JP2720146B2 - Connection ring for wafer prober - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection ring for use in a wafer prober apparatus for measuring electrical characteristics of semiconductor elements formed on a semiconductor wafer as it is, and selecting good or bad.

[0002]

2. Description of the Related Art Conventionally, in an IC manufacturing process, before cutting a large number of IC chips formed on a semiconductor wafer using a wafer prober device and an IC tester, the electrical characteristics of the chips are tested to determine whether they are good or bad. Since this test is performed on a plurality of chips at the same time, a test head is used to distribute the input / output circuits of the IC tester according to the number of chips to be tested. Wiring is connected between the input / output terminals of the probe card and the rear terminals of the probe card on which probes for contacting the plurality of terminals of the IC chip are mounted.

However, in order to cope with an increase in the number of terminals due to the diversification of IC chips to be tested, a connection ring system shown in FIG. 6 described later has been used as a probe card replacement system.

[0004] As shown in FIG.
Instead of connecting the test head 3 with the tester 1 and the connection cable 2 and connecting between the test board 4 of the test head 3 and the probe card 7 by wiring, the upper terminals of the test board and the probe card 7 are connected. Are connected via a contact, and a connection ring 6 is inserted between them for connection.

FIG. 6A shows an example of a connection ring. The illustrated connection ring has a number of spring contact pins (generally referred to as pogo pins hereinafter) around a metal base ring 60. The name of the pogo pins is a trade name of Augat Pylon, a U.S.A. ) Is inserted into an insulating piece insertion hole 61 formed in the base ring 60 to insulate the base ring 60 from the base ring 60, the pogo pin socket 22 is inserted, and one end of the printed circuit board 63.
The connection with the probe card 65 is made by contact of the tip of the pogo pin 23 inserted into the pogo pin socket 22.

FIG. As shown in B, pogo pin 2
3 is inserted from the upper and lower sides of the aluminum ring, and the connection ring is configured to be detachable from the wiring of the test board 4. It can be replaced if necessary, so that it can respond immediately to changes in the type of IC chip to be tested. ing.

[0007]

However, the connection ring having the structure shown in FIG. 6 is formed of a disk-shaped metal material (mainly aluminum) with a flange, and radially pierces the insertion holes of a large number of pogo pin sockets 22. However, as the number of chips to be tested at the same time increases, the arrangement of pogo pins becomes denser, and the outer diameter of the pogo pin socket 22 used becomes smaller due to the need for impedance matching (for example, 1.8φ).
1.0φ), it is necessary to change the gap of the air layer formed between the metal member and the metal material so as to obtain a predetermined distribution capacity. Accordingly, the dimensions of the insulating piece 62 are also changed. In the conventional method, it is necessary to arrange the devices in a high density, and it is difficult to approach the impedance matching state by the conventional method, or the mechanical strength is weakened by thinning the pins, and the workability is deteriorated. was there.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a metal ring member having a predetermined size corresponding to a probe card, the connection ring having a flange having a predetermined size. An outer rim and an inner rim are connected by a plurality of arms, and a base ring having a plurality of fan-shaped spaces formed between the arms and a means for attaching to the fan-shaped space of the base ring is provided. A fan-shaped member with a brim made of a material, the member having a center at an intersection on an extension of a straight line obtained by drawing a plurality of pogo pin socket insertion holes at right angles from the surface thereof along the upper sides on both sides of the fan-shaped member. While radially piercing at predetermined intervals, from the intersection, the insertion holes are pierced at predetermined angles on a concentric circle whose radius is the distance to each insertion hole to form a radial insertion hole row. Column In the middle, a fan-shaped member having a slit of a predetermined size formed therein and an electrostatic shielding plate inserted in the slit formed in the fan-shaped member are fixed, grounded, and inserted into the insertion hole. The pogo pin socket is constituted by a plurality of pin blocks formed by a printed circuit board for fixing and holding one end of the pogo pin socket at a predetermined position.

Next, conductive electroless plating is applied to both side surfaces of the fan-shaped member, the inner surface of the slit, and the edge thereof, and a grounding piece is inserted into a predetermined position of the slit to form the ground. One end of the piece is fixedly grounded to the printed circuit board.

Further, a plurality of fine ground conductors surrounding the insertion hole are buried in proximity to the insertion hole of the pogo pin socket of the fan-shaped member, and are fixedly grounded to the printed circuit board.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of a connection ring 6 for a wafer prober according to the present invention as viewed from below.
The case of is shown.

FIG. In A, 11 is a base ring,
12 is a guide pin provided on the base ring side, 21 is a pin block, and 28 is a positioning guide pin hole into which the guide pin 12 is fitted. FIG. A is pin block 2
This shows a case where 1 is divided into four.

FIG. B is an exploded perspective view of one of the pin blocks 21, 21a is a fan-shaped member, 22 is a pogo pin socket, 23 is a pogo pin, 24 is a printed board for fixing a pogo pin socket, 25 is a shield plate, 26 is a hole for inserting a pogo pin socket, 27 Is a groove for inserting a shield plate.

The pin block 21 is integrated with a fan-shaped member 21a made of an insulating material by soldering one end of a pogo pin socket 22 to a pogo pin socket fixing printed circuit board 24, and the guide pins 12 of the base ring 11 are provided with positioning guide pin holes 28. Then, it is fixed to the base ring 11 through the screw hole 29.

[0016]

【Example】

[Embodiment 1] FIG. 2 is an explanatory view of a first embodiment of the present invention.
FIG. FIG. This shows a state before the pogo pin socket 22 inserted into the fan-shaped member 21a of B is inserted into the pogo pin socket fixing printed board 24. The shield plate 25 is partially inserted into the shield plate insertion groove 27.

FIG. B is a partially exploded perspective view of the pin block 21, 31 indicates a pogo pin insertion hole for a signal, and 32 indicates a pogo pin insertion hole for a ground. The capacitance is increased, the impedance of the signal line is reduced, the signal waveform between the IC tester and the IC chip to be measured is prevented from deteriorating, and the coupling between the signal lines is suppressed.

According to the first embodiment, since the pogo pin socket insertion hole is directly formed in the sector member 21a made of an insulating material, a special insulating piece 62 is not required unlike a conventional base ring made of a metal material. In addition, since the air layer does not intervene, the dielectric constant depending on the material of the fan-shaped member is larger than that of the air layer, so that it can be used even if the diameter of the pogo pin socket slightly changes. In addition, the width of the groove for inserting the shield plate can be cut to be wider, and the distribution capacitance can be adjusted by changing the thickness of the shield plate.

FIG. FIGS. 7A and 7B are explanatory diagrams of a second embodiment of the present invention.

In the second embodiment, the electroless plating 53 is applied to the outer peripheral surface 55 of the sector member 21a and the shield plate insertion groove 27 of the first embodiment.
The electroless plating 53 is applied so as to be in contact with the ground surface of the printed circuit board 24, so that it is completely brought into contact at the time of assembly.

It is also possible to insert the auxiliary ground piece 56 into the groove 27 and to solder the terminal portion of the auxiliary piece 56 to the ground surface of the printed circuit board 24 in order to enhance the shielding effect.

FIG. 7A and 7B are explanatory diagrams of a third embodiment of the present invention.

In the third embodiment, a plurality of shield conductor wires 43 surrounding the insertion hole are buried near the signal pogo pin socket insertion hole 31 of the fan-shaped member 21a, and the end of the thin wire is printed. The capacitor is projected from the ground surface of the substrate 24 and soldered so as to generate a distributed capacitance between the pogo pin socket 22 and the signal.

[0024]

As described in detail above, the structure of the connection ring for the wafer prober is divided into a metal base ring and a pin block made of an insulating material, and the pogo pin insertion hole is directly formed in the insulating material pin block. Since the processing is performed, the pogo pins can be densely arranged, and there is a remarkable effect that a large number of simultaneous measurement can be performed with the connection ring having the conventional size, which is larger than the conventional case.

[Brief description of the drawings]

FIG. 1 is an overall explanatory diagram of a first embodiment of the present invention,

FIG. 2 is a partially exploded explanatory view of Embodiment 1 of the present invention,

FIG. 3 is a partially exploded explanatory view of a second embodiment of the present invention,

FIG. 4 is a partially exploded explanatory view of Embodiment 3 of the present invention,

FIG. 5 is a configuration diagram of a conventional wafer prober apparatus,

FIG. 6 is an explanatory view of a conventional connection ring for a wafer prober.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC tester 2 Connection cable 3 Test head 4 Input / output terminal board of test head 3 5 Wiring 6 Connection ring 7 Probe card 7a Probe pin 8 IC chip 9 Semiconductor wafer 10 Chuck top 11 Base ring 12 Guide pin 21 Pin Block 21a Sector member 22 Pogo pin socket 23 Pogo pin 24 Pogo pin socket fixing printed circuit board 25 Shield plate 26 Pogo pin socket insertion hole 27 Shield plate insertion groove 28 Positioning guide pin hole 29 Screw hole 30 Shield plate mounting hole 31 Signal Pogo pin insertion Hole 32 Pogo pin insertion hole for ground 43 Conductor thin wire for shielding 53 Electroless plating surface 55 Surrounding surface 56 Auxiliary piece 60 Conventional base ring 61 Insulation piece insertion hole 62 Insulation piece 63 Printed circuit board for wiring 64 Ground Pogo pin hole 65 probe card 66 wiring

Claims (4)

(57) [Claims] 1. An IC for outputting a predetermined signal used for an electrical characteristic test of an IC chip formed on a semiconductor wafer.
A means for inserting and holding a socket for inserting a plurality of spring contact pins for connecting between a test head of a tester and a probe card mounted on a wafer prober that carries a semiconductor wafer on which the IC is formed and is carried. In the provided cylindrical connection ring for a wafer prober having a predetermined dimension, a metal annular member having a predetermined size corresponding to the probe card, wherein the member is a flanged outer rim and an inner side having a predetermined size. A base ring having a plurality of fan-shaped spaces formed between the arms, the base ring having a plurality of fan-shaped spaces formed between the arms, and an insulating material having predetermined dimensions provided with means for attaching the base ring to the fan-shaped spaces. A flanged fan-shaped member, wherein said member has a plurality of said spring contact pin socket insertion holes at right angles to a surface thereof. Are pierced at predetermined intervals radially around an intersection on an extension of a straight line drawn along the upper side on both sides of the sector-shaped member, and on a concentric circle whose radius is the distance from the intersection to each insertion hole. The insertion holes are drilled at predetermined angles to form a row of radial insertion holes, and in the middle of each row, a fan-shaped member having a slit of a predetermined size formed therein, and a fan-shaped member formed in the fan-shaped member. A plurality of pin blocks formed by a printed circuit board that fixes a shield plate inserted into the slit, grounds the ground, and fixes and holds one end of a spring contact pin socket inserted into the insertion hole at a predetermined position. A connection ring for a wafer prober, comprising: 2. An electroless electroplating method according to claim 1, wherein both sides of said sector member, an inner surface of said slit, and an edge thereof are plated, and a ground auxiliary piece is sandwiched at a predetermined position of said slit. A connection ring for a wafer prober, wherein an end of the auxiliary piece is fixedly grounded to the printed circuit board. 3. The semiconductor device according to claim 1, wherein a plurality of shield conductive wires surrounding the insertion hole are embedded near the spring contact pin socket insertion hole of the fan-shaped member, and are fixedly grounded to the printed circuit board. A connection ring for a wafer prober. 4. The wafer prober connection ring structure according to claim 1, wherein the spring contact pin socket inserted into the insertion hole row inserts signal pins and ground pins alternately.