CN217719502U - Semiconductor wafer optical detection equipment and system - Google Patents
Semiconductor wafer optical detection equipment and system Download PDFInfo
- Publication number
- CN217719502U CN217719502U CN202221524291.0U CN202221524291U CN217719502U CN 217719502 U CN217719502 U CN 217719502U CN 202221524291 U CN202221524291 U CN 202221524291U CN 217719502 U CN217719502 U CN 217719502U
- Authority
- CN
- China
- Prior art keywords
- wafer
- module
- image capturing
- unit
- capturing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model discloses a semiconductor wafer optical detection device and system, which comprises a carrier module, a position correction module, an integrating sphere module and a detection module; the carrier module comprises a carrying platform for carrying the wafer and an adjusting unit for adjusting the space position of the carrying platform; the position correction module comprises a first image capturing unit for acquiring the position information of the wafer; the integrating sphere module comprises an illumination unit for lighting semiconductor chips on the wafer in a time-sharing manner; the detection module comprises a second image capturing unit for time-sharing shooting of the semiconductor chip lighted on the wafer. The utility model discloses can improve the full automated inspection's of wafer efficiency effectively, promote the rapid development of semiconductor yield detection link.
Description
Technical Field
The utility model discloses a wafer optical detection equipment belongs to wafer detection technology field, specifically discloses a semiconductor wafer optical detection equipment and system.
Background
Generally, the manufacturing process of a semiconductor can be roughly divided into four steps from the first manufacturing of a wafer to the final product: namely, a wafer manufacturing process for manufacturing a wafer from the silica stone; a wafer processing step of forming a plurality of semiconductor chips on the surface of the wafer by using the manufactured wafer; electrical characteristic detection of the semiconductor chip for judging whether the semiconductor chip is good or not (hereinafter referred to as an EDS process); a packaging process for manufacturing a chip by using the processed wafer; and a module assembly process for attaching the package to the module to produce a fully functional product.
During the manufacturing process of the semiconductor device, the wafer or the chips formed on the wafer are subjected to predetermined measurement and correction operations at any time. As a tool for confirming whether the predetermined measurement and correction process for the wafer is performed as required, an optical microscope such as a scanning electron microscope or a transmission electron microscope can be used. The EDS process is a process of detecting electrical characteristics of semiconductor chips formed on a wafer to distinguish a semiconductor chip that is operating normally from a defective semiconductor chip.
In the EDS process, the electrical characteristics of the chips are detected by using a probe card, and a specific current is applied to a plurality of semiconductor chips formed on a wafer to detect whether the semiconductor chips are normal or defective. The technical scheme needs to apply specific current conduction to each semiconductor chip on the same wafer, so that the defect of low detection efficiency exists.
SUMMERY OF THE UTILITY MODEL
To the technical problem who exists among the prior art, the utility model provides a semiconductor wafer optical detection equipment and system, its efficiency that can improve the full automated inspection of wafer effectively promotes the rapid development of semiconductor yield detection link.
The utility model discloses a semiconductor wafer optical detection device, which comprises a carrier module, a position correction module, an integrating sphere module and a detection module; the carrier module comprises a carrying platform for carrying the wafer and an adjusting unit for adjusting the space position of the carrying platform; the position correction module comprises a first image capturing unit for acquiring the position information of the wafer; the integrating sphere module comprises an illumination unit for lighting a semiconductor chip on a wafer in a time-sharing manner; the detection module comprises a second image capturing unit for time-sharing shooting of the lightened semiconductor chip on the wafer.
In a preferred embodiment of the present invention, the second image capturing unit and the lighting unit are located on the same side of the wafer, or the second image capturing unit and the lighting unit are located on different sides of the wafer.
The utility model discloses an among the preferred embodiment, including can be in the space along three axial displacement's the module of moving, the removal end that moves the module of moving is connected with first get for instance unit and second get for instance the unit.
In a preferred embodiment of the present invention, the moving end of the transferring module is connected to a first rotating module capable of rotating around a third axis, the rotating end of the first rotating module is connected to a first fixed frame, the first fixed frame is provided with a first swinging frame capable of swinging around a second axis, the first swinging frame is connected to the second image capturing unit, and the first fixed frame is connected to the first image capturing unit; the image capturing optical axis of the second image capturing unit is perpendicular to the second axis, and the image capturing optical axis of the first image capturing unit is perpendicular to the wafer.
In a preferred embodiment of the present invention, the first fixing frame is provided with a distance measuring sensor arranged along an axial extension of the third shaft.
The utility model discloses an in a preferred embodiment, including the rotatory module of second that can wind the primary shaft rotation, the rotatory end of second rotation module is connected with second fixed frame, be provided with on the second fixed frame and be connected with the second swing frame that can wind the wobbling of third axle, be connected with on the second swing frame lighting unit.
In a preferred embodiment of the present invention, the illumination unit includes a light source and a light path conversion module, and the illumination beam emitted from the light source is vertically irradiated to the semiconductor chip through the light path conversion module.
The utility model discloses an in a preferred embodiment, the regulating unit includes the second straight line module of arranging along the axial extension of second shaft, the removal end of second straight line module is connected with the first straight line module of arranging along the axial extension of primary shaft, the removal end of first straight line module is connected with can be around the rotation of third axle the microscope carrier, the microscope carrier is connected with the driving source transmission.
The utility model discloses an in a preferred embodiment, be provided with on the microscope carrier and be used for the location the constant head tank of wafer, be provided with in the constant head tank and get for instance dodge hole and vacuum adsorption hole.
The utility model also discloses a semiconductor wafer optical detection system, it includes the wafer inspection machine, moves and carries manipulator and aforementioned semiconductor wafer optical detection equipment.
The beneficial effects of the utility model are that: the utility model has the advantages of simple structure, high automation degree and high detection efficiency, and realizes the point screen of the semiconductor chip on the wafer by introducing the integrating sphere module, thereby replacing the defect of low efficiency caused by using a probe card to detect the electrical characteristics of the chip in the prior EDS process;
furthermore, the utility model discloses a second is got for instance unit and lighting unit can be located the same side of wafer, perhaps second is got for instance unit and lighting unit and is located the different sides of wafer, because the light spot of getting into of semiconductor chip can get into the light from both sides and light, so can rationally arrange the relative position of second is got for instance unit, lighting unit according to customer's needs;
furthermore, the utility model introduces the transfer module and integrates the first image capturing unit and the second image capturing unit on the transfer module, so that the utility model has higher integration level and smaller occupied space;
furthermore, the utility model realizes the adjustment of the space position and the space angle of the second image capturing unit by introducing the first rotating module, the first fixed frame and the first swinging frame, so that the utility model can be suitable for the detection of wafers with various types and sizes;
furthermore, the utility model discloses an introduce first image capture unit to realize the accurate acquisition of wafer position, thereby be convenient for the accurate regulation of carrier module upper mounting platform position;
furthermore, the utility model discloses through set up the range finding sensor on first fixed frame, thus realized the accurate focusing of second getting for instance unit;
furthermore, the integrating sphere module of the present invention comprises a second rotating module, a second fixed frame and a second swinging frame, and the technical solution can realize that the lighting unit can vertically irradiate each light-entering spot on each semiconductor chip quickly and accurately;
further, the utility model discloses an adjusting unit includes first sharp module, the sharp module of second and microscope carrier, and this structure not only can dock the upper reaches and carry the manipulator, and the position that can rationally adjust the wafer moreover, the wafer that is located on the microscope carrier has three degree of freedom: axial position adjustment of the first shaft, axial position adjustment of the second shaft and rotation adjustment around a central shaft of the wafer;
furthermore, the carrier of the utility model is provided with a positioning groove, and the positioning groove is internally provided with an image capture avoiding hole and a vacuum adsorption hole, which is more beneficial to positioning the wafer;
further, the utility model also discloses a semiconductor wafer optical detection system, it includes the wafer inspection machine, move and carry manipulator and aforementioned semiconductor wafer optical detection equipment, this system is through manipulator transport wafer to wafer inspection machine, the wafer snatchs again by the manipulator after the correction and moves the carrier module that moves to semiconductor wafer optical detection equipment, fix and the automatic alignment is rectified to the wafer simultaneously, whole journey need not remove the wafer, avoid wearing and tearing fragment, the accuracy that the wafer detected has effectively been improved, semiconductor wafer optical detection equipment's integrating sphere optical component cooperation detects the module and carries out relevant parameter detection, thereby degree of automation is high, very big promotion the detection efficiency of wafer.
Drawings
FIG. 1 is a schematic diagram of an optical inspection apparatus for semiconductor wafers according to the present invention;
fig. 2 is a schematic view of a carrier module of an optical inspection apparatus for semiconductor wafers according to the present invention;
fig. 3 is a schematic view of a stage of the optical inspection apparatus for semiconductor wafers according to the present invention;
FIG. 4 is a schematic view of a wafer-supporting stage of the optical inspection apparatus for semiconductor wafers according to the present invention;
FIG. 5 is a schematic view of a detecting module of the optical detecting apparatus for semiconductor wafers according to the present invention;
fig. 6 is a side view of a detecting module of the optical detecting apparatus for semiconductor wafers according to the present invention;
FIG. 7 is a schematic diagram of an integrating sphere module of an optical inspection apparatus for semiconductor wafers according to the present invention;
fig. 8 is a side view of the integrating sphere module of the optical inspection apparatus for semiconductor wafers according to the present invention;
fig. 9 is a front view of a semiconductor wafer optical inspection system of the present invention;
fig. 10 is a top view of a semiconductor wafer optical inspection system in accordance with the present invention;
FIG. 11 is a schematic view of a wafer;
in the figure: the system comprises a carrier module 1, a carrier module 2, a position correcting module 3, an integrating sphere module 4, a detection module 5, a wafer 6, a transfer module 7, a first rotating module 8, a first fixed frame 9, a first swinging frame 10, a distance measuring sensor 11, a second rotating module 12, a second fixed frame 13, a second swinging frame 14, a wafer correcting machine 15, a transfer manipulator 15, a carrying platform 1.1, a regulating unit 1.2, a first image capturing unit 2.1, an illuminating unit 3.1, a second image capturing unit 4.1, a semiconductor chip 5.1, a first straight line module 1.22, a second straight line module 1.11, a positioning groove 1.12, an image capturing avoiding hole 1.13, a vacuum adsorption hole 3.11, a light source 3.12, a light path conversion component 5.11, a light entering point and a light emitting area 5.12.
Detailed Description
The technical solutions (including the preferred technical solutions) of the present invention are further described in detail below by means of the attached drawings and some optional embodiments of the present invention. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in the accompanying drawing 1, the utility model discloses a semiconductor wafer optical detection device, which can light a wafer 5 based on an integrating sphere module 3, and can detect the optical performance of the wafer 5 (such as appearance, color uniformity/brightness, diffuse light, color contrast, color temperature and the like) based on a detection module 4, and comprises a carrier module 1, a position correction module 2, an integrating sphere module 3 and a detection module 4; the carrier module 1 comprises a carrier platform 1.1 for bearing the wafer 5 and an adjusting unit 1.2 for adjusting the spatial position of the carrier platform 1.1; the position correction module 2 comprises a first image capturing unit 2.1 for acquiring the position information of the wafer 5; the integrating sphere module 3 comprises an illumination unit 3.1 for time-sharing lighting of a semiconductor chip 5.1 on the wafer 5; the inspection module 4 includes a second image capturing unit 4.1 for time-sharing capturing the illuminated semiconductor chips 5.1 on the wafer 5.
As shown in fig. 11, the utility model discloses a wafer 5 is last to be provided with 4 semiconductor chip 5.1, every semiconductor chip 5.1 includes 3 light incident point 5.11 (RGB) and 2 light emitting areas 5.12, when the 1 st light incident point 5.11 on the 3 single vertical irradiation 1 semiconductor chip 5.1 of integrating sphere module, light emitting area 5.12 is lighted, the second is got for instance unit 4.1 and is got for its back, 2 nd light incident point 5.11 on the same 1 semiconductor chip 5.1 of 3 single vertical irradiation of integrating sphere module, light emitting area 5.12 is lighted again, the second is got for instance unit 4.1 and is got for its back, 3 single vertical irradiation 3 of integrating sphere module is got for instance for 3 light incident points 5.11 on the same 1 semiconductor chip 5.1, light emitting area 5.12 is lighted again, the second is got for instance unit 4.1 and is got for its, accomplish 1 detection of semiconductor chip 5.1, the detection step of other semiconductor chip 5.1 is the same with above. It should be noted that the utility model discloses a first image capture unit 2.1's effect lies in obtaining the position of wafer 5, ensures that semiconductor chip 5.1 on wafer 5 is located the shooting field of view of second image capture unit 4.1, if both have the deviation, then can adjust this position deviation of position automatic compensation of microscope stage 1.1 through adjusting element 1.2.
The utility model discloses an in an preferred embodiment, the second is got for instance unit 4.1 and lighting unit 3.1 and is located same one side of wafer 5, perhaps the second is got for instance unit 4.1 and lighting unit 3.1 and is located the different sides of wafer 5, above-mentioned two technical scheme can be based on wafer 5 in semiconductor chip 5.1 number reasonable selection, the second is got for instance unit 4.1 and lighting unit 3.1 and is located the different sides of wafer 5, both are difficult for taking place to interfere, but it is comparatively difficult to maintain the replacement, the second is got for instance unit 4.1 and lighting unit 3.1 and is more do benefit to when being located same one side of wafer 5 and maintains the change.
The utility model discloses an in a preferred embodiment, as shown in fig. 1, including can be in the space along three axial displacement move carry the module 6, move and carry the module 6 and can be assembled by the sharp module that three two liang of mutually perpendicular arranged and form, move and carry module 6 and preferably install on the portal frame, move the removal end that carries module 6 and be connected with first get for instance unit 2.1 and second get for instance unit 4.1.
In a preferred embodiment of the present invention, as shown in fig. 5 to 6, the moving end of the transferring module 6 is connected to a first rotating module 7 capable of rotating around a third axis, the rotating end of the first rotating module 7 is connected to a first fixed frame 8, the first fixed frame 8 is provided with a first swinging frame 9 capable of swinging around a second axis, the first fixed frame 8 and the first swinging frame 9 can be connected through an arc-shaped guide rail slider mechanism, the central axis of the arc-shaped guide rail is the second axis, the first swinging frame 9 is connected to a second image capturing unit 4.1, and the first fixed frame 8 is connected to a first image capturing unit 2.1; the imaging optical axis of the second imaging unit 4.1 is perpendicular to the second axis, and the imaging optical axis of the first imaging unit 2.1 is perpendicular to the wafer 5; it is understood that the degrees of freedom of the second image capturing unit 4.1 are as follows: which can rotate around the Z axis, swing relative to the Z axis in the XOZ plane and swing relative to the Z axis in the YOZ plane.
In a preferred embodiment of the present invention, the first fixing frame 8 is provided with a distance measuring sensor 10 disposed along the axial extension of the third shaft, and the existence of the distance measuring sensor 10 is more favorable for the second to get the focus of the image unit 4.1.
In a preferred embodiment of the present invention, as shown in fig. 7-8, the integrating sphere module 3 further includes a second rotating module 11 capable of rotating around the first axis, the rotating end of the second rotating module 11 is connected with a second fixed frame 12, the first fixed frame 12 is provided with a second swinging frame 13 capable of swinging around the third axis, the second fixed frame 12 and the second swinging frame 13 can be connected through an arc-shaped guide rail slider mechanism, the central axis of the arc-shaped guide rail is the third axis, the second swinging frame 13 is connected with an illumination unit 3.1, it can be understood that the degree of freedom of the illumination unit 3.1 is as follows: which can rotate around the X-axis, oscillate in the XOY plane with respect to the X-axis and oscillate in the XOZ plane with respect to the X-axis.
In a preferred embodiment of the present invention, the illumination unit 3.1 includes a light source 3.11 and a light path conversion component 3.12, and an illumination beam emitted from the light source 3.11 perpendicularly irradiates the light incident point 5.11 of the semiconductor chip 5.1 through the light path conversion component 3.12.
The utility model discloses an in the preferred embodiment, regulating unit 1.2 includes the second straight line module 1.22 that the axial extension along the secondary shaft arranged, and the removal end of second straight line module 1.22 is connected with the first straight line module 1.21 that the axial extension along the primary shaft arranged, and the removal end of first straight line module 1.21 is connected with and can winds the microscope carrier 1.1 of third axle rotation, is connected through transmission such as belt drive, chain drive or gear drive between microscope carrier 1.1 and the driving source. Preferably, the first linear module 1.21 and the second linear module 1.22 may adopt a rail-slide mechanism.
The utility model discloses an in the preferred embodiment, be provided with the constant head tank 1.11 that is used for fixing a position wafer 5 on microscope carrier 1.1, the shape of constant head tank 1.11 corresponds with the shape of wafer 5, is provided with in the constant head tank 1.11 and gets for instance to dodge hole 1.12 and vacuum adsorption hole 1.13, and the diameter of constant head tank 1.11 is greater than the diameter of dodging hole 1.12, and vacuum adsorption hole 1.13 is along the center pin rotational symmetry of constant head tank 1.11 and arranges.
In a preferred embodiment of the present invention, the first image capturing unit 2.1 and the second image capturing unit 4.1 are both an optical camera and a lens.
As shown in fig. 9-10, the utility model also discloses a semiconductor wafer optical detection system, it includes wafer inspection machine 14, move and carry manipulator 15 and aforementioned semiconductor wafer optical detection equipment, wafer inspection machine 14, move and carry the upper reaches that manipulator 15 is located semiconductor wafer optical detection equipment, the system is through moving and carry manipulator 15 transport wafer 5 to wafer inspection machine 14, snatch wafer 5 by moving and carry to carrier module 1 after wafer inspection machine 14 rectifies wafer 5 again, carrier module 1 fixes and automatic alignment correction wafer 5, whole journey need not remove wafer 5, avoid wearing and tearing broken piece, the accuracy that wafer detected has effectively been improved, the utility model discloses an integrating sphere optical component cooperation optical camera carries out relevant parameter detection, degree of automation is high, very big promotion the detection efficiency of wafer. The working steps of the optical detection system for the semiconductor wafer are as follows:
s1, a transfer manipulator 15 grabs a wafer 5 from a feeding station;
s2, the transfer manipulator 15 drives the wafer 5 to transfer to the wafer correcting machine 14 (positioning and calibration);
s2.1, a camera of the wafer correcting machine 14 grabs the wafer 5 to obtain X, Y and theta position signals of the wafer;
s2.2, the wafer correcting machine 14 compensates the wafer 5 based on X, Y and theta signals obtained in S2.1;
s3, the wafer 5 is transferred to the carrier module 1 from the wafer correcting machine 14 by the transfer manipulator 15;
s4, transferring the carrier module 1 to a test station;
s4.1, the distance measuring sensor 10 confirms the working distance of the second image capturing unit 4.1 and adjusts the Z axis;
s4.2, the first image capturing unit 2.1 captures the wafer 5 to obtain X, Y and theta position signals of the wafer;
s5, the integrating sphere module 3 lights the semiconductor chip 5.1, the second image capturing unit 4.1 captures the semiconductor chip 5.1, and after the test is finished, the carrier module 1 returns to the discharging position;
s6, the transfer manipulator 15 takes the wafer 5 out of the carrier module 1 and transfers the wafer to a blanking station.
It will be understood by those skilled in the art that the foregoing is merely exemplary of the present invention, and is not intended to limit the invention to the particular embodiments, and that various modifications, combinations, substitutions, and improvements made without departing from the spirit and scope of the invention are within the scope of the invention.
Claims (10)
1. An optical inspection apparatus for semiconductor wafers, comprising: comprises a carrier module (1), a position correction module (2), an integrating sphere module (3) and a detection module (4);
the carrier module (1) comprises a carrier platform (1.1) for bearing a wafer (5) and an adjusting unit (1.2) for adjusting the space position of the carrier platform (1.1);
the position correction module (2) comprises a first image capturing unit (2.1) for acquiring the position information of the wafer (5);
the integrating sphere module (3) comprises an illumination unit (3.1) for lighting a semiconductor chip (5.1) on the wafer (5) in a time-sharing manner;
the detection module (4) comprises a second image capturing unit (4.1) for time-sharing shooting the semiconductor chip (5.1) which is lighted on the wafer (5).
2. The semiconductor wafer optical inspection apparatus of claim 1, wherein: the second image capturing unit (4.1) and the illuminating unit (3.1) are located on the same side of the wafer (5), or the second image capturing unit (4.1) and the illuminating unit (3.1) are located on different sides of the wafer (5).
3. The optical inspection apparatus for semiconductor wafers as claimed in claim 1, wherein: the device comprises a transfer module (6) capable of moving along three axial directions in space, wherein the moving end of the transfer module (6) is connected with a first image capturing unit (2.1) and a second image capturing unit (4.1).
4. The optical inspection apparatus for semiconductor wafers as claimed in claim 3, wherein: a moving end of the transferring module (6) is connected with a first rotating module (7) capable of rotating around a third axis, a rotating end of the first rotating module (7) is connected with a first fixed frame (8), a first swinging frame (9) capable of swinging around a second axis is arranged on the first fixed frame (8), the first swinging frame (9) is connected with a second image capturing unit (4.1), and the first fixed frame (8) is connected with a first image capturing unit (2.1); the image capturing optical axis of the second image capturing unit (4.1) is vertical to the second axis, and the image capturing optical axis of the first image capturing unit (2.1) is vertical to the wafer (5).
5. The optical inspection apparatus for semiconductor wafers as claimed in claim 4, wherein: and a distance measuring sensor (10) arranged along the axial extension of the third shaft is arranged on the first fixed frame (8).
6. The optical inspection apparatus for semiconductor wafers as claimed in claim 1, wherein: integrating sphere module (3) still include the rotatory module of second (11) that can wind the primary shaft rotation, the rotatory end of the rotatory module of second (11) is connected with second fixed frame (12), be provided with on second fixed frame (12) and be connected with second swing frame (13) that can wind the swing of third axle, be connected with on second swing frame (13) lighting unit (3.1).
7. The optical inspection apparatus for semiconductor wafers as claimed in claim 1, wherein: the lighting unit (3.1) comprises a light source (3.11) and a light path conversion component (3.12), wherein a lighting beam emitted by the light source (3.11) vertically irradiates the semiconductor chip (5.1) through the light path conversion component (3.12).
8. The optical inspection apparatus for semiconductor wafers as claimed in claim 1, wherein: the adjusting unit (1.2) comprises a second linear module (1.22) arranged along the axial extension of the second shaft, the moving end of the second linear module (1.22) is connected with a first linear module (1.21) arranged along the axial extension of the first shaft, the moving end of the first linear module (1.21) is connected with the carrying platform (1.1) capable of rotating around the third shaft, and the carrying platform (1.1) is in transmission connection with a driving source.
9. The optical inspection apparatus for semiconductor wafers as claimed in claim 1, wherein: the wafer positioning device is characterized in that a positioning groove (1.11) used for positioning the wafer (5) is formed in the carrying platform (1.1), and an image taking avoiding hole (1.12) and a vacuum adsorption hole (1.13) are formed in the positioning groove (1.11).
10. An optical inspection system for semiconductor wafers, comprising: comprising a wafer aligner (14), a transfer robot (15) and a semiconductor wafer optical inspection apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221524291.0U CN217719502U (en) | 2022-06-17 | 2022-06-17 | Semiconductor wafer optical detection equipment and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221524291.0U CN217719502U (en) | 2022-06-17 | 2022-06-17 | Semiconductor wafer optical detection equipment and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217719502U true CN217719502U (en) | 2022-11-01 |
Family
ID=83802218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221524291.0U Active CN217719502U (en) | 2022-06-17 | 2022-06-17 | Semiconductor wafer optical detection equipment and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217719502U (en) |
-
2022
- 2022-06-17 CN CN202221524291.0U patent/CN217719502U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101108672B1 (en) | Vision inspection apparatus and vision inspection method therefor | |
| TWI395287B (en) | Substrate position detecting device and its imaging device position adjusting method | |
| US8089622B2 (en) | Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers | |
| JP4938782B2 (en) | Method and apparatus utilizing optical criteria | |
| EP3316039B1 (en) | Wafer alignment method and apparatus for overlay measurement | |
| KR101442792B1 (en) | Method for Inspecting Sapphire Wafer | |
| CN111307421A (en) | Lens defect detection system | |
| US4200393A (en) | Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same | |
| KR102393237B1 (en) | Conductive ball inspection and repair device | |
| KR20190032195A (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| CN115254644A (en) | Four-side detection equipment and method for DFB chip | |
| CN216081976U (en) | Screen detection device | |
| WO2017142132A1 (en) | Marking position correcting apparatus and method | |
| CN217719502U (en) | Semiconductor wafer optical detection equipment and system | |
| KR20220089639A (en) | Die bonding apparatus and manufacturing method of semiconductor device | |
| KR101917720B1 (en) | Wafer marking apparatus and method for marking wafer | |
| CN112087621B (en) | Lens detection apparatus and method | |
| CN218885376U (en) | Display module assembly check out test set | |
| KR100316456B1 (en) | Method and device for inspecting the fluorescent screen of cathod ray tube | |
| JP2011177771A (en) | Laser beam machining method, laser beam machining apparatus, and method for manufacturing solar panel | |
| WO1991013535A1 (en) | Vision system for inspection of electronic components | |
| KR20190106098A (en) | Vision inspection module, device inspection system having the same and device inspection method using the same | |
| CN202196084U (en) | Test probe table of image sensor chip | |
| US20100150430A1 (en) | Visual inspection apparatus and visual inspection method for semiconductor laser chip or semiconductor laser bar | |
| CN212218482U (en) | Mechanical arm calibration device of wafer transfer mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |