CN217007938U

CN217007938U - Industrial camera heat dissipation device

Info

Publication number: CN217007938U
Application number: CN202122894449.5U
Authority: CN
Inventors: 夏金桥; 程海林
Original assignee: Nayan Technology Shanghai Co ltd
Current assignee: Nayan Technology Shanghai Co ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-07-19
Anticipated expiration: 2031-11-23

Abstract

A heat sink for industrial camera is configured between camera and lens mounting assembly; the device comprises a heat conduction block, a semiconductor refrigerating sheet TEC, a radiator, a fan, a temperature control system, a heat insulation gasket and a temperature sensor; the camera shell is connected with the camera barrel in a heat conduction mode, one end of the heat conduction block is in contact with the camera barrel, the other end of the heat conduction block is in contact with the refrigerating surface of the semiconductor refrigerating sheet TEC, the heat conduction block conducts heat of the camera barrel to the semiconductor refrigerating sheet TEC, and the heat insulation gasket is arranged at the connecting position of the camera barrel and the camera lens. The utility model is beneficial to realizing the heat dissipation of the camera shell under the condition of no dewing by combining the semiconductor refrigeration and the heat insulation, and the whole heat dissipation system is arranged outside the camera, so that the structure of the camera is not changed, and the performance of the camera is not influenced.

Description

Industrial camera heat dissipation device

Technical Field

The utility model belongs to the technical field of machine vision images, and relates to an industrial camera heat dissipation device.

Background

In a machine vision system, an industrial camera is a key component of the machine vision system, and its essential function is to convert an optical signal into an ordered electrical signal. The selection of a proper camera is also an important link in the design of the machine vision system, and the selection of the camera not only directly determines the resolution, the image quality and the like of the acquired image, but also is directly related to the operation mode of the whole machine vision system.

It is clear to those skilled in the art that industrial cameras generate heat during operation and transfer heat through the lens, causing structural distortion. In the application of the micron-scale alignment system, the heat of the industrial camera greatly affects the precision, so that different industrial cameras are selected and have different influences on the precision.

Referring to fig. 1, fig. 1 is a schematic view illustrating a refrigeration structure of an industrial camera in the prior art. Fig. 1 is a schematic diagram of chinese patent No. CN207164436U (utility model — an industrial camera refrigeration structure). The industrial camera refrigeration structure comprises a cavity body which is formed by an interface panel front cover 1, an interface panel rear cover 6, a ventilation side shell 7, a top shell 8 and a bottom shell 9, wherein a main control circuit board 3 and a circuit board 10 provided with an image sensor are arranged in the cavity body, an optical filter 11 is arranged at an interface of the interface panel front cover 1, a cooling fan 5 is arranged at the interface panel rear cover 6, a refrigeration device is further arranged in the cavity body and comprises a shell 2, a heat conduction block 12 and a semiconductor refrigeration piece TEC13, the shell 2, the interface panel front cover 1 and the optical filter 11 form a sealed cabin together, the circuit board 10 provided with the image sensor is arranged in the sealed cabin, the semiconductor refrigeration piece TEC13 is further arranged in the sealed cabin, the semiconductor refrigeration piece TEC13 is in contact with the image sensor through the heat conduction block 12, and a radiator 4 is arranged outside the sealed cabin.

That is to say, install a valve inside device that is used for taking out a vacuum and pours into inert gas into cabin on the sealed cabin this utility model sets up image sensor in a sealed cabin to fill inert gas into in sealed cabin, and refrigerate through semiconductor refrigeration piece TEC, make image sensor's operational environment temperature reduce, thereby effectively reduce the noise, improve imaging quality. However, the temperature of the industrial camera with the sealed cabin structure still has an influence on the structure of the lens, i.e. the industrial camera is not adaptive to different models.

Referring to fig. 2, fig. 2 is a schematic view of another refrigeration structure of an industrial camera in the prior art. Fig. 2 is a schematic diagram of chinese patent No. CN211061833U utility model, an industrial camera refrigeration structure). The utility model discloses a through the mode that semiconductor refrigeration, water-cooling and air-cooling three combined, realize the refrigeration to the industry camera.

Specifically, the refrigerating device in the utility model comprises a first water cooling circulation system 2, a semiconductor refrigerating sheet TEC3, a second water cooling circulation system 4 and a temperature sensor 5, wherein the first water cooling circulation system 2 comprises a first water cooling sheet 2-1, a second water cooling sheet 2-2, a first water pump 2-3 and a first water pipe 2-4, the second water cooling circulation system 4 comprises a third water cooling sheet 4-1, a second water pump 4-2, a water radiator 4-3 and a second water pipe 4-4, the temperature sensor 5 is arranged on the shell of the camera 1, the surface of the first water cooling sheet 2-1 is attached to the shell of the camera 1, the first water cooling sheet 2-1, the first water pump 2-3 and the second water cooling sheet 2-2 form a closed loop connection through the first water pipe 2-4 to form the first water cooling circulation system 2, the surface of the second water cooling plate 2-2 is attached to the cold end of the semiconductor refrigerating plate TEC3, the hot end of the semiconductor refrigerating plate TEC3 is attached to a third water cooling plate 4-1 in the second water cooling circulation system, and the third water cooling plate 4-1, the second water pump 4-2 and the water radiator 4-3 form closed-loop connection through a second water pipe 4-4 to form the second water cooling circulation system 4. However, the industrial camera is complex in structure, large in volume and particularly not suitable for being mounted on a compact part of a moving lens.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, the present invention provides a heat dissipation device for an industrial camera, which has the following technical scheme:

an industrial camera heat sink, comprising: the camera comprises a camera shell, a camera barrel, a heat conduction 3 and a semiconductor refrigeration piece TEC; the camera shell is connected with the camera barrel in a heat conduction mode, one end of the heat conduction block is in contact with the camera barrel, the other end of the heat conduction block is in contact with the refrigerating surface of the semiconductor refrigerating piece TEC, and the heat conduction block conducts heat of the camera barrel to the semiconductor refrigerating piece TEC.

Further, the outside of the camera barrel is cylindrical; the heat conducting block is T-shaped, the T-shaped platform part is attached to the refrigerating surface of the semiconductor refrigerating piece TEC, a through hole matched with the outer side surface of the camera barrel is formed in the lower end of the T-shaped platform part, the camera barrel penetrates through the through hole, and the outer side surface of the camera barrel is attached to the inner surface of the through hole.

Further, the industrial camera heat dissipation device further comprises a heat insulation gasket arranged at the joint of the camera barrel and the camera lens.

Further, the industrial camera heat dissipation device further comprises a heat radiator, and the heat radiator is attached to the heat dissipation end of the semiconductor refrigeration sheet TEC.

Further, the industrial camera heat dissipation device further comprises an air draft fan, and the air draft fan blows away heat on the surface of the heat radiator.

Furthermore, heat conduction silicone grease is used for buffering between the heat conduction block and the semiconductor refrigeration sheet TEC.

Further, the industrial camera heat dissipation device is characterized by further comprising a temperature sensor and a temperature control system; when the temperature sensor detects that the temperature of the camera barrel is greater than a preset threshold value, the temperature control system adjusts the working voltage of the semiconductor refrigeration chip TEC so as to ensure that the camera shell works in a preset working range by reducing the temperature of the camera barrel.

Further, the temperature sensor is arranged at the joint of the camera barrel and the camera lens and used for monitoring the temperature of the camera barrel in real time.

According to the technical scheme, in the embodiment of the industrial camera heat dissipation device, the refrigerating device is arranged between the industrial camera and the lens mounting component, heat is dissipated through temperature control under the condition that the structure of the industrial camera is not changed, the influence of heat generation of the industrial camera on heat transfer of the camera mounting component is reduced, instrument precision change caused by heat generation of the existing industrial camera is overcome, meanwhile, the performance of the industrial camera is kept stable, and the industrial camera heat dissipation device is suitable for cameras of different models.

Drawings

FIG. 1 is a schematic diagram of a heat dissipation device of an industrial camera in the prior art

FIG. 2 is a schematic diagram of another heat dissipation device for industrial cameras in the prior art

FIG. 3 is a schematic view of a preferred embodiment of the heat dissipation device of an industrial camera of the present invention

FIG. 4 is a schematic view of a heat-conducting block according to an embodiment of the present invention

Detailed Description

The following describes the embodiments of the present invention in further detail with reference to fig. 3-4.

Referring to fig. 3, fig. 3 is a schematic diagram of a heat dissipation device for industrial cameras according to a preferred embodiment of the utility model. The industrial camera heat dissipation device mainly comprises a camera shell 1, a camera barrel 2, a heat conduction block 3 and a semiconductor refrigeration piece TEC 4; the camera shell 1 is in heat conduction type connection with the camera barrel 2, one end of the heat conducting block 3 is in contact with the camera barrel 2, the other end of the heat conducting block is in contact with the refrigerating surface of the semiconductor refrigerating sheet TEC4, and the heat conducting block 3 conducts heat of the camera barrel 2 to the semiconductor refrigerating sheet TEC 4.

In an embodiment of the present invention, the camera barrel 2 may be a lens barrel connected between the camera case 1 and the camera lens. In order to reduce the heat transfer of the camera case 1, a heat insulation gasket 7 is additionally arranged at the joint of the camera barrel 2 and the lens.

In the preferred embodiment of the utility model, the outside of the phase barrel 2 is cylindrical; the heat conducting block 3 is in a T shape, the T-shaped platform part is attached to the refrigerating surface of the semiconductor refrigerating sheet TEC4, the lower end of the T-shaped platform part is provided with a through hole matched with the outer side surface of the camera barrel 2, the camera barrel 2 penetrates through the through hole, and the outer side surface of the camera barrel is attached to the inner surface of the through hole.

In some embodiments of the present invention, the heat dissipation device for industrial cameras further includes a heat sink 5 and an air draft fan 6, wherein the heat sink 5 is attached to the heat dissipation end of the semiconductor cooling plate TEC 4. The exhaust fan 6 blows heat off the surface of the radiator 5. Preferably, a heat conduction silicone grease can be used for buffering between the heat conduction block 3 and the semiconductor cooling plate TEC 4.

In addition, the industrial camera heat dissipation device of the utility model can also comprise a temperature sensor 8 and a temperature control system 9; when the temperature sensor 8 detects that the temperature of the camera barrel 2 is greater than a predetermined threshold, the temperature control system 9 adjusts the operating voltage of the semiconductor cooling plate TEC4 to ensure that the temperature of the camera barrel 2 is not affected by the heat generation of the camera housing 1. Preferably, the temperature sensor 8 is disposed at the connection between the camera barrel 2 and the camera lens for monitoring the temperature of the camera barrel in real time.

After the assembly of the present invention is completed, the temperature control system 9 can be powered on to work. In the working process, the semiconductor refrigerating sheet TEC4 refrigerates, the temperature lower than the environment is transferred to the camera barrel 2 through the heat conducting block 3, and in order to prevent condensation, heat conducting silicone grease is used for buffering between the heat conducting block 3 and the semiconductor refrigerating sheet TECTECTECTECTECTECTECEC 4. The temperature sensor 8 is used to measure the temperature of the camera cartridge 2 and the data obtained is connected to a temperature control system 9 for further processing. When the temperature of the camera barrel 2 is detected to be larger than a preset threshold value, the voltage applied to the semiconductor refrigerating sheet TEC4 is adjusted, namely, the refrigerating is increased to accelerate the heat dissipation, so that the temperature of the camera barrel 2 can be kept consistent with the temperature of the mounting structure and is not influenced by the heat generated by the camera.

For obtaining better radiating effect, the cold face of the semiconductor refrigeration piece TEC piece 4 can be attached to the heat conducting block 3, the hot face of the semiconductor refrigeration piece TEC piece 4 is attached to the radiator 5, and the exhaust fan 6 is installed on the radiator 5 to accelerate heat radiation. In order to reduce the heat transfer of the camera case 1, a heat insulation gasket 7 can be additionally arranged at the joint of the camera barrel 2 and the lens.

Generally, in the use, heat conduction piece 3 passes through the round hole and pastes with camera section of thick bamboo 2, fixes heat conduction piece 3 on camera section of thick bamboo 2 with the screw, and simple to operate does not also influence the rotation of camera shell 1.

The above description is only for the preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all the equivalent structural changes made by using the contents of the description and the drawings of the present invention should be included in the scope of the present invention.

Claims

1. A heat sink for industrial camera is configured between camera and lens mounting assembly; it is characterized by comprising the following steps: the camera comprises a camera shell (1), a camera barrel (2), a heat conducting block (3) and a semiconductor refrigerating piece TEC (4);

the camera shell (1) is connected with the camera barrel (2) in a heat conduction mode, one end of the heat conducting block (3) is in contact with the camera barrel (2), the other end of the heat conducting block is in contact with the refrigerating surface of the semiconductor refrigerating sheet TEC (4), and the heat conducting block (3) conducts heat of the camera barrel (2) to the semiconductor refrigerating sheet TEC (4).

2. The industrial camera heat sink according to claim 1, characterized in that the outside of the camera barrel (2) is cylindrical; the heat conducting block (3) is T-shaped, the T-shaped platform part is attached to the refrigerating surface of the semiconductor refrigerating sheet TEC (4), a through hole matched with the outer side surface of the camera barrel (2) is formed in the lower end of the T-shaped platform part, the camera barrel (2) penetrates through the through hole, and the outer side surface of the camera barrel is attached to the inner surface of the through hole.

3. The industrial camera heat sink according to claim 2, further comprising a heat insulating gasket (7) disposed at a junction of the camera barrel (2) and a camera lens.

4. The industrial camera heat dissipation device as claimed in claim 1, further comprising a heat sink (5), wherein the heat sink (5) is attached to the heat dissipation end of the semiconductor cooling plate TEC (4).

5. The industrial camera heat sink according to claim 4, further comprising an air draft fan (6), wherein the air draft fan (6) blows heat away from the surface of the heat sink (5).

6. The industrial camera heat sink according to claim 1, wherein the heat conducting block (3) and the semiconductor cooling plate TEC (4) are buffered by using a heat conducting silicone grease.

7. The industrial camera heat sink according to any one of claims 1-6, further comprising a temperature sensor (8) and a temperature control system (9); when the temperature sensor (8) detects that the temperature of the camera barrel (2) is greater than a predetermined threshold value, the temperature control system (9) adjusts the operating voltage of the semiconductor refrigeration chip TEC (4) to ensure that the camera housing (1) operates within a predetermined operating range by reducing the temperature of the camera barrel (2).

8. The industrial camera heat sink according to claim 7, wherein the temperature sensor (8) is provided at the junction of the camera barrel (2) and the camera lens for monitoring the camera barrel temperature in real time.