DE69311774D1 - Verfahren zur Herstellung einer integrierten Schaltung mit einem auf einer Keramikschicht basierenden hermetischen Schutz - Google Patents
Verfahren zur Herstellung einer integrierten Schaltung mit einem auf einer Keramikschicht basierenden hermetischen SchutzInfo
- Publication number
- DE69311774D1 DE69311774D1 DE69311774T DE69311774T DE69311774D1 DE 69311774 D1 DE69311774 D1 DE 69311774D1 DE 69311774 T DE69311774 T DE 69311774T DE 69311774 T DE69311774 T DE 69311774T DE 69311774 D1 DE69311774 D1 DE 69311774D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- integrated circuit
- ceramic layer
- protection based
- hermetic protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US93647592A | 1992-08-28 | 1992-08-28 |
Publications (2)
Publication Number | Publication Date |
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DE69311774D1 true DE69311774D1 (de) | 1997-07-31 |
DE69311774T2 DE69311774T2 (de) | 1998-01-08 |
Family
ID=25468695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE69311774T Expired - Fee Related DE69311774T2 (de) | 1992-08-28 | 1993-08-19 | Verfahren zur Herstellung einer integrierten Schaltung mit einem auf einer Keramikschicht basierenden hermetischen Schutz |
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Country | Link |
---|---|
EP (1) | EP0590780B1 (de) |
JP (1) | JPH06177185A (de) |
KR (1) | KR100287487B1 (de) |
CA (1) | CA2104487A1 (de) |
DE (1) | DE69311774T2 (de) |
TW (1) | TW232094B (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4427309C2 (de) * | 1994-08-02 | 1999-12-02 | Ibm | Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten |
DE19548046C2 (de) * | 1995-12-21 | 1998-01-15 | Siemens Matsushita Components | Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen |
US5935638A (en) * | 1998-08-06 | 1999-08-10 | Dow Corning Corporation | Silicon dioxide containing coating |
WO2008122292A1 (en) * | 2007-04-04 | 2008-10-16 | Ecole Polytechnique Federale De Lausanne (Epfl) | Diffusion-barrier coating for protection of moisture and oxygen sensitive devices |
US10399256B1 (en) | 2018-04-17 | 2019-09-03 | Goodrich Corporation | Sealed circuit card assembly |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63213347A (ja) * | 1987-02-27 | 1988-09-06 | Mitsubishi Electric Corp | 半導体装置 |
US4849296A (en) * | 1987-12-28 | 1989-07-18 | Dow Corning Corporation | Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia |
US4888226A (en) * | 1988-08-08 | 1989-12-19 | American Telephone And Telegraph Company | Silicone gel electronic device encapsulant |
CA2027031A1 (en) * | 1989-10-18 | 1991-04-19 | Loren A. Haluska | Hermetic substrate coatings in an inert gas atmosphere |
US5136364A (en) * | 1991-06-12 | 1992-08-04 | National Semiconductor Corporation | Semiconductor die sealing |
-
1993
- 1993-08-19 EP EP93306587A patent/EP0590780B1/de not_active Expired - Lifetime
- 1993-08-19 DE DE69311774T patent/DE69311774T2/de not_active Expired - Fee Related
- 1993-08-20 CA CA002104487A patent/CA2104487A1/en not_active Abandoned
- 1993-08-20 TW TW082106719A patent/TW232094B/zh active
- 1993-08-27 KR KR1019930016758A patent/KR100287487B1/ko not_active IP Right Cessation
- 1993-08-30 JP JP5214449A patent/JPH06177185A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0590780A1 (de) | 1994-04-06 |
TW232094B (de) | 1994-10-11 |
DE69311774T2 (de) | 1998-01-08 |
KR100287487B1 (ko) | 2001-04-16 |
CA2104487A1 (en) | 1994-03-01 |
KR940004761A (ko) | 1994-03-15 |
JPH06177185A (ja) | 1994-06-24 |
EP0590780B1 (de) | 1997-06-25 |
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