JPH0617338Y2 - 多層プリント配線基板 - Google Patents
多層プリント配線基板Info
- Publication number
- JPH0617338Y2 JPH0617338Y2 JP1989009727U JP972789U JPH0617338Y2 JP H0617338 Y2 JPH0617338 Y2 JP H0617338Y2 JP 1989009727 U JP1989009727 U JP 1989009727U JP 972789 U JP972789 U JP 972789U JP H0617338 Y2 JPH0617338 Y2 JP H0617338Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- diameter
- wiring board
- printed wiring
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 239000011889 copper foil Substances 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009727U JPH0617338Y2 (ja) | 1989-01-30 | 1989-01-30 | 多層プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009727U JPH0617338Y2 (ja) | 1989-01-30 | 1989-01-30 | 多層プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02101571U JPH02101571U (enrdf_load_stackoverflow) | 1990-08-13 |
| JPH0617338Y2 true JPH0617338Y2 (ja) | 1994-05-02 |
Family
ID=31216727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989009727U Expired - Lifetime JPH0617338Y2 (ja) | 1989-01-30 | 1989-01-30 | 多層プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617338Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0342693Y2 (enrdf_load_stackoverflow) * | 1984-12-05 | 1991-09-06 | ||
| JPS63168090A (ja) * | 1986-12-29 | 1988-07-12 | 株式会社フジクラ | 多層プリント配線板の製造方法 |
-
1989
- 1989-01-30 JP JP1989009727U patent/JPH0617338Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02101571U (enrdf_load_stackoverflow) | 1990-08-13 |
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