JPH06132427A - Epoxy-resin molding material for sealing - Google Patents
Epoxy-resin molding material for sealingInfo
- Publication number
- JPH06132427A JPH06132427A JP5185374A JP18537493A JPH06132427A JP H06132427 A JPH06132427 A JP H06132427A JP 5185374 A JP5185374 A JP 5185374A JP 18537493 A JP18537493 A JP 18537493A JP H06132427 A JPH06132427 A JP H06132427A
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- Japan
- Prior art keywords
- molding material
- average particle
- particle size
- epoxy resin
- spherical silica
- Prior art date
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- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品、電子部品、
半導体等を封止するための封止用エポキシ樹脂成形材料
に関するものである。BACKGROUND OF THE INVENTION The present invention relates to electric parts, electronic parts,
The present invention relates to a sealing epoxy resin molding material for sealing a semiconductor or the like.
【０００２】[0002]
【従来の技術】近年、電気機器及び電子機器に用いられ
る半導体等の高性能化、高信頼性、及び生産性向上のた
めに、プラスチックによる封止が行われている。この半
導体等を封止する成形材料として、強度を高め、線膨張
係数を低下させるために樹脂に充填剤としてシリカを高
充填したエポキシ樹脂成形材料が知られている。しかし
ながら、例えば、フォトカプラーの発光素子と受光素子
の間を封止する成形材料には、信号伝搬の信頼性を確保
するための良好な光透過性が要求されるが、従来のエポ
キシ樹脂成形材料はこの光透過性に乏しいという問題が
あった。また、上記光透過性を改善すると、成形性が劣
化してバリ又はボイド等を生じるという問題もあった。2. Description of the Related Art In recent years, plastics have been used to improve the performance, reliability and productivity of semiconductors used in electrical and electronic equipment. As a molding material for encapsulating the semiconductor or the like, an epoxy resin molding material is known in which a resin is highly filled with silica as a filler in order to increase the strength and reduce the linear expansion coefficient. However, for example, a molding material that seals between a light emitting element and a light receiving element of a photocoupler is required to have good light transmittance to ensure reliability of signal propagation. Has a problem of poor light transmission. Further, when the above light transmittance is improved, there is a problem that the moldability is deteriorated and burrs or voids are generated.
【０００３】[0003]
【発明が解決しようとする課題】上記の事情に鑑みて、
本発明は、第一の課題として、良好な光透過性を有する
成形体が得られる封止用エポキシ樹脂成形材料を提供
し、第二の課題として、良好な成形性を有しており、同
時に、良好な光透過性を有する成形体が得られる封止用
エポキシ樹脂成形材料を提供するものである。In view of the above circumstances,
The present invention, as a first problem, provides an epoxy resin molding material for encapsulation, from which a molded product having good light transmittance is obtained, and as a second problem, has a good moldability, and at the same time, The present invention provides an epoxy resin molding material for encapsulation, from which a molded product having good light transmittance can be obtained.
【０００４】[0004]
【課題を解決するための手段】本発明の封止用エポキシ
樹脂成形材料は、第一の課題に対し、平均粒径０．１〜
５０μｍの球状シリカを充填材として充填材量の１０〜
１００重量％の範囲で含有したことを特徴とする。ま
た、第二の課題に対し、平均粒径１０〜２０μｍの破砕
状溶融シリカ、平均粒径５〜３０μｍの球状シリカ、及
び平均粒径０．１〜２μｍの微細球状シリカを充填剤と
して含有したことを特徴とする。Means for Solving the Problems The encapsulating epoxy resin molding material of the present invention has an average particle size of 0.1 to 0.1 with respect to the first object.
The spherical silica of 50 μm is used as the filler and the filler amount is 10
It is characterized in that the content is 100% by weight. Moreover, with respect to the second problem, crushed fused silica having an average particle size of 10 to 20 μm, spherical silica having an average particle size of 5 to 30 μm, and fine spherical silica having an average particle size of 0.1 to 2 μm were contained as fillers. It is characterized by
【０００５】以下本発明を詳細に説明する。本発明の封
止用エポキシ樹脂成形材料に用いるエポキシ樹脂として
は、例えば、ビフェニール型エポキシ樹脂、ビスフェノ
ールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹
脂、ノボラック型エポキシ樹脂、可撓性エポキシ樹脂、
ハロゲン化エポキシ樹脂、グリシジルエステル型エポキ
シ樹脂、高分子型エポキシ樹脂など、エポキシ樹脂全般
を用いることができる。The present invention will be described in detail below. Examples of the epoxy resin used in the encapsulating epoxy resin molding material of the present invention include biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, flexible epoxy resin,
Epoxy resins in general such as halogenated epoxy resin, glycidyl ester type epoxy resin, and polymer type epoxy resin can be used.
【０００６】本発明では、上記エポキシ樹脂の架橋剤又
は硬化剤として、特に限定されないが、例えば、フェノ
ール樹脂、メラミン樹脂、アクリル樹脂、イソシアネー
ト、ジアミン、酸無水物などを用いることができる。In the present invention, the crosslinking agent or curing agent for the epoxy resin is not particularly limited, but, for example, phenol resin, melamine resin, acrylic resin, isocyanate, diamine, acid anhydride and the like can be used.
【０００７】さらに、上記エポキシ樹脂の硬化促進剤と
して、例えば、リン系、イミダゾール系、三級アミン系
化合物等を用いることもできる。Further, as the curing accelerator for the above epoxy resin, for example, phosphorus compounds, imidazole compounds, tertiary amine compounds, etc. can be used.
【０００８】本発明の請求項１に係る封止用エポキシ樹
脂成形材料は、充填剤として、平均粒径０．１〜５０μ
ｍの球状シリカを充填剤量の１０〜１００重量％の範囲
で含有することが必須である。すなわち、上記の如き球
状シリカを用いることで、光透過性を改善するという第
一の課題を解決することができる。仮に、上記球状シリ
カの配合量が充填剤量の１０重量％未満であれば、光透
過性を改善できず、また、球状シリカの平均粒径が５０
μｍを越えると、外観不良、性能のバラツキ等の問題を
生じる。The encapsulating epoxy resin molding material according to claim 1 of the present invention has a mean particle size of 0.1 to 50 μm as a filler.
It is essential to contain m spherical silica in the range of 10 to 100% by weight of the filler amount. That is, by using the spherical silica as described above, it is possible to solve the first problem of improving the light transmittance. If the compounding amount of the spherical silica is less than 10% by weight of the filler amount, the light transmittance cannot be improved, and the average particle diameter of the spherical silica is 50%.
If it exceeds μm, problems such as poor appearance and uneven performance occur.
【０００９】本発明の請求項２に係る封止用エポキシ樹
脂成形材料は、良好な成形性と光透過性を両立するとい
う第２の課題を解決する手段として、充填剤の全体量に
対して、平均粒径１０〜２０μｍの破砕状溶融シリカを
０〜７０重量％、平均粒径５〜３０μｍの球状シリカを
１０〜９０重量％、及び平均粒径０．１〜２μｍの微細
球状シリカを０．１〜１０重量％の範囲で含有する。例
えば、フォトカプラーの発光素子と受光素子の間を上述
のエポキシ樹脂を用いた成形材料で封止した場合、充填
剤として平均粒径１０〜２０μｍの破砕状溶融シリカの
みを用いたときは、成形性は良くなるが、良好な光透過
性を得られず、一方、平均粒径５〜３０μｍの球状シリ
カを用いたときは、光透過性は向上するが、バリ又はボ
イドを生じるなど成形性が問題となる。また、平均粒径
１０〜２０μｍの破砕状溶融シリカと平均粒径５〜３０
μｍの球状シリカを混合して用いただけでは、成形性と
光透過性を十分なレベルで両立できない。これに対し、
本発明の如く、さらに充填剤として平均粒径０．１〜２
μｍの微細球状シリカを含有すると、良好な成形性と光
透過性が両立する。The epoxy resin molding material for encapsulation according to claim 2 of the present invention is a means for solving the second problem of achieving both good moldability and light transmissivity, with respect to the total amount of the filler. 0 to 70% by weight of crushed fused silica having an average particle size of 10 to 20 μm, 10 to 90% by weight of spherical silica having an average particle size of 5 to 30 μm, and 0 of fine spherical silica having an average particle size of 0.1 to 2 μm. The content is in the range of 1 to 10% by weight. For example, when the space between the light emitting element and the light receiving element of the photocoupler is sealed with the molding material using the above-mentioned epoxy resin, when only crushed fused silica having an average particle size of 10 to 20 μm is used as the filler, molding is performed. However, when spherical silica having an average particle diameter of 5 to 30 μm is used, the light transmittance is improved, but the moldability such as burrs or voids is improved. It becomes a problem. Further, crushed fused silica having an average particle size of 10 to 20 μm and an average particle size of 5 to 30
Formability and light transmission cannot be achieved at a sufficient level by simply mixing and using spherical silica of μm. In contrast,
As in the present invention, a filler having an average particle size of 0.1 to 2 is further added.
When the fine spherical silica of μm is contained, good moldability and light transmission are compatible.
【００１０】このとき、上記の各シリカの配合量は、上
記範囲外では、成形性或いは光透過性のいずれかが、実
用上問題のないレベルまで改善できない。At this time, if the amount of each silica compounded is out of the above range, either moldability or light transmittance cannot be improved to a level at which there is no practical problem.
【００１１】本発明の封止用エポキシ樹脂成形材料で
は、配合物の全体量に対する上記充填剤の配合量は、良
好な成形性を得るために、６０〜８５重量％の範囲であ
るのが好ましい。In the epoxy resin molding material for encapsulation of the present invention, the amount of the above-mentioned filler compounded with respect to the total amount of the compound is preferably in the range of 60 to 85% by weight in order to obtain good moldability. .
【００１２】本発明の封止用エポキシ樹脂成形材料は、
必要に応じて、シラン系カップリング剤、ワックス等の
離型剤を用いてもよい。The epoxy resin molding material for sealing of the present invention is
If necessary, a release agent such as a silane coupling agent or wax may be used.
【００１３】本発明の封止用エポキシ樹脂成形材料は、
上記に列挙した原料を配合、混合、混練、粉砕し、必要
に応じて造粒して用いられる。さらに、該封止用エポキ
シ樹脂成形材料を圧縮成形、トランスファー成形、射出
成形等で封止成形して成形体を得ることができる。The encapsulating epoxy resin molding material of the present invention is
The raw materials listed above are blended, mixed, kneaded, pulverized, and, if necessary, granulated and used. Further, the epoxy resin molding material for sealing can be molded by compression molding, transfer molding, injection molding or the like to obtain a molded body.
【００１４】[0014]
【実施例】以下本発明を実施例に基づいて説明する。EXAMPLES The present invention will be described below based on examples.
【００１５】実施例１及び比較例１ 実施例１は、本発明の請求項１に係る封止用エポキシ樹
脂成形材料の実施例である。（表１）に示した配合量に
従って原料を配合、混合、混練、粉砕して封止用エポキ
シ樹脂成形材料を得た。さらに、これをトランスファー
成形機を用いて、金型温度１７５℃、成形圧力５０kg／
ｃｍ2 硬化時間３分間の条件で素子を封止成形した。実
施例１及び比較例１の光透過性の評価として、光透過
率、及び散乱光の相対光強度を、自記分光光度計（日立
製作所社製、品番Ｕ−３４００）を用いて測定波長９４
０ｎｍで測定し、それぞれについて比較例１を１００と
したときの比を（表２）に示した。Example 1 and Comparative Example 1 Example 1 is an example of the epoxy resin molding material for sealing according to claim 1 of the present invention. Raw materials were blended, mixed, kneaded and pulverized according to the blending amounts shown in (Table 1) to obtain an epoxy resin molding material for sealing. Further, using a transfer molding machine, mold temperature is 175 ° C., molding pressure is 50 kg /
The element was sealed and molded under the condition that the curing time was cm 2 for 3 minutes. As the evaluation of the light transmittance of Example 1 and Comparative Example 1, the light transmittance and the relative light intensity of the scattered light were measured with a self-recording spectrophotometer (manufactured by Hitachi, Ltd., product number U-3400) at a wavelength of 94.
The measurement was carried out at 0 nm, and the ratio when Comparative Example 1 was set to 100 for each is shown in (Table 2).
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 （表２）に示した如く、実施例１は比較例１に比べて、
透過光、散乱光が共に約２倍にも増加したことがわか
る。したがって、本発明の請求項１に係る封止用エポキ
シ樹脂成形材料は光透過性の改善に有効であることが明
らかである。[Table 2] As shown in (Table 2), Example 1 is
It can be seen that both the transmitted light and the scattered light increased about twice. Therefore, it is apparent that the encapsulating epoxy resin molding material according to claim 1 of the present invention is effective for improving the light transmittance.
【００１８】実施例２〜６、及び比較例２〜４ 実施例２〜６は、本発明の請求項２に係る封止用エポキ
シ樹脂成形材料の実施例である。実施例２〜６、及び比
較例２〜４について、充填剤の内容が異なる以外は、全
て（表３）に示した配合に共通である。すなわち、エポ
キシ樹脂としてオルトクレゾールノボラックエポキシ樹
脂を１００重量部、架橋剤としてフェノールノボラック
樹脂を５０重量部、硬化促進剤としてトリフェニルホス
フィンを１重量部、カップリング剤としてエポキシシラ
ンを２重量部、離型剤としてカルナバワックスを３重量
部、及び充填剤としてシリカを３６０重量部配合した。
上記充填剤の内容については、破砕状溶融シリカ（平均
粒径１５μｍ）、球状シリカ（平均粒径２０μｍ）、微
細球状シリカ（平均粒径１μｍ）を（表４）に示した配
合量で配合した。上記の如く配合した後、混合、混練、
粉砕して封止用エポキシ樹脂成形材料を得た。Examples 2 to 6 and Comparative Examples 2 to 4 Examples 2 to 6 are examples of the epoxy resin molding material for encapsulation according to claim 2 of the present invention. All of Examples 2 to 6 and Comparative Examples 2 to 4 are common to the formulations shown in (Table 3) except that the content of the filler is different. That is, 100 parts by weight of ortho-cresol novolac epoxy resin as an epoxy resin, 50 parts by weight of phenol novolac resin as a cross-linking agent, 1 part by weight of triphenylphosphine as a curing accelerator, 2 parts by weight of epoxysilane as a coupling agent, 3 parts by weight of carnauba wax as a mold agent and 360 parts by weight of silica as a filler were compounded.
Regarding the content of the filler, crushed fused silica (average particle size 15 μm), spherical silica (average particle size 20 μm), and fine spherical silica (average particle size 1 μm) were compounded in the compounding amounts shown in (Table 4). . After compounding as above, mixing, kneading,
It was pulverized to obtain an epoxy resin molding material for sealing.
【００１９】[0019]
【表３】 実施例２〜６及び比較例２〜４の性能評価 実施例２〜６及び比較例２〜４について、光透過性の評
価として光透過率を測定し、成形性の評価としてバリフ
ロー試験を行った。[Table 3] Performance Evaluation of Examples 2 to 6 and Comparative Examples 2 to 4 For Examples 2 to 6 and Comparative Examples 2 to 4, light transmittance was measured as an evaluation of light transmittance, and a variflow test was performed as an evaluation of moldability. .
【００２０】光透過率については、上記の如くして得た
封止用エポキシ樹脂成形材料をトランスファー成形して
厚さ１ｍｍの試験片を作製し、この試験片の赤外光透過
率（波長９４０ｎｍ）を自記分光光度計（日立製作所社
製、品番Ｕ−３４００）を用いて測定した。Regarding the light transmittance, the epoxy resin molding material for sealing obtained as described above was transfer-molded to prepare a test piece having a thickness of 1 mm, and the infrared light transmittance (wavelength: 940 nm) of this test piece was measured. ) Was measured using a self-recording spectrophotometer (manufactured by Hitachi, Ltd., product number U-3400).
【００２１】バリフロー試験について説明する。バリフ
ロー試験は、バリフロー測定用金型を用いてトランスフ
ァー成形を行う。上記バリフロー測定用金型は、金型の
上面の中央にポット（直径４０ｍｍ）を有し、このポッ
トに連通して放射状に形成されたスリットを１０本備え
た雌型金型と、上面から下面に貫通したポット（直径４
０ｍｍ）を有する雄型金型から構成されており、この雌
型金型の上面に雄型金型を重ねて用いる。上記スリット
には、幅５ｍｍ、スリットの厚さがそれぞれ１０、２
０、３０、５０、１００μｍの５種類がある。バリフロ
ー試験方法は、上記バリフロー測定用金型のポット内に
成形材料を投入してトランスファー成形を行い、そのと
き成形材料がスリットを流動した長さをノギスで測定
し、この値をバリフロー（ｍｍ）とする。バリフロー試
験の測定条件は、金型表面温度１７０℃、成形材料の投
入量１５ｇ，成形材料の注入圧力７０ｋｇｆ／ｃｍ2 ，
硬化時間１００秒、試験回数ｎ＝２で行った。今回の評
価は、厚さ２０μｍのスリットにおけるバリフロー（ｍ
ｍ）を測定して行った。バリフローの値は小さいほど、
バリ等を発生しにくい成形材料である。The variflow test will be described. In the burr flow test, transfer molding is performed using a mold for burr flow measurement. The above-mentioned mold for measuring variflow has a pot (diameter 40 mm) in the center of the upper surface of the mold, and a female mold having 10 slits formed in a radial shape in communication with the pot, and from the upper surface to the lower surface. Through the pot (diameter 4
0 mm) of the male mold, and the male mold is used by stacking it on the upper surface of this female mold. The slit has a width of 5 mm and a slit thickness of 10 and 2, respectively.
There are five types, 0, 30, 50 and 100 μm. In the variflow test method, the molding material is put into the pot of the above-mentioned mold for variflow measurement, and transfer molding is performed. At that time, the length of the molding material flowing through the slit is measured with a caliper, and this value is variflow (mm). And The measurement conditions of the variflow test are: mold surface temperature 170 ° C., injection amount of molding material 15 g, injection pressure of molding material 70 kgf / cm 2 ,
The curing time was 100 seconds, and the number of tests was n = 2. This evaluation is based on the variflow (m
m) was measured. The smaller the variflow value,
A molding material that does not easily generate burrs.
【００２２】[0022]
【表４】 （表４）より、微細球状シリカを含有した実施例２〜６
では、光透過率が２０％以上、バリフローが２ｍｍ以下
を同時に達成しているが、破砕状溶融シリカのみを含有
した比較例２では光透過率が２０％未満であり、球状シ
リカ（２０μｍ）のみを含有した比較例３と、破砕状溶
融シリカと球状シリカを含有し、微細球状シリカを含有
しない比較例４では、バリフローが２ｍｍ以上であっ
た。すなわち、本発明の封止用エポキシ樹脂成形材料を
用いて得られた成形体は、光透過性及び成形性が同時に
良好であった。[Table 4] From Table 4, Examples 2 to 6 containing fine spherical silica
, The light transmittance was 20% or more and the variflow was 2 mm or less at the same time. However, in Comparative Example 2 containing only crushed fused silica, the light transmittance was less than 20%, and only spherical silica (20 μm) was used. In Comparative Example 3 containing No. 1 and Comparative Example 4 containing crushed fused silica and spherical silica but not fine spherical silica, the variflow was 2 mm or more. That is, the molded product obtained by using the encapsulating epoxy resin molding material of the present invention was excellent in both light transmittance and moldability.
【００２３】[0023]
【発明の効果】本発明の封止用エポキシ樹脂成形材料
は、例えばフォトカプラー等の電気部品或いは電子部品
に有用であり、本発明の請求項１に係る封止用エポキシ
樹脂成形材料は良好な光透過性を有する成形体を提供
し、本発明の請求項２に係る封止用エポキシ樹脂成形材
料は、良好な成形性を有しており、同時に、良好な光透
過性を有する成形体を供給することができる。Industrial Applicability The encapsulating epoxy resin molding material of the present invention is useful for electric parts or electronic parts such as photocouplers, and the encapsulating epoxy resin molding material according to claim 1 of the present invention is excellent. Provided is a molded product having light transmittance, and the epoxy resin molding material for encapsulation according to claim 2 of the present invention has good moldability, and at the same time, a molded product having good light transmittance. Can be supplied.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 33/00 Ｎ 7514−4Ｍ Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 33/00 N 7514-4M
Claims (2)
を充填剤として充填剤量の１０〜１００重量％の範囲で
含有したことを特徴とする封止用エポキシ樹脂成形材
料。1. An epoxy resin molding material for encapsulation, comprising spherical silica having an average particle diameter of 0.1 to 50 μm as a filler in an amount of 10 to 100% by weight of the amount of the filler.
〜２０μｍの破砕状溶融シリカを０〜７０重量％、平均
粒径５〜３０μｍの球状シリカを１０〜９０重量％、及
び平均粒径０．１〜２μｍの微細球状シリカを０．１〜
１０重量％の範囲で含有したことを特徴とする封止用エ
ポキシ樹脂成形材料。2. An average particle size of 10 with respect to the total amount of the filler.
0 to 70% by weight of crushed fused silica having an average particle size of 20 μm, 10 to 90% by weight of spherical silica having an average particle size of 5 to 30 μm, and 0.1 to 2% fine spherical silica having an average particle size of 0.1 to 2 μm.
An epoxy resin molding material for encapsulation, which is contained in an amount of 10% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5185374A JP2874524B2 (en) | 1992-09-03 | 1993-07-27 | Epoxy molding compound for sealing |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23618492 | 1992-09-03 | ||
| JP4-236184 | 1992-09-03 | ||
| JP5185374A JP2874524B2 (en) | 1992-09-03 | 1993-07-27 | Epoxy molding compound for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06132427A true JPH06132427A (en) | 1994-05-13 |
| JP2874524B2 JP2874524B2 (en) | 1999-03-24 |
Family
ID=26503064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5185374A Expired - Lifetime JP2874524B2 (en) | 1992-09-03 | 1993-07-27 | Epoxy molding compound for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2874524B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
| WO1999032553A1 (en) * | 1997-12-23 | 1999-07-01 | Cookson Singapore Pte Ltd. | Epoxy mold compound and method |
| KR100665180B1 (en) * | 2005-05-31 | 2007-01-09 | 삼성전기주식회사 | Light emitting diode package and method of faricatiing the same |
| JP2007235085A (en) * | 2006-02-03 | 2007-09-13 | Hitachi Chem Co Ltd | Method of manufacturing package substrate for packaging optical semiconductor element and method of manufacturing optical semiconductor device using the same |
| JP2015096611A (en) * | 2006-11-15 | 2015-05-21 | 日立化成株式会社 | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element using the resin composition, and optical semiconductor device |
| WO2016136075A1 (en) * | 2015-02-27 | 2016-09-01 | 株式会社日立製作所 | Electrical insulation resin composition, electrical insulation resin cured product using same, and receiving and transforming equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01266152A (en) * | 1988-04-18 | 1989-10-24 | Nippon Steel Chem Co Ltd | Silica used as filler in sealing resin |
| JPH05206333A (en) * | 1992-01-27 | 1993-08-13 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and hardened one thereof |
-
1993
- 1993-07-27 JP JP5185374A patent/JP2874524B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01266152A (en) * | 1988-04-18 | 1989-10-24 | Nippon Steel Chem Co Ltd | Silica used as filler in sealing resin |
| JPH05206333A (en) * | 1992-01-27 | 1993-08-13 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and hardened one thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
| WO1999032553A1 (en) * | 1997-12-23 | 1999-07-01 | Cookson Singapore Pte Ltd. | Epoxy mold compound and method |
| US6214905B1 (en) | 1997-12-23 | 2001-04-10 | Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. | Epoxy mold compound and method |
| KR100665180B1 (en) * | 2005-05-31 | 2007-01-09 | 삼성전기주식회사 | Light emitting diode package and method of faricatiing the same |
| JP2007235085A (en) * | 2006-02-03 | 2007-09-13 | Hitachi Chem Co Ltd | Method of manufacturing package substrate for packaging optical semiconductor element and method of manufacturing optical semiconductor device using the same |
| JP2015096611A (en) * | 2006-11-15 | 2015-05-21 | 日立化成株式会社 | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element using the resin composition, and optical semiconductor device |
| US9387608B2 (en) | 2006-11-15 | 2016-07-12 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| JP2017020026A (en) * | 2006-11-15 | 2017-01-26 | 日立化成株式会社 | Thermosetting resin composition for light reflection and substrate for mounting optical semiconductor element and optical semiconductor device using the resin composition |
| US10381533B2 (en) | 2006-11-15 | 2019-08-13 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection |
| WO2016136075A1 (en) * | 2015-02-27 | 2016-09-01 | 株式会社日立製作所 | Electrical insulation resin composition, electrical insulation resin cured product using same, and receiving and transforming equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2874524B2 (en) | 1999-03-24 |
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