JPH0618237A - Cream solder print inspection equipment - Google Patents
Cream solder print inspection equipmentInfo
- Publication number
- JPH0618237A JPH0618237A JP17298292A JP17298292A JPH0618237A JP H0618237 A JPH0618237 A JP H0618237A JP 17298292 A JP17298292 A JP 17298292A JP 17298292 A JP17298292 A JP 17298292A JP H0618237 A JPH0618237 A JP H0618237A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- window frame
- pattern
- contour
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、クリーム半田印刷され
たプリント基板の印刷状態を検査する装置に関し、特に
半田ブリッジの有無を検査する装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting the printed state of a printed circuit board printed with cream solder, and more particularly to an apparatus for inspecting the presence or absence of solder bridges.
【０００２】[0002]
【従来の技術】従来のクリーム半田印刷検査装置におい
て、半田ブリッジの有無を検査する方法を、図４〜図６
に基き説明する。2. Description of the Related Art A conventional method for inspecting the presence or absence of a solder bridge in a cream solder printing inspection apparatus will be described with reference to FIGS.
It will be explained based on.
【０００３】先ず、撮像手段２３によって、クリーム半
田２２が印刷されたプリント基板２１を撮像し、その映
像信号を画像記憶手段２５に発信する。次いで２値化手
段２６によって画像記憶手段２５が記憶している映像信
号から、図５の（ａ）に示すように、検査対象である隣
接する２つの半田パターン２９，２９の間に設けられた
半田ブリッジ検査用窓枠Ｑ内の画像を取り出し２値化す
る。その後投影手段２７が２値化手段２６によって２値
化された２値画像の投影を求め、図５の（ｂ）に示す投
影像の値が所定の閾値Ｓ以上であれば半田ブリッジ有り
と判断し、印刷不良としていた。これらの処理、判定は
制御部２８で行っている。First, the image pickup means 23 picks up an image of the printed circuit board 21 on which the cream solder 22 is printed, and sends the image signal to the image storage means 25. Next, the binarizing means 26 is provided between the two adjacent solder patterns 29, 29 to be inspected, as shown in FIG. 5A, from the video signal stored in the image storing means 25. The image in the solder bridge inspection window frame Q is extracted and binarized. After that, the projection means 27 obtains the projection of the binary image binarized by the binarization means 26, and if the value of the projected image shown in FIG. However, the printing was defective. The control unit 28 performs these processes and determinations.
【０００４】[0004]
【発明が解決しようとする課題】しかし上記従来法によ
ると、図６の（ａ）に示すように、半田のにじみが大き
い場合に、１対の半田パターン２９，２９の間に設けら
れた半田ブリッジ検査用窓枠Ｑ内の投影像が図６の
（ｂ）に示すようになってしまい、半田ブリッジが無い
場合でも、投影像の値が所定の閾値Ｓ以上となり、半田
ブリッジ有りと誤判断してしまう問題があった。However, according to the above-mentioned conventional method, as shown in FIG. 6A, the solder provided between the pair of solder patterns 29, 29 when the solder bleed is large. The projected image in the window frame Q for bridge inspection becomes as shown in FIG. 6B, and even when there is no solder bridge, the value of the projected image becomes the predetermined threshold value S or more, and it is erroneously determined that there is a solder bridge. I had a problem.
【０００５】又半田ブリッジの有無にかかわらず、すべ
ての隣接する半田パターン２９，２９の間に半田ブリッ
ジ検査用窓枠Ｑを設定して検査するため、検査時間が長
くなるという問題もあった。Further, regardless of the presence / absence of the solder bridge, since the solder bridge inspection window frame Q is set between all the adjacent solder patterns 29, and the inspection is performed, there is a problem that the inspection time becomes long.
【０００６】[0006]
【課題を解決するための手段】本発明のクリーム半田印
刷検査装置は上記問題点を解消するため、クリーム半田
印刷されたプリント基板を撮像し、その映像信号を発信
する撮像手段と、前記映像信号を受信し、これに基き半
田パターン認識画像を形成するパターン形成手段と、検
査対象である１対の半田パターンの夫々に窓枠を設定
し、各窓枠内の半田パターンの輪郭を追跡する半田パタ
ーン輪郭追跡手段と、前記輪郭が窓枠に接触するか否か
を判断する窓枠接触判断手段と、窓枠接触判断手段によ
って前記輪郭が窓枠に接触すると判断された場合のみ、
両半田パターンの間に半田ブリッジ検査用窓枠を設定
し、この窓枠内のパターンの輪郭を追跡する半田ブリッ
ジ部輪郭追跡手段と、半田ブリッジ部輪郭追跡手段によ
り得られた輪郭線が両半田パターンの輪郭線を結ぶ場合
に限って、半田ブリッジ有りと判定する半田ブリッジ判
定手段とを、備えたことを特徴とする。In order to solve the above-mentioned problems, the cream solder printing inspection apparatus of the present invention takes an image of a printed circuit board printed with cream solder and sends an image signal thereof, and the image signal. And a window for each of the pair of solder patterns to be inspected, and traces the outline of the solder pattern in each window frame. Only when the pattern contour tracking means, the window frame contact determination means for determining whether the contour contacts the window frame, and the window frame contact determination means determines that the contour contacts the window frame,
A solder bridge inspection window frame is set between both solder patterns, and a solder bridge portion contour tracing means for tracing the contour of the pattern in this window frame and a contour line obtained by the solder bridge portion contour tracing means Solder bridge determining means for determining that there is a solder bridge is provided only when connecting the contour lines of the pattern.
【０００７】[0007]
【作用】本発明によれば、半田パターン輪郭追跡手段に
よって、１対の半田パターンの夫々に窓枠を設定し、各
窓枠内の半田パターンの輪郭を追跡し、次いで窓枠接触
判断手段によって輪郭が窓枠に接触するか否かを判断す
ることにより、半田ブリッジの有無の１次判定を行う。
前記輪郭が窓枠に接触しないと判断されれば、半田ブリ
ッジ無しと判定され、その後の検査が不要となる。この
ため従来例のような半田ブリッジ検査工程が省略でき
る。According to the present invention, the window pattern is set for each of the pair of solder patterns by the solder pattern contour tracing means, the contour of the solder pattern in each window frame is traced, and then the window frame contact judging means is used. By determining whether or not the contour contacts the window frame, the primary determination of the presence or absence of the solder bridge is performed.
If it is determined that the contour does not contact the window frame, it is determined that there is no solder bridge, and subsequent inspection is unnecessary. Therefore, the solder bridge inspection step as in the conventional example can be omitted.
【０００８】窓枠接触判断手段によって輪郭が窓枠に接
触すると判断されれば、次いで半田ブリッジ部輪郭追跡
手段によって、両半田パターンの間に半田ブリッジ検査
用窓枠を設定し、この窓枠内のパターンの輪郭を追跡し
た後、半田ブリッジ判定手段により、前記輪郭線が両半
田パターンの輪郭線を結ぶか否かを判断することによ
り、半田ブリッジの有無の２次判定を行う。前記輪郭線
が両半田パターンの輪郭線を結ぶ場合に限って、半田ブ
リッジ有りと判定される。If the window frame contact determination means determines that the contour contacts the window frame, then the solder bridge portion contour tracking means sets a solder bridge inspection window frame between the two solder patterns, and the inside of the window frame is checked. After tracing the contour of the pattern, the solder bridge determining unit determines whether or not the contour connects the contours of both solder patterns, thereby making a secondary determination of the presence or absence of a solder bridge. Only when the contour line connects the contour lines of both solder patterns is it determined that there is a solder bridge.
【０００９】この判定法によれば、半田のにじみに影響
されず、正確な半田ブリッジの有無の検査が可能とな
り、例えば図２、図３の場合は半田ブリッジ有りと判定
され、図６の場合は半田ブリッジ無しと判定される。According to this determination method, the presence or absence of a solder bridge can be accurately inspected without being affected by solder bleeding. For example, in the case of FIGS. 2 and 3, it is determined that there is a solder bridge, and in the case of FIG. Is determined to have no solder bridge.
【００１０】[0010]
【実施例】本発明の実施例を図面に基いて説明する。Embodiments of the present invention will be described with reference to the drawings.
【００１１】図１において、１はプリント基板、２はプ
リント基板１上に印刷されたクリーム半田、３はクリー
ム半田印刷されたプリント基板１をカラー撮像する撮像
手段である。In FIG. 1, 1 is a printed circuit board, 2 is cream solder printed on the printed circuit board 1, and 3 is an image pickup means for color-imaging the printed circuit board 1 printed with cream solder.
【００１２】１１は前記撮像手段３からカラー映像信号
を受信し、これに基き半田パターン認識画像を形成する
パターン形成手段である。具体的にはパターン形成手段
１１は、色抽出手段４と平滑化手段５によって構成され
る。すなわち、カラー映像信号を受信した色抽出手段４
は、予め制御部１０から与えられている、クリーム半田
２の色分布と前記カラー映像信号の色とを比較して、前
記色分布内に存在するカラー映像信号の色の部分をクリ
ーム半田２の部分と判断して、その部分を示す色抽出デ
ータを発信する。平滑化手段５は、前記色抽出データを
受信して、ノイズ成分を平滑化して半田パターン認識画
像を形成する。A pattern forming means 11 receives the color video signal from the image pickup means 3 and forms a solder pattern recognition image based on the color video signal. Specifically, the pattern forming means 11 is composed of the color extracting means 4 and the smoothing means 5. That is, the color extraction means 4 that has received the color video signal
Compares the color distribution of the cream solder 2 given in advance from the control unit 10 with the color of the color video signal, and determines the portion of the color of the color video signal existing in the color distribution of the cream solder 2. It is determined that it is a portion, and the color extraction data indicating that portion is transmitted. The smoothing means 5 receives the color extraction data, smoothes the noise component, and forms a solder pattern recognition image.
【００１３】６は、半田パターン認識画像から、検査対
象である１対の半田パターン１２，１２の夫々に窓枠
Ｐ，Ｐを設定し、各窓枠Ｐ，Ｐ内の半田パターン１２の
輪郭を追跡する半田パターン輪郭追跡手段である（図
２）。窓枠Ｐの設定は制御部１０に記憶されているデー
タに基いて行なわれる。The reference numeral 6 sets window frames P and P for each of the pair of solder patterns 12 and 12 to be inspected from the solder pattern recognition image, and outlines the solder pattern 12 in each window frame P and P. It is a solder pattern contour tracing means for tracing (FIG. 2). The window frame P is set based on the data stored in the control unit 10.
【００１４】７は、前記輪郭が窓枠Ｐに接触するか否か
を判断する窓枠接触判断手段である。窓枠ＰのＸ−Ｙ座
標と、半田パターン１２の輪郭線のＸ−Ｙ座標とを対比
し、一致する点があるか否かを判断し、一致する点があ
れば輪郭が窓枠Ｐに接触すると判断する。他方、一致す
る点がなければ、輪郭が窓枠Ｐに接触しないと判断し、
その判断結果が制御部１０に送られ、ここで半田ブリッ
ジ無しと判定され、検査は終了する。Reference numeral 7 is a window frame contact determining means for determining whether or not the contour contacts the window frame P. The XY coordinates of the window frame P and the XY coordinates of the outline of the solder pattern 12 are compared to determine whether there is a coincident point. If there is a coincident point, the contour is in the window frame P. Judge that it will come into contact. On the other hand, if there is no coincident point, it is determined that the contour does not contact the window frame P,
The determination result is sent to the control unit 10, where it is determined that there is no solder bridge, and the inspection ends.
【００１５】８は窓枠接触判断手段７によって前記輪郭
が窓枠Ｐに接触すると判断された場合のみ、両半田パタ
ーン１２，１２の間に半田ブリッジ検査用窓枠Ｒを設定
し、この窓枠Ｒ内のパターンの輪郭を追跡する半田ブリ
ッジ部輪郭追跡手段である。A window frame R for solder bridge inspection is set between the solder patterns 12 and 12 only when the window frame contact determination means 7 determines that the contour contacts the window frame P. It is a solder bridge portion contour tracing means for tracing the contour of the pattern in R.
【００１６】この追跡手段８は、検査対象となる１対の
半田パターン１２，１２の位置データと、窓枠Ｐと半田
パターン１２の輪郭線との交点のＸ−Ｙ座標、（Ｘ1 ，
Ｙ2 ）、（Ｘ2 ，Ｙ2 ）、（Ｘ3 ，Ｙ3 ）・・・・・の
データとを受取って、適正な窓枠Ｒを設定する。その後
半田パターンの輪郭を示す平滑化された信号を平滑化手
段５より取り出し、前記窓枠Ｒ内のパターンの輪郭線Ｂ
を図２に示すように求める。The tracing means 8 has an X-Y coordinate (X 1 , Y 1) of the intersection of the position data of the pair of solder patterns 12 and 12 to be inspected and the window frame P and the outline of the solder pattern 12.
Y 2 ), (X 2 , Y 2 ), (X 3 , Y 3 ), and the like are received, and an appropriate window frame R is set. After that, the smoothed signal indicating the outline of the solder pattern is taken out from the smoothing means 5, and the outline B of the pattern in the window frame R is obtained.
Is calculated as shown in FIG.
【００１７】９は前記輪郭線Ｂが両半田パターンの輪郭
線を結ぶ場合に限って、半田ブリッジ有りと判定する半
田ブリッジ判定手段である。Reference numeral 9 is a solder bridge determining means for determining that there is a solder bridge only when the outline B connects the outlines of both solder patterns.
【００１８】すなわち図２に示す場合では、半田ブリッ
ジ検査用窓枠Ｒ内に輪郭線ＢのＸ−Ｙ座標の中に、前記
交点を示す（Ｘ1 ，Ｙ2 ）、（Ｘ2 ，Ｙ2 ）、（Ｘ3 ，
Ｙ3）、（Ｘ4 ，Ｙ4 ）のすべてが存在するか否かが判
定される。イエスの場合には半田ブリッジ有り、ノーの
場合には半田ブリッジ無しと判断される。That is, in the case shown in FIG. 2, the intersections are shown in the XY coordinates of the outline B in the solder bridge inspection window frame R (X 1 , Y 2 ), (X 2 , Y 2). ), (X 3 ,
Y 3), it is determined whether or not there all the (X 4, Y 4). If yes, it is determined that there is a solder bridge, and if no, it is determined that there is no solder bridge.
【００１９】上記の判定方法を用いれば、図３に示すよ
うに半田のにじみが大きい場合にも、半田ブリッジの有
無の判定を正確に行うことができる。By using the above determination method, it is possible to accurately determine the presence / absence of a solder bridge even when solder bleeding is large as shown in FIG.
【００２０】[0020]
【発明の効果】本発明によれば、半田のにじみに影響さ
れず半田ブリッジの有無を正確に判定することができる
と共に、検査時間を短縮することができるクリーム半田
印刷検査装置を提供することができる。According to the present invention, it is possible to provide a cream solder printing inspection device capable of accurately determining the presence or absence of a solder bridge without being affected by solder bleeding and shortening the inspection time. it can.
【図１】本発明の一実施例の構成を示すブロック図。FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.
【図２】その検査例を示す原理図。FIG. 2 is a principle diagram showing an example of the inspection.
【図３】その検査例を示す原理図。FIG. 3 is a principle diagram showing an example of the inspection.
【図４】従来例の構成を示すブロック図。FIG. 4 is a block diagram showing a configuration of a conventional example.
【図５】その検査例を示す原理図。FIG. 5 is a principle diagram showing an example of the inspection.
【図６】その検査例を示す原理図。FIG. 6 is a principle diagram showing an example of the inspection.
１ プリント基板 ２ クリーム半田 ３ 撮像手段 ４ 色抽出手段 ５ 平滑化手段 ６ 半田パターン輪郭追跡手段 ７ 窓枠接触判断手段 ８ 半田ブリッジ部輪郭追跡手段 ９ 半田ブリッジ判定手段 １０ 制御部 １１ パターン形成手段 Ｐ 窓枠 Ｒ 半田ブリッジ検査用窓枠 DESCRIPTION OF SYMBOLS 1 printed circuit board 2 cream solder 3 image pickup means 4 color extraction means 5 smoothing means 6 solder pattern contour tracing means 7 window frame contact judging means 8 solder bridge contour tracing means 9 solder bridge judging means 10 control section 11 pattern forming means P window Frame R Window frame for solder bridge inspection
Claims (2)
撮像し、その映像信号を発信する撮像手段と前記映像信
号を受信し、これに基き半田パターン認識画像を形成す
るパターン形成手段と、 検査対象である１対の半田パターンの夫々に窓枠を設定
し、各窓枠内の半田パターンの輪郭を追跡する半田パタ
ーン輪郭追跡手段と、 前記輪郭が窓枠に接触するか否かを判断する窓枠接触判
断手段と、 窓枠接触判断手段によって前記輪郭が窓枠に接触すると
判断された場合のみ、両半田パターンの間に半田ブリッ
ジ検査用窓枠を設定し、この窓枠内のパターンの輪郭を
追跡する半田ブリッジ部輪郭追跡手段と、 半田ブリッジ部輪郭追跡手段により得られた輪郭線が両
半田パターンの輪郭線を結ぶ場合に限って、半田ブリッ
ジ有りと判定する半田ブリッジ判定手段とを、 備えたことを特徴とするクリーム半田印刷検査装置。1. An image pickup device for picking up an image of a printed circuit board printed with cream solder and transmitting a video signal thereof, a pattern forming unit for receiving the video signal and forming a solder pattern recognition image based on the image signal, and an inspection target. Solder pattern contour tracking means for setting a window frame for each of a pair of solder patterns and tracing the contour of the solder pattern in each window frame, and a window frame for judging whether or not the contour comes into contact with the window frame Only when the contact judging means and the window frame contact judging means judge that the contour contacts the window frame, a solder bridge inspection window frame is set between the two solder patterns, and the contour of the pattern in the window frame is set. Solder bridging that determines that there is a solder bridge only when the solder bridge contour tracing means to trace and the contour obtained by the solder bridge contour tracing means connect the contours of both solder patterns. And di-determining means, a cream solder printing inspection apparatus characterized by comprising.
ント基板をカラー撮像し、そのカラー映像信号を発信す
るものであり、 パターン形成手段が、前記カラー映像信号を受信し、こ
のカラー映像信号の中で、予め与えられた半田の色分布
を呈する部分を、半田部分と判断して、その部分を示す
色抽出データを発信する色抽出手段と、この色抽出手段
からのデータを受信して平滑化処理を行い、平滑化され
た半田パターン認識画像信号を発信する平滑化手段とか
らなるものである、 請求項１記載のクリーム半田印刷検査装置。2. The image pickup means picks up a color image of a printed circuit board on which cream solder is printed, and transmits the color video signal, and the pattern forming means receives the color video signal and outputs the color video signal. Then, a portion exhibiting a predetermined solder color distribution is determined to be a solder portion, color extracting means for transmitting color extraction data indicating the portion, and data from this color extracting means are received and smoothed. The cream solder printing inspection device according to claim 1, further comprising a smoothing unit that performs processing and transmits a smoothed solder pattern recognition image signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04172982A JP3105353B2 (en) | 1992-06-30 | 1992-06-30 | Cream solder printing inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04172982A JP3105353B2 (en) | 1992-06-30 | 1992-06-30 | Cream solder printing inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0618237A true JPH0618237A (en) | 1994-01-25 |
| JP3105353B2 JP3105353B2 (en) | 2000-10-30 |
Family
ID=15951977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04172982A Expired - Fee Related JP3105353B2 (en) | 1992-06-30 | 1992-06-30 | Cream solder printing inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3105353B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7664311B2 (en) | 2004-02-09 | 2010-02-16 | Sony Corporation | Component mounting board inspecting apparatus |
| EP4092408A4 (en) * | 2020-01-17 | 2023-02-08 | Fuji Corporation | Inspection device and inspection method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5079678B2 (en) * | 2008-01-22 | 2012-11-21 | 明 北原 | Device mounted appearance inspection apparatus and inspection method |
-
1992
- 1992-06-30 JP JP04172982A patent/JP3105353B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7664311B2 (en) | 2004-02-09 | 2010-02-16 | Sony Corporation | Component mounting board inspecting apparatus |
| EP4092408A4 (en) * | 2020-01-17 | 2023-02-08 | Fuji Corporation | Inspection device and inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3105353B2 (en) | 2000-10-30 |
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