JPH06177173A - Positioning device for substrate - Google Patents

Abstract

PURPOSE:To provide a device allowing positioning by pushing a substrate on a pressure connector so as not to damage it when a small-sized substrate is placed on a carrier and a chip is mounted on this substrate or this substrate is connected to the chip by a wire. CONSTITUTION:When a carrier mounted with a substrate 2 is clocated directly under a mask plate 4, a carrier 1 is raised to press this substrate 2 against a spring material 31 mounted on the underface of the mask plate 4 for positioning the substrate 2, a pressure connector 32 to be pressure connected to the upper face of the substrate 2 is mounted rotatably on a lower free end of the spring material 31 supported at the other end on the underface of the mask plate 4. Thereby, when the upper face of the substrate 2 is pressed against the underface of the pressure connector 32, the pressure connector 32 slightly turned to absorb rubbing friction so as to prevent damage to the substrate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate positioning device, and more particularly, to mounting a chip on the upper surface of a small substrate mounted on a carrier or connecting the chip and the substrate with a wire. The present invention relates to a board positioning device for firmly positioning the board without damaging it.

[0002]

2. Description of the Related Art For example, an electric element such as a crystal oscillator is
The chip is mounted on the substrate and assembled. This substrate is small, and it is difficult to transport the substrate by itself on the transport path. Therefore, it is loaded on the carrier and transported on the assembly line. A conventional substrate positioning device for mounting a chip on a substrate will be described below.

FIG. 5 is a perspective view of a conventional substrate positioning apparatus. A large number of substrates 2 are loaded on a plate-shaped carrier 1 arranged horizontally. The carrier 1 is conveyed on the conveying path by the conveyor belt 3. Carrier 1
The mask plate 4 is parallel to the carrier 1 above
Are arranged, and a large number of window portions 5 for exposing the substrate 2 are opened in the mask plate 4. A dispenser 6 for supplying a bond of adhesive from the window portion 5
The bond 8 is applied to the substrate 2 by the nozzle 7 and the chip 11 vacuum-adsorbed by the nozzle 10 of the head 9 is mounted on the applied bond 8. The dispenser 6 and the head 9 are held by moving tables 12 and 13, respectively, and move in the Y direction shown in the drawing to move above a predetermined window 5.

Below the mask plate 4, an inverted L-shaped elevator 15 is provided. A slider 16 is attached to a side portion of the elevator 15 and the slider 16 moves up and down along a guide rail 17 extending in the Z direction. A nut 18 is attached to the elevator 15 and the nut 18
A ball screw 19 extending in the vertical direction is screwed into this.
The lower end of the ball screw 19 is connected to the rotating shaft of the motor 20, and therefore the motor 20 drives to drive the ball screw 1
When the shaft 9 is rotated, the elevator 15 moves up and down along the guide rail 17, and pushes up the carrier 1 from below by a pin 21 provided upright inside the two conveyor belts of the conveyor 3, which is the upper part thereof.

As shown in FIG. 6, a spring material 22 composed of a leaf spring is cantilevered and attached to the lower surface of the mask plate 4, and when the carrier 1 is pushed up by a pin 21, the substrate 2 is attached to the spring material 22. The free end, which is the lower end, is pressed and positioned. 23 is for fitting the substrate 2,
The concave portion is provided on the upper surface of the carrier 1 and is slightly larger than the size of the substrate 2 so that the substrate 2 can be taken in and out. In FIG. 5, 24 is a fixed clamper, 2
Reference numeral 5 denotes a movable clamper, and by pressing the movable clamper 25 from both left and right sides with coil springs 26, the carrier 1 is clamped and fixed to both clampers 24 and 25 from the left and right.

[0006]

In the above-mentioned conventional device,
By pushing up the carrier 1 conveyed under the mask plate 4 by the conveyor belt 3 with the pin 21, the substrate 2 fitted in the recess 23 of the carrier 1 is pressed against the spring material 22 as shown in FIG. After positioning, the bond 8 is applied to the substrate 2 by the dispenser 6 in that state, and then the chip 11 is mounted and fixed on the bond 8 by the head 9. If the chips 11 are mounted on all the substrates 2 on the carrier 1 by repeating such an operation,
The pin 21 is lowered to release the pressing state of the spring material 22, and the carrier 1 is conveyed by the conveyor belt 3 toward the next step.

However, in this conventional device, as shown in FIG.
When the upper surface of the substrate 2 is pressed against the lower end free end portion of the spring member 22 as shown in FIG. 2, the spring member 22 is deformed as shown by the chain line in the figure, and the lower end free end portion scrapes the upper surface of the substrate 2. There was a problem that it was easily damaged. That is, the substrate 2 is generally formed of glass epoxy resin, ceramics or the like, whereas the spring material 22 is formed of steel material having a hardness higher than that of the substrate 2, so that the substrate 2 is easily damaged.

After mounting the chip 11 on the substrate 2,
The carrier 1 is sent to the next step, and wire bonding is performed to connect the electrode of the chip 11 and the electrode of the substrate 2 with a wire. At the time of this wire bonding, as in the case described above, the upper surface of the substrate 2 is pressed against the lower end free end portion of the spring material on the lower surface of the mask plate to be positioned. There was a problem that the upper surface of 2 was easily scratched.

Therefore, according to the present invention, when the upper surface of the substrate placed on the carrier is pressed against the lower end free end of the spring material of the mask plate for chip mounting or wire bonding, the lower end free end of the spring material is used. It is an object of the present invention to provide a substrate positioning device that does not damage the upper surface of the substrate.

[0010]

To this end, according to the present invention, a push contactor that presses against the upper surface of a substrate is rotatably attached to the lower free end of a spring member that is cantilevered on the lower surface of a mask plate. It is attached.

[0011]

According to the above construction, the base plate is pressed against the push contactor mounted on the lower free end of the spring member. At this time, the push contactor slightly rotates to absorb the sliding contact friction. The upper surface of the substrate is not damaged.

[0012]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 5 is a perspective view of a conventional substrate positioning apparatus. In the embodiment of the positioning apparatus of the present invention, a spring member 31 is provided instead of the spring 22. 1 and 2 are enlarged cross-sectional views of the main part of the positioning device of the present invention. As shown in the figure, this spring material 31 is composed of a gently curved leaf spring, and a push contactor 32 is attached to the free end of its lower end. The pusher 32 is formed by forming a ball 32b at the lower end of the pin 32a and an enlarged portion 32c for preventing the pin 32a from coming off.
2a is loosely inserted into a hole 33 formed at the lower end of the spring member 31 with a clearance. Therefore, the ball 32b can be slightly rotated around the hole 33 so as to swing in the direction of the arrow. The pressing piece 32 is formed of the same material as the substrate 2 or a material having a slightly lower hardness than the substrate 2. Specifically, for example, when the substrate 2 is made of ceramics, the pressing piece 32 is also made of ceramics. By thus selecting the material of the press contactor 32, the substrate 2 is prevented from being damaged by the press contactor 32 when the substrate 2 is pressed against the press contactor 32.

The operation of this apparatus is similar to the operation of the above-mentioned conventional example, in which the carrier 1 is conveyed to just below the mask plate 4 by the conveyor belt 3, and then the carrier 1 is pin 2
Push up by 1. In FIG. 2, the chain line shows the pushed up state. As shown in the figure, the upper surface of the substrate 2 is pressed against the curved lower surface of the ball 32b. At this time, the ball 32b is rotated so as to swing in the direction of the arrow, so that the sliding friction is absorbed. The upper surface of the substrate 2 is not damaged. In this state, the dispenser 6 applies the bond 8 to the substrate 2, and then the head 9 mounts the chip 11 on the bond 8. By repeating such an operation, the chip 11 is applied to all the substrates 2 on the carrier 1. After mounting, the pin 21 is lowered to release the pressing state of the spring material 22, and the carrier 1 is conveyed to the next step by the conveyor belt 3.

3 and 4 show another embodiment of the present invention. The spring member 35 is composed of a plate portion 35a and an arm portion 35b extending obliquely downward from both side portions of the plate portion 35a, and a roll-shaped push contact member 36 is provided at a tip portion of the arm portion 35b.
Is rotatably attached. The spring member 35 is attached to the lower surface of the mask plate 4 by inserting a screw 38 into a hole 37 formed in the plate portion 35a.

As shown in FIG. 4, when the substrate 2 is raised,
The upper surface of the pressing member 36 is pressed against the lower surface of the pressing member 36. At this time, the pressing member 36 slightly rotates in the arrow direction to absorb the sliding friction. Of course, the pusher 36 is also made of the same material as the pusher 32. In the above embodiment, the case where the chip 11 is mounted on the substrate 2 has been described as an example. However, after mounting the chip 11 on the substrate 2, positioning of the substrate in wire bonding for connecting the substrate 2 and the chip 11 with a wire. It can also be applied to devices.

[0017]

As described above, according to the present invention, the push contactor for pressing the upper surface of the substrate is rotatably attached to the lower free end of the spring material which is cantilevered on the lower surface of the mask plate. Therefore, when the substrate is pressed against the pressing contactor, the pressing contactor slightly rotates and absorbs the sliding friction, so that the damage of the substrate can be eliminated.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an essential part of a board positioning apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of an essential part of a substrate positioning device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a spring member and a pusher according to another embodiment of the present invention.

FIG. 4 is a sectional view of an essential part of a substrate positioning apparatus according to another embodiment of the present invention.

FIG. 5 is a perspective view of a conventional board positioning device.

FIG. 6 is a sectional view of a main part of a conventional board positioning device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier 2 Substrate 4 Mask plate 5 Window 18 Nut (vertical moving means) 19 Ball screw (vertical moving means) 20 Motor (vertical moving means) 31 Spring material 32 Push contact 36 Push contact

Claims (1)

[Claims] 1. A carrier for mounting and carrying a substrate, a mask plate disposed above the carrier and having a window portion for exposing the substrate, and a cantilever on a lower surface of the mask plate. And a vertically moving means for vertically moving the carrier relative to the mask plate so as to press and fix the upper surface of the substrate to the lower free end of the spring material. A substrate positioning device, wherein a push contact for pushing the upper surface of the substrate is rotatably attached to the free lower end of the spring member.