CN109041506B

CN109041506B - Electronic equipment

Info

Publication number: CN109041506B
Application number: CN201710435814.1A
Authority: CN
Inventors: 李峥
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2017-06-09
Filing date: 2017-06-09
Publication date: 2023-12-01
Anticipated expiration: 2037-06-09
Also published as: CN109041506A

Abstract

The application discloses an electronic device, which comprises a shell, a movement and a heat conduction mechanism, wherein the shell is provided with a heat conduction mechanism; the housing has a receiving cavity and an opening in communication with the receiving cavity; the machine core is arranged in the accommodating cavity and provided with a first structural surface facing the opening and a second structural surface deviating from the opening, a third structural surface is arranged at a position, located between the first structural surface and the second structural surface, on the machine core, and the third structural surface is arranged opposite to the inner wall of the accommodating cavity; the heat conduction mechanism is arranged between the third structural surface and the inner wall of the accommodating cavity so as to conduct heat to the shell. The scheme can solve the problem that the heat radiation structure occupies a larger space in the opening direction of the shell in the current electronic equipment.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment heat dissipation, in particular to electronic equipment.

Background

With the development of demand and technology, users increasingly pursue miniaturization of electronic devices, and miniaturization design of electronic devices is an important research and development direction of product developers. The electronic equipment is miniaturized and needs to be compatible with the heat dissipation performance of the equipment. For this reason, the current electronic devices are provided with heat dissipation structures.

Electronic devices typically include a housing having an opening and a movement, and for ease of installation, a heat-dissipating structure is typically mounted on a mounting surface of the movement toward or away from the opening, or directly at the opening. In this case, the heat dissipation structure and the movement are sequentially arranged in the opening direction. Obviously, the heat dissipation structure occupies a larger space in the opening direction, and thus the space in the opening direction, which is important, is occupied in a large amount. The space in the opening direction of the opening in the shell is occupied in a large amount, so that the operation of operators on other mechanisms through the opening is inconvenient, and the miniaturization design of electronic equipment is also inconvenient.

Disclosure of Invention

The application provides electronic equipment, which aims to solve the problem that a heat dissipation structure occupies a larger space in the opening direction of an opening of a shell in the existing electronic equipment.

The application adopts the following technical scheme:

the electronic equipment comprises a shell, a movement and a heat conduction mechanism; the housing has a receiving cavity and an opening in communication with the receiving cavity; the machine core is arranged in the accommodating cavity and provided with a first structural surface facing the opening and a second structural surface deviating from the opening, a third structural surface is arranged on the machine core at a position between the first structural surface and the second structural surface, and the third structural surface is arranged opposite to the inner wall of the accommodating cavity; the heat conduction mechanism is arranged between the third structural surface and the inner wall of the accommodating cavity so as to conduct heat to the shell.

Preferably, in the electronic device, the mounting and dismounting direction of the heat conducting mechanism is parallel to the orientation of the opening.

Preferably, in the electronic device, the heat conducting mechanism is mounted on an inner wall of the accommodating cavity and contacts with the third structural surface.

Preferably, in the electronic device, a space formed by the inner wall of the accommodating cavity and the third structural surface includes a wedge-shaped space, and the heat conducting mechanism is a wedge-shaped mechanism capable of being matched with the wedge-shaped space.

Preferably, in the electronic device, the end with the larger cross-sectional area of the wedge-shaped space faces the opening, and the heat conducting mechanism is inserted into the wedge-shaped space from the end with the larger cross-sectional area of the wedge-shaped space.

Preferably, in the electronic device, an inner wall of the accommodating cavity has a guiding inclined plane, and the guiding inclined plane and the third structural plane form the wedge-shaped space.

Preferably, in the electronic device, the housing includes a housing main body and a guide block, and the guide block has the guide inclined surface; the guide block is disposed on the case body.

Preferably, in the electronic device, the guide block and the case main body are integrally formed.

Preferably, in the electronic device, the heat conducting mechanism includes a wedge block and a heat conducting layer; the heat conduction layer is arranged on the wedge-shaped block and is attached to the third structural surface; the surface of the wedge block, which is opposite to the guide inclined surface, is a wedge inclined surface which is in sliding fit with the guide inclined surface, the wedge inclined surface is in limit fit with the guide inclined surface in the installation direction of the heat conducting mechanism, and the installation direction is parallel to the direction of the opening.

Preferably, in the above electronic device, two side edges of the wedge-shaped inclined plane are provided with positioning portions, two surfaces of the two opposite positioning portions and the wedge-shaped inclined plane form a guiding chute, and the guiding chute is in sliding fit with the guiding block.

Preferably, in the electronic device, a lap joint portion is provided at a top of the wedge block, and the lap joint portion is in lap joint with the guide block in the installation direction.

Preferably, in the above electronic device, the overlapping portion is provided with a connecting hole, the overlapping portion is fixedly connected with the guide block through a connecting piece matched with the connecting hole, and the connecting piece can be dismounted along a direction parallel to the opening direction.

Preferably, in the above electronic device, the wedge-shaped block is provided with two clamping holes, the two clamping holes are symmetrically arranged at two sides of the connecting hole, and the axes of the connecting hole are equal to the distances between two ends of the overlap joint portion.

Preferably, in the electronic device, a surface of the wedge block opposite to the third structural surface is provided with grains, and the heat conducting layer is smeared on the surface of the wedge block opposite to the third structural surface.

Preferably, in the electronic device, the plurality of third structural surfaces form an annular space surrounding the movement with the inner wall of the accommodating cavity, and the plurality of heat conducting mechanisms are arranged in the annular space at intervals.

Preferably, in the electronic device, the movement is a camera movement, the camera movement is provided with an image sensor, and a photosensitive side of the image sensor faces the opening.

Preferably, in the electronic device, the method includes:

the movement comprises a circuit board and a metal cover covered on the circuit board, and the metal cover is provided with the first structural surface, the second structural surface and the third structural surface; or alternatively

The movement comprises a hexahedral metal frame, wherein the hexahedral metal frame comprises the first structural surface, the second structural surface and the third structural surface; or alternatively

The movement comprises a base body and a circuit board arranged on at least one surface of the base body, and a chip is arranged on the circuit board; the circuit board and the substrate form a hexahedral structure body, and the hexahedral structure body comprises the first structural surface, the second structural surface or the third structural surface.

The at least one technical scheme adopted by the application can achieve the following beneficial effects:

in the electronic equipment disclosed by the application, the shell is provided with the accommodating cavity and the opening communicated with the accommodating cavity, the movement is provided with the first structural surface facing the opening, the second structural surface deviating from the opening and the third structural surface positioned between the first structural surface and the second structural surface, and the heat conducting mechanism is arranged between the third structural surface and the inner wall of the accommodating cavity, so that heat generated by the movement is transferred to the shell through the third structural surface, and finally heat dissipation is realized. According to the radiating process, the heat conducting mechanism is located between the third structural surface and the inner wall of the accommodating cavity, and the third structural surface is located between the first structural surface and the second structural surface, so that the heat conducting mechanism cannot be arranged on the first structural surface facing the opening or the second structural surface deviating from the opening, the position of the opening cannot be occupied, and the heat conducting mechanism can be prevented from occupying a larger space in the opening direction.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

fig. 1 is a schematic cross-sectional structure of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic perspective view of the heat conducting mechanism in FIG. 1;

FIG. 3 is a schematic view of a partial enlarged structure of FIG. 1;

fig. 4 is an installation schematic diagram of a heat conducting mechanism of an electronic device according to an embodiment of the present application, in fig. 4, a direction of a hollow arrow is an installation direction of the heat conducting mechanism, and a detachment direction of the heat conducting mechanism is opposite to the direction of the hollow arrow.

Reference numerals illustrate:

100-shell, 110-accommodating cavity, 120-opening, 130-opening, 140-shell main body and 150-guide block;

200-movement, 210-structural plane, 220-structural plane, 230-third structural plane;

300-heat conduction mechanism, 310-wedge block, 311-wedge inclined plane, 312-positioning part, 313-lap joint part, 314-connecting hole, 315-clamping hole, 320-heat conduction layer and 330-threaded connecting piece;

400-annular space.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.

Referring to fig. 1-4, an embodiment of the present application discloses an electronic device, which includes a housing 100, a movement 200, and a heat conducting mechanism 300.

The case 100 has a receiving chamber 110 and an opening communicating with the receiving chamber 110, and the movement 200 is provided in the receiving chamber 110, the movement 200 being a heat generating portion of the electronic device disclosed in the embodiment of the present application, the movement 200 having a first structural surface facing the opening and a second structural surface facing away from the opening. It should be noted that the number of openings may be one or two opposite openings. One embodiment is shown in fig. 1, where the number of openings is two, and the two openings are respectively an opening 120 and an opening 130, and the opening 120 is disposed opposite to the opening 130. For the opening 120, the structural surface 210 faces the opening 120, i.e., is a first structural surface, and the structural surface 220 faces away from the opening 120, i.e., is a second structural surface; for the opening 130, the structural surface 210 faces away from the opening 130, i.e., is the second structural surface, and the structural surface 220 faces toward the opening 130, i.e., is the first structural surface. That is, the surface facing away from a certain opening may be referred to as a second surface, and the surface facing toward the opening may be referred to as a first surface.

The movement 200 has a third structural surface 230 at a location between the first and second structural surfaces. The third structural surface 230 is disposed opposite to the inner wall of the receiving chamber 110. The heat conduction mechanism 300 is disposed between the inner wall of the accommodating chamber 110 and the third structural surface 230 of the deck 200 to conduct heat to the case 100.

In the electronic device disclosed in the embodiment of the application, the housing 100 has the accommodating cavity 110 and the opening communicating with the accommodating cavity 110, the movement 200 has the first structural surface facing the opening, the second structural surface facing away from the opening, and the third structural surface 230 located between the first structural surface and the second structural surface, and the heat conducting mechanism 300 is disposed between the third structural surface 230 and the inner wall of the accommodating cavity 110, so that heat generated by the movement 200 can be transferred to the housing 100 through the third structural surface 230, and finally heat dissipation is achieved. As can be seen from the above heat dissipation process, the heat conducting mechanism 300 is located between the third structural surface 230 and the inner wall of the accommodating cavity 110, and the third structural surface 230 is located between the first structural surface and the second structural surface, so that the heat conducting mechanism 300 is not disposed on the first structural surface facing the opening and the second structural surface facing away from the opening, and does not occupy the opening position, and thus the heat conducting mechanism 300 can be prevented from occupying a larger space in the opening direction.

Typically, movement 200 is secured in receiving cavity 110 by a special connection mechanism or attachment (e.g., screws), and thermal mechanism 300 functions to conduct heat. In the embodiment of the application, the heat conducting mechanism 300 is arranged between the third structural surface of the movement 200 and the inner wall of the accommodating cavity 110, so that not only can the heat conducting function be achieved, but also the function of supporting the movement 200 in an auxiliary manner can be achieved, and the movement 200 can be installed more stably.

In a further preferred embodiment, the movement 200 and the inner wall of the accommodating chamber 110 may form an annular space 400, that is, the movement 200 may have a gap between each direction and the inner wall of the accommodating chamber 110, and the plurality of heat conducting mechanisms 300 may be plural, that is, at least two, and the plurality of heat conducting mechanisms 300 may be arranged in the annular space 400 at intervals. In this case, the plurality of heat conduction mechanisms 300 can conduct heat from the plurality of directions of the third structural surfaces 230 or the plurality of third structural surfaces 230, and thus heat conduction efficiency can be improved. Meanwhile, the plurality of heat conduction mechanisms 300 can play a role in supporting the movement 200 in a more balanced manner, so that the movement 200 is mounted more stably, and meanwhile, the influence of vibration received by the electronic equipment on the movement 200 can be relieved from multiple directions, and the movement 200 is protected.

In particular, the plurality of thermally conductive mechanisms 300 may be discretely and uniformly disposed within the annular space 400. The structure of annularly arranging the plurality of heat conduction mechanisms 300 can enable the electronic device to have good heat dissipation performance, and is beneficial to realizing heat balance in the electronic device more quickly. Particularly, when the electronic device is provided with the temperature measuring device, the heat conducting mechanism 300 can well reduce the influence of self-heating of the electronic device on the temperature measuring device, so that the temperature measuring precision of the temperature measuring device can be improved. Of course, in order to reduce the interference to the operation of the temperature measuring device as much as possible, a larger number of heat conducting mechanisms 300 may be arranged near the temperature measuring device of the electronic device, and the purpose of enhancing heat conduction is achieved by arranging the heat conducting mechanisms 300 more.

In the embodiment of the present application, the third structural surface 230 may be one, that is, there is a third structural surface 230, such as a cylindrical surface, between the first structural surface and the second structural surface; the number of third structural surfaces 230 may be plural, and there are plural third structural surfaces 230 between the first structural surface and the second structural surface. In a specific embodiment, the movement 200 has a plurality of third structural surfaces 230, and the heat conducting mechanisms 300 may be plural and correspond to the plurality of third structural surfaces 230 one by one, that is, the number of the heat conducting mechanisms 300 may be equal to the number of the third structural surfaces 230. Of course, the number of the heat conducting mechanisms 300 may be greater than, equal to, or less than the number of the third structural surfaces 230, and a product designer of the electronic device may adaptively adjust the number of the heat conducting mechanisms 300 according to the specific heat dissipation requirement of the electronic device. In a specific embodiment, the number of the third structural surfaces 230 is three, and the heat conducting mechanism 300 is disposed between at least one of the three third structural surfaces 230 and the inner wall of the accommodating cavity 110, where the number of the third structural surfaces is plural, the number of the third structural surfaces is generally at least three in the present application.

Another specific embodiment is: the third structural surface 230 is a cylindrical surface, the number of the heat conducting mechanisms 300 is multiple, and the heat conducting mechanisms 300 are respectively connected with different parts of the cylindrical surface in different directions, so that heat dissipation of the movement 200 in multiple directions is realized.

In the electronic device disclosed by the embodiment of the application, the heat conduction mechanism 300 has good heat conduction effect, so that the heat balance in the electronic device can be quickened, the preparation time for reaching a normal working state when the electronic device is cold started is shortened, and the working efficiency of the electronic device can be further improved.

In the actual assembly process of the apparatus, the heat conducting mechanism 300 may be disposed between the third structural surface 230 and the inner wall of the accommodating cavity 110 in various manners, so that various disassembly and assembly manners of the heat conducting mechanism 300 are possible. Preferably, the direction of disassembly and assembly of the heat conducting mechanism 300 is parallel to the direction of the opening, in which case, disassembly and assembly of the heat conducting mechanism 300 can be achieved by fully utilizing the opening of the housing 100, without designing other disassembly and assembly structures on the electronic device.

It should be noted that, herein, the mounting and dismounting directions of the heat conducting mechanism 300 include a mounting direction and a dismounting direction, the mounting direction is opposite to the dismounting direction, the dismounting direction of the heat conducting mechanism 300 is parallel to the direction of the opening, and it can be considered that the mounting direction and the dismounting direction of the heat conducting mechanism 300 are both parallel to the direction of the opening. The mounting direction refers to a direction in which the heat conduction mechanism 300 gradually approaches until it is in the assembled position, and the dismounting direction refers to a direction in which the heat conduction mechanism 300 gradually moves away until it is out of the assembled position.

As described above, the heat conduction mechanism 300 is disposed between the third structural surface 230 and the inner wall of the accommodating chamber 110 to achieve heat conduction, and the heat conduction mechanism 300 may be mounted on the inner wall of the accommodating chamber 110 and in contact with the third structural surface 230 in order to improve heat conduction efficiency. More preferably, the heat conducting mechanism 300 and the third structural surface 230 are contacted by surface-to-surface fitting, which can further increase the heat conducting area.

In the electronic device disclosed in the embodiment of the present application, there are various ways in which the heat conduction mechanism 300 is disposed between the third structural surface 230 of the movement 200 and the inner wall of the accommodating chamber 110. In order to facilitate installation and improve assembly stability, in one embodiment, the space formed by the inner wall of the accommodating cavity 110 and the third structural surface 230 includes a wedge-shaped space, and the heat conducting mechanism 300 is a wedge-shaped mechanism capable of matching with the wedge-shaped space. The heat conduction mechanism 300 is matched with the wedge-shaped space, so that the installation and the positioning of the heat conduction mechanism 300 are realized. The cooperation of the heat conduction mechanism 300 and the wedge space can form a wedge mechanism, and the wedge mechanism has a good positioning function.

Of course, the end of the wedge-shaped space with the larger cross-sectional area may be inclined at an angle to the opening, but this approach is detrimental to the assembly and disassembly of the thermal conduction mechanism 300 as compared to the end of the wedge-shaped space with the larger cross-sectional area facing the opening of the housing 100. To further facilitate the assembly and disassembly of the heat conduction mechanism 300, the end of the wedge-shaped space with the larger cross-sectional area faces the opening of the housing 100, and the heat conduction mechanism 300 is inserted into the wedge-shaped space from the end of the wedge-shaped space with the larger cross-sectional area. In the process of disassembly and assembly, an operator can more conveniently control the disassembly and assembly operation of the heat conduction mechanism 300 through the opening.

The space formed by the third structural surface 230 and the inner wall of the accommodating chamber 110 may be a wedge-shaped space as a whole, or a part of the space formed by the third structural surface 230 and the inner wall of the accommodating chamber 110 may be a wedge-shaped space. The wedge-shaped space may be formed in various manners, and in one embodiment, the inner wall of the accommodating cavity 110 has a guiding inclined surface, and the guiding inclined surface forms the wedge-shaped space with the third structural surface 230. Specifically, the third structural surface 230 may be a straight surface extending parallel to the direction in which the opening faces, and the guiding inclined surface extends obliquely with respect to the straight surface.

The guide slope may be formed directly on the inner wall of the receiving chamber 110, i.e., smoothly engaged with other portions of the inner wall of the receiving chamber 110. The guide slope may also be formed by other structures, and in one embodiment, the housing 100 may include a housing body 140 and a guide block 150, the guide block 150 having the guide slope, the guide block 150 being disposed on the housing body 140. Specifically, the guide block 150 may be detachably disposed on the case body 140, so that a user can conveniently replace the guide block 150 or overhaul and disassemble the electronic device. For example, the guide block 150 may be fastened to the case body 140 in a snap-fit manner. Of course, the guide block 150 and the case body 140 may be of an integral structure such that the guide block 150 can function to assist in reinforcing the strength of the case 100 in addition to providing a guide slope, in which case the guide block 150 is similar to the reinforcing rib of the case body 140. Meanwhile, the casing 100 adopts an integrated structure, and has the advantages of convenient manufacture, saving the disassembly and assembly operations of the guide block 150, and the like.

In a further preferred embodiment, the heat conducting mechanism 300 may include a wedge block 310 and a heat conducting layer 320, where the heat conducting layer 320 is disposed on a surface of the wedge block 310 opposite to the third structural surface 230 of the movement 200 and is attached to the third structural surface 230, so as to implement heat conduction between the movement 200 and the heat conducting mechanism 300. The surface of the wedge block 310 opposite to the guiding inclined plane is a wedge inclined plane 311, the wedge inclined plane 311 is in sliding fit with the guiding inclined plane, and the wedge inclined plane 311 and the guiding inclined plane can be in limit fit in the installation direction of the heat conducting mechanism 300. Preferably, the installation direction of the heat conduction mechanism 300 is parallel to the direction of the opening. During installation, the operator engages the bottom end of the wedge ramp 311 with the top end of the guide ramp and then slides the wedge ramp 311 along the guide ramp until the thermal mechanism 300 is positioned within the wedge space.

In a specific heat conduction process, heat is transferred from the movement 200 to the wedge block 310 by the heat conduction layer 320, and is then guided to the casing 100 by the wedge block 310 to be dissipated. The heat conducting layer 320 is a key for the heat conducting mechanism 300 to obtain heat from the movement 200, and therefore, the heat conducting layer 320 may be made of a material with good heat conducting property. Specifically, the heat conductive layer 320 may be a heat conductive silicone layer, i.e., a layered structure formed of heat conductive silicone grease.

In the above-mentioned structure, the heat conducting mechanism 300 includes the wedge block 310, the inner wall of the accommodating cavity 110 has a guiding inclined plane, a wedge space is formed between the guiding inclined plane and the third structural surface 230 of the movement 200, in the installation direction of the heat conducting mechanism 300, the gap width of the wedge space is gradually reduced, and the cooperation of the wedge inclined plane 311 of the wedge block 310 and the guiding inclined plane can realize the positioning of the whole heat conducting mechanism 300. In this case, the heat conducting mechanism 300 can slide along the guiding inclined plane, so as to realize installation, and the sliding installation mode similar to a drawer type has a simpler structure, can realize quick assembly and disassembly, and is convenient for subsequent equipment maintenance operation.

In addition, in the process that the wedge block 310 slides along the installation direction of the heat conducting mechanism 300, the gap width of the wedge space formed by the guide inclined plane and the third structural surface 230 of the movement 200 is gradually reduced, as shown in fig. 4, in this case, the wedge block 310 slides along the guide inclined plane, so that the heat conducting layer 320 gradually approaches the third structural surface 230 of the movement 200, and further, the problem that the heat conducting layer 320 is easily scratched by the third structural surface 230 of the movement 200 during the sliding process of the wedge block 310 can be better avoided, the integrity of the heat conducting layer 320 after the installation is completed can be ensured, and further, the damage of the installation to the heat conducting layer 320 can be avoided.

Moreover, under the guidance of the guiding inclined plane, the wedge block 310 slides along the guiding inclined plane until the heat conducting layer 320 is attached to the third structural surface 230 of the movement 200, and the guiding inclined plane can ensure that the sliding of the wedge block 310 continues, and finally ensure that the heat conducting layer 320 is attached to the third structural surface 230 of the movement 200 more stably, so as to ensure reliable heat conduction.

In addition, the heat conducting mechanism 300 adopts the wedge block 310 and the guide inclined plane to realize positioning in a sliding fit manner, so that the complexity of positioning the heat conducting mechanism 300 can be reduced, the problem of inconvenient operation caused by narrow internal space of the electronic equipment can be solved, and the lightweight design of the electronic equipment and the improvement of the internal space utilization rate of the electronic equipment are facilitated.

In order to realize more stable sliding of the wedge block 310, a sliding rail mechanism extending along the sliding direction can be arranged on the wedge inclined surface 311 or the guiding inclined surface, and the sliding rail mechanism can realize sliding positioning of the wedge inclined surface 311 and avoid deflection of sliding. For example, one of the wedge-shaped inclined surface 311 and the guide inclined surface is provided with a guide groove, the other is provided with a guide protrusion which is in sliding fit with the guide groove, and the guide groove and the guide protrusion are matched to form a sliding rail mechanism. In a specific embodiment, the guide groove is located between two side edges of the wedge-shaped inclined surface 311, and correspondingly, the guide protrusion is located between two side edges of the guide inclined surface.

Of course, the sliding rail mechanism has various structures, please refer to fig. 2, in a preferred embodiment, two side edges of the wedge-shaped inclined surface 311 may be provided with positioning portions 312, opposite surfaces of the two positioning portions 312 and the wedge-shaped inclined surface 311 form a guiding chute, the guiding chute is slidingly matched with the guiding block 150, and the guiding chute and the guiding block 150 cooperate to form the sliding rail mechanism. The positioning portion 312 can be matched with the side surface of the wedge block 310 in a positioning manner, so that the wedge block 310 can slide along the guiding inclined plane more stably, meanwhile, the wedge inclined plane 311 and the guiding inclined plane can be ensured to have larger sliding contact area, and the guiding inclined plane can stably support the wedge block 310 while the wedge block 310 slides.

The top of the wedge block 310 may be provided with a lap joint portion 313, the lap joint portion 313 is lap-jointed with the guide block 150 in the installation direction of the heat conduction mechanism 300, and when the lap joint portion 313 is in a lap joint state with the guide block 150, the wedge slope 311 of the wedge block 310 slides in place along the guide slope, and at this time, the heat conduction layer 320 is in a state of being in contact with the third structural surface 230 of the movement 200.

The bridging portion 313 may also be used as a fixed connection portion for installing the heat conducting mechanism 300, specifically, the bridging portion 313 may be provided with a connection hole 314, and the bridging portion 313 is fixedly connected with the guide block 150 through a connection piece matched with the connection hole 314. The connection may be a threaded connection 330 as shown in fig. 1 or 3. The connecting piece can be disassembled and assembled along the direction parallel to the opening direction of the shell 100, and in this case, the disassembly and assembly of the connecting piece and the disassembly and assembly of the heat conduction mechanism 300 are all parallel to the opening direction of the shell 100, so that the disassembly and assembly of the heat conduction mechanism 300 can be further facilitated.

As described in the background art, the current electronic devices are moving toward miniaturization, and the sizes of the individual components of the electronic devices are also becoming smaller and smaller. To facilitate the operation of the installation of the heat conducting mechanism 300, the wedge block 310 may preferably be provided with a clamping hole 315. The operator clamps the clamping hole 315 by a clamp such as forceps, thereby clamping the heat conduction mechanism 300. Specifically, the clamping hole 315 may be disposed on the overlap portion 313, in which case an operator can clamp the top of the wedge 310, thereby facilitating the subsequent installation operation.

The embodiment of the application discloses an assembly process of part of components of electronic equipment with a specific structure, which comprises the following steps: the movement 200 is fixed on the case 100, then an operator can clamp the clamping hole 315 of the heat conducting mechanism 300 with tweezers, so that the wedge-shaped inclined surface 311 of the wedge-shaped block 310 of the heat conducting mechanism 300 slides down along the guiding inclined surface until the overlap portion 313 overlaps the guiding block 150 and the heat conducting layer 320 is attached to the third structural surface 230 of the movement 200, and then the wedge-shaped block 310 is fixed on the guiding block 150 with the threaded connection 330. In this case, the heat conduction route of the electronic device is: movement 200- & gt heat conducting layer 320- & gt wedge 310- & gt guide block 150- & gt housing 100- & gt the external environment of the electronic device. When an operator needs to maintain the movement 200, the operator only needs to loosen the threaded connection 330, and take out the heat conduction mechanism 300 from the wedge-shaped space by using tweezers, so that the operation is simple, convenient and quick.

The embodiment of the present application does not limit the specific number and distribution positions of the clamping holes 315, as long as the number and distribution positions of the clamping holes 315 are convenient for an operator to perform the clamping operation on the wedge-shaped block 310 through the clamping holes 315. In a specific embodiment, the number of the clamping holes 315 is two, and the two clamping holes 315 may be symmetrically disposed at two sides of the connecting hole 314, and the axes of the connecting holes 314 are equidistant from two ends of the overlap portion 313. Under this condition, the connecting hole 314 is located at the middle part of the overlap portion 313, the two clamping holes 315 are symmetrically arranged at two sides of the connecting hole 314, and the arrangement positions of the connecting hole 314 and the two clamping holes 315 can ensure that the quality of the whole wedge-shaped block 310 is balanced, so that the sliding of the heat conducting mechanism 300 is more stable, and the heat conducting mechanism 300 is prevented from deflecting in the sliding process. In addition, the two clamping holes 315 can also function as lightening holes, facilitating the clamping up of the wedge 310.

As described above, the heat conductive layer 320 may be disposed on the wedge block 310 by spraying, in order to improve the stability of the connection of the heat conductive layer 320 and the wedge block 310. In a preferred embodiment, the surface of the wedge block 310 opposite to the third structural surface 230 of the movement 200 may be provided with a pattern, and the heat conducting layer 320 is coated on the surface of the wedge block 310 opposite to the third structural surface 230 of the movement 200. The stability that heat conduction layer 320 attached can be improved in the setting of line, can improve the heat conduction area between wedge 310 and the heat conduction layer 320 simultaneously, and then can improve heat conduction efficiency.

In particular, the texture may comprise protrusions or depressions distributed in an array. Of course, the surface of the wedge block 310 on which the heat conductive layer 320 is disposed may be provided with both protrusions and depressions, which can further improve the stability of the bonding of the heat conductive layer 320 with the wedge block 310. Specifically, the protrusion may be a strip-shaped protrusion, and the recess may be a strip-shaped recess. The application is not limited to the specific shape of the protrusions or depressions.

In the embodiment of the present application, the movement 200 may be a battery or a camera movement. Specifically, under the premise that the movement 200 is a camera movement, the camera movement is provided with an image sensor, and the photosensitive side of the image sensor faces towards the opening, so that the image sensor can acquire images conveniently. One specific embodiment is as follows: on the premise that the movement 200 is a camera movement, the electronic device may be an unmanned aerial vehicle, and the unmanned aerial vehicle may implement aerial photography. In this case, the image sensor that the camera core set up is towards uncovered, and heat conduction mechanism 300 sets up between the inner wall of camera core and holding chamber 110, and this can reduce the size of shell 100 in uncovered direction, and then can make whole unmanned aerial vehicle have smaller size and less weight, this has outstanding contribution to the unmanned aerial vehicle that needs to fly in the air, not only can reduce unmanned aerial vehicle aerial camera's energy consumption, can also provide stability, the flexibility of high altitude shooting.

In an embodiment of the present application, the movement 200 may include a circuit board and a metal cover covering the circuit board, where the metal cover has a first structural surface, a second structural surface, and a third structural surface 230. The movement 200 may include a hexahedral metal frame including a first structural surface, a second structural surface, and a third structural surface 230. The movement 200 may include a base and a circuit board disposed on at least one surface of the base, the circuit board having a chip disposed thereon, the circuit board and the base forming a hexahedral structure including a first structural surface, a second structural surface, and a third structural surface 230. The present application is not limited to the specific structure of movement 200.

The electronic equipment disclosed by the embodiment of the application can be unmanned aerial vehicle, mobile phone, tablet and other equipment for high-altitude mapping or monitoring. Fig. 1 is a schematic cross-sectional view of the unmanned aerial vehicle, in which case the housing 100 has a cylindrical structure. Of course, the specific kinds of electronic devices are different, and the specific structures of the case 100 and the movement 200 may be different, but the above-described matching relationship between the case 100, the movement 200, and the heat conduction mechanism 300 is not affected.

In this disclosure, as long as the technical features in the embodiments are not contradictory, they can be combined to form new technical solutions, and these new technical solutions are all within the scope of the disclosure of the present application, and in view of brevity, these new technical solutions are not described herein again.

The preferred embodiments are only described with emphasis on being different from other preferred embodiments, and the embodiments formed by the combination can be arbitrarily combined as long as the preferred embodiments do not conflict, and the embodiments formed by the combination are also within the scope of the disclosure of the present specification, and the embodiments formed by the combination are not separately described in consideration of brevity.

The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.

Claims

1. The electronic equipment is characterized by comprising a shell, a movement and a heat conduction mechanism; the housing has a receiving cavity and an opening in communication with the receiving cavity; the machine core is arranged in the accommodating cavity and provided with a first structural surface facing the opening and a second structural surface deviating from the opening, a third structural surface is arranged on the machine core at a position between the first structural surface and the second structural surface, and the third structural surface is arranged opposite to the inner wall of the accommodating cavity; the heat conduction mechanism is arranged between the third structural surface and the inner wall of the accommodating cavity so as to conduct heat to the shell;

the inner wall that holds the chamber with the space that the third structural plane formed includes wedge space, the shell includes shell main part and guide block, the guide block sets up in the shell main part, heat conduction mechanism including can with wedge space complex wedge, the top of wedge is provided with overlap joint portion, overlap joint portion in the installation direction with guide block overlap joint cooperation, the connecting hole has been seted up to overlap joint portion, overlap joint portion through with connecting hole complex connecting piece with the guide block is connected.

2. The electronic device of claim 1, wherein the direction of attachment and detachment of the thermally conductive mechanism is parallel to the orientation of the opening.

3. The electronic device of claim 1, wherein the thermally conductive mechanism is mounted on an inner wall of the receiving cavity and is in contact with the third structural surface.

4. The electronic device of claim 1, wherein the larger cross-sectional area end of the wedge-shaped space is oriented toward the opening, and the thermally conductive mechanism is inserted into the wedge-shaped space from the larger cross-sectional area end of the wedge-shaped space.

5. The electronic device of claim 1, wherein an inner wall of the receiving cavity has a guiding ramp, the guiding ramp and the third structural surface forming the wedge-shaped space.

6. The electronic device of claim 5, wherein the guide block has the guide slope.

7. The electronic device of claim 6, wherein the guide block is of unitary construction with the housing body.

8. The electronic device of claim 6, wherein the thermally conductive mechanism comprises a thermally conductive layer; the heat conduction layer is arranged on the wedge-shaped block and is attached to the third structural surface; the surface of the wedge block, which is opposite to the guide inclined surface, is a wedge inclined surface which is in sliding fit with the guide inclined surface, the wedge inclined surface is in limit fit with the guide inclined surface in the installation direction of the heat conducting mechanism, and the installation direction is parallel to the direction of the opening.

9. The electronic device of claim 8, wherein two side edges of the wedge-shaped inclined surface are provided with positioning portions, and two opposite surfaces of the positioning portions and the wedge-shaped inclined surface form a guide chute, and the guide chute is in sliding fit with the guide block.

10. The electronic device according to claim 1, wherein the overlap portion is provided with a connection hole, the overlap portion is fixedly connected with the guide block through a connection member mated with the connection hole, and the connection member is detachable in a direction parallel to the opening direction.

11. The electronic device according to claim 10, wherein the wedge-shaped block is provided with two clamping holes, the two clamping holes are symmetrically arranged at both sides of the connecting hole, and the axes of the connecting holes are equidistant from both ends of the overlap portion.

12. The electronic device of claim 8, wherein a surface of the wedge block opposite the third structural surface is provided with texturing, and the thermally conductive layer is coated on the surface of the wedge block opposite the third structural surface.

13. The electronic device of claim 1, wherein the third structural surface is a plurality of, an annular space surrounding the movement is formed between the plurality of third structural surfaces and the inner wall of the accommodating cavity, the plurality of heat conducting mechanisms are a plurality of, and the plurality of heat conducting mechanisms are arranged in the annular space at intervals.

14. Electronic device according to any of claims 1-13, characterized in that the movement is a camera movement provided with an image sensor, the light sensitive side of which is directed towards the opening.

15. The electronic device of any one of claims 1-13, wherein: