JPH0617233U - Workpiece suction part in chip bonding machine - Google Patents

Abstract

(57) [Summary] [Structure] The present invention is a work suction unit used for a pick-and-place, a chip stage, and the like having the following structure. A porous material such as a breathable sintered material is used for the suction plate of the work suction portion. The work suction side of the suction plate is coated with a breathable ultra-hard film. [Effect] Since the present invention is configured as described above, it has the following effects. It is possible to improve the bonding accuracy without causing the work to be displaced during the suction that occurs when the work is sucked in the suction holes. It is possible to adsorb on the entire surface of the adsorption plate, and if there is a margin in the amount of air sucked into the workpiece adsorption section, it is possible to adsorb large to small workpieces. Therefore, it is not necessary to replace the suction plate for each work, and the number of dedicated parts can be reduced. Since the work suction surface of the suction plate is coated with a breathable ultra-hard thin film, the wear resistance is improved and it is possible to always ensure high surface accuracy.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is an improvement of the work suction part for the purpose of holding a work by vacuum used in a pick and place (chip supply mechanism) and a chip stage (chip mounting table) in a chip bonding device for bonding a chip to a circuit board. It is about.

[0002]

[Prior art]

 The chip bonding equipment mainly consists of a chip stage on which a chip is placed during bonding, a pick and place that picks up the chip to move the chip onto the chip stage, and a bonding part for bonding the chip to a circuit board. It is what The chip stage and the pick-and-place both have a work suction part for sucking and holding a chip, which is a work, by vacuum suction from an external suction device.

Conventionally, a work suction portion in a pick-and-place and a chip stage has one or more suction holes matched with the size and shape of the work on the work suction surface on which the work abuts and is held. The work is sucked by a vacuum force (negative pressure) given by an external suction device to the suction hole. Incidentally, FIG. 3 is a perspective view showing the relationship between the work suction part 6 and the work 5 of the conventional pick and place 1.

However, when the suction holes 4 are provided in the work suction surface 3 and the work 5 is held by the vacuum force to the suction holes 4, it is impossible to suction the works 5 having different sizes and shapes. Occurs. Further, depending on the position of the suction hole 4, there is a risk that the work 5 may be displaced during suction.

Therefore, it is necessary to replace the suction part 6 of the pick and place 1 depending on the size and shape of the work 5. As described above, the work suction part 6 in the conventional pick-and-place has low compatibility and compatibility. This applies not only to the suction portion 6 of the pick and place 1 but also to the suction portion 7 of the chip stage 2.

[0006]

[Problems to be solved by the device]

 Therefore, the present invention is capable of adsorbing and holding without being influenced by the size and shape of the work by improving the work adsorbing part such as pick-and-place and chip stage in the chip bonding device, and has excellent wear resistance. It is an object of the present invention to provide a work suction portion in a chip bonding apparatus that helps improve the surface accuracy of the suction surface due to its properties.

[0007]

[Means for Solving the Problems]

 In order to solve the above problems, the present invention uses a porous material such as a gas permeable sintered material for a suction plate of a work suction portion by a vacuum used in a pick and place and a chip stage in a chip bonding apparatus. It is intended to provide a work suction part in a chip bonding apparatus, characterized in that the work suction side of the work suction part is coated with a breathable ultra-hard thin film.

[0008]

【Example】

 A description will be given below according to the illustrated embodiment. FIG. 1 is a sectional view showing a work suction part 6 of a pick and place 1 and a work suction part 7 of a chip stage 2 of a chip bonding apparatus according to the present invention, and FIG. 2 is a work suction part 6 in the pick and place. FIG.

In the figure, 1 is a pick and place in a chip bonding apparatus, and 2 is a chip stage. The basic configurations of the pick-and-place 1 and the chip stage 2 are the same as those of the conventional devices except the configuration of the suction section.

The work suction portion 6 of the pick-and-place 1 has a suction flow passage 12 formed in a pick-and-place main body 8, and a suction plate 11 is formed at an end of the suction flow passage 12 at a lower end portion of the main body 8. It is attached. In addition, the workpiece suction portion 7 of the chip stage 2 also has a suction channel 12 'formed toward the upper part of the stage body 9, and the suction plate 11' is attached to the end of the suction channel 12 'at the upper end of the stage body 9. It is a thing.

A porous material such as a permeable sintered material is used for both suction plates 11 and 11 ′. In the examples, a spherical spherical sintered body of stainless steel having an opening size of 100 μm and an opening ratio of 15% of the surface area is used.

Both suction plates 11, 11 ′ are coated with breathable ultra-hard thin films 10, 10 ′ on the work suction surface 3 (on the side where the work 5 abuts). The ultrahard thin films 10 and 10 'in the embodiments are breathable thin films containing diamond or ceramic as a main component and having a size of about 5 microns.

[0013]

[Function of the device]

 In the present invention, when sucked by the external suction device, the suction flow paths 12 and 12 'of the pick and place 1 and the chip stage 2 are vacuumed in the direction of the arrow in the figure. The negative pressure in the suction passages 12 and 12 'due to the vacuum is transmitted to the surfaces of the suction plates 11 and 11' while passing through the pores of the porous material of the suction plates 11 and 11 ', and the uniform suction force is applied to the entire suction surface. Will be given. Although the ultra-hard films 10 and 10 'are present on the adsorption surface, they do not affect the adsorption force because they have air permeability.

[0014]

[Effect of device]

 Since the present invention is configured as described above, it has the following effects. Since the suction plates 11 and 11 'of the work suction portions 6 and 7 are made of a porous material having air permeability, the work is displaced when suctioning the work 5 in the suction hole 4. Instead, the bonding accuracy can be improved.

Since the suction plates 11 and 11 ′ of the work suction portions 6 and 7 are made of a porous material, they can be sucked on the entire surface of the suction plates 11 and 11 ′ and supplied to the work suction portions 6 and 7. If there is a margin in the air intake amount, it is possible to adsorb the work 5 from large to small. Therefore, it is not necessary to replace the suction plates 11 and 11 'for each work 5, and the number of dedicated parts can be reduced.

Since the work suction surface 3 (work contact surface side) of the suction plates 11 and 11 ′ of the work suction portions 6 and 7 is coated with the breathable ultra-hard thin film 10, wear resistance of the work suction surface 3 Has improved, and it has become possible to always ensure high surface accuracy.

[Brief description of drawings]

FIG. 1 is a partial sectional view of a work suction part used in the present invention.

FIG. 2 is a sectional view of a pick-and-place work suction part.

FIG. 3 is a perspective view of a conventional pick-and-place suction unit.

[Explanation of symbols]

 1. ． ． ． ． Pick and place 2. ． ． ． ． Chip stage 3. ． ． ． ． Work adsorption surface 6,7. ． ． Work adsorption part 8. ． ． ． ． Pick and place body 9. ． ． ． ． Chip stage body 10, 10 '. Ultra-hard thin film 11, 11 '. Adsorption plate 12, 12 '. Suction channel

Claims (1)

[Scope of utility model registration request] 1. A suction plate of a work suction portion by vacuum used for pick-and-place and a chip stage in a chip bonding apparatus, and a porous material such as a breathable sintered material is used for the suction plate of the work. Work adsorption part in a chip bonding device, characterized in that the side is coated with a breathable ultra-hard thin film.