since the heat dissipation becomes good and it is not necessary to increase the insulation distance, the first heat radiating plate can be mounted closer to the control board and the case housing 50 can be made smaller. Therefore, a structure that achieves both noise resistance and heat dissipation is possible even with a small-sized controller.
(2) The unit casing 201, which is a metal frame portion of the base unit 200, and the electronic device 100 are fixed using case-proof earthquake-resistant screws, so that a stronger fixation is possible, and cooling of the highly heat-generating electronic components is possible. The effect can be improved.
(3) Since the first heat radiating plate 11, that is, the heat sink is used as the ground potential, the insulation distance between the heat sink and the control board can be shortened, and the electronic component 15 constituting the control IC which is a high heat generating electronic component can be used. It becomes possible to improve the heat dissipation to the heat sink.

  That is, the base unit 200, the frame ground plate 12 for grounding the frame, and the first heat radiating plate 11 used for heat radiation of the high heat generating electronic components are separately provided, and the first heat radiating plate 11 is grounded to the signal ground of the substrate. In this way, when the first heat radiating plate 11 is at the ground potential, a structure that is not affected by noise while radiating the electronic components is realized. Further, by dissipating the heat from the first heat radiating plate 11 to the base unit 200, the heat radiating effect of the electronic component can be greatly improved by expanding the heat radiating area.

Embodiment 2. FIG.
In the electronic device of the second embodiment, as shown in the schematic cross-sectional views of FIGS. 12A and 12B, the first heat dissipating plate 11 is bent into a U shape at the end, and the second control board 20. The second heat dissipating part 11 </ b> S is configured to be opposed to the electronic component 25 of the second control board 20 via the insulating heat transfer sheet 31. The first heat radiating plate 11 and the second heat radiating portion 11S separately formed on the first surface side and the second surface side are respectively a signal (not shown) of the first and second control boards 10 and 20 with conductive columns and screws. Connected to ground pattern. 12A is a view corresponding to the AA cross section of FIG. 2, and FIG. 12B is a view corresponding to the BB cross section of FIG. Since other configurations are the same as those in the first embodiment, description thereof is omitted here.

  According to such a configuration, it is possible to obtain an electronic device that is easy to manufacture and highly assembled.

Embodiment 3 FIG.
In the second embodiment, the first heat dissipating plate 11 is bent in a U shape at the end portion to constitute the second heat dissipating portion 11S facing the second control board 20, whereas in the third embodiment, As shown in the schematic cross-sectional views of FIGS. 13A and 13B, the electronic device is configured such that the second heat dissipating part 11 </ b> S independently forms a second control board heat dissipating plate 21. The first heat dissipation plate 11 and the second heat dissipation plate 21 for the control board, which are separately formed on the first surface side and the second surface side, are the first and second control boards 10 and 20 with conductive columns and screws, respectively. Are connected to a signal ground pattern (not shown). One of the conductive columns is formed so as to penetrate and connect the first heat dissipation plate 11 and the second heat dissipation plate 21 for the control board. The separately formed heat dissipation plate is electrically connected together with the control board. 13A is a view corresponding to the AA cross section of FIG. 2, and FIG. 13B is a view corresponding to the BB cross section of FIG. Others are the same as those of the electronic device of the second embodiment, and thus description thereof is omitted here.

  According to this configuration, it is possible to obtain an electronic device that is easy to manufacture, easy to handle, and highly assembled.

Embodiment 4 FIG.
As shown in the schematic cross-sectional views of FIGS. 14A and 14B, the electronic device of the fourth embodiment is configured such that both surfaces of the first heat radiating plate 11 are the electronic component 15 of the first control board 10, the first The second embodiment is different from the first embodiment in that the electronic component 25 on the second control board 20 is fixed to the electronic component 25 via the insulating heat transfer sheet 31. The first heat radiating plate 11 abuts on the electronic component 15 on the first control board 10 on the first control board 10 side, and the electronic part on the second control board 20 on the second control board 20 side. 25 abuts. 14A is a view corresponding to the AA cross section of FIG. 2, and FIG. 14B is a view corresponding to the BB cross section of FIG. Since other configurations are the same as those in the first embodiment, description thereof is omitted here.

  According to such a configuration, since heat radiation and grounding for two sheets are performed with one heat radiation plate, the thickness can be further reduced.

Embodiment 5. FIG.
In the electronic device of the fifth embodiment, the first heat radiating plate 11 covers the first surface 10A side of the first control board 10 as shown in the schematic cross-sectional views of FIGS. 15 (a) and 15 (b). It has a first surface portion 11A and a second surface portion 11B that covers the second surface 10B side facing the first surface 10A, and electronic components are provided on both surfaces of the first control board 10 via an insulating heat transfer sheet 31. It is characterized by that. The first heat radiating plate 11 is bent in a U shape at the end so as to surround the first control board 10, and constitutes the second surface portion 11 </ b> B. The other electronic component 18 mounted on the second surface 10 </ b> B side of the first control board 10 is connected via an insulating heat transfer sheet 31. 15A is a diagram corresponding to the AA cross section of FIG. 2, and FIG. 15B is a diagram corresponding to the BB cross section of FIG. Since other configurations are the same as those in the first embodiment, description thereof is omitted here.

  According to such a configuration, it is possible to obtain an electronic device that is easy to manufacture and highly assembled.

Modified example.
The second heat radiating plate 40 has a U-shaped screw insertion hole 40h at one end. As shown in FIG. 16, as a modification of the second heat radiating plate 40 described in the first embodiment, You may make it have the U-shaped screw insertion hole 40h in both ends. Thereby, it is good also as a structure connected with the 1st heat radiating plate 11 at one end side, and connecting with the 1st support piece 202a of the base unit 200 at the other end side.

  In addition, as shown in FIG. 17 as a further modification of the second heat radiation plate 40 described in the first embodiment, the second heat radiation plate 40 includes a first heat radiation piece 40a and a second heat radiation piece 40b. A two-part structure may be used. Thereby, in Embodiment 3, it isolate | separates into the 1st heat radiating piece 40a connected to the 1st heat radiating plate 11, and the 2nd heat radiating piece 40b connected to the 2nd control board heat radiating plate 21 of an electronic device. To dissipate heat.

  In each of the above embodiments, the number of control boards is two, but it goes without saying that the number may be one or three or more.

  Furthermore, in each of the above embodiments, the first and second heat radiating plates and the second heat radiating plate and the base unit are connected via an insulating heat transfer sheet. A sheet may be used. As a result, the ground potential can also be made conductive with the base unit. Also, the frame ground potential and the signal line ground potential can be more efficiently divided by dividing the base unit into two parts at the top and bottom and insulating the divided base units.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

DESCRIPTION OF SYMBOLS 10 1st control board, 10A 1st surface, 10B 2nd surface, 10c Frame grounding pattern, 11 1st heat radiating plate, 11A 1st surface part, 11B 2nd surface part, 11a Plate main body, 11b Contact piece, 12 frame Ground plate, 13 engagement spring, 15, 25 electronic component, 16, 26 other IC, 17, 27 connector, 20 second control board, 21 second heat dissipation plate for control board, 30, 31 insulating heat transfer Sheet, 40 second heat radiating plate, 40a first heat radiating piece, 40b second heat radiating piece, 40h screw insertion hole, 40s engaging piece, 41, 42 screw, 50 case housing, 50v groove, 51 case lid, 54 Face plate, 55 connector hole, 100 electronic device, 120 connector, 200 base unit, 202a first support piece, 202b second support piece, 220 connector, R _A first region, R _B the second region.

In order to solve the above-described problems and achieve the object, the present invention provides a control board on which electronic components are mounted, a frame ground plate connected to a frame ground pattern in the control board, and a frame ground plate. And a first heat dissipating plate connected to the ground pattern of the control board, and each of the first heat dissipating plate and the frame ground plate includes an engaging portion that engages with the base unit. The first heat radiating plate and the frame grounding plate are engaging portions, and are electrically attached to the frame grounding portion and the signal line grounding portion that also serve as the engaging portion of the base unit.

Claims (21)

A control board on which electronic components are mounted;
A frame ground plate connected to a frame ground pattern in the control board;
A first heat dissipating plate provided apart from the frame ground plate and connected to the ground pattern of the control board;
Have
The electronic device, wherein the first heat radiating plate and the frame grounding plate are mounted on the base unit electrically independently.   2. The electronic apparatus according to claim 1, wherein the first heat radiating plate is in contact with the base unit via a second heat radiating plate provided at an end portion of the control board.   The electronic apparatus according to claim 2, wherein the second heat radiating plate is screwed to the base unit. A first region where the second heat dissipation plate is connected to the base unit;
The second region where the frame ground plate is connected to the base unit is
The electronic apparatus according to claim 2, wherein the electronic apparatus is disposed at different end portions on the same side.   The electronic device according to claim 4, wherein the first region is located above the control board on the base unit.   The electronic apparatus according to claim 4, wherein the first region is located below the control board on the base unit. The second heat dissipation plate is a conductive rod-shaped body,
The electronic device according to claim 2, further comprising a screw insertion hole at one end. The control board is housed in a housing,
The electronic apparatus according to claim 7, wherein the second heat radiating plate is inserted into and fixed to a groove provided in the housing. The first heat radiation plate is provided on the first surface side of the control board so as to face the first surface of the control board,
A contact piece that contacts the second heat dissipation plate;
The electronic device according to claim 2, wherein the contact piece is brought into contact with the second heat radiating plate via an insulating heat transfer sheet.   The electronic apparatus according to claim 9, wherein the first heat dissipation plate is a flat plate.   The electronic device according to claim 9, wherein the contact piece is an integrally molded body continuously extending from one end of the first heat radiation plate.   The electronic device according to claim 11, wherein the contact piece is formed by being bent 90 degrees with respect to the first heat radiating plate along the end portion of the housing.   The first heat radiating plate has a first surface portion covering the first surface side of the control board and a second surface portion covering the second surface side facing the first surface, and is provided on both surfaces of the control board. The electronic device according to claim 1, wherein the electronic device is provided.   13. The electronic apparatus according to claim 12, wherein the first and second surface portions of the first heat radiating plate are integrally formed.   13. The electronic apparatus according to claim 12, wherein the first and second surface portions of the first heat radiating plate are separately formed and electrically connected by the contact piece. The control board has a first board part and a second board part provided in parallel with the first board part,
The first heat radiating plate is connected to the ground pattern of the first substrate part and the ground pattern of the second substrate part, and is provided to face the first ground plate. A second ground plate,
The first ground plate and the second ground plate are electrically connected to the ground patterns on the first and second substrate parts, respectively.
16. The connection fixing of the first ground plate portion through the first ground plate and the second ground plate with a conductive pillar that abuts against the second substrate portion. The electronic device as described in. A base unit having an electronic device mounting portion including a frame grounding portion and a signal line grounding portion provided apart from the frame grounding portion;
A control board on which electronic components are mounted, a frame grounding plate connected to a frame grounding pattern in the control board, and provided separately from the frame grounding plate and connected to the grounding pattern of the control board A first heat dissipation plate;
An electronic device having
The frame ground plate is connected to the frame ground portion of the base unit,
The electronic device system, wherein the first heat radiating plate is connected to the signal line grounding portion of the base unit.   The electronic device system according to claim 17, wherein the frame grounding unit and the signal line grounding unit are configured to serve as an engaging unit that engages with the electronic device.   The electronic device has one side fixed to the base unit, and the frame ground plate and the first heat radiating plate are connected to the frame ground portion and the signal line ground portion of the base unit on the one side. The electronic device system according to claim 18, wherein   The electronic equipment system according to claim 19, wherein the frame ground plate of the electronic device includes a leaf spring joint portion, and the leaf spring joint portion is spring joined to the frame ground portion.   The first heat radiating plate is connected to a second heat radiating plate through an insulating heat transfer sheet, and the second heat radiating plate is screwed to the signal line grounding portion of the base unit. The electronic device system according to claim 19.

Images