CN109041506A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN109041506A CN109041506A CN201710435814.1A CN201710435814A CN109041506A CN 109041506 A CN109041506 A CN 109041506A CN 201710435814 A CN201710435814 A CN 201710435814A CN 109041506 A CN109041506 A CN 109041506A
- Authority
- CN
- China
- Prior art keywords
- heat
- electronic equipment
- structural plane
- machine core
- accommodating chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 114
- 238000009434 installation Methods 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Abstract
The application discloses a kind of electronic equipment, and disclosed electronic equipment includes shell, machine core and heat-conducting mechanism；The opening that the shell has accommodating chamber and is connected to the accommodating chamber；The machine core is arranged in accommodating chamber, and there is the first structure face towards the opening and the second structural plane away from the opening, position on the machine core between the first structure face and second structural plane has third structural plane, and the third structural plane and the inner wall of the accommodating chamber are positioned opposite；The heat-conducting mechanism is arranged between the third structural plane and the inner wall of the accommodating chamber, with thermally conductive to the shell.Above scheme can solve in current electronic equipment, and radiator structure opens the problem of occupying biggish space on direction in the opening of shell.
Description
Technical field
This application involves electronic equipment dissipating heat technical field more particularly to a kind of electronic equipment.
Background technique
With the development of demand and technology, user increasingly pursues the miniaturization of electronic equipment, the miniaturization of electronic equipment
Design is the important R&D direction of research and development of products person.Electronic equipment needs to take into account the heat dissipation of equipment while miniaturization
Performance.For this purpose, current electronic equipment is provided with radiator structure.
Electronic equipment generally includes shell and machine core, and shell has opening, and for the ease of installation, radiator structure is commonly installed
On mounting surface of the machine core toward and away from opening, or it is directly installed on open-mouth.In such cases, radiator structure and machine core
Direction sequence is opened in opening to arrange.It will be apparent that radiator structure can be opened in opening occupies biggish space, Jin Erhui on direction
The space for causing more important opening to open direction is largely occupied.The open space for opening direction is largely occupied in shell
Both inconvenient operator operated other mechanisms by opening, was also unfavorable for the Miniaturization Design of electronic equipment.
Summary of the invention
The application provides a kind of electronic equipment, and to solve in current electronic equipment, radiator structure is opened in the opening of shell
The problem of occupying biggish space on logical direction.
The application adopts the following technical solutions:
Electronic equipment, including shell, machine core and heat-conducting mechanism；The shell has accommodating chamber and connects with the accommodating chamber
Logical opening；The machine core is arranged in the accommodating chamber, and has towards the first structure face of the opening and away from described
The second open structural plane, position on the machine core positioned at the first structure face and second structural plane between is with the
Three structural planes, the third structural plane and the inner wall of the accommodating chamber are positioned opposite；The heat-conducting mechanism is arranged in the third
Between structural plane and the inner wall of the accommodating chamber, with thermally conductive to the shell.
Preferably, in above-mentioned electronic equipment, the dismounting direction of the heat-conducting mechanism is parallel with the open direction.
Preferably, in above-mentioned electronic equipment, the heat-conducting mechanism is mounted on the inner wall of the accommodating chamber, and with described
Three structural planes are in contact.
Preferably, in above-mentioned electronic equipment, the inner wall of the accommodating chamber and the third structural plane are formed by space packet
Wedge shape space is included, the heat-conducting mechanism is the wedge mechanism that can cooperate with the wedge shape space.
Preferably, in above-mentioned electronic equipment, described biggish one end of wedge shape space cross-sectional area is described towards the opening
Heat-conducting mechanism is inserted into the wedge shape space from described biggish one end of wedge shape space cross-sectional area.
Preferably, in above-mentioned electronic equipment, the inner wall of the accommodating chamber has a guiding surface, the guiding surface with it is described
Third structural plane forms the wedge shape space.
Preferably, in above-mentioned electronic equipment, the shell includes shell main body and guide pad, and the guide pad has described lead
To inclined-plane；The guide pad is arranged in the shell main body.
Preferably, in above-mentioned electronic equipment, the guide pad is an integral structure with the shell main body.
Preferably, in above-mentioned electronic equipment, the heat-conducting mechanism includes wedge block and heat-conducting layer；The heat-conducting layer setting exists
On the wedge block, and fit with the third structural plane；The surface opposite with the guiding surface is on the wedge block
Tapered ramp, the tapered ramp are slidably matched with the guiding surface, and the tapered ramp and the guiding surface can be
The installation direction of the heat-conducting mechanism limits cooperation, and the installation direction is parallel with the open direction.
Preferably, in above-mentioned electronic equipment, two side edges of the tapered ramp are provided with positioning region, described in two
The opposite surface in positioning region and the tapered ramp form guide chute, and the guide chute is slidably matched with the guide pad.
Preferably, in above-mentioned electronic equipment, clinch is provided at the top of the wedge block, the clinch is in the peace
It fills to overlap on direction with the guide pad and cooperate.
Preferably, in above-mentioned electronic equipment, the clinch is provided with connecting hole, the clinch by with the connection
The connector of hole cooperation is fixedly connected with the guide pad, and the connector can be torn open along with the opening towards parallel direction
Dress.
Preferably, in above-mentioned electronic equipment, the wedge block is provided with holding holes, and the quantity of the holding holes is two,
Two holding holes are arranged symmetrically in the two sides of the connecting hole, the axis of the connecting hole away from the clinch both ends away from
From equal.
Preferably, in above-mentioned electronic equipment, the surface opposite with the third structural plane is provided with line on the wedge block
Road, the heat-conducting layer are applied to surface opposite with the third structural plane on the wedge block.
Preferably, in above-mentioned electronic equipment, the third structural plane is multiple, multiple third structural planes and the appearance
Receive the annulus constituted between the inner wall of chamber around the machine core, the heat-conducting mechanism is multiple, multiple heat-conducting mechanisms
Arranged for interval is in the annulus.
Preferably, in above-mentioned electronic equipment, the machine core is camera machine core, and the camera machine core is provided with image sensing
Device, the photosensitive side of described image sensor is towards the opening.
Preferably, in above-mentioned electronic equipment:
The machine core includes circuit board and the metal cap that is located on the circuit board, and the metal cap has described first
Structural plane, second structural plane and the third structural plane；Or
The machine core includes hexahedron metal frame, and the hexahedron metal frame includes the first structure face, described second
Structural plane and the third structural plane；Or
The machine core includes matrix and the circuit board that is arranged at least one surface of described matrix, is set on the circuit board
It is equipped with chip；The circuit board and described matrix form six sided structures body, the six sided structures body include the first structure face,
Second structural plane or the third structural plane.
The application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
In electronic equipment disclosed in the present application, the opening that shell has accommodating chamber and is connected to accommodating chamber, machine core has court
To open first structure face, away from open the second structural plane and the third between first structure face and the second structural plane
Structural plane, heat-conducting mechanism are arranged between third structural plane and the inner wall of accommodating chamber, so that the heat of the generation of machine core is passed through the
Three structural planes are transmitted on shell, final to realize heat dissipation.By above-mentioned radiation processes it is found that heat-conducting mechanism is located at third structural plane
Between the inner wall of accommodating chamber, and third structural plane is located between first structure face and the second structural plane, this allows for thermally conductive
Mechanism will not be arranged in towards open first structure face or on the second open structural plane, will not more occupy open position
It sets, also just can be avoided heat-conducting mechanism and open direction in opening and occupy biggish space.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the schematic cross-sectional view of electronic equipment provided by the embodiments of the present application；
Fig. 2 is the schematic perspective view of heat-conducting mechanism in Fig. 1；
Fig. 3 is the partial enlargement structural representation of Fig. 1；
Fig. 4 is the scheme of installation of the heat-conducting mechanism of electronic equipment provided by the embodiments of the present application, in Fig. 4, hollow arrow
The installation direction for being oriented to heat-conducting mechanism, the disassembly direction of heat-conducting mechanism and the direction of hollow arrow are opposite.
Description of symbols:
100- shell, 110- accommodating chamber, 120- are open, 130- is open, 140- shell main body, 150- guide pad；
200- machine core, 210- structural plane, 220- structural plane, 230- third structural plane；
300- heat-conducting mechanism, 310- wedge block, 311- tapered ramp, the positioning region 312-, 313- clinch, 314- connection
Hole, 315- holding holes, 320- heat-conducting layer, 330- threaded connector；
400- annulus.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
Please refer to Fig. 1-4, the embodiment of the present application discloses a kind of electronic equipment, disclosed electronic equipment include shell 100,
Machine core 200 and heat-conducting mechanism 300.
The opening that shell 100 has accommodating chamber 110 and is connected to accommodating chamber 110, machine core 200 are arranged in accommodating chamber 110,
Machine core 200 is the heat generating parts of electronic equipment disclosed in the embodiment of the present application, and machine core 200 has towards open first structure face
With the second structural plane away from opening.It should be noted that open quantity can be one, or opposite two.
For a kind of specific embodiment as shown in Figure 1, open quantity is two, two openings are respectively opening 120 and opening 130,
Opening 120 and opening 130 are positioned opposite.For opening 120, structural plane 210 is towards opening 120, as first structure face,
Structural plane 220 is away from opening 120, as the second structural plane；For opening 130, structural plane 210 is away from opening 130, as
Second structural plane, structural plane 220 is towards opening 130, as first structure face.That is, deviating from the structural plane of a certain opening
It can be referred to as the second structural plane, first structure face can be referred to as towards the structural plane of the opening.
Position on machine core 200 between first structure face and the second structural plane has third structural plane 230.Third knot
Structure face 230 and the inner wall of accommodating chamber 110 are positioned opposite.The inner wall and machine core 200 of accommodating chamber 110 is arranged in heat-conducting mechanism 300
Between third structural plane 230, with thermally conductive to shell 100.
In electronic equipment disclosed in the embodiment of the present application, shell 100 has accommodating chamber 110 and is connected to accommodating chamber 110
Opening, machine core 200 has towards open first structure face, away from the second open structural plane and is located at first structure face and the
Third structural plane 230 between two structural planes, heat-conducting mechanism 300 be arranged in third structural plane 230 and accommodating chamber 110 inner wall it
Between, the heat so as to generate machine core 200 is transmitted on shell 100 by third structural plane 230, final to realize heat dissipation.Pass through
Above-mentioned radiation processes it is found that heat-conducting mechanism 300 between third structural plane 230 and the inner wall of accommodating chamber 110, and third structure
Again between first structure face and the second structural plane, this, which allows for heat-conducting mechanism 300, will not be arranged in towards opening in face 230
First structure face and on the second open structural plane, will not more occupy open position, also just can be avoided heat-conducting mechanism 300
Direction, which is opened, in opening occupies biggish space.
Under normal conditions, machine core 200 is realized by special bindiny mechanism or connector (such as screw) in accommodating chamber 110
In fixation, the function of heat-conducting mechanism 300 is thermally conductive.In the embodiment of the present application, machine core 200 is arranged in heat-conducting mechanism 300
Between third structural plane and the inner wall of accommodating chamber 110, conductive force can be not only played, but also Auxiliary support machine core can be played
200 effect, so that the installation of machine core 200 is more stable.
In further preferred scheme, the inner wall of machine core 200 and accommodating chamber 110 can form annulus 400, that is,
Say, machine core 200 has a gap between the inner wall of accommodating chamber 110 in all directions, heat-conducting mechanism 300 can be it is multiple, i.e., extremely
Two few, multiple heat-conducting mechanisms 300 can be arranged in annulus 400 with compartment of terrain.In such cases, multiple heat-conducting mechanisms
300 can be from the multiple directions of third structural plane 230 or multiple third structural planes 230 implement heat transfer, and then can improve
Heat transfer efficiency.At the same time, multiple heat-conducting mechanisms 300 can play the role of more balancedly Auxiliary support machine core 200, so that machine
Core 200 installation it is more stable, simultaneously, moreover it is possible to from multiple directions alleviate electronic equipment by vibration machine core 200 is influenced, rise
To the effect of protection machine core 200.
Specifically, multiple heat-conducting mechanisms 300 can be discrete and be uniformly distributed in annulus 400.This ring-type cloth
The structure for setting multiple heat-conducting mechanisms 300 can make electronic equipment have good heat dissipation performance, be conducive to quickly realize electronics
Thermal balance inside equipment.Especially when electronic equipment has temperature measuring equipment, heat-conducting mechanism 300 can preferably reduce electronics
Influence of the equipment self-heating to temperature measuring equipment, so as to improve the temperature measurement accuracy of temperature measuring equipment.Certainly, in order to subtract as much as possible
The temperature measuring equipment of the small interference to temperature measuring equipment work, electronic equipment nearby can arrange greater number of heat-conducting mechanism 300, lead to
Excessive arrangement heat-conducting mechanism 300, which is realized, reinforces thermally conductive purpose.
In the embodiment of the present application, third structural plane 230 can be one, i.e., have between first structure face and the second structural plane
There are a third structural plane 230, such as cylindrical surface；Third structural plane 230 can be multiple, first structure face and the second structural plane
Between have multiple third structural planes 230.In a kind of specific embodiment, machine core 200 has multiple third structural planes 230,
Heat-conducting mechanism 300 can be multiple, and can correspond with multiple third structural planes 230, i.e. the quantity of heat-conducting mechanism 300 can
With equal with the quantity of third structural plane 230.Certainly, the quantity of heat-conducting mechanism 300 can greater than, equal to or be less than third structure
The product design personnel of the quantity in face 230, electronic equipment can adaptively adjust according to the specific radiating requirements of electronic equipment
The quantity of heat-conducting mechanism 300.In a kind of specific embodiment, third structural plane 230 is three, three third structural planes 230
In at least one heat-conducting mechanism 300 is set between the inner wall of accommodating chamber 110, third structural plane be it is multiple in the case where,
Third structural plane is traditionally arranged to be at least three in the application.
Another specific embodiment are as follows: third structural plane 230 is cylindrical surface, and heat-conducting mechanism 300 is multiple and multiple
Heat-conducting mechanism 300 is connected in the different parts on different directions and cylindrical surface respectively, to realize machine core 200 in a plurality of directions
Heat dissipation.
In electronic equipment disclosed in the embodiment of the present application, heat-conducting mechanism 300 has good heat-conducting effect, and then can accelerate
The thermal balance of electronic equipment internal reaches the time of normal operating conditions when reducing electronic equipment cold start-up, and then can mention
The working efficiency of high electronic equipment.
During the actual assembled of equipment, heat-conducting mechanism 300 can be arranged using various ways in third structural plane 230
Between the inner wall of accommodating chamber 110, also allowing for heat-conducting mechanism 300, there may be a variety of dismounting modes.Preferably, heat-conducting mechanism
300 dismounting direction is parallel with open direction, and in such cases, the dismounting of heat-conducting mechanism 300 can make full use of shell 100
It is open realize, without designing other disassembly and assembly structures on an electronic device.
It should be noted that herein, the dismounting direction of heat-conducting mechanism 300 includes installation direction and disassembly direction, installation
Direction is with disassembly direction on the contrary, the dismounting direction of heat-conducting mechanism 300 is parallel with open direction, it is believed that heat-conducting mechanism 300
Installation direction and disassembly direction it is parallel with open direction.So-called installation direction refers to that heat-conducting mechanism 300 gradually leans on
Closely until its direction for being in rigging position, so-called disassembly direction refer to that heat-conducting mechanism 300 is gradually distance from until its disengaging
The direction of rigging position.
As described above, heat-conducting mechanism 300 is arranged in realization between third structural plane 230 and the inner wall of accommodating chamber 110 and leads
Heat, in order to improve heat transfer efficiency, heat-conducting mechanism 300 be may be mounted on the inner wall of accommodating chamber 110, and with third structural plane 230
It is in contact.More preferably, heat-conducting mechanism 300 is realized in such a way that face fits with face with third structural plane 230 and is contacted, this
Heat-conducting area can be further increased.
In electronic equipment disclosed in the embodiment of the present application, the third structural plane 230 of machine core 200 is arranged in heat-conducting mechanism 300
There are many modes between the inner wall of accommodating chamber 110.For the ease of installation, while the stability of assembly is improved, it is a kind of specific
Embodiment in, it includes wedge shape space, heat-conducting mechanism that the inner wall of accommodating chamber 110 and third structural plane 230, which are formed by space,
300 wedge mechanism for that can cooperate with wedge shape space.Heat-conducting mechanism 300 and wedge shape space cooperate and then realize heat-conducting mechanism
300 installation positioning.The cooperation of heat-conducting mechanism 300 and wedge shape space is capable of forming wedge mechanism, and wedge mechanism has preferable
Positioning function.
Certainly, the biggish one end of wedge shape space cross-sectional area can be inclined to open certain angle, but compared to wedge shape
Towards for the opening of shell 100, such mode is unfavorable for the dismounting of heat-conducting mechanism 300 for Space Cross Section biggish one end of product.
In order to further facilitate the dismounting of heat-conducting mechanism 300, the biggish one end of wedge shape space cross-sectional area towards shell 100 opening,
Heat-conducting mechanism 300 is inserted into wedge shape space from the biggish one end of wedge shape space cross-sectional area.During dismounting, operator
Member can manipulate the disassembling operations of heat-conducting mechanism 300 by open more conveniently.
The inner wall of third structural plane 230 and accommodating chamber 110 is formed by space and integrally can be wedge shape space, can also be with
It is that it is wedge shape space that the inner wall of third structural plane 230 and accommodating chamber 110, which is formed by a part in space,.The shape of wedge shape space
At there are many modes, a kind of specific embodiment is that the inner wall of accommodating chamber 110 has guiding surface, guiding surface and third
Structural plane 230 forms wedge shape space.Specifically, third structural plane 230 can be parallel to open direction direction extend it is straight
Face, guiding surface tilt extension for facing directly.
Guiding surface can be formed directly into the inner wall of accommodating chamber 110, i.e., smooth with the other positions of the inner wall of accommodating chamber 110
Linking.Guiding surface can also be formed by other structures portion, and in a kind of specific embodiment, shell 100 may include shell
Main body 140 and guide pad 150, guide pad 150 have guiding surface, and guide pad 150 is arranged in shell main body 140.Specifically, leading
It can be removeably positioned in shell main body 140 to block 150, convenient for user to the replacement of guide pad 150 or to electronics
The maintenance of equipment dismounts.For example, guide pad 150 can be fixed in shell main body 140 in a manner of clamping.Certainly, guide pad 150
Integral structure can be used with shell main body 140, such structure makes guide pad 150 other than providing guiding surface, moreover it is possible to
Play the role of 100 intensity of assistant reinforcement shell, in such cases, guide pad 150 is similar to the reinforcing rib of shell main body 140.Together
When, shell 100 uses integral structure, has many advantages, such as to save 150 disassembling operations of guide pad convenient for manufacture.
In further preferred scheme, heat-conducting mechanism 300 may include wedge block 310 and heat-conducting layer 320, heat-conducting layer 320
Surface opposite with the third structural plane 230 of machine core 200 on wedge block 310 is set, and is fitted with third structural plane 230,
It is thermally conductive between machine core 200 and heat-conducting mechanism 300 to realize.The surface opposite with guiding surface is wedge shape on wedge block 310
Inclined-plane 311, tapered ramp 311 are slidably matched with guiding surface, and tapered ramp 311 and guiding surface can be in heat-conducting mechanisms 300
Installation direction limit cooperation.Preferably, the installation direction of heat-conducting mechanism 300 is parallel with open direction.In the process of installation
In, then the top of the bottom end fitting guiding surface of tapered ramp 311 is made tapered ramp 311 along guiding by operator
Inclined-plane sliding, until heat-conducting mechanism 300 is located in wedge shape space.
In specific conduction process, heat is transported on wedge block 310 by heat-conducting layer 320 from machine core 200, then wedge-shaped
Block 310 is oriented to the realization of shell 100 and sheds.Heat-conducting layer 320 is the key that heat-conducting mechanism 300 obtains heat from machine core 200, therefore,
Heat-conducting layer 320 can be made of the good material of heating conduction.Specifically, heat-conducting layer 320 can be heat conduction silicone, i.e., by
The layer structure that heat-conducting silicone grease is formed.
In above structure, heat-conducting mechanism 300 includes wedge block 310, and the inner wall of accommodating chamber 110 has guiding surface, guiding
Wedge shape space is formed between inclined-plane and the third structural plane 230 of machine core 200, in the installation direction of heat-conducting mechanism 300, wedge shape space
Gap width be gradually reduced, the tapered ramp 311 of wedge block 310 and the cooperation of guiding surface are able to achieve entire heat-conducting mechanism
300 positioning.In such cases, heat-conducting mechanism 300 can be slided along guiding surface, thus realize installation, it is this to be similar to
The mode that is slidably installed of drawer type, structure is relatively simple, can be realized fast assembling-disassembling, while being also convenient for subsequent plant maintenance behaviour
Make.
In addition, during wedge block 310 is slided along the installation direction of heat-conducting mechanism 300, guiding surface and machine core
The gap width that 200 third structural plane 230 is formed by wedge shape space is gradually reduced, as shown in figure 4, in such cases, wedge
Shape block 310 is slided along guiding surface, and heat-conducting layer 320 can be made to move closer to the third structural plane 230, Jin Erneng of machine core 200
It is enough that heat-conducting layer 320 in 310 sliding process of wedge block is preferably avoided to be easier to be scratched by the third structural plane 230 of machine core 200
Problem, can ensure that the integrality of heat-conducting layer 320 after being installed, and then be avoided that the destruction installed to heat-conducting layer 320.
Moreover, wedge block 310 can be slided along guiding surface under the guidance of guiding surface, until heat-conducting layer 320 and machine
Until the third structural plane 230 of core 200 is bonded, guiding surface can ensure that the sliding of wedge block 310 persistently carries out, finally can be really
It protects heat-conducting layer 320 to be fitted in relatively stablely on the third structural plane 230 of machine core 200, it is ensured that reliable thermally conductive.
In addition, above-mentioned heat-conducting mechanism 300 is slidably matched using wedge block 310 and guiding surface realizes positioning, can reduce
The complexity that heat-conducting mechanism 300 positions, and then the inner space that can solve electronic equipment is narrow and lead to inconvenient problem,
Be conducive to the light-weight design of electronic equipment and improve the inner space utilization rate of electronic equipment.
In order to realize that wedge block 310 more steadily slides, can be set on tapered ramp 311 or guiding surface along cunning
The sliding track mechanism that dynamic direction extends, sliding track mechanism can be realized the positioning slided to tapered ramp 311, avoid its sliding from generating inclined
Tiltedly.For example, one is provided with guiding groove in tapered ramp 311 and guiding surface, it is provided in another one sliding with guiding groove
The guide protrusions of dynamic cooperation, guiding groove and guide protrusions cooperation constitute sliding track mechanism.In a kind of specific embodiment, guiding
Groove is located between two side edges of tapered ramp 311, and correspondingly, guide protrusions are located at two side edges of guiding surface
Between.
Certainly, there are many structures of sliding track mechanism, referring to FIG. 2, in a kind of preferred scheme, the two of tapered ramp 311
Positioning region 312 has can be set in a side edge, and the opposite surface in two positioning regions 312 and tapered ramp 311 form guiding and slide
Slot, guide chute are slidably matched with guide pad 150, and the guide chute and the cooperation of guide pad 150 constitute sliding track mechanism.Above-mentioned positioning
Portion 312 can with the side location fit of wedge block 310, and then enable to wedge block 310 along guiding surface sliding more
Stablize, while can ensure that tapered ramp 311 and guiding surface have biggish sliding contact area, guarantees that wedge block 310 slides
While, guiding surface can support relatively stablely wedge block 310.
Clinch 313 has can be set in the top of wedge block 310, and clinch 313 is on the installation direction of heat-conducting mechanism 300
It overlaps and cooperates with guide pad 150, when clinch 313 is in overlap joint state with guide pad 150, the tapered ramp of wedge block 310
311 slide in place along guiding surface, at this point, heat-conducting layer 320 is in the state to fit with the third structural plane 230 of machine core 200.
Clinch 313 is also used as installation heat-conducting mechanism 300 and is fixedly connected with portion, specifically, clinch 313 can be opened
Equipped with connecting hole 314, clinch 313 is realized by the connector that cooperates with connecting hole 314 and is fixedly connected with guide pad 150.
Connector can be threaded connector 330, as shown in Fig. 1 or 3.Connector can be along open towards parallel with shell 100
Direction dismounting, in such cases, the dismounting of connector and the dismounting of heat-conducting mechanism 300 are open towards phase with shell 100
Parallel dismounting, can further facilitate the dismounting of heat-conducting mechanism 300.
As described in the background art, current electronic equipment develops towards miniaturization, the various components of electronic equipment
Size it is also smaller and smaller.Implement operation for the ease of the installation to heat-conducting mechanism 300, it is preferred that wedge block 310 can be set
There are holding holes 315.Operator implements to clamp by clampers such as tweezers to holding holes 315, to realize to heat-conducting mechanism
300 clamping.Specifically, holding holes 315 can be set on clinch 313, in such cases, operator being capable of clamping wedge
The top of shape block 310, and then it is more convenient subsequent installation operation.
A kind of assembling process of the section components of the electronic equipment of specific structure disclosed in the embodiment of the present application is as follows: first will
Machine core 200 is fixed on shell 100, and then operator can be made using the holding holes 315 of tweezers clamping heat-conducting mechanism 300
The tapered ramp 311 for obtaining the wedge block 310 of heat-conducting mechanism 300 is slided along guiding surface, until clinch 313 is overlapped on guiding
On block 150 and heat-conducting layer 320 is fitted on the third structural plane 230 of machine core 200, then will be wedge-shaped using threaded connector 330
Block 310 is fixed on guide pad 150.In such cases, the thermally conductive route of electronic equipment are as follows: machine core 200 → heat-conducting layer, 320 → wedge
The external environment of shape block 310 → guide pad, 150 → shell, 100 → electronic equipment.When operator needs to implement to tie up to machine core 200
When shield, operator only needs to come loose threaded connector 330, takes out heat-conducting mechanism 300 out of wedge shape space with tweezers and is
Can, it is simple, convenient, quick.
The embodiment of the present application does not limit the particular number and distributing position of holding holes 315, the quantity and distribution of holding holes 315
As long as position, which can facilitate, implements clipping operation to wedge block 310 by holding holes 315 for operator.A kind of specific reality
It applies in mode, the quantity of holding holes 315 is two, and two holding holes 315 can be arranged symmetrically in the two sides of connecting hole 314, even
Connect axis being equidistant away from 313 both ends of clinch in hole 314.In such cases, connecting hole 314 is located in clinch 313
Between position, two holding holes 315 are arranged symmetrically in the two sides of connecting hole 314, the arrangement of connecting hole 314 and two holding holes 315
Position can ensure that the quality of entire wedge block 310 is more balanced, and then the sliding of heat-conducting mechanism 300 can be made more stable, keep away
Exempt to glance off in 300 sliding process of heat-conducting mechanism.In addition, two holding holes 315 can also play the role of lightening hole, it is convenient for
Wedge block 310 is picked up.
As described above, heat-conducting layer 320 can be arranged on wedge block 310 by way of spraying, thermally conductive in order to improve
The stability that layer 320 is connect with wedge block 310.In preferred scheme, on wedge block 310 with the third structural plane 230 of machine core 200
Lines has can be set in opposite surface, and heat-conducting layer 320 is applied to 230 phase of third structural plane on wedge block 310 with machine core 200
Pair surface.The setting of lines can be improved the stability that heat-conducting layer 320 depends on, at the same can be improved wedge block 310 with it is thermally conductive
Heat-conducting area between layer 320, and then heat transfer efficiency can be improved.
Specifically, lines may include in the raised or sunken of array distribution.Certainly, heat-conducting layer 320 is arranged in wedge block 310
Surface can both be provided with protrusion, be also equipped with recess, this can be further improved what heat-conducting layer 320 was combined with wedge block 310
Stability.Specifically, protrusion can be strip projected parts, recess can be strip recess.The application does not limit raised or sunken
Concrete shape.
In the embodiment of the present application, machine core 200 can be battery, be also possible to camera machine core.Specifically, machine core 200 is phase
Under the premise of machine machine core, camera machine core is provided with imaging sensor, and the photosensitive side of imaging sensor is passed towards opening convenient for image
Sensor obtains image.A kind of specific embodiment are as follows: under the premise of machine core 200 is camera machine core, electronic equipment can be nothing
Man-machine, which can be realized high-altitude and takes photo by plane.In such cases, the imaging sensor of camera machine core setting is led towards opening
Heat engine structure 300 is arranged between camera machine core and the inner wall of accommodating chamber 110, this can reduce shell 100 in the size in open direction,
And then can make entire unmanned plane that there is smaller size and smaller weight, this for the unmanned plane that needs to fly in the sky and
Speech, have contribution outstanding, can not only reduce the energy consumption of unmanned plane device, moreover it is possible to provide high-altitude shooting stability, flexibly
Property.
In the embodiment of the present application, machine core 200 may include circuit board and be provide with metal cap on circuit boards, metal cap tool
There are first structure face, the second structural plane and third structural plane 230.Machine core 200 may include hexahedron metal frame, hexahedron metal
Frame includes first structure face, the second structural plane and third structural plane 230.Machine core 200 may include matrix and setting matrix extremely
Lack the circuit board on a surface, chip is provided on circuit board, circuit board and matrix form six sided structures body, six sided structures body
Including first structure face, the second structural plane and third structural plane 230.The application does not limit the specific structure of machine core 200.
Electronic equipment disclosed in the embodiment of the present application can be unmanned plane, the mobile phone, plate surveyed and drawn or monitored for high-altitude
Etc. equipment.Fig. 1 is the schematic diagram of the section structure of unmanned plane, and in such cases, shell 100 is tubular structure.Certainly, electronic equipment
Specific type it is different, the specific structure of shell 100 and machine core 200 can be variant, but does not influence shell as described above
100, the matching relationship between machine core 200 and heat-conducting mechanism 300.
Herein, as long as the technical characteristic non-contradiction in each embodiment can combine to form new technical solution, this
A little new technical solutions are in range disclosed in the present application, it is contemplated that text is succinct, these new technical solutions this then not
It repeats again.
Only emphasis describes the difference with other preferred embodiments to each preferred embodiment, as long as each preferred embodiment does not rush
It is prominent, can any combination, embodiment is formed by after combination also within scope disclosed in this specification, it is contemplated that text
Succinctly, it is individually described with regard to being no longer formed by embodiment to combination herein.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (17)
1. electronic equipment, which is characterized in that including shell, machine core and heat-conducting mechanism；The shell have accommodating chamber and with institute
State the opening of accommodating chamber connection；The machine core is arranged in the accommodating chamber, and has towards the first structure face of the opening
With the second structural plane for deviating from the opening, on the machine core between the first structure face and second structural plane
Position has third structural plane, and the third structural plane and the inner wall of the accommodating chamber are positioned opposite；The heat-conducting mechanism setting
Between the third structural plane and the inner wall of the accommodating chamber, with thermally conductive to the shell.
2. electronic equipment according to claim 1, which is characterized in that the dismounting direction of the heat-conducting mechanism and the opening
Direction it is parallel.
3. electronic equipment according to claim 1, which is characterized in that the heat-conducting mechanism is mounted on the interior of the accommodating chamber
On wall, and it is in contact with the third structural plane.
4. electronic equipment according to claim 1, which is characterized in that the inner wall of the accommodating chamber and the third structural plane
Being formed by space includes wedge shape space, and the heat-conducting mechanism is the wedge mechanism that can cooperate with the wedge shape space.
5. electronic equipment according to claim 4, which is characterized in that the biggish one end court of wedge shape space cross-sectional area
To the opening, the heat-conducting mechanism is inserted into the wedge shape space from described biggish one end of wedge shape space cross-sectional area.
6. electronic equipment according to claim 4, which is characterized in that the inner wall of the accommodating chamber has guiding surface, institute
It states guiding surface and the third structural plane forms the wedge shape space.
7. electronic equipment according to claim 6, which is characterized in that the shell includes shell main body and guide pad, described
Guide pad has the guiding surface；The guide pad is arranged in the shell main body.
8. electronic equipment according to claim 7, which is characterized in that the guide pad is integral type knot with the shell main body
Structure.
9. electronic equipment according to claim 7, which is characterized in that the heat-conducting mechanism includes wedge block and heat-conducting layer；
The heat-conducting layer setting fits on the wedge block, and with the third structural plane；On the wedge block with the guiding
The opposite surface in inclined-plane is tapered ramp, and the tapered ramp is slidably matched with the guiding surface, and the tapered ramp and
The guiding surface can be limited in the installation direction of the heat-conducting mechanism to be cooperated, and the installation direction and the open direction are flat
Row.
10. electronic equipment according to claim 9, which is characterized in that two side edges of the tapered ramp are respectively provided with
There is positioning region, the opposite surface in two positioning regions and the tapered ramp form guide chute, the guide chute and institute
Guide pad is stated to be slidably matched.
11. electronic equipment according to claim 9, which is characterized in that be provided with clinch, institute at the top of the wedge block
It states clinch and is overlapped on the installation direction with the guide pad and cooperated.
12. electronic equipment according to claim 11, which is characterized in that the clinch is provided with connecting hole, described to take
Socket part is fixedly connected by the connector cooperated with the connecting hole with the guide pad, and the connector can edge and the opening
It is dismounted towards parallel direction.
13. electronic equipment according to claim 12, which is characterized in that the wedge block is provided with holding holes, the folder
The quantity for holding hole is two, and two holding holes are arranged symmetrically in the two sides of the connecting hole, the axis of the connecting hole away from
The clinch both ends are equidistant.
14. electronic equipment according to claim 9, which is characterized in that on the wedge block with the third structural plane phase
Pair surface be provided with lines, the heat-conducting layer is applied to surface opposite with the third structural plane on the wedge block.
15. electronic equipment according to claim 1, which is characterized in that the third structural plane be it is multiple, multiple described the
Between three structural planes and the inner wall of the accommodating chamber constitute around the machine core annulus, the heat-conducting mechanism be it is multiple,
Multiple heat-conducting mechanism arranged for interval are in the annulus.
16. electronic equipment described in any one of -15 according to claim 1, which is characterized in that the machine core is camera machine core,
The camera machine core is provided with imaging sensor, and the photosensitive side of described image sensor is towards the opening.
17. electronic equipment described in any one of -15 according to claim 1, it is characterised in that:
The machine core includes circuit board and the metal cap that is located on the circuit board, and the metal cap has the first structure
Face, second structural plane and the third structural plane；Or
The machine core includes hexahedron metal frame, and the hexahedron metal frame includes the first structure face, second structure
Face and the third structural plane；Or
The machine core includes matrix and the circuit board that is arranged at least one surface of described matrix, is provided on the circuit board
Chip；The circuit board and described matrix form six sided structures body, and the six sided structures body includes the first structure face, described
Second structural plane or the third structural plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710435814.1A CN109041506B (en) | 2017-06-09 | 2017-06-09 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710435814.1A CN109041506B (en) | 2017-06-09 | 2017-06-09 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109041506A true CN109041506A (en) | 2018-12-18 |
| CN109041506B CN109041506B (en) | 2023-12-01 |
Family
ID=64630024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710435814.1A Active CN109041506B (en) | 2017-06-09 | 2017-06-09 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109041506B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116761327A (en) * | 2023-05-29 | 2023-09-15 | 英迪迈智能驱动技术无锡股份有限公司 | Radiator structure and self-radiating rectifying module applied to circuit board |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118216A (en) * | 2000-10-11 | 2002-04-19 | Kenichi Shimizu | Electronic cooling device |
| CN1592566A (en) * | 2003-08-28 | 2005-03-09 | 王松 | Hardware structure for colour display screen electrical appliance |
| US20090073659A1 (en) * | 2007-09-14 | 2009-03-19 | Touch Electronic Co. Ltd. | Heat sink structure for a power supply |
| CN101600325A (en) * | 2009-07-02 | 2009-12-09 | 北京东土科技股份有限公司 | A kind of combination heat abstractor of closed shell electronic equipment |
| US20130188318A1 (en) * | 2012-01-20 | 2013-07-25 | Lite-On Technology Corporation | Heat dissipation structure and electronic device with the same |
| CN103294134A (en) * | 2012-02-28 | 2013-09-11 | 研祥智能科技股份有限公司 | Mainboard module, computer case module and computer |
| CN203224166U (en) * | 2012-12-13 | 2013-10-02 | 大连金三维科技有限公司 | Mounting structure for radiator |
| CN103370996A (en) * | 2011-02-04 | 2013-10-23 | 索尤若驱动有限及两合公司 | Electrical device |
| CN204691240U (en) * | 2015-04-22 | 2015-10-07 | 富于安（福建）环保模板有限公司 | A kind of overlapping external corner die clamper of concrete blinding |
| CN106507651A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Electronic equipment |
| CN106717140A (en) * | 2014-12-26 | 2017-05-24 | 三菱电机株式会社 | Electronic apparatus and electronic apparatus system |
| CN207354779U (en) * | 2017-06-09 | 2018-05-11 | 杭州海康机器人技术有限公司 | Electronic equipment |
-
2017
- 2017-06-09 CN CN201710435814.1A patent/CN109041506B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118216A (en) * | 2000-10-11 | 2002-04-19 | Kenichi Shimizu | Electronic cooling device |
| CN1592566A (en) * | 2003-08-28 | 2005-03-09 | 王松 | Hardware structure for colour display screen electrical appliance |
| US20090073659A1 (en) * | 2007-09-14 | 2009-03-19 | Touch Electronic Co. Ltd. | Heat sink structure for a power supply |
| CN101600325A (en) * | 2009-07-02 | 2009-12-09 | 北京东土科技股份有限公司 | A kind of combination heat abstractor of closed shell electronic equipment |
| CN103370996A (en) * | 2011-02-04 | 2013-10-23 | 索尤若驱动有限及两合公司 | Electrical device |
| US20130188318A1 (en) * | 2012-01-20 | 2013-07-25 | Lite-On Technology Corporation | Heat dissipation structure and electronic device with the same |
| CN103294134A (en) * | 2012-02-28 | 2013-09-11 | 研祥智能科技股份有限公司 | Mainboard module, computer case module and computer |
| CN203224166U (en) * | 2012-12-13 | 2013-10-02 | 大连金三维科技有限公司 | Mounting structure for radiator |
| CN106717140A (en) * | 2014-12-26 | 2017-05-24 | 三菱电机株式会社 | Electronic apparatus and electronic apparatus system |
| CN204691240U (en) * | 2015-04-22 | 2015-10-07 | 富于安（福建）环保模板有限公司 | A kind of overlapping external corner die clamper of concrete blinding |
| CN106507651A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Electronic equipment |
| CN207354779U (en) * | 2017-06-09 | 2018-05-11 | 杭州海康机器人技术有限公司 | Electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116761327A (en) * | 2023-05-29 | 2023-09-15 | 英迪迈智能驱动技术无锡股份有限公司 | Radiator structure and self-radiating rectifying module applied to circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109041506B (en) | 2023-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10809486B2 (en) | Heat dissipation module and system camera including heat dissipation module | |
| WO2020006877A1 (en) | Heat dissipating assembly and remote control | |
| CN207885067U (en) | Camera, photographic device and unmanned plane | |
| WO2020006871A1 (en) | Heat dissipation assembly and remote controller | |
| CN108614624A (en) | A kind of heat-radiating chassis for computer | |
| JP7016678B2 (en) | A heat dissipation module and a system camera equipped with a heat dissipation module | |
| CN109041506A (en) | Electronic equipment | |
| CN207354779U (en) | Electronic equipment | |
| CN207543209U (en) | A kind of industrial camera with radiator structure | |
| CN109496462A (en) | Center plate unit and unmanned vehicle | |
| CN109462972B (en) | Heat dissipation type core shell structure | |
| CN209072628U (en) | Data processor and camera system with it | |
| JP2021034789A (en) | Imaging apparatus | |
| CN217007938U (en) | Industrial camera heat dissipation device | |
| CN206042150U (en) | Miniature camera | |
| CN212276169U (en) | Curved surface display screen supports backplate | |
| CN109348090A (en) | The infrared line-scan digital camera of accurate temperature controller type and control method | |
| CN111465283B (en) | Display structure, intelligent lighting operation terminal and electronic equipment | |
| CN212164080U (en) | Outdoor liquid crystal splicing screen | |
| CN111818252B (en) | Electronic equipment and camera module thereof | |
| CN210157562U (en) | Quick heat abstractor is used to electronic product | |
| CN208984926U (en) | A kind of heat radiation module and video camera | |
| CN208046752U (en) | A kind of camera module structure of terminal | |
| CN113508571A (en) | Heat radiation structure, camera and unmanned vehicles | |
| US20200133066A1 (en) | Heat dissipation device of backlight module, backlight module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 310051 room 304, B / F, building 2, 399 Danfeng Road, Binjiang District, Hangzhou City, Zhejiang Province Applicant after: Hangzhou Hikvision Robot Co.,Ltd. Address before: 310052 5 / F, building 1, building 2, no.700 Dongliu Road, Binjiang District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU HIKROBOT TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230706 Address after: No.555, Qianmo Road, Binjiang District, Hangzhou City, Zhejiang Province Applicant after: Hangzhou Hikvision Digital Technology Co.,Ltd. Address before: 310051 room 304, B / F, building 2, 399 Danfeng Road, Binjiang District, Hangzhou City, Zhejiang Province Applicant before: Hangzhou Hikvision Robot Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |