JPH0618561A - Multiplex probe substrate - Google Patents

Abstract

PURPOSE:To obtain such a multiplex probe substrate that the substrates constituting the substrate are not required to be designed individually at every semiconductor integrated circuit and the number of earthing conductors can be increased, and then, earthing can be intensified and stabilized in flexibly corresponding to an arbitrary semiconductor integrated circuit and the substrate has an excellent shielding effect against noise. CONSTITUTION:An annular metallic sheet 9 for earthing is fixed to the periphery of a probe supporting member 7 on the lower surface of a substrate 2 with an insulator 10 in between and the output terminal 6b of a probe 6 for earthing and a printed pattern 3 for earthing are connected to the sheet 9. Therefore, the sheet 9 shields noise arriving from the bottom side and, at the same time, reduces the impedance of earthing wiring with its wide area.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a probe substrate used for inspecting integrated circuit chips in the manufacturing process of large scale semiconductor integrated circuits (LSI).

[0002]

2. Description of the Related Art Recent advances in semiconductor technology have been remarkable, and the types and integration levels of large-scale semiconductor integrated circuits have increased remarkably. As a result, the types of probe substrates used for inspecting the same chip in the manufacturing process have increased. It has increased.

FIG. 5 is an external view showing an example of a conventional probe substrate. FIG. 5 (a) is a bottom view and FIG. 5 (b) is A-.
It is an A'expansion sectional view.

The probe substrate 21 has a circular (or substantially square) hole 23 formed in the center of a circular (or substantially square) substrate 22 formed of glass epoxy resin or the like, and has a circular (or substantially square) inner periphery. An annular probe support member 24 having a substantially square shape (or a circular shape) and formed of a material such as ceramics or aluminum is adhered and fixed, and the probe support member 24 is provided with a large number (60 to 160) of insulating material such as resin. Book) probe 2
5 is fixed by molding or the like.

The substrate 22 is formed as a printed circuit board having through holes, and a large number of printed patterns 26 are formed in a straight line radially from the central portion of one surface (lower surface) of the substrate 22 toward the peripheral portion. A plurality of terminals for attaching a ground and a power supply, an electronic circuit component, or a lead wire to be connected to an external test / inspection device are connected to the printed pattern 26 through through holes 27 at the end of the Then, it is formed on the upper surface of the substrate 22.

The probe 25 is processed so that all the tips 25a are arranged in exactly the same plane, and the output ends 25b are bonded or soldered to the corresponding print patterns 26 on the substrate 22 at the center of the substrate. Connected. In FIG. 5, the probe 25
The print pattern 26 is shown only in part,
Other illustrations are omitted.

[0007]

Various noises such as radio noises and fluorescent lamp noises arrive at the probe substrate 21 from the indoor environment during use in inspections in the manufacturing process of semiconductor integrated circuits, and the semiconductor integrated circuit Affects inspection. On the other hand, in order to shield against noise and to reduce grounding and power source impedance, for example, the substrate 22 is formed as a multilayer laminated substrate, and a conductive foil such as copper is sandwiched in the inner layer of the substrate 22. There is an example in which it is sandwiched and used as ground wiring or power wiring, but such a conventional probe board 2
In the case of 1, the probe 25 connected to the ground and the power source for each semiconductor integrated circuit to be inspected, and therefore the print pattern 26 corresponding thereto may be unavoidable at the design stage. The conductive foil sandwiched between the inner layers often has a unique design for each semiconductor integrated circuit targeted by the probe substrate 21. Therefore, when the semiconductor integrated circuit to be inspected is changed and the probe 25 connected to the ground and the power supply needs to be changed, or the grounding needs to be strengthened, the substrate 22 itself must be newly redesigned. There were many cases.

Further, on the upper and lower surfaces of the substrate 22, by surrounding the terminals of all the through holes 27 except for grounding with a conductive ring connected to the ground while ensuring an insulating space of a short distance, noise is generated. Countermeasures are possible, but through holes 27 and print patterns 26
Since it was exposed to the substrate 22, noise was introduced from these portions, which was not an effective noise countermeasure.

A first object of the present invention is to solve the above-mentioned problems and to flexibly deal with any semiconductor integrated circuit without the need to newly design a substrate for each semiconductor integrated circuit. Enables additional wiring and enhanced grounding stability,
An object of the present invention is to provide a multiple probe board having an excellent shield effect against noise.

A second object of the present invention is to further increase the power supply wiring dedicated to the power supply and stable power supply without changing the form of the substrate, and to improve the shielding effect for the power supply wiring. It is to provide a probe substrate.

[0011]

According to a first aspect of the present invention, an annular metal sheet for grounding is fixed to the periphery of a probe supporting member on the lower surface of a substrate through an insulating material, and the annular metal sheet is provided with: The output end of the probe for grounding and the printed pattern for grounding are connected to each other.

Further, according to the present invention as set forth in claim 2, three or more annular metal sheets are fixed in a laminated state around the probe supporting member on the lower surface of the substrate via insulating materials, respectively, The innermost layer and the outermost layer of the annular metal sheet are connected to the output end of the probe for grounding and the printed pattern for grounding, respectively, to the annular metal sheet of the intermediate layer,
The output end of the power supply probe and the print pattern for the power supply are connected to each other.

[0013]

According to the first aspect of the present invention, the ring-shaped metal sheet for grounding shields noise coming from below, and the ground wiring has a low impedance due to its large area.

Further, in the present invention according to claim 2, since the annular metal sheet for power supply is sandwiched by the annular metal sheet for grounding, noise generated from the power source wiring is shielded and the area is wide. Both ground wiring and power wiring should have low impedance.

[0015]

1 is an external view of a multi-probe substrate which is a first embodiment of the present invention. FIG. 1 (a) is a bottom view and FIG. 1 (b) is an enlarged cross-sectional view taken along the line BB '. Is.

The board 2 constituting the multiple probe board 1 is a printed board for a general-purpose probe board, and a large number of thin linear printed patterns made of copper foil are formed on the lower surface of the board 2 usually formed of glass epoxy resin or the like. 3 are formed in a radial pattern so that the pattern width gradually increases from the central portion toward the peripheral portion. Grounding and power supply, electronic circuit components, or , A plurality of terminals 4a of through holes 4 for attaching lead wires to be connected to an external test / inspection device are provided. The terminals 4a penetrate the substrate 2 and are formed in the through holes 4 covered with a conductive member. It is electrically connected.

On the upper surface of the substrate 2, terminals 4b corresponding to the terminals 4a on the lower surface of the through hole 4 are exposed.

The center of the substrate 2 is usually circular, substantially square,
Alternatively, a rectangular hole 5 is formed, but on the lower surface of the peripheral portion of the hole 5, a cylindrical probe support member 7 of an appropriate thickness made of an insulating material such as resin for supporting the probe 6 is provided on the substrate. It is firmly adhered and fixed to 2. The probe 6 is attached to the probe supporting member 7 so that the probe 6 comes into contact with the terminal of the semiconductor integrated circuit chip to be inspected at a substantially central portion thereof.
The tips 6a of the probe 6 are fixed so that all the levels thereof are located exactly on the same plane, and the output end 6b of the probe 6 is free.

As shown in FIG. 1, the output end 6 of the probe 6 is
b has a hole 8 having a diameter that can secure a space to be connected to the print pattern 3 at one end on the center side.
An annular metal sheet 9 (e.g., a copper plate having a thickness of about 0.5 mm to 1.5 mm) for grounding having good conductivity is bonded to the substrate 2 through an extremely thin insulating sheet 10 having the same shape as the annular metal sheet 9. The output end 6b of the probe 6 for grounding is bonded or soldered to the annular metal sheet 9 according to the circuit configuration of the semiconductor integrated circuit to be inspected. Note that only a part of the probe 6 and the print pattern 3 is illustrated, and other illustrations are omitted.

At the peripheral edge of the annular metal sheet 9, one end 11a of a metal wire 11 having good conductivity such as copper is connected by bonding or soldering, and the other end 11b of the metal wire 11 is used for grounding. Print pattern 3
Is soldered to the terminal 4a of the through hole 4 in the peripheral portion of the.

The power supply and signal probe 6 has its output end 6b connected to the printed pattern 3 of the substrate 2 by bonding or soldering at its central portion, if necessary.

As described above, by attaching the low-impedance ground wiring by the annular metal sheet 9 to the lower surface of the substrate 2, which is a general-purpose probe substrate printed circuit board constituting the probe substrate 1, the existing probe substrate can be used. Board 2
The grounding can be strengthened, and a new board design for strengthening the grounding is not required, and it is possible to reduce the impedance of grounding, take measures against noise by stabilizing, and shield the board 2.

In the first embodiment described above, an example in which the ring-shaped metal sheet 9 for grounding is adhered and fixed only to the lower surface of the substrate 2 has been described, but as shown in the partial sectional view of FIG. As a measure against incoming noise, a ring-shaped metal sheet 12 for grounding can be similarly bonded and fixed to the upper surface of the substrate 2 via a thin insulating sheet 13 having the same shape as that of the grounded metallic sheet 12, and a more reliable noise countermeasure is implemented. can do. However, the outer diameter of the annular metal sheet 12 in this case is formed to be smaller than the annular metal sheet 9 that is adhesively fixed to the lower surface of the substrate 2 so as not to cover most of the terminals 4b on the upper surface of the substrate 2. To be done.

FIG. 3 is an external view of a multi-probe substrate according to a second embodiment of the present invention. FIG. 3 (a) is a bottom view,
FIG. 3B is an enlarged sectional view taken along the line CC ′.

In this embodiment, the substrate 2 constituting the multiple probe substrate 14 and the probe 6 on the lower surface of the central portion of the substrate 2 are used.
The fact that the cylindrical probe support member 7 that supports the substrate is firmly fixed to the substrate 2 is exactly the same as in the first embodiment described with reference to FIG.

As shown in FIG. 3, on the lower surface of the substrate 2, which is a general-purpose probe substrate printed circuit board, first, as in the first embodiment, a conductive hole 8 having a predetermined diameter is formed in the center. The first annular metal sheet 9 (for example, a copper plate having a thickness of about 0.5 mm in order to make multiple layers in this case) for grounding having a high ratio is formed on the substrate 2 through an extremely thin insulating sheet 10 having the same shape as that of the first annular metal sheet 9. According to the circuit configuration of the semiconductor integrated circuit to be inspected, the output end 6b of the probe 6 for grounding is bonded or soldered to the first annular metal sheet 9 at the inner peripheral portion. Further, at the peripheral edge of the first annular metal sheet 9, one end 11a of the metal wire 11 such as copper is bonded or soldered and connected, and the other end 11b of the metal wire 11 is of the print pattern 3 used for grounding. It is soldered and connected to the terminal 4a on the peripheral portion.

Next, on the lower surface of the grounding first annular metal sheet 9 previously bonded to the substrate 2 via the insulating sheet 10, the inner diameter is slightly larger than the first annular metal sheet 9, and the outer diameter is smaller. Is a little smaller than the first annular metal sheet 9, and the second annular metal sheet 15 for power source (thickness is the same as the first annular metal sheet 9) is the second annular metal sheet 1
5, which is attached to the first annular metal sheet 9 through the same extremely thin insulating sheet 16 as that of the probe 5, for supplying power according to the circuit configuration of the semiconductor integrated circuit to be inspected.
The output end 6b of is connected to the inner peripheral portion of the second annular metal sheet 15 by bonding or soldering. Also,
On the outer peripheral portion of the second annular metal sheet 15, one end 11a of the metal wire 11 such as copper is bonded or soldered and connected, and the other end 11b of the metal wire 11 is a peripheral portion of the print pattern 3 used for power supply. Is connected to the terminal 4a by soldering.

Further, on the lower surface of the second annular metal sheet 15, the inner diameter is slightly larger than that of the second annular metal sheet 15,
Further, the third annular metal sheet 17 for grounding (having the same thickness as the first annular metal sheet 9) having an outer diameter slightly smaller than that of the second annular metal sheet 15 has a third annular metal sheet in shape. The output end 6b of the probe 6 is bonded to the second annular metal sheet 15 through the same extremely thin insulating sheet 18 as 17 and is grounded according to the circuit configuration of the semiconductor integrated circuit to be inspected. The inner peripheral portion of the metal sheet 17 is connected by bonding or soldering. Further, on the outer peripheral portion of the third annular metal sheet 17, one end 11a of the metal wire 11 made of copper or the like is bonded or soldered and the other end 11b of the metal wire 11 is connected to the ground of the print pattern 3 used for grounding. It is soldered and connected to the terminal 4a on the peripheral portion.

The signal probe 6 has the output end 6b connected to the printed pattern 3 as required by bonding or soldering at the center.

The inner diameter of the second annular metal sheet 15 is slightly larger than the inner diameter of the first annular metal sheet 9, and the outer diameter of the second annular metal sheet 15 is larger than the outer diameter of the first annular metal sheet 9. It is a little small and the third annular metal sheet 17
The inner diameter of the second annular metal sheet 15 is slightly larger than the inner diameter of the second annular metal sheet 15, and the outer diameter of the third annular metal sheet 17 is slightly smaller than the outer diameter of the second annular metal sheet 15. This is for facilitating the bonding or soldering connection of the other end 6b of the probe 6 and the one end 11a of the metal wire 11 to the metal sheet, but for facilitating the bonding or soldering connection, the second annular metal sheet is used. 15 and the third annular metal sheet 17 have the same dimensions as the first annular metal sheet 9, and a large number of U-shapes are provided on the inner and outer peripheral portions of the second annular metal sheet 15 and the third annular metal sheet 17. Of the metal wire 11 and the output end 6b of the probe 6 by making use of the exposed portion of the metal sheet which is the inner layer from itself and which is formed by these U-shaped cuts. It may be the 11a connection fee.

When a ring-shaped metal sheet for power supply (here, the second metal sheet 15) is attached, ground ring-shaped metal for the innermost layer and the outermost layer is provided in order to avoid mixing of noise from the outside into the power supply wiring. It is desirable that the sheets (here, the first annular metal sheet 9 and the third annular metal sheet 17) are sandwiched and sandwiched between them, whereby both the ground and power supply wirings have a low impedance, and at the same time, the multiple wirings are provided. The probe substrate 14 is strongly shielded against noise, and accurate and stable inspection of the semiconductor integrated circuit becomes possible.

In the second embodiment described above, an example in which a circular annular metal sheet for grounding is adhered and fixed in multiple layers only on the lower surface of the substrate 2 has been described, but a modification of the first embodiment (FIG. 2).
Similarly to the above, as a measure against noise coming from the upper part, the annular metal sheet 12 can also be adhesively fixed to the upper surface of the substrate 2 via the insulating sheet 13, and thereby a more reliable measure against noise can be implemented. it can.

FIG. 4 is a side view of a multiple probe substrate according to the third embodiment of the present invention.

In this embodiment, as described with reference to FIG. 2, one or a plurality of annular metal sheets are bonded and fixed to the lower surface of the substrate 2 through an extremely thin insulating sheet, and the upper surface of the substrate 2 is grounded. An annular metal sheet 12 for grounding is further adhered and fixed to the upper surface of the substrate 2 with respect to the multiple probe substrate 1 configured so that the annular metal sheet 12 is adhesively fixed.
The component mounting printed circuit board 20 is mounted and fixed on the upper part of the board via the insulating spacer 19. In FIG. 4, one grounding annular metal sheet 9 is bonded and fixed to the lower surface of the circuit board 2. It is shown as an example added to the modification of the first embodiment shown in FIG.

In this way, the component mounting printed circuit board 20
By mounting and fixing the substrate 2 in the vicinity of the substrate 2, it is possible to configure a multiple probe substrate in which various components for testing and inspection can be easily mounted.

[0036]

As described above, according to the present invention as set forth in claim 1, an annular metal sheet for grounding is fixed around the probe supporting member on the lower surface of the substrate through an insulating material,
The output end of the probe for grounding and the printed pattern for grounding are connected to the annular metal sheet, respectively, so that the annular metal sheet for grounding shields noise coming from below and widens its area. As a result, the ground wiring has a low impedance, so there is no need to individually design a new board for each semiconductor integrated circuit. It is possible to strengthen the stability of the, and to be excellent in the shielding effect against noise.

Further, according to the present invention as defined in claim 2, three or more annular metal sheets are fixed in a laminated state around the probe supporting member on the lower surface of the substrate through insulating materials, respectively. To the innermost and outermost annular metal sheets of the sheet, the output end of the probe for grounding and the printed pattern for grounding are respectively connected, to the annular metal sheet of the intermediate layer, the output end of the probe for power supply and By connecting each of the printed patterns for the power supply and sandwiching the ring-shaped metal sheet for power supply with the ring-shaped metal sheet for grounding, the noise generated from the power supply wiring is shielded and the grounding is performed due to the large area. Since both the wiring and the power supply wiring have low impedance, it is possible to add power supply wiring dedicated to the power supply and stable power supply without changing the form of the board. It is possible to improve the shielding effect against.

[Brief description of drawings]

FIG. 1 is an external view of a multiple probe substrate that is a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a multiple probe substrate, which is a modification of the embodiment shown in FIG.

FIG. 3 is an external view of a multiple probe substrate that is a second embodiment of the present invention.

FIG. 4 is a side view of a multiple probe board according to a third embodiment of the present invention.

FIG. 5 is an external view showing an example of a conventional probe substrate.

[Explanation of symbols]

 1 Multiple Probe Board 2 Board 3 Print Pattern 4 Through Hole 4a, 4b Terminal 5 Hole 6 Probe 6a Tip 6b Output End 7 Probe Support Member 8 Hole 9 Ring Metal Sheet 10 Insulation Sheet 11 Metal Wire 11a One End 11b Another End 12 Ring Metal Sheet 13 Insulating Sheet 14 Multiple Probe Board 15 Annular Metal Sheet 16 Insulating Sheet 17 Annular Metal Sheet 18 Insulating Sheet 19 Spacer 20 Component Mounting Printed Circuit Board

Claims (4)

[Claims] 1. An annular probe support member is fixed in a hole formed in the center of a substrate having a print pattern,
In the probe support member, a number of probes are fixed to the probe support member so that the tips thereof face downward of the substrate,
Around the probe supporting member on the lower surface of the substrate, an annular metal sheet for grounding is fixed via an insulating material, and an output end of the probe for grounding and a print pattern for grounding are respectively attached to the annular metal sheet. A multi-probe substrate that is connected. 2. An annular probe support member is fixed in a hole formed in the center of a substrate having a print pattern,
In the probe support member, a number of probes are fixed to the probe support member so that the tips thereof face downward of the substrate,
Around the probe supporting member on the lower surface of the substrate, three or more annular metal sheets are fixed in a laminated state with insulating materials interposed therebetween to form an innermost layer and an outermost layer of the annular metal sheets. The output terminal of the probe for grounding and the printed pattern for grounding are respectively connected, and the output terminal of the probe for power supply and the printed pattern for power supply are respectively connected to the circular metal sheet of the intermediate layer. Multiple probe board. 3. An annular metal sheet for grounding is fixed to the periphery of the probe supporting member on the upper surface of the substrate via an insulating material,
The output end of a grounding probe and a printed pattern for grounding are connected to the annular metal sheet, respectively.
Alternatively, the multi-probe substrate described in 2. 4. The multiple probe board according to claim 3, wherein a component mounting printed board is mounted via a spacer on a grounding annular metal sheet fixed to the upper surface of the board via an insulating material.