JPH06167320A - Measuring method and apparatus for standoff of semiconductor device and inspecting method for standoff of semiconductor device using the method and apparatus - Google Patents

Abstract

PURPOSE:To automatically inspect the standoff of a surface-mounted IC. CONSTITUTION:A QFP.IC 1 is mounted on a jig 13 with mounting faces 4 of a group of leads 3 thereof pressed in touch with a reference face 14 of the jig 13. A measuring light 35 is cast between the reference face 14 and the lower face of a package 2 along the diagonal of the package by a measuring light casting device 34. The width of the measuring light passing through between the reference face 14 and the lower face of the package 2 is measured by a photodetecting device 36, so that the standoff as the minimum distance from the mounting face 4 of the lead to the lower face of the package 2 is measured. The measuring value of the photodetecting device 36 is compared with a preset value by a detecting device 38. Accordingly, the standoff of the QFP.IC 1 is automatically inspected. Since the mounting face of the QFP.IC 1 is butted to the reference face of the jig, the standoff can be inspected in the actually mounting state. The standoff is measured by the width of the measuring light, and therefore, processing of images can be omitted, thereby shortening the inspecting time and improving the inspecting accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for inspecting a semiconductor device, and more particularly to a technique for inspecting a standoff of a package of a semiconductor device, for example, a semiconductor integrated circuit device (hereinafter referred to as a semiconductor integrated circuit device) equipped with a surface mount type package. IC)), which is effective for inspecting the standoff of the surface mount package.

[0002]

2. Description of the Related Art Recently, ICs have been further reduced in size, thickness and weight, and in response to the demand for high density mounting, ICs equipped with surface mounting type packages (hereinafter referred to as surface mounting type ICs). Abbreviated.) Is rapidly gaining popularity.
The surface mount type IC, together with the mounting of the chip component, promotes automation of mounting on the substrate.

However, even with an automatic chip component mounting apparatus, it is not desirable to have a proper mounting rate of 100%, and as the number of components per board increases, the cumulative mounting failure rate also increases, with one board as a unit. When evaluated, it has come to count one to two digit percent defects.

In order to promptly find and eliminate such a defective substrate in the manufacturing process, there is a demand for the development of an automatic inspection device for the mounted state. Therefore, on the supply side of the surface mount type IC, in order to prevent occurrence of mounting failure after mounting on the substrate, a lead appearance inspection is performed before the product is shipped.

However, the measurement standard is not defined in the inspection item of the lead of the surface mount type IC. Further, it is difficult to uniquely define the mounting state only by the positional relationship between the leads in the lead group row on each side surface of the surface mount type package IC. For this reason,
At present, the visual inspection of the leads of the surface mount type IC is performed by human work.

As an example in which the chip component mounting inspection technique is described, "Electronic Material 19" issued by the Industrial Research Institute Co., Ltd.
Issued on Nov. 10, 1987, P63-
There is P69. Further, JP-A-3-188641, JP-A-3-165535, and JP-A-3-165.
536, JP-A-3-185848, JP-A-3-195040, JP-A-3-195041, and JP-A-3-1955042.

[0007]

Since the visual inspection of the leads of the surface mount type IC relies on manual work, not only is there a limit to the improvement of productivity, but there is also a limit to the reliability of the inspection. is there. Therefore, it is necessary to develop a lead visual inspection apparatus that can automatically perform visual inspection of the leads of the surface mount type IC.

As a problem to be solved in the development of this lead appearance inspection apparatus, assuming the state when the surface mount type IC is mounted, the positional relationship between the leads in that state is measured, and the entire lead group is measured. In this case, the quality of the external appearance of each lead is determined.

Here, a standoff inspection is one of the important inspection items assuming the mounting state of the surface mount type IC. That is, the standoff of the surface mount type IC is a surface mount type IC in which a plurality of leads are protruded from at least two side surfaces of a square surface mount type package and bent in the direction of one main surface. This is the minimum distance from the mounting surface where the lead group comes into contact with the mounting substrate to one main surface of the surface mounting type package when the IC chip is mounted on the mounting substrate. The inspection regarding the standoff means an inspection for determining whether or not the actual value of the standoff matches a preset standard value (usually including a tolerance).

As an inspection method for carrying out the stand-off inspection of the surface mount type IC, a method of inspecting by image processing like the other inspection items of the appearance inspection of the leads is generally considered.

However, with the increasing number of lead visual inspection items, if all the various measurements required for the inspection are performed by an image processing apparatus or the like, the inspection time will be greatly consumed for the image processing. Further, with the downsizing and thinning of surface mount packages, the positional relationship of the lead groups has become strict, and improvement in inspection accuracy has begun to be required. There is also a strong demand for improvement in inspection accuracy for stand-off inspection of surface mount ICs.

It is a first object of the present invention to provide a semiconductor device standoff measurement technique capable of automatically measuring the standoff value of a surface mount type IC.

A second object of the present invention is to perform a standoff inspection of a surface mount type IC without using an image processing device, and to shorten the inspection time and improve the inspection accuracy. It is to provide a stand-off inspection technology for the device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0015]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, regarding a semiconductor device in which a plurality of leads are projected from at least two side surfaces of a rectangular package and bent in the direction of the one main surface, the lead group is formed when the semiconductor device is mounted on a mounting board. A standoff inspection device for a semiconductor device, which inspects a distance from a mounting surface in contact with a mounting substrate to a main surface of the package, wherein the semiconductor device is a jig to which the semiconductor device is mounted. A jig having a reference surface on which the main surface is directed and in contact with the mounting surface of the lead group, and a jig outside the jig, which is on a diagonal line of the semiconductor device mounted on the jig. It is arranged at a desired position, and is configured to irradiate the measurement light between the main surface and the reference surface of the package of the semiconductor device mounted on the jig along the diagonal line of the package. The measuring light irradiating device and the main surface of the package of the semiconductor device, which is arranged outside the jig and faces the measuring light irradiating device across a diagonal line, and is mounted on the jig. A light receiving device that receives the measurement light that has passed through between the reference surface and measures its width, and compares the measurement value from the light receiving device with a preset setting value, and the quality is judged by the comparison result. A determination device for determining
The semiconductor device is mounted on a jig so that the main surface is directed to the jig side and the mounting surface of the lead group is in contact with the reference surface of the jig. Measuring light is irradiated between the main surface of the package and the main surface of the package by the measuring light irradiation device along a diagonal line of the package, and the width of the measuring light transmitted between the reference surface and the main surface of the package is the received light. The distance from the mounting surface where the lead group comes into contact with the mounting substrate to the main surface of the package is measured by being measured by the device, and the measured value from the light receiving device is a preset value and the determination device. According to the comparison result, when the semiconductor device is mounted on the mounting substrate, the distance from the mounting surface where the lead group contacts the mounting substrate to the one main surface of the package is inspected. Characterized in that it is configured.

[0017]

According to the above-described means, when inspecting a standoff, the semiconductor device to be inspected is mounted so that the main surface thereof faces the reference surface of the jig and the mounting surface of the lead group comes into contact with the jig. Therefore, the inspection state is the same as the state in which the semiconductor device is actually mounted on the mounting board. Therefore, the standoff value of the semiconductor device is measured under the assumption of the actual mounting state, and the standoff is inspected based on the measured value.

Further, the standoff measuring light emitted from the measuring light irradiating device is transmitted along the diagonal of the package between the reference surface of the jig and the main surface of the package of the semiconductor device which is the object for measuring the standoff value. Therefore, the measurement light covers the diagonal position and the central portion on the main surface of the package. Therefore, the inspection area of the standoff covers the entire area of the package.

Further, the width of the measuring light transmitted along the diagonal of the package between the reference surface of the jig and the main surface of the package of the semiconductor device, which is the object of standoff value measurement, is such that the lead group and the mounting substrate are the same. Since it corresponds to the minimum distance from the mounting surface to contact the main surface of the package, by measuring the width of the transmitted measurement light with a light receiving device, the lead group from the mounting surface to contact the mounting board to the main surface of the package. The minimum spacing, or standoff value, can be measured. Then, since the standoff value is measured by measuring the width of the transmitted measurement light by the light receiving device,
In the measurement of the standoff value, the image processing can be omitted, the measurement time in measuring the standoff value can be shortened, and the measurement accuracy can be improved.

By comparing the actual stand-off value measured in this way with an appropriate preset stand-off value by the judging device, and automatically executing the judgment of good or bad, The off inspection will be automatically performed.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a surface mount type I which is an embodiment of the present invention.
It is a perspective view which shows the standoff inspection apparatus of C. FIG. 2 is a schematic plan view. FIG. 3 is a sectional view taken along the line III-III in FIG. FIG. 4 is a sectional view taken along the line IV-IV in FIG.
5A and 5B are views for explaining the action, FIG. 5A is a plan view, FIG. 5B is a side sectional view, and FIG. Figure 6
[Fig. 6] is a plan view showing a case where the inspection object is changed.

In the present embodiment, the semiconductor device standoff inspection apparatus according to the present invention is configured to inspect the standoff of a surface mount IC. That is, the standoff of the surface mount type IC means that a plurality of leads are protruded from at least two side surfaces of a square surface mount type package and are bent in the direction of one main surface (hereinafter, sometimes referred to as a lower surface). With respect to the surface mount type IC, the minimum distance from the mounting surface where the lead group contacts the mounting board to the lower surface of the surface mount type package when the surface mount type IC is mounted on the mounting board. The inspection regarding the standoff means an inspection for determining whether or not the actual value of the standoff matches a preset standard value (usually including a tolerance).

In the present embodiment, the stand-off inspection device 10 for the surface mount type IC is equipped with a machine base 11.
A central shaft 12 formed in a cylindrical shape is provided on the machine base 11 so as to project vertically upward. An inspection jig 13 is detachably attached to the upper end of the central shaft 12. For example, the inspection jig 13 is formed by using a material having conductivity such as stainless steel, and its surface is subjected to surface treatment such as hard chrome plating to improve wear resistance.

A plurality of types of inspection jigs 13 are prepared in accordance with the standard of the surface mount type IC to be inspected, so that the type exchange work for the central axis 12 of the inspection jig 13 can be performed by one-touch operation. Is configured. Hereinafter, in order to facilitate understanding of the description, an IC (hereinafter referred to as a QFP IC) including a resin-encapsulated quad flat package, which is an example of the surface mount IC, will be described.

The QFP / IC 1 is provided with a resin-sealed package (hereinafter, simply referred to as a package) 2 formed in a substantially square flat plate shape, and the outer leads (hereinafter, simply referred to as a package) from four side surfaces of the package 2. , Leads 3) are arranged in a row in the circumferential direction and project at right angles, and each lead 3 is bent in the direction of the lower surface of the package 2 into a so-called gull wing shape. ing. The lower end surface of each lead 3 is aligned so as to be included in one plane, so that the mounting surface 4 to be soldered to the mounting substrate is substantially configured.

The inspection jig 13 for the QFP / IC1 shown in FIG. 1 is formed in a substantially rectangular parallelepiped shape larger than the package 2 of the QFP / IC1. On the upper surface of the inspection jig 13, the QFP / IC to be inspected
Reference surface 1 for holding 1 in the state where the mounting state is assumed
4 is substantially formed by processing the upper surface thereof precisely to be flat. That is, the inspection target Q
With the FP / IC 1 mounted on the inspection jig 13, the mounting surface 4 of the lead 3 of the QFP / IC 1 is in contact with the reference surface 14.

A guide 15 formed in a square frame shape is concentrically arranged on the reference surface 14 of the inspection jig 13 and protrudes vertically upward. The inner diameter of the guide 15 is formed in a square frame shape that is substantially the same as the outer diameter of the package 2 of the QFP IC1. That is, the guide 15
The inner diameter of the QFP I
The package 2 can be positioned by mounting the C1 and fitting the package 2 into the guide 15.

The height of the guide 15 is set so as to be lower than the height from the mounting surface 4 of the lead 3 in the QFP / IC 1 to be inspected to the lower end surface of the horizontal base end portion 5. . That is, the height of the guide 15 is set so as not to interfere with the lead 3 when the inspection object 13 is mounted with the QFP / IC 1 as the inspection object and the package 2 is positioned by the inner diameter of the guide 15. As a result, the contact of the lead 3 with the mounting surface 4 of the reference surface 14 is ensured.

At the four corners of the guide 15, measuring light transmitting windows 16 for transmitting measuring light, which will be described later, are provided. Since the four measurement light transmission windows 16 are arranged diagonally to the guides 15, the measurement light transmitted through the transmission windows 16 are respectively positioned at the Q positions determined by the guides 15.
It passes on the inspection jig 13 along the diagonal line of the package 2 of the FP / IC 1.

In the inspection jig 13, a suction nozzle insertion hole 17 is arranged concentrically with the cylindrical central shaft 12 and is opened in the vertical direction. The insertion hole 17 and the central hollow of the central shaft 12 are hollow. The suction nozzle 18 is inserted. The suction nozzle 18 is configured to be moved up and down by a vertical movement device (not shown). Further, a negative pressure supply device (not shown) is fluidly connected to the suction nozzle 18, and the suction nozzle 18 is configured to hold the package 2 of the QFP / IC1 in a vacuum suction state at its upper end opening. There is.

A first support arm 1 is provided at an intermediate portion of the central shaft 12.
9 and the second support arm 20 are arranged above and below each other so that the intermediate portions thereof penetrate and extend horizontally, respectively, and a first radial bearing 21 and a second radial bearing 22 and a plurality of thrust bearings 23. It is rotatably supported by. The first in plan view
The support arm 19 and the second support arm 20 intersect with each other about the central axis 12 and are formed in a symmetrical shape.

The right end portion of the first support arm 19 (hereinafter, left and right are based on FIG. 2) and the second support arm 2
A spring shaft 24 is vertically erected on the machine base 11 in a space portion where the right end of 0 faces each other. One end of the first spring 25 and the second spring 26 of the spring shaft 24 are arranged. One end and the other are locked. The other end of the first spring 25 is locked to the right end portion of the first support arm 19, and the first spring 25 is
The support arm 19 is always biased in the direction of the spring shaft 24. The other end of the second spring 26 is the second
The second spring 26 is locked to the right end portion of the support arm 20, and always biases the second support arm 20 toward the spring shaft 24. Therefore, the first support arm 19 and the second support arm 20 are always in a state of trying to close each other.

A guide rail 27 is laid in the extension line of the line connecting the spring shaft 24 and the central shaft 12 in the machine base 11, and a slider 28 slides on the guide rail 27. It is laid freely.
A support shaft 29 is arranged vertically upward on the slider 28 and is erected so as to move integrally. A cam follower 30 is rotatably supported on the upper end of the support shaft 29 so that the cam follower 30 can rotate in a horizontal plane. Has been done.

This cam follower 30 includes the first support arm 1
The left end portion of 9 and the left end portion of the second support arm 20 are disposed in the space portions facing each other, and are circumscribed on the opposite side surfaces of both support arms 19 and 20, respectively. That is, the left end of the first support arm 19 and the second end
The left end of the support arm 20 is always in contact with the cam follower 30 by trying to close each other.

On the extension line of the guide rail 27, a cylindrical cam 31 is rotatably supported so as to be horizontally arranged so that its cylinder center is parallel to the extension line, and is supported on the cam surface of the cylindrical cam 31. The cam follower 30 is always circumscribed. A rotation driving device 33 such as a servomotor is connected to a rotation shaft 32 of the cylindrical cam 31, and the rotation of the cylindrical cam 31 is controlled by the driving device 33. The rotation of the cylindrical cam 31 advances and retracts the cam follower 30 in the left-right direction, and the advance / retreat of the cam follower 30 changes and adjusts the opening angle between the first support arm 19 and the second support arm 20.

A first measuring light irradiation device 34 is installed on the left end of the first support arm 19, and the first measuring light irradiation device 34 is provided.
The measurement light irradiation device 34 is configured to horizontally irradiate the first standoff measurement light 35 toward the opposite end of the first support arm 19. That is, the measurement light 35 emitted from the first measurement light irradiator 34 has a pair of measurement light transmission windows 1 that are opened at one diagonal position of the inspection jig 13.
It passes through 6 and 16 and is irradiated on the opposite side.

The first measuring light irradiating device 34 is so constructed that it can irradiate the measuring light 35 having a constant width in at least the vertical direction. Then, the first measurement light irradiation device 34
As will be described later, the measurement light 35 having a constant width emitted from the light source reaches the opposite end portion with a constant width unless it is shielded by the measurement light transmission window 16 and the package 2 of the QFP / IC1.

A first light receiving device 36 is provided on the right end which is the opposite end of the first supporting arm 19, and the first light receiving device 36 is irradiated by the first measuring light irradiation device 34. 1 Stand-off measuring light 35
It faces the measurement light irradiation device 34 with the inspection jig 13 interposed therebetween. Therefore, the first light receiving device 36 transmits the measurement light 35 having a certain width, which is transmitted through the pair of measurement light transmission windows 16 and 16 respectively opened at one diagonal position of the inspection jig 13 and irradiated to the opposite side. It is designed to receive light.

The first light receiving device 36 is configured to generate an electric signal having a voltage having a magnitude corresponding to the width of the received first standoff measuring light 35. The first light receiving device 36 is connected to receive the electrical signal generated by the first signal processing device 37, and the first signal processing device 3
7 is connected to the determination device 38. The first signal processing device 37 is configured to A / D convert the electrical signal transmitted from the first light receiving device 36 and transmit the electrical signal to the determination device 38.

Similarly, a second measuring light irradiation device 39 is provided on the right end portion of the second support arm 20, and the second measuring light irradiation device 39 is provided.
The measurement light irradiation device 39 is configured to horizontally irradiate the second standoff measurement light 40 toward the opposite end of the second support arm 20. That is, the measurement light 40 emitted from the second measurement light irradiating device 39 has a pair of measurement light transmission windows 1 formed at the other diagonal positions of the inspection jig 13.
It passes through 6 and 16 and is irradiated on the opposite side.

The second measuring light irradiating device 39 is so constructed that it can irradiate the measuring light 40 having a constant width in at least the vertical direction. Then, the second measurement light irradiation device 39
As will be described later, the measuring light 40 having a constant width emitted from the light source reaches the opposite side end portion with a constant width unless it is shielded by the measuring light transmission window 16 and the package 2 of the QFP IC1.

A second light receiving device 41 is provided on the left end which is the opposite end of the second support arm 20, and the second light receiving device 41 is irradiated by the second measuring light irradiation device 39. Second standoff measurement light 40
It faces the measurement light irradiation device 39 with the inspection jig 13 interposed therebetween. Therefore, the second light receiving device 39 transmits the measurement light 40 having a certain width, which is transmitted through the pair of measurement light transmission windows 16 and 16 which are respectively opened at the other diagonal positions of the inspection jig 13 and is irradiated to the opposite side. It is designed to receive light.

The second light receiving device 41 is configured to generate an electric signal having a voltage having a magnitude corresponding to the width of the received second standoff measuring light 40. The second signal processing device 4 is connected to the second light receiving device 41 so as to transmit the electric signal generated by the second signal processing device 42.
2 is connected to the determination device 38. The second signal processing device 42 is configured to A / D convert the electrical signal transmitted from the second light receiving device 41 and transmit the electrical signal to the determination device 38.

The judging device 38 is constructed by a microcomputer or the like, and executes the quality judgment to be described later based on the signals respectively transmitted from the first signal processing device 37 and the second signal processing device 42. It is configured.

For example, the first measuring light irradiating device 34 and the second measuring light irradiating device 39 are constituted by a transmission type displacement laser irradiating device or the like. Further, the first light receiving device 36 and the second light receiving device 41 are configured by using a photo sensor or the like, receive the laser from the laser irradiation device, and have an electric signal having a voltage corresponding to the received light amount. Is configured to generate.

Next, the operation of the stand-off inspection device 10 for the surface mount type IC according to the above configuration will be described.
A standoff measuring method and an inspecting method of a surface mount type IC according to an embodiment of the present invention will be described.

In advance, the inspection jig 13 corresponding to the semiconductor device to be inspected is attached to the upper end of the central shaft 12 by one-touch operation. Here, the QF shown in FIG.
A substantially square inspection jig 13 corresponding to the package 2 of the P.IC1 is mounted on the upper end of the central shaft 12.

Further, the opening angle between the first support arm 19 and the second support arm 20 is changed and adjusted according to the semiconductor device which is the inspection object. Here, the first support arm 19 corresponds to the diagonal line of the package 2 of the QFP / IC 1.
The opening angle between the second support arm 20 and the second support arm 20 is changed and adjusted to 90 degrees.

First support arm 19 and second support arm 20
The adjustment work for changing the opening angle is performed by rotating the cylindrical cam 31 by the rotation drive device 33. That is, when the rotation driving device 33 rotates the cylindrical cam 31 in a predetermined direction, the cam follower 30 is moved along the guide rail 27 by the cam surface of the cylindrical cam 31, so that the cam follower 30 is circumscribed by the springs 25 and 26. First support arm 19 and second support arm 2
The opening angle with 0 is changed.

The QFP / IC 1 to be inspected is mounted on the inspection jig 13 so that the package 2 thereof is fitted into the frame of the guide 15. QFP / IC1 is inspection jig 1
When the package 2 is mounted on the package 3, the package 2 is positioned by the guide 15 and the mounting surface 4 of the lead 3 group is in contact with the reference surface 14 of the inspection jig 13. The mounting state of the QFP / IC1 on the inspection jig 13 is equivalent to the state in which the QFP / IC1 is actually mounted on the mounting board.

When mounting the QFP / IC 1 on the inspection jig 13, the inspection jig 13 is held by the handler (not shown) while the QFP / IC 1 is held by vacuum suction by the vacuum suction head (not shown). Is transported directly above
Aligned with the guide 16. When the QFP / IC1 is located right above, the suction nozzle 18 is raised, and the QFP / IC1
The lower surface of the package 2 is held by vacuum suction. QFP
When IC1 is held by vacuum suction, the suction nozzle 18 is lowered, and the QFP IC1 is fitted in the frame of the guide 16.

As described above, since the work of transferring the QFP / IC1 is executed so that the suction nozzle 18 supports the lower surface of the package 2, the inspection jig 1 for the QFP / IC1 is executed.
It is possible to prevent the lead group 3 from being damaged during the mounting work on the lead 3.

Then, from the first measuring light irradiation device 34 to the first
The standoff measurement light 35 is emitted. This measuring light 35
Is transmitted through a pair of measurement light transmission windows 16 and 16 respectively opened at one diagonal position of the inspection jig 13,
As shown in (a), the QFP on the inspection jig 13
The IC 1 irradiates the opposite side of the package 2 along the diagonal and is received by the first light receiving device 36.

When passing through the measurement light transmission window 16 and the package 2, the first standoff measurement light 35 is emitted as shown in FIG.
As shown in (b), the upper region portion in the vertical direction is shielded by the package 2, and the lower region portion thereof is shielded by the portion below the reference surface 14 of the inspection jig 13. That is, the measurement light 35 is transmitted along the diagonal line of the package 2 between the reference surface 14 of the inspection jig 13 and the lower surface of the package 2 of the QFP / IC 1, and the first light receiving device 3
6 will receive the light.

Reference surface 14 of inspection jig 13 and QFP / IC
The width of the measuring light 35 which is transmitted along the one diagonal line of the package 2 between the lower surface of the package 2 of FIG.
As shown in FIG. 3, since it corresponds to the minimum distance from the mounting surface 4 of the lead 3 group to the lower surface of the package 2, by measuring the width of the transmitted measurement light 35 by the first light receiving device 36, The minimum distance from the mounting surface 4 of the group to the lower surface of the package 2, that is, the standoff value will be measured.

Therefore, the first light receiving device 36 measures the width of the received measurement light 35. That is, the measurement light 35 received by the first light receiving device 36 outputs a voltage having a magnitude corresponding to its width. As shown in FIG. 4 (c),
Since this output voltage V is proportional to the width of the measuring light 35, that is, the standoff value L, the standoff of the QFP / IC1 currently measured by the first standoff measuring light 35 is determined by the voltage value currently output. The off value can be obtained.

The output voltage of the first light receiving device 36 is A / D converted by the first signal processing device 37, and the converted electric signal is input to the determination device 38. This electric signal is a signal indicating the currently measured standoff value of the QFP IC1.

Therefore, the judging device 38 judges whether or not the standoff value measured for the QFP.IC1 to be inspected is within the preset tolerance range of the set value. That is, the determination device 38 compares the currently measured standoff value with a preset setting value, and if the difference is within the tolerance range, it determines that the product is non-defective and is outside the tolerance range. In this case, defective product determination is generated. The set value relating to the standoff value is stored in advance in the determination device 38 for each QFP / IC1 based on the standard dimensions of the QFP / IC1 as the inspection object.

On the other hand, the second standoff measuring light 40 is emitted from the second measuring light irradiating device 39 at the same time as or after the first measuring light irradiating device 34. Similar to the first standoff measurement light 35, this second standoff measurement light 40
The stand-off value corresponding to the other diagonal line in the package 2 of the same QFP / IC 1 is measured by the second light receiving device 41.

The standoff value corresponding to the other diagonal line is A / D converted by the second signal processing device 42,
It is input to the determination device 38. Then, in the determination device 38, in the same manner as described above, it is determined whether the standoff value for the other diagonal is good or bad.

Incidentally, the vacuum suction by the suction nozzle 18 is released during the above-mentioned work of measuring the standoff value.
The reason for releasing the vacuum suction is that when the QFP / IC 1 is vacuum-sucked by the suction nozzle 18, the mounting surface 4 of the lead 3 group is pressed against the reference surface 14 of the inspection jig 13, and It is to avoid inaccurate measurement of the off value.

Upon completion of the above good / bad judgment on the standoff value, the suction nozzle 18 is raised and the package 2 of the QFP / IC1 on the inspection jig 13 is vacuum suction-held. The suction-held QFP IC 1 is lifted from the inspection jig 13 by the suction nozzle 18.

When the QFP / IC1 is lifted, the handler moves the suction head right above the QFP / IC1 and the suction head holds the package 2 of the QFP / IC1 by vacuum suction. Then, the held QFP / IC 1 is appropriately transferred by the handler to a non-defective stocker (not shown) or a defective stocker (not shown) in accordance with the good / bad judgment of the judging device 38.

After that, by repeating the above-mentioned operation, the stand-off inspection for the QFP IC1 is sequentially carried out.

Next, the operation when the inspection target product is changed from QFP IC1 to, for example, an IC having a small outline package (hereinafter referred to as SOP IC) will be briefly described with reference to FIG. To do.

The SOP IC1A has a package 2A formed in a rectangular shape.
A plurality of leads 3A are arranged in a line and project at a right angle on the side surfaces on both long sides of each of the leads 3A, and each lead 3A is bent toward the lower surface of the package 2A in a gull-wing shape. The lower surface of the lead 3A group is aligned so as to be included in one plane, thereby substantially forming a mounting surface (not shown).

In this case, as shown in FIG. 6, the inspection jig 13A formed in a rectangular parallelepiped in plan view is mounted on the central shaft 12. This inspection jig 13A
Is prepared in advance corresponding to SOP / IC1A. The structure of the inspection jig 13A conforms to that of the inspection jig 13 for the QFP / IC1, and thus detailed description thereof will be omitted.

When the inspection jig 13A for the SOP / IC1A as the inspection object is mounted on the central shaft 12, the opening angle of the first support arm 19 and the second support arm 20 is changed and adjusted. Here, the opening angle between the first support arm 19 and the second support arm 20 is appropriately changed and adjusted according to the angle formed by the diagonal line of the package 2A of the SOP IC1A.

First support arm 19 and second support arm 20
The adjustment work for changing the opening angle is performed by rotating the cylindrical cam 31 by the rotation drive device 33. That is, when the rotation driving device 33 rotates the cylindrical cam 31 in a predetermined direction, the cam follower 30 is moved along the guide rail 27 by the cam surface of the cylindrical cam 31, so that the cam follower 30 is circumscribed by the springs 25 and 26. First support arm 19 and second support arm 2
The opening angle with 0 is changed.

The SOP / IC 1A to be inspected is mounted on the inspection jig 13A so that the package 2A is fitted into the frame of the guide 16 (not shown). SOP
When the IC 1A is mounted on the inspection jig 13A, the package 2A is positioned by the guide 16 and the mounting surface of the lead 3 group is in contact with the reference surface 14A of the inspection jig 13A. And this SOP
The mounting state of the IC 1A on the inspection jig 13A is S
The OP / IC1A is in a state equivalent to that actually mounted on the mounting board.

The work of measuring the standoff values for both diagonal lines in the package 2A of the SOP IC1A and the work of inspecting the standoff by the measured data are as follows.
Since the operation of the QFP / IC1 is similar to that described above, the description thereof will be omitted.

According to the above described embodiment, the following effects can be obtained. When measuring the standoff value and inspecting the standoff, the semiconductor device that is the object of measurement and inspection is mounted so that the lower surface of the semiconductor device faces the reference surface of the inspection jig and the mounting surface of the lead group contacts. The measurement state and the inspection state are the same as the state in which the semiconductor device is actually mounted on the mounting board. Therefore, the standoff value of the semiconductor device is measured and the standoff is inspected under the condition that the actual mounting state is assumed.

The measuring light emitted from the measuring light irradiating device is transmitted along the diagonal line of the package between the reference surface of the inspection jig and the lower surface of the package of the semiconductor device which is the inspection object. It covers the diagonal position and the center of the lower surface of the package. Therefore, the inspection area of the standoff covers the entire area of the package.

The width of the measurement light transmitted along the diagonal of the package between the reference surface of the inspection jig and the lower surface of the package of the semiconductor device which is the inspection object is determined from the mounting surface where the lead group contacts the mounting substrate. Since it corresponds to the minimum distance to the bottom surface of the package, the minimum distance from the mounting surface where the lead group contacts the mounting board to the bottom surface of the package, that is, the standoff, by measuring the width of the transmitted measurement light with a light receiving device. The value can be measured. And
Since the standoff value is measured by measuring the width of the transmitted measurement light by the light receiving device, the image processing can be omitted in the standoff value measurement, and the standoff value measurement and the standoff inspection based on the standoff value measurement can be omitted. It is possible to shorten the inspection time and improve the inspection accuracy.

When the lead is deformed, the standoff value fluctuates. Therefore, by measuring the standoff value, it is possible to estimate the occurrence of deformation of the lead, so that the burden of the visual inspection work of the lead is reduced. can do.

The inspection jig is QFP / IC or SOP / I.
By preparing in advance corresponding to the type of semiconductor device to be inspected such as C, and configuring each of these inspection jigs to be attachable and detachable to the central shaft 12, a stand for all types of semiconductor devices can be obtained. The off inspection can be performed accurately and efficiently.

The measuring light irradiating device and the light receiving device are provided on both ends of the same supporting arm so as to face each other, and the supporting arm rotatably supports the inspection jig as a center. Together, the standoff test can be performed on all types of semiconductor devices.

By installing a pair of the support arms, it is possible to simultaneously measure the standoff values regarding a pair of diagonal lines, so that the work efficiency of the standoff inspection can be further enhanced.

Since the suction nozzle is vertically movably inserted in the center of the inspection jig and is configured to be vertically driven, the lower surface of the package of the semiconductor device, which is the inspection object, can be vacuum suction-held. Therefore, it is not necessary to damage the lead group when attaching or detaching the semiconductor device to or from the inspection jig.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the measuring light irradiating device, the light receiving device, and the signal processing device are not limited to being provided as a pair, but only one set may be provided.

Further, the measuring light irradiating device and the light receiving device are not limited to be rotated, but the semiconductor device as the inspection object, that is, the jig side may be rotated.

The determination device may be omitted in some cases, and the operator may be configured to perform the determination.

In the above description, the QFP, which is the field of application of the invention mainly made by the present inventor, was the background.
The case where the present invention is applied to the stand-off inspection technique for the surface mount type IC including the gull wing lead package such as IC and SOP IC has been explained, but the present invention is not limited to this, and the J lead package,
The present invention can be applied to all standoff inspection techniques for surface mount type ICs including I-lead packages and non-lead packages. If necessary, insert type leads such as dual in-line package IC
It can also be applied to a standoff inspection technique for an IC including a package, a transistor, an optical device, and the like.

[0085]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

At the time of inspecting the standoff, the semiconductor device which is the inspection object is mounted so that its main surface is directed to the reference surface of the jig and the mounting surface of the lead group comes into contact with the jig. This is the same as the state in which the semiconductor device is actually mounted on the mounting board. Therefore, it is possible to measure the standoff value of the semiconductor device under the assumption of the actual mounting state, and the standoff is inspected based on the measured value.

Further, since the standoff measuring light emitted from the measuring light irradiating device is transmitted along the diagonal line of the package between the reference surface of the jig and the main surface of the package of the semiconductor device which is the inspection object, The measuring light covers the diagonal position and the central portion on the main surface of the package.
Therefore, the inspection area of the standoff can cover the entire area of the package.

Further, the width of the measuring light transmitted along the diagonal of the package between the reference surface of the jig and the main surface of the package of the semiconductor device as the inspection object is determined by the mounting of the lead group in contact with the mounting board. Since it corresponds to the minimum distance from the main surface of the package to the main surface of the package, the width of the transmitted measurement light is measured by the light receiving device, and the minimum distance from the mounting surface where the lead group contacts the mounting substrate to the main surface of the package. That is, the standoff side can be measured. Then, since the standoff value is measured by measuring the width of the transmitted measurement light by the light receiving device, in the measurement of the standoff value, image processing can be omitted,
It is possible to shorten the measurement time in measuring the standoff value and improve the measurement accuracy.

By comparing the actual stand-off value measured in this way with a preset proper stand-off value by a judging device and automatically executing the judgment of good or bad, The off inspection can be automatically performed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a stand-off inspection device for a surface-mounted IC that is an embodiment of the present invention.

FIG. 2 is a schematic plan view.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

5A and 5B are views for explaining the action, FIG. 5A is a plan view, FIG. 5B is a side sectional view, and FIG.

FIG. 6 is a plan view showing a case where the inspection object is changed.

[Explanation of symbols]

1 ... QFP / IC (semiconductor device), 1A ... SOP / IC
(Semiconductor device) 2, 2A ... Resin-sealed package 3,
3A ... Outer leads, 4 ... Mounting surface, 5 ... Horizontal base end, 1
0 ... Standoff inspection device, 11 ... Machine base, 12 ... Central axis, 13 ... QFP / IC inspection jig, 13A ... SOP /
IC inspection jig, 14, 14A ... Reference plane, 15 ... Guide, 16 ... Measuring light transmitting window, 17 ... Suction nozzle insertion hole, 1
8 ... Suction nozzle, 19 ... 1st support arm, 20 ... 2nd support arm, 21 ... 1st radial bearing, 22 ... 2nd
Radial bearing, 23 ... Thrust bearing, 24
... Spring shaft, 25 ... First spring, 26 ... Second spring, 27 ... Guide rail, 28 ... Slider, 2
9 ... Spindle, 30 ... Cam follower, 31 ... Cylindrical cam, 32
Rotation axis, 33 ... Rotation drive device, 34 ... 1st measurement light irradiation device, 35 ... 1st standoff measurement light, 36 ... 1st light receiving device, 37 ... 1st signal processing device, 38 ... Judgment device, 39
... second measurement light irradiation device, 40 ... second standoff measurement light, 41 ... second light receiving device, 42 ... second signal processing device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yutaka Koda 3-3, Fujibashi, Ome-shi, Tokyo 2-3 Hitachi Hitachi Electronics Co., Ltd. (72) Hideto Fujiwara 3--3, Fujihashi, Ome, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Osamu Obata 3-3 Fujibashi, Ome City, Tokyo 2 Inside Hitachi Tokyo Electronics Co., Ltd.

Claims (5)

[Claims] 1. A semiconductor device in which a plurality of leads are projected from at least two side surfaces of a rectangular package and bent in the direction of one main surface, and when the semiconductor device is mounted on a mounting substrate, the lead group is formed. A standoff measuring method for a semiconductor device, which measures a distance from a mounting surface in contact with a mounting substrate to one main surface of the package, wherein the semiconductor device is directed to a jig, and the main surface is directed to the jig side. And, the mounting surface of the lead group is mounted in contact with the reference surface of the jig, and the measuring light is irradiated along the diagonal line of the package between the reference surface and the main surface of the package. The width of the measurement light transmitted between the surface and the main surface of the package is measured to measure the distance from the mounting surface where the leads contact the mounting substrate to the main surface of the package. Standoff measuring method of a semiconductor device characterized in that it is. 2. A semiconductor device in which a plurality of leads are projected from at least two side surfaces of a rectangular package and bent in the direction of one main surface, and when the semiconductor device is mounted on a mounting substrate, the lead group is formed. A stand-off measuring device for a semiconductor device, which measures a distance from a mounting surface in contact with a mounting substrate to a main surface of the package, wherein the device is a jig to which the semiconductor device is mounted. A jig having a reference surface on which the main surface is directed and in contact with the mounting surface of the lead group, and a jig outside the jig, which is on a diagonal line of the semiconductor device mounted on the jig. A measuring device arranged at a desired position and configured to irradiate the measuring light between the main surface and the reference surface of the package of the semiconductor device mounted on the jig along a diagonal line of the package. A light irradiating device and the outside of the jig, the main surface of the package of the semiconductor device mounted on the jig, and the reference, which are arranged at a position facing the measuring light irradiating device across a diagonal line. And a light-receiving device that measures the width of the measuring light transmitted between the semiconductor device and the jig, and the semiconductor device is a jig, and the main surface is directed to the jig side, and , The mounting surface of the lead group is mounted in contact with the reference surface of the jig, and measurement light is irradiated between the reference surface and the main surface of the package along the diagonal line of the package by the measurement light irradiation device. The width of the measuring light transmitted between the reference surface and the main surface of the package is measured by the light receiving device, so that the lead group contacts the mounting substrate to the main surface of the package. Is configured to be measured Standoff measuring device wherein a Rukoto. 3. The standoff measuring device for a semiconductor device according to claim 2, wherein a plurality of kinds of the jigs are prepared corresponding to the standard of the semiconductor device to be measured. 4. The measuring light irradiating device and the light receiving device are provided on opposite ends of the same support arm so as to face each other, and the support arm is rotatably supported around a jig. The standoff measuring device for a semiconductor device according to claim 1, wherein the standoff measuring device is configured to rotate corresponding to a diagonal line of the semiconductor device mounted on the jig. 5. A semiconductor device in which a plurality of leads are projected from at least two side surfaces of a rectangular package and bent in the direction of one main surface, and when the semiconductor device is mounted on a mounting board, the lead group is formed. A standoff inspection device for a semiconductor device, which inspects a distance from a mounting surface in contact with a mounting substrate to a main surface of the package, wherein the device is a jig for mounting the semiconductor device. A jig having a reference surface on which the main surface is directed and with which the mounting surface of the lead group comes into contact, and a jig outside the jig and on a diagonal line of the semiconductor device mounted on the jig. A measuring device arranged at a desired position and configured to irradiate the measuring light between the main surface and the reference surface of the package of the semiconductor device mounted on the jig along a diagonal line of the package. A light irradiating device and the outside of the jig, the main surface of the package of the semiconductor device mounted on the jig, and the reference, which are arranged at a position facing the measuring light irradiating device across a diagonal line. A light receiving device that receives the measurement light that has passed through between the surfaces and measures the width of the light, and compares the measured value from the light receiving device with a preset value, and determines the quality based on the comparison result. The semiconductor device is mounted on a jig so that the main surface is directed to the jig side and the mounting surface of the lead group is in contact with the reference surface of the jig. , Measurement light is irradiated between the reference surface and the main surface of the package along a diagonal line of the package by the measurement light irradiation device, and the measurement light transmitted between the reference surface and the main surface of the package. That the width of the The distance from the mounting surface where the lead group contacts the mounting substrate to the main surface of the package is measured, and the measured value from this light receiving device is compared with a preset setting value in the determination device, and the comparison result When the semiconductor device is mounted on a mounting substrate, the lead group is inspected for a distance from a mounting surface in contact with the mounting substrate to one main surface of the package. Equipment stand-off inspection device.