JPH06286375A - Manufacture of non-contact ic card and non-contact ic card - Google Patents

Abstract

PURPOSE:To make it possible to mass-produce a product excellent in various characteristics by a method wherein a pair or front and rear resin plates are injection-molded and, at the same time, a non-contact IC module is installed in a recessed part, which is formed on at least one resin plate and, after that, both the resin plates are bonded together into an integral body. CONSTITUTION:In order to manufacture the non-contact IC card concerned, a pair of or front and rear resin plates 1 and 2 are injection-molded. At the same time, on at least one resin plate 2, a recessed part 4 for installing a non- contact IC module 3 therein is formed. Next, after the non-contact IC module 3 is installed in the recessed part 4, both the resin plates 1 and 2 are boded at their mating surfaces 7 together into an integral body. Thus, the non-contact IC card, which is equipped with enough mechanical strength and airtightness, excellent in reliability and manageability and, at the same time, has fine outer appearance, can be mass-produced at high quality.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless IC card manufacturing method and a contactless IC card. That is, information exchange between the IC circuit and an external data processing device is performed by an electromagnetic induction method in close proximity, or by an electric wave / optical method in a remote manner, so that information is electrically and mechanically connected. TECHNICAL FIELD The present invention relates to a method for manufacturing a non-contact IC card and a non-contact IC card that do not require a contact terminal electrode.

[0002]

2. Description of the Related Art In recent years, the sophistication of information in society has been remarkable, and cards have become indispensable in social life. Compared with conventional magnetic stripe cards, IC cards with built-in or built-in ICs such as microcomputers and memories have the characteristics of high security, high privacy, and large storage capacity. The use is spreading. For example,
In the company, it is used as an employee ID card for multiple purposes such as employee cafeteria / store use, in-house deposit use, welfare use, entry / exit management, attendance management, health management, and financial, medical, sales / service. Trial use has begun in fields such as transportation, manufacturing, and education.

These conventional IC cards are used for exchanging information between the IC circuit of the IC card and an external data processing device.
It has contact terminal electrodes for connection for electrical and mechanical connection. However, since the contact terminal electrode is provided, there are various problems such as ensuring the airtightness of the IC circuit, measures against electrostatic breakdown, poor electrical connection of the terminal electrode, and complicated mechanism of the IC card reading device. There is. In addition, a human operation of inserting or mounting the IC card into the IC card reading device is required,
There is a demand for an IC card that is inefficient and complicated depending on the field of use and can exchange information with a remote data processing device so that it can be used in a portable state without such trouble. A contactless IC card that is not only carried by people but also capable of remote data communication is used as an ID card by being attached to parts, devices, luggage, vehicles, etc. in the fields of manufacturing, assembling, transport sorting, etc. , Extremely useful. Therefore, a contactless IC card in which information is exchanged between the IC circuit of the IC card and an external data processing device by an electromagnetic induction method or a radio wave / optical method without contact has been considered.

As a method of manufacturing such a non-contact IC card, a resin substrate having a shape capable of mounting the non-contact IC module is manufactured by injection molding or the like, and after mounting the non-contact IC module on the resin substrate, A manufacturing method is known in which an adhesive tape having desired printing is attached to the resin substrate to cover both front and back surfaces of the resin substrate. In addition, the cardboard board is punched into a shape that allows the non-contact IC module to be mounted, and after mounting the non-contact IC module on the cardboard board, printing of the same size as the cardboard board is performed on both front and back surfaces of the cardboard board. Temporarily fix the applied paper, and then use a transparent transparent plastic film that is one size larger than the cardboard board, attach the non-contact IC module and sandwich both sides of the resin board to which the paper is temporarily fixed. Then, there is known a manufacturing method by so-called laminating, in which four-sided sealing is performed by heat welding or the like and enclosing.

However, in the former case, since the non-contact IC module is enclosed by the adhesive tape, the adhesive tape may be peeled off from the resin substrate, which is a problem in terms of airtightness. In addition, the adhesive tape was relatively thin and had insufficient mechanical strength and poor durability. Also, in the latter case, the strength against external force such as bending is poor and there is a problem in handling, the durability is very poor such as the notch progressing from the edge part, and it is also cheap to look and gives concern to the user. Met.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional technical drawbacks, whereby sufficient mechanical strength and airtightness can be obtained, and reliability and handleability are excellent. Another object of the present invention is to provide a high-quality and mass-production method of a beautiful contactless IC card that looks good and a contactless IC card.

[0007]

As a result of various researches for achieving the object of the present invention, at least two resin plates constituting a non-contact IC card are manufactured by injection molding. A resin plate, wherein a recess for mounting a non-contact IC module is formed in at least one resin plate by the injection molding, the non-contact IC module is mounted in the recess, and the two resin plates are It has been found that the above-mentioned problems can be achieved by adhering and integrating them to complete the present invention.

[0008]

[Function] Since the front and back surfaces of the non-contact IC card are made of resin plates and are adhered to each other, sufficient mechanical strength and
It is airtight and has excellent reliability and handleability. Further, the resin plate has excellent printability, beautiful printing is possible, and a high-quality non-contact IC card having a good appearance can be manufactured by the manufacturing method of the present invention. Further, it is low in cost, has good dimensional accuracy with respect to a complicated module shape, and can be mass-produced.

[0009]

The present invention will be described in detail below based on preferred embodiments. FIG. 1 is a block diagram of a non-contact IC card of the present invention. In FIG. 1, 1 is a resin plate (front). This resin plate (table) 1 is a resin plate (table) 1 made of a single resin, a mixed resin, a fiber-containing resin or the like, and is provided with a recess 4 in which the non-contact IC module 3 in FIG. 1 can be mounted. ing. The resin plate having such recesses 4 is manufactured by making a mold and injection molding. The resin plate (back) 2 in FIG. 1 can also be made of the same material and the same manufacturing method as the resin plate (front) 1. The non-contact IC card of the present invention is manufactured by mounting the non-contact IC module 3 in the recess 4 and then integrally bonding the resin plate (front) 1 and the resin plate (back) 2 together.

As the resin for the resin plate, any resin suitable for injection molding can be used regardless of the type. In particular, thermoplastic resins are generally used, and usable resins are vinyl chloride resin, polystyrene resin, ABS.
Resin (acrylonitrile butadiene styrene copolymer resin), SAN resin (acrylonitrile styrene copolymer resin), acrylic resin, polysanphon resin, polycarbonate resin, noryl resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, fluororesin , Polyester resin and the like. Thermosetting resins can also be used in injection molding machines for thermosetting resins, and usable resins include phenolic resins, urea resins, melamine resins, polyester resins, epoxy resins, polyretane resins, xylene resins, silicone resins. Etc.

Further, when the front and back resin plates are bonded by ultrasonic welding, a thermoplastic resin is preferable as the resin, and any type of thermoplastic resin can be used. Among them, the amorphous resin is welded. Excellent weldability can be obtained.
However, even a crystalline resin will be welded if strong ultrasonic energy is applied. As the amorphous resin that can be used, ABS resin (acrylonitrile butadiene styrene copolymer resin), SAN resin (acrylonitrile styrene copolymer resin), acrylic resin, styrene resin, polysanphon resin, polycarbonate resin, noryl resin, chloride Examples include vinyl. Examples of the crystalline resin that can be used include polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, and polyester resin.

FIG. 2 shows an example of the non-contact IC module 3 which can be used in the present invention. In FIG. 2, 11 is a printed circuit board.
As shown in 2, I of CPU, memory, analog IC, etc.
The C chip is bonded, and electronic circuit parts such as the capacitor 13 and others are mounted. IC
The chips and the like are electrically connected to necessary portions of the conductive pattern of the circuit board by wire bonding. In addition, terminal portions having various purposes are also provided. In FIG. 2, reference numeral 14 is an elliptical coil made of an insulated copper wire or the like, which constitutes a loop antenna. The loop antenna 14 is provided on the printed circuit board 11
It is connected to the upper antenna terminal 15. Further, in the lower diagram of FIG. 2, a plurality of contact terminals 16 are provided on the back surface of the printed circuit board 11 and are electrically connected to the front surface by through holes. These contact terminals 16 are provided in an IC module that is non-contact and cannot be written in the IC. When performing an operation test of a completed non-contact IC module, when writing an ID code or the like in a memory, or when a non-contact IC having a contact terminal 16 is provided. The contact IC card is used when the contents of the memory are rewritten during use. Also, a method is possible in which the loop antenna 14 receives an electromagnetic wave emitted from an external processing device, the electric power is obtained from the electromagnetic wave, and the non-contact IC module modulates and reflects the electromagnetic wave to perform a communication operation. To battery 1
It is also possible to adopt a system in which 7 is built in to perform a more powerful active operation.

(Embodiment 1) The present invention will be described with reference to a more specific example. FIG. 3 is a cross-sectional view of the non-contact IC card of the present invention, showing a cross section taken along the line AA ′ in FIG. Resin plate (front) 1 and resin plate (back) 2 in FIG.
Are made by injection molding, and these resin plates (front)
A concave portion 4 for mounting the non-contact IC module 3 is formed on the resin plate 1 and the resin plate (back) 2 by injection molding. Further, desired printing 8 is applied to the surface of the resin plate. As shown in FIG. 3, the non-contact IC module 3 is mounted in the recess 4, and the front and back surfaces of the resin plate are adhered by an adhesive 9 and hermetically sealed.

Next, a method of manufacturing a non-contact IC card having such a structure will be described. FIG. 4 is a diagram showing a manufacturing process of the non-contact IC card of the present invention. 1 in FIG.
The resin plate (1) and the resin plate 2 (2) are manufactured by injection molding of ABS resin (not shown). As the ABS resin, for example, ABS resin ABS manufactured by Denki Kagaku Kogyo Co., Ltd.
-QF can be used. Desired printing is performed on these front and back resin plates in a printing process (not shown).
As a printing method, offset printing, screen printing or the like can be used. Next, in the adhesive applying step 54, the adhesive 9 is applied to the resin plate (back) 2. As the adhesive 9, any adhesive can be used as long as it has good adhesiveness to the ABS resin, but a curable adhesive having excellent adhesive strength and durability, which has rubber elasticity after curing, is particularly preferable. Considering the sex, the one-liquid type is better than the two-liquid type. Further, in the case of the heat-curing type, a portion of the resin plate subjected to the injection molding may be distorted and deformed depending on the heating temperature. Therefore, the heating temperature is low or the room-temperature curing type is desirable. For example, an adhesive or the like having a silyl group as a reactive group, which causes a curing reaction by moisture in the air, is suitable. Specifically, Cemedine
Super X and the like manufactured by Co., Ltd. can be used. As a method for applying the adhesive to the resin plate, a method such as spray coating or roll coating can be used, and any application method may be used as long as it can be applied thinly and uniformly. Further, if the adhesive is of a type containing an organic solvent, the organic solvent is dried.

Next, the non-contact IC module 3 is attached to the adhesive 9
The resin plate (back) 2 coated with is attached in the attaching step 52. The mounting can be performed manually, but an assembly method using a robot hand can be performed. Next, in the pressure fixing step 55, the resin plate (front) 1 is aligned with the adhesive surface of the resin plate (back) 2 and bonded together.
Pressing is continued by the press machine until the adhesive 9 is cured, and after the curing is completed, the adhesive 9 is taken out of the press machine to complete the production of the non-contact IC card. Although the adhesive 9 is applied only to the resin plate (back) 2 in the above description, it may be applied only to the resin plate (front) 1 or to both resin plates. . In addition, after the above-mentioned curing is completed, if there is a protrusion of the adhesive or the like, a process of removing it may be added to the above process.

(Embodiment 2) FIG. 5 is a cross-sectional view of a non-contact IC card of the present invention, showing a cross section taken along the line AA 'in FIG. Resin plate (front) 1 and resin plate (back) in FIG.
2 is made by injection molding, and the resin plate (front) 1 and the resin plate (back) 2 have a non-contact IC module 3
The concave portion 4 for mounting is formed by injection molding. Further, desired printing 8 is applied to the surface of the resin plate. As shown in FIG. 5, the non-contact IC module 3 is mounted in the recess 4, and the front and back surfaces of the resin plate are adhered and hermetically sealed by the adhesive sheet 10.

Next, a method of manufacturing the contactless IC card having such a structure will be described. FIG. 6 is a diagram showing a manufacturing process of the non-contact IC card of the present invention. 1 in FIG.
The resin plate (1) and the resin plate 2 (2) are manufactured by injection molding of ABS resin (not shown). As the ABS resin, for example, ABS resin ABS manufactured by Denki Kagaku Kogyo Co., Ltd.
-QF can be used. Desired printing is performed on these front and back resin plates in a printing process (not shown).
As a printing method, offset printing, screen printing or the like can be used. After the two resin plates constituting the non-contact IC card are manufactured as described above, the resin plates and the non-contact IC module are then integrated to form the non-contact I
Manufacture C card. In the mounting step 52 of FIG. 5, the non-contact IC module 3 is mounted on the resin plate (back) 2. The mounting can be performed manually, but an assembly method using a robot hand can be performed.

Next, in a temporary fixing step 56, the adhesive sheet 10 is aligned with the resin plate (back) 2 and temporarily fixed. The outer shape of the adhesive sheet 10 is the same as or slightly smaller than that of the resin plate, and the notch is formed in the shape of the non-contact IC module. The cuts can be made by pushing and cutting with the blade shape of the outer shape of the non-contact IC module. To do. It is a so-called perforated cut. Further, the adhesive sheet 10 can be temporarily fixed at two or more places and pressed with a heated iron tip. As the adhesive sheet 10, Clan Better E-7400 manufactured by Kurashiki Spinning Co., Ltd. can be used. Next, in the heating / pressurizing fixing step 57, the resin plate (front) 1 is aligned with the resin plate (back) 2 and
The manufacturing process of the non-contact IC card is completed by stacking, heating and pressing with a heat press, and cooling.

(Embodiment 3) The present invention will be described with reference to another more specific example. FIG. 7 shows the non-contact IC of the present invention.
FIG. 2 is a cross-sectional view of the card, showing a cross section taken along the line AA ′ in FIG. 1. The resin plate (front) 1 and the resin plate (back) 2 in FIG. 7 are manufactured by injection molding, and the non-contact IC module 3 is attached to the resin plate (front) 1 and the resin plate (back) 2. The recess 4 for mounting is formed by injection molding, and the non-contact IC module 3 is mounted in this recess 4 as shown in FIG. Further, desired printing is applied to the resin plate. The resin plate (front) 1 and the resin plate (back) 2 are adhered by ultrasonic welding, and the non-contact IC module 3 is hermetically sealed.

FIG. 8 is a plan view and a sectional view of the resin plate. An energy director 5 for ultrasonic welding surrounds a recess 4 for mounting the non-contact IC module 3, and the non-contact IC module 3 can be completely sealed. In this example, a concave portion 21 having a fitting structure and a convex portion 22 having a fitting structure are formed on the resin plate, and a projection which is an energy director 5 for ultrasonically welding the resin plates to each other is fitted to the resin plate. It is formed on the convex portion 22 of the structure. In the fitting diagram of FIG. 7, the concave portion 21 and the convex portion 22 including the energy director 5 have a larger depth c of the concave portion 21 than the height (ba) of the energy director 5, and the convex portion including the energy director. The height b of 22 is greater than c. That is (b−a) <
It is formed so that c <b. If formed in this way, the resin plate (front), the non-contact IC module, and the resin plate (back) can be assembled and fitted to each other before ultrasonic welding to form a temporary integrated structure. By doing so, it is easy to handle and the components can be easily and accurately aligned.

Next, a method of manufacturing a non-contact IC card having such a structure will be described. FIG. 9 is a diagram showing a manufacturing process of the non-contact IC card of the present invention. 1 in FIG.
The resin plate (1) and the resin plate 2 (2) are manufactured by injection molding of ABS resin (not shown). As the ABS resin, for example, ABS resin ABS manufactured by Denki Kagaku Kogyo Co., Ltd.
-QF can be used. Desired printing is performed on these front and back resin plates in a printing step 51. As a printing method, offset printing, screen printing or the like can be used. Next, in the mounting step 52, the non-contact IC module 3 is mounted and combined in the recesses 4 of the front and back resin plates, and in the ultrasonic welding step 53, ultrasonic welding is performed while applying pressure, and ultrasonic energy is applied to the portion of the energy director 5. Are concentrated and the ABS resin melts and the above-mentioned front and back resin plates are brought into close contact with each other by pressing, and when the irradiation of ultrasonic waves is stopped, the melted ABS resin solidifies and the above-mentioned front and back resin plates are bonded and integrated even after the pressing is stopped. To do. As an apparatus for ultrasonic welding, an ultrasonic welding machine BRANSON 84 is used.
00 (900 W) can be used, and preferable welding conditions when using this apparatus are ultrasonic frequency 20 to 4
0 KHz, welding time 0.1 to 0.2 seconds, holding time 0.2 to
0.3 seconds. If the welding time and holding time are extended further, the appearance will be impaired and the quality will also deteriorate. In this way, the non-contact IC card of the present invention can be manufactured.

In the case where the energy director 5 completely surrounds the non-contact IC module 3, in some cases, for example, the dimensional accuracy of the resin plate is very good, the pressing accuracy of the ultrasonic welding machine is good, and the ultrasonic wave distribution is also good. In the case of evenness, when air is enclosed in the non-contact IC card and the pressure of the ultrasonic welding machine is released, the air expands and the non-contact I
The center of the C card may swell. As a method for preventing such entrapment of air, as shown in FIG. 9, a low-height portion 31 in which the height of the energy director is reduced is formed in a part of the energy director, and ultrasonic welding is performed. When pressure is applied by a machine, it is possible to prevent air from being caught without sacrificing airtightness by letting air escape from that portion. Further, as shown in FIG. 10, if air vent holes 32 are provided in the resin plate, and after ultrasonic welding, the holes are closed by ultrasonic welding, heat fusion, resin sealing, or the like, both air venting and airtightness are achieved. it can.

Although the injection-molded ABS resin plate is used as the resin plate constituting the non-contact IC card as described above, other compatible resins can be used. Further, in the embodiment, an example in which the energy director has a structure in which the non-contact IC module is completely surrounded is shown. However, if the airtightness is not perfect, ultrasonic welding may be performed at several spots without completely enclosing it. can do. Further, in the embodiment, the recesses for mounting the non-contact IC module are provided on both the front and back resin plates, but it may be provided only on one resin plate depending on the shape of the non-contact IC module.

[0024]

According to the present invention, since the front and back surfaces of the non-contact IC card are made of resin plates and are adhered to each other, sufficient mechanical strength and airtightness can be obtained, and reliability and handleability are obtained. Is excellent. Further, the resin plate has excellent printability, enables beautiful printing, has a beautiful appearance similar to that of a conventional credit card having a good appearance, and a high-quality non-contact IC card can be manufactured by the manufacturing method of the present invention. Further, since the resin plates on both the front and back surfaces of the non-contact IC card are manufactured by injection molding, they have high precision and high productivity even for complicated shapes, and are suitable for mass production.

[0025]

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a non-contact IC card of the present invention.

FIG. 2 is a diagram showing a structure of a non-contact IC module used in the present invention.

FIG. 3 is a sectional view of the non-contact IC card of the present invention.

FIG. 4 is a diagram showing a manufacturing process of the non-contact IC card of the present invention.

FIG. 5 is a sectional view of the non-contact IC card of the present invention.

FIG. 6 is a diagram showing a manufacturing process of the non-contact IC card of the present invention.

FIG. 7 is a sectional view of the non-contact IC card of the present invention.

8A and 8B are a front view and a cross-sectional view of a resin plate constituting the non-contact IC card of the present invention.

FIG. 9 is a diagram showing a manufacturing process of the non-contact IC card of the present invention.

FIG. 10 is a diagram of an energy director provided on a resin plate that constitutes the non-contact IC card of the present invention.

FIG. 11 is a view of an air vent hole provided with a resin plate that constitutes the non-contact IC card of the present invention.

[Explanation of symbols]

 1. Resin plate (front) 2. Resin plate (back) 3. Non-contact IC module 4. 4. Recess for mounting non-contact IC module 5. Energy director 6. 6. Recess facing energy director 7. Adhesive surface 8. Printing 9. Adhesive 10. Adhesive sheet 11. Printed circuit board 12. IC chip bonding section 13. Capacitor 14. Loop antenna 15. Antenna terminal 16. Contact terminal 17. Battery 18. Outline of non-contact IC card 21. Fitting recess 22. Fitting convex part 31. Low height part 32. Air vent hole 51. Printing process 52. Mounting process 53. Ultrasonic welding step 54. Adhesive applying step 55. Pressurizing step 56. Temporary fixing step 57. Heating and pressing process

Claims (2)

[Claims] 1. At least two constituting a non-contact IC card
In one resin plate, the resin plates are resin plates manufactured by injection molding, and by the injection molding, a recess for mounting a non-contact IC module is formed in at least one resin plate, and the recess is formed. A method for manufacturing a non-contact IC card, characterized in that a non-contact IC module is mounted on and the two resin plates are bonded and integrated. 2. At least two constituting a non-contact IC card
In one resin plate, the resin plates are resin plates manufactured by injection molding, and by the injection molding, a recess for mounting a non-contact IC module is formed in at least one resin plate, and the recess is formed. A non-contact IC card in which a non-contact IC module is mounted on and the two resin plates are bonded and integrated.