JPH06151517A - Film carrier - Google Patents

Abstract

PURPOSE:To enable easy execution of a gate processing which is needed after a semiconductor device for which a film carrier is used is sealed with resin. CONSTITUTION:In a film carrier 1 which is used for a resin-sealed type semiconductor device to be molded by resin, a metal plating film 10 having low adhesion to resin is formed on a part corresponding to a runner 17 of a bottom tool 12, of the surface Q of a base film material of an outer-peripheral frame part 2b of a base film 2 held by a top force 11 and the bottom tool 12 between. The resin flowing through the runner 17 at the time of resin sealing comes into contact with the surface of the metal plating film 10 alone. Since the adhesion of the metal plating film 10 to the resin is lower than that of the base film material, a residue 22 of resin setting in the runner 17 can be peeled off simply from the surface of the metal plating film 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier used in a resin-sealed semiconductor device molded with a resin.

[0002]

2. Description of the Related Art TAB (Tape
Automated Bonding) method is known. This TAB
As shown in FIG. 3 and FIG. 4, for example, a plurality of leads 3 made of a conductive metal material such as copper foil are formed on a flexible and insulating base film 2 made of a polyimide resin or the like. This is a method in which the respective leads 3 and a plurality of electrodes formed on the semiconductor element 4 are collectively bonded via bumps by using the film carrier 1 as described above. It should be noted that the base film 2 has a device hole 5 in which the semiconductor element 4 is located, a lead hole 6 through which the leads 3 are bridged, and a sprocket hole 7 for carrying and positioning the film carrier 1.
And a support portion 2a for supporting each lead 3
And an outer peripheral frame portion 2b forming an outer frame of the film carrier 1.
And remain.

In general, the protection of the semiconductor element 4 in the TAB method is mainly performed by sealing with a thermosetting resin, and as a sealing method, there is a transfer molding method. This transfer molding method is shown in FIG.
As shown in FIG. 2, the film carrier 1 on which the semiconductor element 4 is mounted is sandwiched by a sealing die including an upper die 11 and a lower die 12, and the upper die 11 and the lower die 12 are pressed while pressurizing the heat-melted resin. It is a method of molding the resin mold 20 by injecting it into the cavities 13 and 14 and hardening it.

[0004]

However, as shown in FIG. 4, the sealing mold in the above-mentioned transfer molding method generally has a cavity 13 from a pot which is a resin injection port of the mold. Runners (resin inflow passages) 16 and 17 leading to a gate 15 which is an entrance of
Are formed on the mating surfaces of the upper mold 11 and the lower mold 12.

Therefore, when the film carrier 1 is sandwiched by the upper mold 11 and the lower mold 12, the runners 16 and 17 come into contact with the outer peripheral frame portion 2b of the base film 2.
The resin flowing in the runners 16 and 17 at the time of resin injection is
After curing, resin residues 21 and 22 are attached to the outer peripheral frame portion 2b.

For this reason, after the film carrier 1 on which the resin mold 20 has been molded is released from the upper mold 11 and the lower mold 12, the resin residues 21 and 22 are kept on the outer periphery while the film carrier 1 is held as a gate process. It is necessary to peel off from the frame portion 2b and cut the resin residues 21 and 22 at the gate 15 portion.

However, the base film material of the outer peripheral frame portion 2b has a high adhesiveness with the resin, and in particular, in order to improve the moisture resistance of the semiconductor device, the adhesive force at the interface with the base film 2 is increased, Resins that are highly effective in preventing the ingress of moisture from the inside have been used. Therefore, it is very difficult to peel off the resin residues 21 and 22 from the outer peripheral frame portion 2b, and there is a problem that it becomes extremely difficult to perform the gate processing after the resin sealing.

Further, the outer peripheral frame portion 2b of the base film 2
The lead 3 is usually formed on the lead forming surface P among the two surfaces.
Even if there is no copper foil etc. remaining on the entire surface, the copper foil etc. that is the material of is left only with the adhesive for adhering the copper foil etc. It may be given. Therefore, the lead forming surface P of the outer peripheral frame portion 2b has higher adhesiveness to the resin than the base film material surface Q, and it is more difficult to peel off the resin residue 21 on the runner 16 side from the outer peripheral frame portion 2b. .

If the resin residues 21 and 22 attached to the outer peripheral frame portion 2b of the base film 2 are forcibly peeled off with a strong force, the flexible base film 2 bends and the leads 3 unexpectedly. There was also the problem of deformation.

Therefore, the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a film carrier capable of easily performing a gate treatment after resin encapsulation.

[0011]

In order to achieve the above object, the present invention provides a resin-encapsulated semiconductor device which is composed of a base film and leads formed on the base film and is molded with a resin. A film carrier used, in the surface of the base film sandwiched by the sealing mold, adhesiveness with the resin at a portion corresponding to the resin inflow runner provided in the sealing mold. It has a low metal plating film.

The metal plating film may be formed by gold plating.

[0013]

According to the present invention constructed as described above, the surface of the base film of the film carrier is provided with the metal plating film having low adhesiveness to the resin on the portion corresponding to the runner of the sealing die. Since it is formed, when the semiconductor element is mounted on the film carrier and sealed with resin, the resin flowing in the runner comes into contact only with the metal plating film. Since this metal plating film has low adhesion to resin,
The resin residue cured in the runner can be easily peeled off from the metal plating film, and the gate treatment after resin encapsulation can be performed very easily.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 is a bottom view of the film carrier as seen from the surface of the base film, and FIG. 2 is a line AA of FIG. 1 in a state where a semiconductor element is mounted on the film carrier and is resin-sealed using a sealing die. FIG. It should be noted that the same components as those of the conventional example are designated by the same reference numerals, and the description thereof will be omitted.

First, as shown in FIG. 2, the sealing die for resin-sealing the film carrier 1 of this embodiment is composed of an upper die 11 and a lower die 12, and the cavity 13 and The runner 17 for inflowing the resin into the lower mold 14 is the lower mold 1
It is provided only in 2.

As shown in FIGS. 1 and 2, the film carrier 1 which is resin-sealed by the sealing die has a lower surface (base film material surface Q) of the outer peripheral frame portion 2b of the base film 2 as shown in FIGS. , A metal plating film 1 having a low adhesiveness with a resin on a portion of the lower die 12 corresponding to the runner 17
0 is formed. The range of formation of the metal plating film 10 is set to be larger than the range including the portion corresponding to the runner 17.

The metal plating film 10 has a lower adhesiveness with the resin than the base film material, and chrome plating, gold plating and the like are effective. In particular, since gold plating is applied to the leads 3 of the film carrier 1 by a known means, there is no need to construct new plating equipment, which is preferable.

Then, as shown in FIG.
The film carrier 1 on which is mounted the upper mold 11 and the lower mold 12
The resin mold 20 is molded by sandwiching the resin mold with, and injecting a resin into the cavities 13 and 14 of the upper mold 11 and the lower mold 12 through the runner 17 of the lower mold 12 to cure the resin.

According to the present embodiment configured as described above, the base film material surface Q of the outer peripheral frame portion 2b of the base film 2 is bonded to the resin at the portion corresponding to the runner 17 of the lower die 12. Since the metal plating film 10 having low property is formed, the resin flowing in the runner 17 contacts only the metal plating film 10. Since the metal plating film 10 has lower adhesiveness to the resin than the base film material, the resin residue 22 cured in the runner 17
Can be easily peeled off from the metal plating film 10, and the gate treatment after resin sealing can be performed very easily.

Further, since the resin residue 22 can be easily peeled off with a weak force, the flexible base film 2 does not bend and the lead 3 can be prevented from being unexpectedly deformed. it can.

When the film carrier 1 of this embodiment is resin-sealed, the runner 17 is provided only on the lower die 12 and the metal plating film 10 is formed on the base film material surface Q of the outer peripheral frame portion 2b of the base film 2. However, runner 1
Of course, when it is provided on only one or both the upper mold 11 and the lower mold 12, the metal plating film 10 may be provided on the same surface as the lead forming surface P of the outer peripheral frame portion 2b. Thereby, even on the lead forming surface P having high adhesiveness with the resin, the remaining resin can be easily peeled off.

[0022]

As described above, according to the present invention,
Improving the moisture resistance of semiconductor devices obtained by using a sealing resin with high adhesiveness to the base film by forming a metal plating film with low adhesiveness to the resin on the surface of the base film corresponding to the runner It is possible to extremely easily perform the gate processing that is required after the semiconductor device is sealed with the resin. As a result, generation of resin residue on the gate and unexpected deformation of the leads can be prevented in advance, so that the productivity and quality of the resin-sealed semiconductor device can be significantly improved. Further, since the metal plating film of the base film corresponds to the runner, the conventional sealing mold can be used as it is.

[Brief description of drawings]

FIG. 1 is a bottom view of a film carrier according to an exemplary embodiment of the present invention, viewed from the side of a base film.

FIG. 2A of FIG. 1 in a state in which a semiconductor element is mounted on the film carrier and is resin-sealed by using a sealing die.
It is a sectional view taken along line A-A.

FIG. 3 is a plan view of a conventional film carrier.

FIG. 4B of FIG. 3 in a state in which a semiconductor element is mounted on the film carrier and is resin-sealed by using a sealing die.
FIG. 6 is a cross-sectional view taken along line B-arrow.

[Explanation of symbols]

 1 film carrier 2 base film 2b outer peripheral frame 3 lead 4 semiconductor element 10 metal plating film 11 upper mold 12 lower mold 13 cavity 14 cavity 15 gate 17 runner 20 resin mold 22 resin remaining P lead formation surface Q base film material surface

Claims (2)

[Claims] 1. A film carrier comprising a base film and leads formed on the base film, the film carrier being used in a resin-sealed semiconductor device molded with a resin, the film carrier being sandwiched between sealing molds. A film carrier characterized in that a metal plating film having low adhesiveness to a resin is formed on a portion of the surface of the base film corresponding to the resin inflow runner provided in the sealing die. 2. The film carrier according to claim 1, wherein the metal plating film is formed by gold plating.