JPH06183190A - Manufacture of ic card and the same ic card - Google Patents

Abstract

PURPOSE:To improve an external appearance and to prevent a trouble of a conveying system in a card reader/writer by forming a foamable resin layer on an outer periphery of an IC module and engaging to fix the module to a recess opened at a card base material in a credit card, etc. CONSTITUTION:An IC module 1 is set in a mold, foamable resin is cast at a predetermined temperature, and a foamable resin layer 2 is formed on an outer periphery of the module 1. On the other hand, a recess 4 to be engaged with the module 1 surrounded with foamable resin 2 is opened on a card base material 3. An epoxy series heat-curable adhesive sheet 6 is adhered to a part having no resin 2 of the module 1 surrounded with the resin 2, engaged with the recess 4, heated and fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a built-in IC module, which is being considered and implemented in credit cards, cash cards and the like.

[0002]

2. Description of the Related Art In general, a magnetic recording type credit card, cash card and the like have a limited storage capacity, so that an IC card incorporating a semiconductor element having a large storage capacity is experimentally used. In this type of IC card, a semiconductor element in the IC module fitted to the IC card and an external device such as a reader / writer for the IC card are connected to each other via an external terminal formed on the IC module. Since recording / reproducing is performed, the IC module is fitted in the concave portion of the card base so that the external terminals of the IC module fitted in the IC card are located on the surface of the IC card. However, since such an IC card is subjected to various bending stresses during use, it is
The module may peel off or fall off, or the IC module may break, resulting in damage to the semiconductor elements in the IC module. Also, the card base material in the part in contact with the corners of the IC module may be torn, and the IC may be damaged when using the IC card. There is a possibility that a trouble such as an IC card being caught in the card carrying system inside the card reader / writer may occur. Further, the damage of the card base material may adversely affect the appearance of the IC card itself. In order to eliminate such a defect, as disclosed in Japanese Utility Model Laid-Open No. Sho 63-75370,
A space is formed between the IC module and the inner peripheral wall of the recess of the card substrate into which the IC module is fitted, and the IC is formed in this space.
The bending stress applied to the card (semiconductor element in the IC module) is absorbed to protect the IC card.

[0003]

By the way, forming an interstice around an IC module fitted in a recess of a card substrate to form an IC card as in the prior art is to use an IC card that is strong against bending stress. However, foreign matter such as dust enters the gap between the inner peripheral wall of the recess of the card base material and the IC module, which not only spoils the appearance of the IC card but also causes troubles in the card transport system inside the reader / writer for the IC card. However, there are problems such as the occurrence of such a phenomenon and a decrease in the bending stress absorbing ability. The present invention eliminates these conventional problems, protects the semiconductor element built in the IC module against bending stress, does not impair the appearance of the IC card, and is an internal card carrier system for a reader / writer for an IC card. The present invention is intended to provide an IC card manufacturing method and an IC card in which no trouble occurs.

[0004]

According to the present invention, a foamed resin layer is formed by injection-molding a foamed resin on the outer periphery of an IC module, and the IC module having the foamed resin layer is bonded to a card substrate through an adhesive. A method of manufacturing an IC card, characterized in that the IC card is fitted and fixed in a recessed hole formed in
I adhered to the recess formed in the card base material with an adhesive
The IC card is characterized in that a foamed resin layer is provided between the outer periphery of the C module and the inner periphery of the recess.

[0005]

According to the present invention, since the foamed resin layer for absorbing the bending stress is provided between the outer periphery of the IC module fitted and fixed to the concave portion of the card base material with the adhesive, it is possible to reduce the bending stress. In contrast, it is strong, and foreign matter such as dust does not enter the gap between the inner peripheral wall of the recess of the card base material and the IC module,
Not only does the appearance of the IC card be impaired, but no trouble occurs in the card transport system inside the reader / writer for the IC card.

[0006]

Embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a mold 22a provided with a suction hole 21.
The IC module 1 forming the foamed resin layer is positioned between the mold 22b and the mold 22b, and is fixed to the mold 22a by vacuuming using the hole 21, and the mold 22b is closed to close the cavity inside the cavity.
Fix the C module. Next, a thermoplastic resin and a foaming agent such as a bicarbonate, an azo compound, or a peroxide are mixed, and non-toxic gas is generated by thermal decomposition to cause fine foaming, and then the injection nozzle 23 of the mold 22b is used. A foamed resin is filled and a foamed resin layer 2 is formed around the IC module 1 as shown in FIGS. At this time, the foamed resin layer 2 preferably has a thickness of about 200 to 500 μm and is formed to have a uniform thickness around the IC module 1. If the size of the foam to be foamed is too large, the bending stress can be absorbed, but the strength of the foamed resin layer 2 is weak and the foamed resin layer 2 may be damaged during use of the IC card. If the size of the foam is too small, the foamed resin layer 2 is unlikely to be damaged during use of the IC card, but the bending stress cannot be absorbed. Therefore, the size of the foamed foam is 40 μm or more. However, it is preferable that the thickness is 60 to 80 μm.

A specific example for forming the foamed resin layer 2 will be described below. [Example 1] Thermoplastic resin Polyethylene 300% by weight Blowing agent (peroxide) N ', N'-dinitroso-NN' dimethylterephthalamide 1% by weight Reaction temperature 110 ° C Reaction time (formation time) 80 sec [ Example 2] Thermoplastic resin Polystyrene 400 wt% Foaming agent (azo compound) Diazoaminobenzene 1 wt% Reaction temperature 100-120 ° C Reaction time (formation time) 60 sec Polypropylene, poly Vinyl chloride and polyvinylidene chloride can also be used. Further, as the bicarbonate serving as a foaming agent, sodium hydrogencarbonate or the like is used, as the azo compound, azobisisobutylnitrile or the like, and as the nitroso compound, dinitrosopentamethylenetetramine, t-butylamine nitrile and azobisisobutyronitrile. Ronitrile and the like, and benzenesulfonic acid hydrazide and the like can be used as the sulfone hydrazide compound.

First, as shown in FIG. 1, the IC module 1
Air is sucked from the hole 21 in order to fix the mold to a predetermined position of the mold 22a. Next, after the mold 22a and the mold 22b are clamped, the foamed resin shown in the above Example 1 was heated to 110 ° C.
The resin is injected into the mold from the nozzle 23 while being heated to cause foaming reaction, and then cooled for about 60 seconds until the temperature of the mold reaches about 40 ° C. Next, open the mold and
As described above, the IC module 1 in which the foamed resin layer 2 is formed on the IC module 1 is formed. Regarding Example 2, Example 1
The same procedure as above is applied to the IC module 1 and the foamed resin layer 2
Is formed. Here, the air vent 24 of the mold 22b
Is provided to ensure the formation of the foamed resin around the IC module 1.

On the other hand, as shown in FIG.
The recessed portion 4 into which the IC module 1 surrounded by the foamed resin layer 2 is fitted with an end mill or the like, and the foamed resin layer 2 is formed in the recessed portion 4. Adhesive 5 in which an epoxy thermosetting adhesive sheet is attached to the part where the adhesive is not formed (see FIG. 3)
Is provided to the concave portion 4 on the card base material 3 through the adhesive 5.
The C module 1 is fitted and fixed while heating.

As a concrete example, as shown in FIG. 5, an IC module 1 in which a foamed resin layer 2 is formed of a thin plate material.
Is used, and a guide jig 11 in which a guide hole 12 that is loosely inserted into the concave portion 4 of the card base material 3 is formed to project is used. As shown in FIG.
Is loosely inserted into the concave portion 4 of the card base material 3, and the IC module 1 having the thermosetting adhesive 5 on the bottom surface is pressed from the guide hole 12 to the bottom surface of the concave portion 4 while being heated and fixed, and as shown in FIG. By removing the jig 11, the foamed resin layer 2
Is restored, and as shown in FIG. 8, the recess 4 of the card substrate 3 and the IC
An IC card having the foamed resin layer 2 between the modules 1 can be obtained, and bending stress applied to the IC card is absorbed by the foamed resin layer 2. This absorption power is higher than that when the IC module 1 is similarly surrounded by a rubber-based elastic material due to the difference in the packing density of the resin.

[0011]

As described above, according to the present invention, the IC module is fixed to the recess formed in the card substrate, and the IC
By providing a foaming resin layer for absorbing bending stress between the C module and the C module, the IC card becomes resistant to bending stress, and dust such as dust is left in the gap between the inner peripheral wall of the recess of the card substrate and the IC module. The appearance of the IC card can be improved without the entry of foreign matter, no trouble occurs in the card carrier system inside the reader / writer for the IC card, and the ability to absorb bending stress is reduced. Nor.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view of a main part of a mold for forming a foamed resin layer on an IC module of the present invention.

FIG. 2 shows an example of the manufacturing process of the IC card of the present invention I
It is a top view of a C module.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a cross-sectional explanatory view of a main part of a card substrate used in the manufacturing process of FIG.

FIG. 5 is an explanatory cross-sectional view of a main part of a guide jig used in the manufacturing process of the IC card of the present invention.

FIG. 6 is a cross-sectional explanatory view of essential parts showing an example of use of the guide jig of FIG.

7 is a cross-sectional explanatory view of a main part showing an example of use of the guide jig of FIG.

FIG. 8 is a cross-sectional explanatory view of a main part of the IC card of the present invention.

[Explanation of reference numerals] 1 IC module 2 Foamed resin layer 3 Card substrate 4 Recess 5 Adhesive 11 Guide jig 12 Guide hole 21 Hole 22a Mold 22b Mold 23 Injection nozzle 24 Air vent

Continuation of front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display area // B29L 31:34 4F

Claims (5)

[Claims] 1. A foamed resin layer is formed by injection-molding a foamed resin on the outer periphery of an IC module, and the IC module having the foamed resin layer is fitted into a recess formed in a card substrate through an adhesive. ICs characterized by sticking together
Card manufacturing method. 2. The method of manufacturing an IC card according to claim 1, wherein the foamed resin layer is formed by mixing a thermoplastic resin with a bicarbonate salt and performing injection molding. 3. The method of manufacturing an IC card according to claim 1, wherein the foamed resin layer is formed by mixing an azo compound with a thermoplastic resin and performing injection molding. 4. The method of manufacturing an IC card according to claim 1, wherein the foamed resin layer is formed by mixing a thermoplastic resin with a peroxide and performing injection molding. 5. An IC card characterized in that a foamed resin layer is provided between the outer periphery of an IC module fixed to a recess formed in a card base material with an adhesive agent and the inner periphery of the recess.