JPH06177185A - 集積回路 - Google Patents

集積回路

Info

Publication number
JPH06177185A
JPH06177185A JP5214449A JP21444993A JPH06177185A JP H06177185 A JPH06177185 A JP H06177185A JP 5214449 A JP5214449 A JP 5214449A JP 21444993 A JP21444993 A JP 21444993A JP H06177185 A JPH06177185 A JP H06177185A
Authority
JP
Japan
Prior art keywords
silicon
ceramic
layer
integrated circuit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5214449A
Other languages
English (en)
Japanese (ja)
Inventor
Robert C Camilletti
チャールズ カミレッティ ロバート
Grish Chandra
チャンドラ グリッシュ
Mark J Loboda
ジョン ロボダ マーク
Keith W Michael
ウィントン マイケル キース
David A Sierawski
アラン シーラウィスキー デビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of JPH06177185A publication Critical patent/JPH06177185A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/43—
    • H10W74/01—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H10W72/019—
    • H10W74/476—
    • H10W72/075—
    • H10W72/07536—
    • H10W72/07537—
    • H10W72/923—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5214449A 1992-08-28 1993-08-30 集積回路 Pending JPH06177185A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93647592A 1992-08-28 1992-08-28
US936475 1992-08-28

Publications (1)

Publication Number Publication Date
JPH06177185A true JPH06177185A (ja) 1994-06-24

Family

ID=25468695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5214449A Pending JPH06177185A (ja) 1992-08-28 1993-08-30 集積回路

Country Status (6)

Country Link
EP (1) EP0590780B1 (cg-RX-API-DMAC10.html)
JP (1) JPH06177185A (cg-RX-API-DMAC10.html)
KR (1) KR100287487B1 (cg-RX-API-DMAC10.html)
CA (1) CA2104487A1 (cg-RX-API-DMAC10.html)
DE (1) DE69311774T2 (cg-RX-API-DMAC10.html)
TW (1) TW232094B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
US5935638A (en) * 1998-08-06 1999-08-10 Dow Corning Corporation Silicon dioxide containing coating
WO2008122292A1 (en) * 2007-04-04 2008-10-16 Ecole Polytechnique Federale De Lausanne (Epfl) Diffusion-barrier coating for protection of moisture and oxygen sensitive devices
US10399256B1 (en) 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
US4849296A (en) * 1987-12-28 1989-07-18 Dow Corning Corporation Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia
US4888226A (en) * 1988-08-08 1989-12-19 American Telephone And Telegraph Company Silicone gel electronic device encapsulant
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
US5136364A (en) * 1991-06-12 1992-08-04 National Semiconductor Corporation Semiconductor die sealing

Also Published As

Publication number Publication date
DE69311774T2 (de) 1998-01-08
DE69311774D1 (de) 1997-07-31
KR940004761A (ko) 1994-03-15
CA2104487A1 (en) 1994-03-01
TW232094B (cg-RX-API-DMAC10.html) 1994-10-11
KR100287487B1 (ko) 2001-04-16
EP0590780B1 (en) 1997-06-25
EP0590780A1 (en) 1994-04-06

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20010612