CN103294134A - Mainboard module, computer case module and computer - Google Patents
Mainboard module, computer case module and computer Download PDFInfo
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- CN103294134A CN103294134A CN2012100472817A CN201210047281A CN103294134A CN 103294134 A CN103294134 A CN 103294134A CN 2012100472817 A CN2012100472817 A CN 2012100472817A CN 201210047281 A CN201210047281 A CN 201210047281A CN 103294134 A CN103294134 A CN 103294134A
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Abstract
The invention relates to a mainboard module, a computer case module and a computer. The computer comprises the computer case module and the mainboard module which is arranged in the computer case module in a pluggable manner; the mainboard module comprises a mainboard and a first heat conduction unit fixed on the mainboard; the computer case module comprises a computer case and a second heat conduction unit fixed on the inner side of an upper cover of the computer case; and the first heat conduction unit and the second heat conduction unit are in heat conduction connection through an oblique plane. According to the main board, the computer case module and the computer, the mainboard module and the computer case module adopt 'pluggable heat conduction structures', so that the mainboard module can be withdrawn from the inside of the computer case module rapidly and conveniently; screws are not required to be removed; after the computer case module is plugged again, the heat conduction between the mainboard and a housing of the computer case cannot be affected; the process is simple and efficient; and maintenance for a user as well as update and replacement of the mainboard in the using process is greatly facilitated.
Description
Technical field
The present invention relates to the industrial computer technical field, more particularly, relate to a kind of mainboard module, cabinet module and computing machine.
Background technology
Enclosed industry computer utilizes the casing heat radiation, and the heat that produces on its mainboard is to conduct to casing by heat-conducting plate (metal that thermal conductivity ratio is higher, aluminium or copper).Usually, mainboard 1, heat-conducting plate 2 and cabinet 3 threes are fastened together (as shown in Figure 1, simultaneously referring to Fig. 2 and Fig. 3) with screw, are filled with heat-conducting medium (heat-conducting cream or heat conductive pad) between each surface of contact, connect to have guaranteed the heat conduction between the three.Like this, to be extremely inconvenient if mainboard 1 is disassembled in the cabinet 3, to pull down the heat-dissipating casing 4 of cabinet 3 earlier, to pull down heat-conducting plate 2 (in order reinforcing from mainboard 1 again, heat-conducting plate 2 is that the mounting hole that sees through on the mainboard 1 is locked in cabinet 3 bottoms), could in cabinet 3, pull down mainboard 1 at last.Will twist a lot of screws in the unloading process, the parts that disassemble are trifling scattered, and process is also very complicated, lose time very much, there is such drawback equally in the process that mainboard 1 is reinstalled, is unfavorable for the maintenance of terminal client, is unfavorable for that also terminal client in use exchanges the upgrading of mainboard 1.
Summary of the invention
The technical problem to be solved in the present invention is, at the above-mentioned defective of prior art, provides a kind of mainboard module, cabinet module and computing machine.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of mainboard module, comprise mainboard, and be arranged on the described mainboard, with cabinet in first heat-conducting unit that contacts of the second heat-conducting unit heat conduction, described first heat-conducting unit is fixedlyed connected with described mainboard.
Mainboard module of the present invention, wherein, described first heat-conducting unit contacts with the described second heat-conducting unit face, and described first heat-conducting unit is the inclined-plane with the side that the described second heat-conducting unit face contacts.
Mainboard module of the present invention, wherein, described first heat-conducting unit also is provided with heat conductive pad with the side that the described second heat-conducting unit face contacts.
Mainboard module of the present invention, wherein, the side that described first heat-conducting unit is fixedlyed connected with described mainboard is provided with the projection with the thermal source device contacts of described mainboard.
Another technical scheme that the present invention solves its technical matters employing is: construct a kind of cabinet module, comprise cabinet, be provided with second heat-conducting unit that contacts with the first heat-conducting unit heat conduction of mainboard module described above in the described cabinet.
Cabinet module of the present invention, wherein, a side of described second heat-conducting unit contacts with the described first heat-conducting unit face, and this side is the inclined-plane.
Cabinet module of the present invention, wherein, described cabinet is provided with chassis cover, the inboard of described chassis cover offers mounting hole, correspondence position with described mounting hole on described second heat-conducting unit is provided with mounting hole, and described second heat-conducting unit is fixed on the inboard of described chassis cover by the locking member that passes described mounting hole and mounting hole.
Cabinet module of the present invention, wherein, parallel interval is provided with for the elastic parts of regulating described second heat-conducting unit and the first heat-conducting unit applying degree on the rear wall of described cabinet, and an end of described elastic parts is fixedlyed connected with the rear end face of described second heat-conducting unit.
Cabinet module of the present invention, wherein, described elastic parts comprises that parallel interval is arranged on the bar and be set in spring on the described bar that presses of pressing of described cabinet rear wall, an end of described spring is fixedlyed connected with the rear end face of described second heat-conducting unit.
Another technical scheme that the present invention solves its technical matters employing is: construct a kind of computing machine, comprise cabinet module described above and be plugged on the interior mainboard module as described above of described cabinet module;
The both sides that are respectively equipped with inserting groove, described mainboard on the internal face of the relative both sides of described cabinet are respectively equipped with the Plug Division that is slidingly matched with described inserting groove;
Described mainboard module was slidably disposed in the described cabinet module by Plug Division and cooperating of inserting groove, so that first heat-conducting unit of described mainboard module contacts with the second heat-conducting unit heat conduction of described cabinet module.
Implement mainboard module of the present invention, cabinet module and computing machine, have following beneficial effect: " plug type conductive structure " that mainboard module of the present invention and cabinet module adopt can realize that the mainboard module is drawn out of quickly from the cabinet module internal, do not need to dismantle screw, again inserting can not influence mainboard behind the cabinet module yet and be connected with heat conduction between the casing, process is simple, efficient, and ten minutes is convenient to client's maintenance and in use the upgrading of mainboard is exchanged.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of cabinet in the prior art;
Fig. 2 is the inner structure synoptic diagram of cabinet in the prior art;
Fig. 3 is the structure dismounting figure of cabinet in the prior art;
Fig. 4 is the structural representation of a kind of mainboard module of the present invention preferred embodiment;
Fig. 5 is the front view of a kind of mainboard module of the present invention preferred embodiment;
Fig. 6 is the structural representation of mainboard in a kind of mainboard module of the present invention preferred embodiment;
Fig. 7 is the structural representation of first heat-conducting unit in a kind of mainboard module of the present invention preferred embodiment;
Fig. 8 is the structural representation of a kind of cabinet module of the present invention preferred embodiment;
Fig. 9 is the structural representation of second heat-conducting unit in a kind of cabinet module of the present invention preferred embodiment;
Figure 10 is the cut-open view of a kind of cabinet module of the present invention preferred embodiment;
Figure 11 is the enlarged drawing at A position among a kind of cabinet module of the present invention preferred embodiment Figure 10;
Figure 12 is the structural representation of a kind of computerized optimization embodiment of the present invention;
Figure 13 is the skeleton view of a kind of computerized optimization embodiment of the present invention;
Figure 14 is the use constitutional diagram when the mainboard module does not also insert the cabinet module among a kind of computerized optimization embodiment of the present invention;
Figure 15 is the use constitutional diagram in the mainboard module is inserted into the cabinet module time among a kind of computerized optimization embodiment of the present invention.
Embodiment
As shown in Figure 4, in the preferred embodiment of mainboard module of the present invention, mainboard module 100 comprises mainboard 101, and be arranged on first heat-conducting unit 102 on the mainboard 101, that contact with second heat-conducting unit 202 (as shown in Figure 8) heat conduction in the cabinet 201, wherein, first heat-conducting unit 102 is fixedlyed connected with mainboard 101.And in a preferred embodiment of the invention, first heat-conducting unit 102 is fixed on the mainboard 101 by Nut column and screw are installed, specifically, mainboard 101 is provided with mounting hole (not illustrating with label among the figure), the side that first heat-conducting unit 102 is corresponding with mounting hole is provided with Nut column, and first heat-conducting unit 102 is fixed on the mainboard 101 with cooperating of Nut column by the screw that passes mounting hole.Understandable, the fixed form of first heat-conducting unit 102 and mainboard 101 is not limited to Nut column and the fixing mode of screw.In addition, can also see in the drawings that a side of mainboard 101 also is vertically installed with front panel 104, front panel 104 is provided with a plurality of connection terminals, and this part-structure is all identical with front panel of the prior art with effect, therefore repeats no more.
Preferably, as shown in Figure 5, first heat-conducting unit 102 and second heat-conducting unit 202 are for face contacts, and the side that first heat-conducting unit 102 contacts with 202 of second heat-conducting units is the inclined-plane.First heat-conducting unit 102 is contacted the heat transfer area that is conducive to increase each other with second heat-conducting unit, 202 faces of being designed to, thereby make the radiating effect maximization, and being designed to the inclined-plane, this surface of contact is conducive in the process of cabinet module 200 that mainboard module 100 is packed into, reduce the friction between first heat-conducting unit 102 and second heat-conducting unit 202 as much as possible, therefore be conducive to the installation of mainboard module 100.
Further, the side that contacts with 202 of second heat-conducting units of above-mentioned first heat-conducting unit 102 also is provided with heat conductive pad 103 (as shown in Figure 5).Specifically, heat conductive pad 103 can be made the form of single face gum, stick on the side that first heat-conducting unit 102 contacts with 202 of second heat-conducting units, make itself and mainboard module 100 form an integral body, the benefit of doing like this is, can guarantee that heat conductive pad 103 can be not damaged in the process of installing, can also reuse simultaneously, therefore be conducive to the saving of cost.Understandable, heat conductive pad 103 also can be arranged on second heat-conducting unit 202 and that face that 102 heat conduction of first heat-conducting unit contact.
As shown in Figure 6, simultaneously referring to Fig. 7.First heat-conducting unit 102 and mainboard 101 fixedly connected sides also are provided with the projection 107 that contacts with thermal source device 106 on the mainboard 101.Wherein, first heat-conducting unit 102 adopts the higher metal material of thermal conductivity ratio, make as copper or aluminium, and projection 107 is all the higher metal of thermal conductivity ratio, and projection 107 can be one-body molded with first heat-conducting unit 102.
As shown in Figure 8, in another specific embodiment of the present invention, construct a kind of cabinet module 200, comprised cabinet 201, be provided with second heat-conducting unit 202 that contacts with first heat-conducting unit, 102 heat conduction of above-mentioned mainboard module 100 in the cabinet 201.Wherein, second heat-conducting unit 202 is fixedlyed connected with chassis cover 203.Similarly, a side of second heat-conducting unit 202 contacts with 102 of first heat-conducting units, and this side is all the inclined-plane.Further, the angle of inclination, inclined-plane of first heat-conducting unit 102 can be designed to equate with the angle of inclination, inclined-plane of second heat-conducting unit 202, like this, not only second heat-conducting unit 202 can be fitted well with first heat-conducting unit 102, and can also play the effect that increases heat transfer area and reduce both friction force in the installation process simultaneously.
As shown in Figure 9, simultaneously referring to Figure 10.The inboard of chassis cover 203 offers mounting hole (not illustrating with label among the figure), correspondence position with mounting hole on second heat-conducting unit 202 is provided with mounting hole 204, the second heat-conducting units 202 are fixed on chassis cover 203 by the locking member that passes mounting hole and mounting hole 204 inboard.Offer mounting hole 204 at second heat-conducting unit 202 and be conducive to accurately regulate second heat-conducting unit 202 in the fixed position of chassis cover 203, thereby adjust the tightening degree between first heat-conducting unit 102 and second heat-conducting unit 202.In addition, the partially filled heat-conducting cream that can also contact with chassis cover 203 at second heat-conducting unit 202 is to improve heat-conducting effect.
Further, as shown in figure 10, going back parallel interval on the rear wall 205 of cabinet 201 is provided with for the elastic parts 206 of regulating applying degree between second heat-conducting unit 202 and first heat-conducting unit 102, that is to say, two groups of elastic partss 206 should be set at least to guarantee the stability of mainboard module 100 and cabinet module 200 grafting processes on the rear wall 205 of cabinet 201.One end of this elastic parts 206 is fixedlyed connected with the rear end face of second heat-conducting unit 202.Because second heat-conducting unit 202 is provided with mounting hole 204, therefore, elastic parts 206 can play the effect of automatic adjusting first heat-conducting unit 102 and second heat-conducting unit, 202 tightening degrees, thereby first heat-conducting unit 102 is connected with the better heat conduction of heat conductive pad 103 compacted formation between second heat-conducting unit 202, be subjected to the thrust of elastic parts 206 and the combined action of first heat-conducting unit, 102 inclined-plane pressure, second heat-conducting unit 202 has realized pressing applying with chassis cover 203, also forms better heat conduction and connects.
As shown in figure 11, elastic parts 206 comprises that parallel interval is arranged on the bar 207 and be set in spring 208 on the bar 207 that presses of pressing of cabinet rear wall 205, and an end of spring 208 is fixedlyed connected with the rear end face of second heat-conducting unit 202.Understandable, elastic parts 206 is not limited to the scheme that present embodiment provides.
As shown in figure 12, in another specific embodiment of the present invention: constructed a kind of computing machine 300, comprised above-mentioned cabinet module 200 and be plugged on mainboard module 100 as described above in the cabinet module 200.
As shown in figure 13, the both sides that are respectively equipped with inserting groove 209, mainboard 101 on the internal face of cabinet 201 relative both sides are respectively equipped with the Plug Division (not illustrating with label among the figure) that is slidingly matched with inserting groove 209, in addition, mainboard 101 1 sides also are provided with front panel 104, the two ends of this front panel 104 are respectively equipped with 105 (as shown in Figure 4) of shaking hands, this handle 105 is provided with fastener (not illustrating with label among the figure), and cabinet 201 both sides are provided with the button bit (not illustrating with label among the figure) that cooperates with fastener with handle 105 corresponding positions.The fastener that arranges on the handle 105 can prevent that the mainboard module 100 that inserts cabinet module 200 from skidding off in cabinet module 200, play the fixedly effect of mainboard module 100, plate 104 is strengthened fixed effect with the part that cabinet 201 contacts with screw in front simultaneously.
Figure 14 is the use constitutional diagram of also not inserting cabinet module 200 when mainboard module 100, and the alphabetical a among the figure represents the direction that mainboard module 100 is pulled out, and alphabetical b represents the direction that mainboard module 100 is inserted into.Figure 15 is the use constitutional diagram when mainboard module 100 insertion cabinet modules 200 put in place, from figure, can clearly see, fit fully in the inclined-plane of the inclined-plane of first heat-conducting unit 102 and second heat-conducting unit 202, thereby the heat that the thermal source device of mainboard 101 is produced is discharged in the external environment by chassis cover 203.
Above embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement accordingly, can not limit protection scope of the present invention.All equalizations of doing with claim scope of the present invention change and modify, and all should belong to the covering scope of claim of the present invention.
Claims (10)
1. mainboard module, it is characterized in that, comprise mainboard (101), and be arranged on the described mainboard (101), with cabinet (201) in first heat-conducting unit (102) that contacts of second heat-conducting unit (202) heat conduction, described first heat-conducting unit (102) is fixedlyed connected with described mainboard (101).
2. mainboard module according to claim 1, it is characterized in that, described first heat-conducting unit (102) contacts with described second heat-conducting unit (202) face, and described first heat-conducting unit (102) is the inclined-plane with the side that described second heat-conducting unit (202) face contacts.
3. mainboard module according to claim 2 is characterized in that, described first heat-conducting unit (102) also is provided with heat conductive pad (103) with the side that described second heat-conducting unit (202) face contacts.
4. mainboard module according to claim 2 is characterized in that, the fixedly connected side of described first heat-conducting unit (102) and described mainboard (101) is provided with the projection (107) that contacts with the thermal source device (106) of described mainboard (101).
5. a cabinet module is characterized in that, comprises cabinet (201), is provided with second heat-conducting unit (202) that contacts with first heat-conducting unit (102) heat conduction of each described mainboard module (100) of claim 1-4 in the described cabinet (201).
6. cabinet module according to claim 5 is characterized in that, a side of described second heat-conducting unit (202) contacts with described first heat-conducting unit (102) face, and this side is the inclined-plane.
7. cabinet module according to claim 5, it is characterized in that, described cabinet (201) is provided with chassis cover (203), the inboard of described chassis cover (203) offers mounting hole, described second heat-conducting unit (202) is gone up and the correspondence position of described mounting hole is provided with mounting hole (204), and described second heat-conducting unit (202) is fixed on the inboard of described chassis cover (203) by the locking member that passes described mounting hole and mounting hole (204).
8. cabinet module according to claim 7, it is characterized in that, the rear wall (205) of described cabinet (201) is gone up parallel interval and is provided with for regulating the elastic parts (206) of described second heat-conducting unit (202) with first heat-conducting unit (102) applying degree, and an end of described elastic parts (206) is fixedlyed connected with the rear end face of described second heat-conducting unit (202).
9. cabinet module according to claim 8, it is characterized in that, described elastic parts (206) comprises that parallel interval is arranged on the bar that presses (207) of described cabinet rear wall (205) and is set in spring (208) on the described bar that presses (207), and an end of described spring (208) is fixedlyed connected with the rear end face of described second heat-conducting unit (202).
10. a computing machine is characterized in that, comprises the described cabinet module of claim 5 (200) and is plugged on the interior mainboard module as claimed in claim 1 (100) of described cabinet module (200);
The both sides that are respectively equipped with inserting groove (209), described mainboard (101) on the internal face of the relative both sides of described cabinet (201) are respectively equipped with the Plug Division that is slidingly matched with described inserting groove (209);
Described mainboard module (100) was slidably disposed in the described cabinet module (200) by Plug Division and cooperating of inserting groove (209), so that first heat-conducting unit (102) of described mainboard module (100) contacts with second heat-conducting unit (202) heat conduction of described cabinet module (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047281.7A CN103294134B (en) | 2012-02-28 | 2012-02-28 | A kind of mainboard module, cabinet module and computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047281.7A CN103294134B (en) | 2012-02-28 | 2012-02-28 | A kind of mainboard module, cabinet module and computer |
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| Publication Number | Publication Date |
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| CN103294134A true CN103294134A (en) | 2013-09-11 |
| CN103294134B CN103294134B (en) | 2018-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210047281.7A Active CN103294134B (en) | 2012-02-28 | 2012-02-28 | A kind of mainboard module, cabinet module and computer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041506A (en) * | 2017-06-09 | 2018-12-18 | 杭州海康机器人技术有限公司 | Electronic equipment |
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201319172Y (en) * | 2008-12-01 | 2009-09-30 | 研祥智能科技股份有限公司 | Closed special computer |
| CN201402437Y (en) * | 2009-03-10 | 2010-02-10 | 罗伏军 | Computer heat conducting block |
| TW201032030A (en) * | 2009-02-24 | 2010-09-01 | Moxa Inc | Heat dissipation structure of chassis for industry computer and manufacture method thereof |
| CN202025273U (en) * | 2011-03-29 | 2011-11-02 | 研祥智能科技股份有限公司 | Universal heat conducting block and installation structure thereof |
-
2012
- 2012-02-28 CN CN201210047281.7A patent/CN103294134B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201319172Y (en) * | 2008-12-01 | 2009-09-30 | 研祥智能科技股份有限公司 | Closed special computer |
| TW201032030A (en) * | 2009-02-24 | 2010-09-01 | Moxa Inc | Heat dissipation structure of chassis for industry computer and manufacture method thereof |
| CN201402437Y (en) * | 2009-03-10 | 2010-02-10 | 罗伏军 | Computer heat conducting block |
| CN202025273U (en) * | 2011-03-29 | 2011-11-02 | 研祥智能科技股份有限公司 | Universal heat conducting block and installation structure thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041506A (en) * | 2017-06-09 | 2018-12-18 | 杭州海康机器人技术有限公司 | Electronic equipment |
| CN109041506B (en) * | 2017-06-09 | 2023-12-01 | 杭州海康威视数字技术股份有限公司 | Electronic equipment |
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
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| Publication number | Publication date |
|---|---|
| CN103294134B (en) | 2018-03-02 |
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Effective date of registration: 20230719 Address after: 518000 1701, Yanxiang Science and Technology Building, No. 31, High-tech Middle 4th Road, Maling Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd. Patentee after: BEIJING EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: 518057 Guangdong city of Shenzhen province Nanshan District high in the four EVOC Technology Building No. 31 Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. Patentee before: BEIJING EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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