JPH0617338Y2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH0617338Y2 JPH0617338Y2 JP1989009727U JP972789U JPH0617338Y2 JP H0617338 Y2 JPH0617338 Y2 JP H0617338Y2 JP 1989009727 U JP1989009727 U JP 1989009727U JP 972789 U JP972789 U JP 972789U JP H0617338 Y2 JPH0617338 Y2 JP H0617338Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- diameter
- wiring board
- printed wiring
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、多層プリント配線基板の構造に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a structure of a multilayer printed wiring board.
〈従来の技術〉 第３図は多層プリント配線基板におけるスルーホールの
形成方法を各段階の断面構造により示している。(a)で
は内層の配線パターンをエッチングにより形成した後、
積層プレスによって多層配線構造が形成されている。上
下の外層銅箔１，２と内層銅箔３との間にガラスエポキ
シ基材４が積層されている。<Prior Art> FIG. 3 shows a method of forming a through hole in a multilayer printed wiring board by a sectional structure at each stage. In (a), after forming the inner layer wiring pattern by etching,
A multi-layer wiring structure is formed by stacking press. A glass epoxy base material 4 is laminated between the upper and lower outer copper foils 1 and 2 and the inner copper foil 3.
(b)は、ドリリングによってスルーホールの下孔６′を
形成した状態を示している。このスルーホール用の下孔
を形成する場合、下孔６′の周囲のガラスエポキシ基材
４を構成するエポキシ樹脂がドリルの回転により生じる
切削熱で溶融し、溶けたエポキシ樹脂が内層銅箔３の切
削面３ａ上に付着する。このため、(c)に示すように、
スルーホールメッキを行った場合にメッキ層５と内層銅
箔３との間にエポキシ樹脂が介在し、スルーホールと内
層銅箔３との電気的接続が不良となる。(b) shows a state in which a through hole pilot hole 6'is formed by drilling. When the pilot hole for the through hole is formed, the epoxy resin constituting the glass epoxy base material 4 around the pilot hole 6'is melted by the cutting heat generated by the rotation of the drill, and the melted epoxy resin is the inner layer copper foil 3 Adheres to the cutting surface 3a. Therefore, as shown in (c),
When the through-hole plating is performed, the epoxy resin is interposed between the plated layer 5 and the inner copper foil 3, and the electrical connection between the through hole and the inner copper foil 3 becomes defective.
このための対策として、内層銅箔３の切削面３ａにエポ
キシ樹脂が付着するのを防止するために、ドリルの最大
使用回数を厳しく管理して切味の低下による発熱を少な
くし、エポキシ樹脂が溶融しないようにする方法、ま
た、下孔６′の形成後、プリント配線基板を濃硫酸、ク
ロム酸溶液あるいは過マンガン酸溶液中に浸して切削面
３ａ上のエポキシ樹脂を化学的に溶解して除去する方
法、あるいはＯ２とＣＦ４の混合ガスプラズマ雰囲気中
においてエポキシ樹脂をフリーラジカル（遊離基）に分
解して除去するプラズマ法、砥粒を高速で衝突させ、そ
の衝撃力によりエポキシ樹脂を除去する液体ホーニング
法等が用いられていた。As a countermeasure for this, in order to prevent the epoxy resin from adhering to the cutting surface 3a of the inner layer copper foil 3, the maximum number of times of use of the drill is strictly controlled to reduce heat generation due to a decrease in sharpness, so that the epoxy resin is In order to prevent melting, the printed wiring board is immersed in concentrated sulfuric acid, chromic acid solution or permanganate solution to chemically dissolve the epoxy resin on the cutting surface 3a after forming the pilot hole 6 '. Or a plasma method of decomposing and removing the epoxy resin into free radicals (free radicals) in a mixed gas plasma atmosphere of O 2 and CF 4, a high-speed collision of abrasive grains, and the impact force of the epoxy resin The liquid honing method etc. which were removed were used.
〈考案が解決しようとする課題〉 上記対策のいずれにおいても作業性の点で問題があっ
た。すなわち、ドリルの切味低下を管理する方法では、
エポキシ樹脂が溶融する切味低下の限度が通常使用時の
ドリル寿命より遥かに短く設定されるため、ドリルの交
換が頻繁になる。また、化学的除去方法は、薬品や専用
容器の購入、排液処理や液体濃度の管理等の煩雑な作業
を要する。さらに、プラズマ法では、フリーラジカル発
生システムの構築に多くの手間を要する。さらに、液体
ホーニング法では、その運用のために設備の構築や運転
に多くの手間がかかる。<Problems to be solved by the invention> All of the above measures have problems in workability. That is, in the method of managing the sharpness deterioration of the drill,
Since the limit of sharpness reduction when the epoxy resin melts is set to be much shorter than the drill life during normal use, the drill must be replaced frequently. Further, the chemical removal method requires complicated work such as purchase of chemicals or a dedicated container, drainage treatment and management of liquid concentration. Furthermore, the plasma method requires a lot of work to construct a free radical generation system. Furthermore, in the liquid honing method, it takes a lot of time to construct and operate the equipment for its operation.
本考案は上記事情に鑑みてなされたものであり、その目
的は、簡単な加工を付加するだけでスルーホールの電気
的接続不良を解消し得るようにした多層プリント配線基
板を提供することである。The present invention has been made in view of the above circumstances, and an object thereof is to provide a multilayer printed wiring board capable of eliminating electrical connection failure of a through hole only by adding simple processing. .
〈課題を解決するための手段〉 スルーホールの下孔を形成する場合、ドリリング条件
（例えば多層の重ね枚数）が同じであれば、ドリル径が
大きい方が小さい方よりエポキシ樹脂が溶融し易い。ド
リル径の大小と樹脂の溶融との相関は、孔あけの際のド
リルと基材樹脂との摩擦面積の大小、言い換えれば発生
する摩擦熱の大小に起因すると考えられる。すなわち、
ドリル径が大きい場合、基材樹脂とドリルとの摩擦面積
が増加し、したがって、摩擦熱が高くなり、樹脂が溶融
し易くなる。それではスルーホールの径を小さくすれば
よいのであるが、チップ部品等の脚が挿入されるスルー
ホールにおいては径を小さくすることは不可能である。
そこで、本考案による多層プリント配線基板において
は、大径のスルーホールと同じ導体間を接続する小径の
スルーホールが大径のスルーホールと近接した位置に形
成された構造である。<Means for Solving the Problems> When forming a through hole, if the drilling conditions (for example, the number of stacked multilayers) are the same, the epoxy resin melts more easily with a larger drill diameter than with a smaller drill diameter. It is considered that the correlation between the size of the drill diameter and the melting of the resin is due to the size of the friction area between the drill and the base resin during drilling, in other words, the size of the friction heat generated. That is,
When the diameter of the drill is large, the friction area between the base resin and the drill is increased, so that the friction heat is increased and the resin is easily melted. Then, it suffices to reduce the diameter of the through hole, but it is impossible to reduce the diameter of the through hole into which the leg of the chip component or the like is inserted.
Therefore, the multilayer printed wiring board according to the present invention has a structure in which a small-sized through hole that connects the same conductors as the large-sized through hole is formed in a position close to the large-sized through hole.
〈作用〉 小径のスルーホールにおいては、下孔のドリリングに際
して、ドリルと基材樹脂との摩擦面積が小さいため、発
生する摩擦熱が少なく、基材樹脂が溶融せず、樹脂内層
銅箔の切削面に付着しない。したがって、スルーホール
メッキ層が内層銅箔に密着し、大径のスルーホールのメ
ッキ層と内層銅箔との電気的接続が充分でない場合にお
いても、小径のスルーホールによって層間の良好な電気
的接続が得られる。<Operation> When drilling a pilot hole in a small-diameter through hole, the friction area between the drill and the base resin is small, so less frictional heat is generated, the base resin does not melt, and the resin inner layer copper foil is cut. Does not adhere to the surface. Therefore, even if the through-hole plating layer adheres to the inner layer copper foil and the electrical connection between the plating layer of the large-diameter through hole and the inner-layer copper foil is insufficient, the small-diameter through hole ensures good electrical connection between the layers. Is obtained.
〈実施例〉 第１図は本実施例の多層プリント配線基板の断面構造を
示している。図において、１，２は外層銅箔、３は内層
銅箔、４はガラスエポキシ基材、５はスルーホールメッ
キ層、６，７はスルーホールである。<Embodiment> FIG. 1 shows a cross-sectional structure of a multilayer printed wiring board according to this embodiment. In the figure, 1 and 2 are outer layer copper foils, 3 is an inner layer copper foil, 4 is a glass epoxy base material, 5 is a through hole plating layer, and 6 and 7 are through holes.
この多層プリント配線基板は、上下の外層銅箔１，２と
内層銅箔３との間にガラスエポキシ基材４がそれぞれ積
層された構造である。This multilayer printed wiring board has a structure in which a glass epoxy base material 4 is laminated between upper and lower outer copper foils 1 and 2 and an inner copper foil 3.
大径のスルーホール６は、チップ部品の脚（図示せず）
が挿入され、ハンダ付により固定される。この大径のス
ルーホール６は、下孔を形成する際、ドリルとの摩擦熱
によって下孔の周囲のエポキシ樹脂が溶融し、内層銅箔
３の切削面３ａ上に付着する。この結果、スルーホール
メッキ層５と内層銅箔３の切削面３ａとの間にエポキシ
樹脂が介在した状態にある。The large-diameter through hole 6 is a leg of the chip component (not shown).
Is inserted and fixed by soldering. When forming a pilot hole, the large-diameter through hole 6 melts the epoxy resin around the pilot hole due to frictional heat with the drill and adheres to the cutting surface 3a of the inner copper foil 3. As a result, the epoxy resin is present between the through-hole plating layer 5 and the cutting surface 3a of the inner copper foil 3.
小径のスルーホール７は、大径のスルーホール６と近接
した位置すなわちパターン化された外層銅箔１，２のラ
ンド部に形成される。第２図はスルーホールの下孔とラ
ンドとの関係を示したもので、大径スルーホール６の下
孔６′と同心円であるランド８の内に小径スルーホール
７の下孔７′が形成されている。The small-diameter through hole 7 is formed at a position close to the large-diameter through hole 6, that is, in the land portion of the patterned outer layer copper foils 1, 2. FIG. 2 shows the relationship between the through hole pilot holes and the lands. The pilot hole 7'of the small diameter through hole 7 is formed in the land 8 which is concentric with the pilot hole 6'of the large diameter through hole 6. Has been done.
この小径のスルーホール７は、その下孔７′をドリリン
グにより形成する際、ドリルとガラスエポキシ基材４と
の摩擦面積が小さいため、摩擦熱は多く発生せず、エポ
キシ樹脂は溶融しない。したがって、内層銅箔３の切削
面３ａにエポキシ樹脂が付着せず、後工程のスルーホー
ルメッキにおいてメッキ層は内層銅箔３の切削面３ａに
密着して形成される。この結果、小径スルーホール７に
おいてはメッキ層５と内層銅箔３との電気的接続は良好
であり、大径スルーホール６においてメッキ層５と内層
銅箔３との電気的接続が不良であっても、外層銅箔１，
２と内層銅箔３との間の電気的接続は良好である。When forming the lower hole 7'of the small diameter through hole 7 by drilling, since the friction area between the drill and the glass epoxy base material 4 is small, a large amount of friction heat is not generated and the epoxy resin is not melted. Therefore, the epoxy resin does not adhere to the cutting surface 3a of the inner copper foil 3, and the plated layer is formed in close contact with the cutting surface 3a of the inner copper foil 3 in the through-hole plating in the subsequent step. As a result, the electrical connection between the plating layer 5 and the inner copper foil 3 is good in the small diameter through hole 7, and the electrical connection between the plating layer 5 and the inner copper foil 3 is poor in the large diameter through hole 6. Even outer layer copper foil 1,
The electrical connection between 2 and the inner layer copper foil 3 is good.
〈考案の効果〉 以上説明したように本考案においては、大径のスルーホ
ールと近接して同じ導体間を電気的に接続する小径のス
ルーホールを形成したことにより、大径のスルーホール
の下孔加工時に樹脂の溶融により導体間接続が不良とな
っても、小径のスルーホールによって良好な導体間接続
が得られる。したがって、ドリルの最大使用回数の厳し
い管理が不要となり、ドリルの頻繁な交換をなくし、作
業の能率を向上させるとともに、ドリルの有効利用が図
れる。また、化学的除去法のように薬品や専用装置を必
要とすることがなく、さらに、プラズマ法や液体ホーニ
ング法のように高価な設備を必要とすることがないの
で、多層プリント配線基板の製造コストを著しく節約で
きる。さらに、従来のスルーホール作成と同じ作業を付
加するだけであるので、工程が単純であり、自動化が容
易である。さらに、特殊な処理が不要であるので、製品
の不良率を低くすることができる。<Effect of Device> As described above, according to the present invention, by forming the small-diameter through-hole that electrically connects the same conductors to the large-diameter through-hole in the vicinity of the large-diameter through-hole, Even if the conductor-to-conductor connection becomes defective due to the melting of the resin during hole processing, a good conductor-to-conductor connection can be obtained due to the small diameter through hole. Therefore, strict control of the maximum number of times of use of the drill is not required, frequent replacement of the drill is eliminated, work efficiency is improved, and the drill is effectively used. Further, unlike the chemical removal method, there is no need for chemicals or a dedicated device, and no expensive equipment such as the plasma method or the liquid honing method is required. Therefore, it is possible to manufacture a multilayer printed wiring board. Significant cost savings. Further, since the same work as in the conventional through hole creation is added, the process is simple and the automation is easy. Furthermore, since no special processing is required, it is possible to reduce the defective rate of the product.
第１図は本考案実施例の断面構造を示す図、 第２図は本考案実施例の平面構造を示す図、 第３図は従来例の製造方法を示す図である。 １，２……外層銅箔 ３……内層銅箔 ４……ガラスエポキシ基材 ５……スルーホールメッキ層 ６，７……スルーホール ８……ランド FIG. 1 is a view showing a sectional structure of an embodiment of the present invention, FIG. 2 is a view showing a plane structure of an embodiment of the present invention, and FIG. 3 is a view showing a manufacturing method of a conventional example. 1, 2 ... outer layer copper foil 3 ... inner layer copper foil 4 ... glass epoxy base material 5 ... through-hole plating layer 6, 7 ... through-hole 8 ... land
Claims (1)
ーホールを有する多層プリント配線基板において、上記
スルーホールと近傍した位置に上記配線導体間を電気的
に接続する小径のスルーホールが形成されてなる多層プ
リント配線基板。1. A multilayer printed wiring board having a through hole for electrically connecting between wiring conductors of a multi-layer, a small-diameter through hole for electrically connecting between the wiring conductors is formed at a position near the through hole. A multilayer printed wiring board made up of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009727U JPH0617338Y2 (en) | 1989-01-30 | 1989-01-30 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009727U JPH0617338Y2 (en) | 1989-01-30 | 1989-01-30 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02101571U JPH02101571U (en) | 1990-08-13 |
| JPH0617338Y2 true JPH0617338Y2 (en) | 1994-05-02 |
Family
ID=31216727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989009727U Expired - Lifetime JPH0617338Y2 (en) | 1989-01-30 | 1989-01-30 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617338Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0342693Y2 (en) * | 1984-12-05 | 1991-09-06 | ||
| JPS63168090A (en) * | 1986-12-29 | 1988-07-12 | 株式会社フジクラ | Manufacture of multilayer printed interconnection board |
-
1989
- 1989-01-30 JP JP1989009727U patent/JPH0617338Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02101571U (en) | 1990-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4387336B2 (en) | BGA package having half-etched solder ball pad and cut plating line and method of manufacturing the same | |
| KR100598274B1 (en) | Embedded resistor printed circuit board and method for fabricating the same | |
| US20060060558A1 (en) | Method of fabricating package substrate using electroless nickel plating | |
| JP2006173554A (en) | Ball grid array substrate provided with window and its manufacturing method | |
| JP2001053447A (en) | Multilayer wiring board with built-in part and manufacturing method thereof | |
| KR101896555B1 (en) | Printed circuit board and manufacturing method for printed circuit board | |
| JP2556282B2 (en) | Method for manufacturing printed wiring board | |
| JP2003046243A (en) | Method for manufacturing high density multilayer build- up wiring board | |
| JPH0617338Y2 (en) | Multilayer printed wiring board | |
| CN116581032A (en) | Packaging loading plate with hollow structure and manufacturing process thereof | |
| JP2007165863A (en) | Via hole having minute hole land and method of forming same | |
| JP2003347747A (en) | Method of manufacturing multilayer wiring board and multilayer wiring board using the same | |
| JPH05275852A (en) | Metal cored printed circuit board and manufacture thereof | |
| JP2004087697A (en) | Method for manufacturing wiring board | |
| JPH03244181A (en) | Formation of conductor pattern of printed wiring board | |
| JP5014673B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| JP2011061161A (en) | Method of manufacturing printed circuit board | |
| KR100632579B1 (en) | How to Form Via Holes in Printed Circuit Boards | |
| JPH01264290A (en) | Manufacture of printed wiring board | |
| JP2000068653A (en) | Smear removing method of multilayer board | |
| KR102054198B1 (en) | Method for manufacturing wiring board | |
| JP2016207696A (en) | Manufacturing method of printed wiring board | |
| KR100332516B1 (en) | Method of making blind-via hole in PCB | |
| KR20030042339A (en) | Method for creating through holes in printed wiring board | |
| KR100645642B1 (en) | High density BGA package board and method for manufacturing thereof |