JPH0516583A - Ic card and manufacture thereof - Google Patents

Abstract

PURPOSE:To manufacture efficiently an IC card with a complicated shape in which IC chips may be assuredly built in. CONSTITUTION:A projecting molded part 2 which protrudes from the outer surface is provided on a base material sheet 1, and on the inner surface 21 at the molded part, an IC chip 3 is placed, and a cover sheet 4 is placed over the base material sheet 1 and joined to close the molded part 2, to manufacture the title IC card. For the title manufacture method of IC cards, a protuberance shaped molded part 2, which protrudes from the outer surface, and in which an IC chip 3 is placed, is provided on the base material sheet 1 which has an enough area to punch out a plurality of IC cards, and on the inner surface 21 of the molded part 2, the IC chip 3 is placed, and the cover sheet 4 is placed over the base material sheet 1 and joined to close the molded part 2, and then the contour of the IC card is punched to complete the process. By this method, a storage storage space can be acquired, and at the same time, the IC chip is assuredly held between two sheets which are put together and joined, and in addition, a large number of cards can be efficiently manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly to an IC card in which an IC chip is built in a card-shaped body made of plastic or the like, and a method for manufacturing the IC card.

[0002]

2. Description of the Related Art A conventional IC card is manufactured by an injection molding method as shown in FIG.
A card-shaped main body 8 having a pocket portion 81 capable of accommodating an IC as shown in the sectional view is manufactured, and an IC chip 84 is mounted on a lid plate 83 that closes the pocket portion. , A method of fitting the IC chip side toward the pocket part and adhering it,
It has also been practiced to use a body in which a hole is formed in an upper plate of a sheet and the lower plate of the sheet is heat-welded to form the pocket portion.

[0003]

In the above conventional method, I
I hate that the card becomes thick and heavy by the thickness of the pocket that stores the C chip. Further, the lid plates on which the IC chips are mounted must be adhered to the inside of the pockets one by one, and there is a problem that the lid plates come off when the adhesive force is weak. further,
The IC card using the main body manufactured by the injection molding method is costly because it is printed one by one afterwards. The method of using the main body composed of two sheets is preferable when the IC chip is thin, but when the IC chip is thick, the thickness of the sheet upper plate having holes is increased by the thickness of the IC chip so that the holes can be accurately formed. There is a risk that the corners will not be opened well, and R will be generated at the corners, or the upper and lower dimensions of the pocket will be touched to create a gap between the IC chip and the adhesive, and the adhesive force will be reduced and the pocket will be more easily peeled off. Further, as the manufacturing method, the upper plate and the lower plate of the sheet are welded by heat, so that the heat easily causes deformation of the holes.

[0004]

An object of the present invention is to efficiently manufacture an IC card having a complicated shape in which an IC chip can be reliably built in, and its gist is to project to the outer surface of a base sheet. An IC card in which a convex molded portion is provided, an IC chip is housed on the inner surface of the molded portion, a lid sheet is polymerized and adhered to the base material sheet to close the molded portion, and a plurality of IC cards are provided. A base sheet having a punchable area is provided with a convex molding portion protruding to the outer surface where the IC chip is stored, the IC chip is stored on the inner surface of the molding portion, and a lid sheet is polymer-bonded to the base sheet. Then, the molded portion is closed, and thereafter, the contour of the IC card is punched to manufacture an IC card.

As a result, a portion for accommodating the IC chip and components accompanying it (a substrate, a connection terminal, a coil, a battery, etc.) is formed by molding a sheet so as to stick out a convex shape on the outer surface, which is thicker than the thickness of the card. You can take a large storage space inside. If card-shaped sheets are used as the base sheet and the lid sheet, the two card-shaped sheets can be entirely polymer-bonded and the IC chip can be reliably held. Moreover, many IC cards can be efficiently manufactured. Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of an IC card of the present invention, FIG.
FIG. 3 is a schematic perspective view illustrating a method of manufacturing an IC card according to the present invention, and FIG. 3 is a sectional view of a conventional IC card. According to the present invention, as shown in FIG. 1, a base sheet 1 is provided with a convex molding portion 2 protruding to the outer surface, and an inner surface 21 of the molding portion has an I shape.
This is an IC card in which a C chip 3 is housed, a lid sheet 4 is polymer-bonded to the base material sheet 1 and the molding portion 2 is closed. In this example, the base material sheet 1 is formed by molding a printed synthetic resin sheet by general press molding, heating vacuum molding, or the like, and has a convex molding portion 2 (the inner surface 21 of which is concave Will be molded). It should be noted that a convex shaped portion 2 can be formed on the lid sheet 4 side as required.

The IC chip 3 to be housed includes components accompanying it, such as the substrate 31 and the connection terminals 3.
2, a coil 33, a battery, and the like. The IC chip 3 is fitted into the inner surface 21 of the convex shaped portion or adhered using an adhesive, the adhesive is applied, and the lid sheet 4 printed as necessary is placed at the position of the base sheet 1. Adhere while matching. In the structure having the writing terminals 32 and the like, for example, the terminal holes 41 are opened in the upper sheet 2. Further, in the case of an IC chip or a component which is weak in bendability, the molded portion can be molded to be slightly larger to make a play, or a cushion material can be incorporated around the IC chip.

According to the manufacturing method of the present invention, as shown in FIG. 2, a base sheet 1 having an area through which a plurality of IC cards can be punched is formed in a convex shape protruding to the outer surface in which the IC chips 3 are housed. The part 2 is provided and the inner surface 21 of the molding part 2 is
The C chip 3 is housed, the lid sheet 4 is polymer-bonded to the base material sheet 1 to close the molding portion 2, and then the IC
Since an IC card can be manufactured by punching into the contour of the card, printing is performed on a large sheet, molding processing and hole processing are performed, an adhesive is applied to the lid sheet 4 and pressure bonding is performed, and then the contour of the card is formed. If both are punched together, the IC card can be completed very efficiently.

[0009]

EXAMPLE As shown in FIG. 2, the lid sheet 4 is a hard vinyl chloride sheet (thickness: 0.3 mm), and printing is arranged on the surface according to the number of cards to be taken. (55 × 86 in this example)
The sheet area is 41 so that 30 mm size cards can be taken.
It was set to 0 × 505 mm. ) The same base sheet 1 as the lid sheet 4 was used, and the convex molding portion 2 was molded using a vacuum molding die capable of simultaneously molding 30 cards. Holes were provided in the lid sheet 4 as the terminal holes 41. Base sheet 1
Each of the components for a non-contact card in which the IC chip 3 and the connection terminal 32 are incorporated in the inner surface 21 of the convex shaped portion 2 of FIG. I was fitted.

In the subsequent step, the lid sheet 4 is coated with a hot-melt type adhesive 5 and pressed against the base sheet 1 to polymerize and bond. If the adhesive agent 5 has a solvent addition number of 10% or less, there is no fear of damaging the IC chip or the like, and it is desirable that the adhesive agent is a non-solvent type and quick cure. When the superposition and adhesion of the base sheet and the lid sheet are completed, the IC card is punched out in the contour of the card.

[0011]

EFFECTS OF THE INVENTION The present invention provides a base sheet with a convex molding portion protruding to the outer surface, accommodates an IC chip on the inner surface of the molding portion, and polymerizes and adheres a lid sheet to the base sheet. Since the molding portion is closed, a large storage space can be secured on the inner surface of the molding portion, the IC chip is securely held between the two sheets which are polymer-bonded, and there is a convex molding portion on the outer surface of the card. Therefore, it does not slip off when it is held by hand, and it is easy to take it out from the pocket. Moreover, the stress of the parts such as IC chips is less likely to be applied to the bending of the card than that of the conventional flat-faced card, so the damage rate is low. Further, a base material sheet having an area through which a plurality of IC cards can be punched is provided with a convex molding portion protruding to the outer surface where the IC chips are housed, and the IC chips are housed on the inner surface of the molding portion. Since a lid sheet is polymerized and adhered to the sheet to close the molding portion, and then the contour of the IC card is punched to manufacture an IC card, a large number of cards can be manufactured efficiently.

[Brief description of drawings]

FIG. 1 is a sectional view of an IC card of the present invention.

FIG. 2 is a schematic perspective view illustrating a method of manufacturing an IC card according to the present invention.

FIG. 3 is a sectional view of a conventional IC card.

[Explanation of symbols]

1 Base sheet 2 Convex shaped part protruding to the outer surface 21 Inner surface of convex shaped part 3 IC chips 4 lid sheet

Claims (2)

[Claims] 1. A base sheet is provided with a convex molding portion protruding to the outer surface, an IC chip is housed on the inner surface of the molding portion, and a lid sheet is polymer-bonded to the base sheet to form the molding portion. An IC card that is closed. 2. A base material sheet having an area through which a plurality of IC cards can be punched is provided with a convex molding portion projecting to the outer surface on which the IC chips are stored, and the IC chips are stored on the inner surface of the molding portion. A method for producing an IC card by polymerizing and adhering a lid sheet to the base sheet to close the molding portion, and then punching the contour of the IC card.