JPH01264290A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01264290A JPH01264290A JP9133288A JP9133288A JPH01264290A JP H01264290 A JPH01264290 A JP H01264290A JP 9133288 A JP9133288 A JP 9133288A JP 9133288 A JP9133288 A JP 9133288A JP H01264290 A JPH01264290 A JP H01264290A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- etching resist
- hole
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 9
- 238000005553 drilling Methods 0.000 claims 1
- 238000011946 reduction process Methods 0.000 claims 1
- 238000011282 treatment Methods 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000000206 photolithography Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線板の製造方法にかかわり、特に、
微細パターンを有するプリント配線板におけるパターン
欠陥防止に好適なプリント配線板の製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing a printed wiring board, and in particular,
The present invention relates to a method of manufacturing a printed wiring board suitable for preventing pattern defects in a printed wiring board having a fine pattern.
従来、プリント配線板の製造に際しては、エツチングレ
ジスタと銅箔との密着力を向上させるための処理として
、エツチングレジスト付着の直前に、銅箔に対して砥粒
による機械的研磨を行っていプこ。Conventionally, when manufacturing printed wiring boards, the copper foil is mechanically polished with abrasive grains immediately before the etching resist is attached as a treatment to improve the adhesion between the etching resist and the copper foil. .
また、本発明で採用している酸化処理を用いる方法は、
積層接着に用いた例はあるが、エツチングレジストと銅
箔との密着力向上圧用いた例はない。なお、これに関す
る公知例としては、特公昭５８−２４７６号公報に記載
のものが挙げられる。Furthermore, the method using oxidation treatment adopted in the present invention is as follows:
Although there are examples of it being used for lamination adhesion, there are no examples of using pressure to improve the adhesion between etching resist and copper foil. In addition, as a publicly known example regarding this, the one described in Japanese Patent Publication No. 58-2476 can be mentioned.
上記従来技術は、銅箔に微細な粗化面を形成することが
できないため、エツチングレジストとの十分な密着力を
得ることができなかった。このことは、パターン寸法の
微細化に伴うパターン欠陥増加の要因の一つとなりてお
り、銅箔に微細な粗化面を形成することが課題となって
いた。In the above-mentioned conventional technology, it was not possible to form a finely roughened surface on the copper foil, and therefore it was not possible to obtain sufficient adhesion with the etching resist. This is one of the causes of an increase in pattern defects as pattern dimensions become finer, and forming a finely roughened surface on copper foil has become a problem.
本発明の目的は、銅箔に微細な粗化面を形成Ｉ−、エツ
チングレジストとの密着力を向上させる方法を提供する
ことにある。An object of the present invention is to provide a method for forming a finely roughened surface on a copper foil to improve its adhesion to an etching resist.
上記目的は、触媒付与工程の前に、銅箔表面を酸化処理
し、さらにその表面を還元処理するとと罠より、達成さ
れる。The above object can be achieved by oxidizing the surface of the copper foil and further reducing the surface before the catalyst application step.
上記構成において、酸化処理は銅箔表面に微細な粗化面
を形成する作用をもち、還元処理は、触媒付与工程で用
いる処理液によって形成された酸化粗化面が溶解するの
を防止する作用をもつ。また、エツチング工程の前工程
である触媒付与工程の前にこれらの処理を行うのは、酸
化処理により触媒が溶解脱落するのを防止するためであ
る。In the above configuration, the oxidation treatment has the effect of forming a finely roughened surface on the surface of the copper foil, and the reduction treatment has the effect of preventing the oxidized and roughened surface formed by the treatment liquid used in the catalyst application step from dissolving. have. Furthermore, the reason why these treatments are performed before the catalyst application step, which is a pre-etching step, is to prevent the catalyst from dissolving and falling off due to the oxidation treatment.
以上のような作用によって、銅箔に微細な粗化面を形成
することができる。Due to the above-described effects, a finely roughened surface can be formed on the copper foil.
以下、本発明の一実施例を第１図（ａｌ〜（ｆ）Ｋ従い
処理工程ごとに順次説明する。Hereinafter, one embodiment of the present invention will be described in sequence for each processing step according to FIGS. 1A to 1FK.
（イ）基材１および銅箔２からなる銅張積層板にスルー
ホール用の貫通穴３を明ける（第１図（ａｔ）。(a) A through hole 3 for a through hole is made in a copper clad laminate consisting of a base material 1 and a copper foil 2 (FIG. 1(at)).
（口］ 銅箔２の表置に酸化処理剤（例えばシブレイ社
製プロボンド８０）を使用して酸化処理を行った後、そ
の表面に還元処理剤（例えばジメチルアミンボラン）を
使用して還元処理を行い、銅箔２に微細な粗化面２ａを
形成する（第１図（ｂ））。(Explanation) After performing oxidation treatment on the surface of the copper foil 2 using an oxidation treatment agent (for example, Probond 80 manufactured by Sibley), the surface thereof is subjected to reduction treatment using a reduction treatment agent (for example, dimethylamine borane). A finely roughened surface 2a is formed on the copper foil 2 (FIG. 1(b)).
（ハ）貫通穴３の壁面に触媒４（例えばシブレイ社展キ
ャタボジット４４）を付与する（第１図（Ｃ））。(c) A catalyst 4 (for example, Sibley Catabogit 44) is applied to the wall surface of the through hole 3 (FIG. 1(C)).
に） ドライフィルム（例えば日立化成製フォテック８
８３）を用いて写真法によりエツチングレジスト５を形
成する（第１図（ｄ））。) Dry film (for example, Hitachi Chemical's Photec 8)
83) by a photographic method (FIG. 1(d)).
（ホ）エツチング剤（例えば塩化第二銅）を使用して銅
箔２のエツチングを行う（第１図（ｅ））。(e) Etching the copper foil 2 using an etching agent (for example, cupric chloride) (FIG. 1(e)).
（へ）スルーホールランド部以外に耐めっきレジスト６
（例えば日立製Ｈ８−０８）を形成し、化学銅めつき法
により、スルーホールに銅めっき皮膜７を形成する（第
１図（ｆ））。(f) Plating resist 6 other than through-hole land area
(For example, Hitachi H8-08) is formed, and a copper plating film 7 is formed in the through hole by a chemical copper plating method (FIG. 1(f)).
本実施例においては、エツチングレジスト５は銅箔２の
微細な粗化面２＆の上く形成されるので、エツチングレ
ジスト５と銅箔２との高い密着力を得ることができる。In this embodiment, since the etching resist 5 is formed on the finely roughened surface 2& of the copper foil 2, high adhesion between the etching resist 5 and the copper foil 2 can be obtained.
本発明によれば、プリント配線板の製造において、銅箔
に対するエツチングレジストの密着力を著しく向上でき
るので、微細ノくターンのノくターン欠陥を著しく低減
することができ、歩留りを高めることができる。According to the present invention, in the production of printed wiring boards, it is possible to significantly improve the adhesion of etching resist to copper foil, so it is possible to significantly reduce the number of fine turn defects, and to increase the yield. .
第１図は本発明の一実施例における工程ごとのワークの
断面図である。
符号の説明
１・・・基材、２・・・銅箔、２ａ・・・粗化面、３・
・・貫通穴、４・・・触媒、５・・・エツチングレジス
ト、６・・・耐めっきレジスト、７・・・銅めっき皮膜
。
第 １図FIG. 1 is a sectional view of a workpiece at each step in an embodiment of the present invention. Explanation of symbols 1...Base material, 2...Copper foil, 2a...Roughened surface, 3.
... Through hole, 4... Catalyst, 5... Etching resist, 6... Plating resistant resist, 7... Copper plating film. Figure 1
Claims (1)
、めっき工程とを順次実施するプリント配線板の製造方
法において、触媒付与工程の前に、銅箔表面を酸化処理
し、さらにその表面を還元処理する工程を設けたことを
特徴とするプリント配線板の製造方法。1. In a printed wiring board manufacturing method that sequentially performs a drilling process, a catalyst application process, an etching process, and a plating process, the surface of the copper foil is oxidized before the catalyst application process, and the surface is further subjected to a reduction process. 1. A method for manufacturing a printed wiring board, comprising a step of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9133288A JPH01264290A (en) | 1988-04-15 | 1988-04-15 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9133288A JPH01264290A (en) | 1988-04-15 | 1988-04-15 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01264290A true JPH01264290A (en) | 1989-10-20 |
Family
ID=14023489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9133288A Pending JPH01264290A (en) | 1988-04-15 | 1988-04-15 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01264290A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0472158A2 (en) * | 1990-08-20 | 1992-02-26 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
| US5252195A (en) * | 1990-08-20 | 1993-10-12 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
| WO1996015651A1 (en) * | 1994-11-09 | 1996-05-23 | Blaupunkt-Werke Gmbh | Method of producing a feedthrough on a circuit board |
| US5539181A (en) * | 1992-08-26 | 1996-07-23 | International Business Machines Corporation | Circuit board |
| EP0762814A1 (en) * | 1995-08-22 | 1997-03-12 | Macdermid Incorporated | Method for the manufacture of printed circuit boards |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
-
1988
- 1988-04-15 JP JP9133288A patent/JPH01264290A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0472158A2 (en) * | 1990-08-20 | 1992-02-26 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
| EP0472158A3 (en) * | 1990-08-20 | 1992-10-28 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
| US5252195A (en) * | 1990-08-20 | 1993-10-12 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
| US5539181A (en) * | 1992-08-26 | 1996-07-23 | International Business Machines Corporation | Circuit board |
| US5680701A (en) * | 1992-08-26 | 1997-10-28 | International Business Machines Corporation | Fabrication process for circuit boards |
| WO1996015651A1 (en) * | 1994-11-09 | 1996-05-23 | Blaupunkt-Werke Gmbh | Method of producing a feedthrough on a circuit board |
| US5799393A (en) * | 1994-11-09 | 1998-09-01 | Blaupunkt-Werke Gmbh | Method for producing a plated-through hole on a printed-circuit board |
| EP0762814A1 (en) * | 1995-08-22 | 1997-03-12 | Macdermid Incorporated | Method for the manufacture of printed circuit boards |
| JPH09102676A (en) * | 1995-08-22 | 1997-04-15 | Macdermid Inc | Manufacture of printed circuit board |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
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