JPH06132400A - Layout method of semiconductor integrated circuit - Google Patents

Layout method of semiconductor integrated circuit

Info

Publication number
JPH06132400A
JPH06132400A JP4283359A JP28335992A JPH06132400A JP H06132400 A JPH06132400 A JP H06132400A JP 4283359 A JP4283359 A JP 4283359A JP 28335992 A JP28335992 A JP 28335992A JP H06132400 A JPH06132400 A JP H06132400A
Authority
JP
Japan
Prior art keywords
wiring
terminal
length
actual
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4283359A
Other languages
Japanese (ja)
Inventor
Ryutaro Kawai
龍太郎 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP4283359A priority Critical patent/JPH06132400A/en
Publication of JPH06132400A publication Critical patent/JPH06132400A/en
Pending legal-status Critical Current

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  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To lessen a semiconductor integrated circuit in design time by a method wherein an actual wiring is adjusted in area and route so as to make an actual wiring and a virtual wiring equal to each other in capacity when an actual wiring and a virtual wiring are different from each other in length after a layout-wiring operation is finished. CONSTITUTION:If a delay value caused by the virtual wiring length of a route from a terminal A to a terminal B is 3 (=1+2), an actual wiring is adjusted in area (length, width) and route conforming to the delay value caused by a load of the virtual wiring length of a route from a terminal A to a terminal B so as to set a delay time t1+t2 from the terminal A to the terminal B equal to the same delay value of 3 with the virtual wiring. That is, provided that t1 and t2 are 0.6 and 2.7 respectively in an actual wiring, t2 is set to 2.4 (=3-0.6).

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、配置を決定すべき回路
素子間に仮配線長を与えて動作をシミュレーションした
後、配置・配線を行う半導体集積回路のレイアウト手法
に係り、特に、配置・配線後の実配線長と前記仮配線長
の間に差が生じたときの、再レイアウトや回路修正及び
再レイアウト後のシミュレーションを省略して、設計期
間を短縮することが可能な半導体集積回路のレイアウト
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a layout method of a semiconductor integrated circuit in which a temporary wiring length is given between circuit elements whose layout is to be determined, and then the operation is simulated, and more particularly, the layout method of the semiconductor integrated circuit is arranged. A semiconductor integrated circuit capable of shortening the design period by omitting relayout, circuit correction, and simulation after relayout when a difference occurs between the actual wiring length after wiring and the temporary wiring length. It relates to a layout method.

【0002】[0002]

【従来の技術】一般に、半導体集積回路のレイアウトに
際しては、図1に示す如く、配置を決定すべき回路素子
P1、P2、P3間に、仮配線長(1)(2)を与えて
動作をシミュレーションする。この仮配線長シミュレー
ション時には、ある定められた式により、実配線長にな
る予想配線長(仮配線長)によってシミュレーションを
行う。
2. Description of the Related Art In general, when laying out a semiconductor integrated circuit, as shown in FIG. Simulate. At the time of this tentative wiring length simulation, the simulation is performed with an expected wiring length (temporary wiring length) that becomes an actual wiring length according to a predetermined formula.

【0003】この仮配線長シミュレーションにより、正
常に動作することを確認した上で、配置・配線を行う。
By this tentative wiring length simulation, it is confirmed that the circuit operates normally, and then the placement and wiring are performed.

【0004】すると、配置・配線後の実配線長(0.
8)(1.9)と前記仮配線長(1)(2)の間に差が
生じるため、仮配線シミュレーション時になかったタイ
ミングエラー(セットアップ、ホールドタイム)が出る
ことがある。
Then, the actual wiring length (0.
8) Since there is a difference between (1.9) and the tentative wiring lengths (1) and (2), timing errors (setup, hold time) not present during the tentative wiring simulation may occur.

【0005】[0005]

【発明が解決しようとする課題】従って従来は、前記実
配線長(0.8)(1.9)により実配線長シミュレー
ションを行って、回路が正常に動作することを再確認す
る必要があった。特に、この実配線長シミュレーション
で正常に動作しなかった場合には、配置・配線をやり直
したり、甚だしい場合には、回路図修正にまで戻って作
業をし直す必要があった。
Therefore, conventionally, it is necessary to reconfirm that the circuit operates normally by performing an actual wiring length simulation with the actual wiring length (0.8) (1.9). It was In particular, if the actual wiring length simulation does not operate normally, it is necessary to re-arrange the layout and wiring, and if it is severe, it is necessary to return to the circuit diagram correction and perform the work again.

【0006】本発明は、前記従来の問題点を解消するべ
く成されたもので、配置・配線前に行う仮配線長シミュ
レーションだけで論理確認を完了することができ、従っ
て、設計期間を短縮することが可能な半導体集積回路の
レイアウト方法を提供することを目的とする。
The present invention has been made to solve the above-mentioned conventional problems, and the logical confirmation can be completed only by the tentative wiring length simulation performed before the placement / wiring, thus shortening the design period. It is an object of the present invention to provide a layout method of a semiconductor integrated circuit capable of performing the above.

【0007】[0007]

【課題を解決するための手段】本発明は、配置を決定す
べき回路素子間に仮配線長を与えて動作をシミュレーシ
ョンした後、配置・配線を行う半導体集積回路のレイア
ウト方法において、配置・配線後の実配線長と前記仮配
線長の間に差が生じたときは、両者の静電容量が一致す
るよう、実配線の面積や経路を調整することにより、前
記目的を達成したものである。
SUMMARY OF THE INVENTION The present invention provides a layout method of a semiconductor integrated circuit in which a temporary wiring length is given between circuit elements whose layout is to be determined, and then the operation is simulated. When there is a difference between the actual wiring length afterwards and the temporary wiring length, the area and the route of the actual wiring are adjusted so that the capacitances of the two become the same, thereby achieving the above object. .

【0008】[0008]

【作用】本発明においては、配置・配線後の実配線長と
仮配線長シミュレーション時の仮配線長の間に差が生じ
たときに、両者の静電容量(即ち配線容量)が一致する
よう、実配線の面積や経路を調整するようにしている。
従って、配置・配線後にシミュレーションをやり直す必
要がなく、配置・配線の再実行や回路修正が不要とな
り、設計期間を短縮することができる。
In the present invention, when there is a difference between the actual wiring length after placement / wiring and the tentative wiring length during the tentative wiring length simulation, the electrostatic capacitances (ie, wiring capacitances) of both are matched. The area and route of the actual wiring are adjusted.
Therefore, it is not necessary to re-execute the simulation after the placement / wiring, and it is not necessary to re-execute the placement / wiring or to modify the circuit, and the design period can be shortened.

【0009】[0009]

【実施例】以下図面を参照して、本発明の実施例を詳細
に説明する。
Embodiments of the present invention will now be described in detail with reference to the drawings.

【0010】本実施例によるレイアウトに際しては、例
えば図2に示す如く、端子Aから端子Bに至る経路の仮
配線長による遅延値が、(1+2=3)であった場合、
該端子Aから端子Bまでの仮配線長の負荷の遅延値に合
わせて、実配線の面積(長さ、幅)や経路を調整し、端
子Aから端子Bまでの遅延値( t1 + t2 )が、仮配線
時と同じ遅延値(3)となるようにする。
In the layout according to this embodiment, for example, as shown in FIG. 2, when the delay value due to the tentative wiring length of the route from the terminal A to the terminal B is (1 + 2 = 3),
The area (length, width) and the route of the actual wiring are adjusted according to the delay value of the load of the tentative wiring length from the terminal A to the terminal B, and the delay value (t 1 + t from the terminal A to the terminal B is adjusted. 2 ) so that the delay value (3) is the same as in the temporary wiring.

【0011】即ち、例えば実配線により t1 が0.6、
t2 が2.7となった場合には、例えば t2 が2.4
(=3−0.6)となるようにする。
That is, for example, with real wiring, t 1 is 0.6,
When t 2 is 2.7, for example, t 2 is 2.4.
(= 3-0.6).

【0012】図3は、実配線の面積と遅延値 t1 、 t2
の関係の例を示したものであり、図4に示す如く、端子
Aから端子Bに至る遅延値の和( t1 + t2 )が、仮配
線長の負荷の遅延値(図では3)となるように、回路素
子P1とP2間、及び、回路素子P2とP3間の配線の
面積や経路を調整する。
FIG. 3 shows the area of the actual wiring and the delay values t 1 and t 2.
As shown in FIG. 4, the sum of the delay values from terminal A to terminal B (t 1 + t 2 ) is the delay value of the load of the tentative wiring length (3 in the figure). The wiring area and route between the circuit elements P1 and P2 and between the circuit elements P2 and P3 are adjusted so that

【0013】本実施例においては、端子Aから端子Bま
での遅延値が問題であり、回路素子P1−P2間、P2
−P3間のそれぞれの遅延値は問題でなかったため、端
子Aから端子Bに至る遅延値 t1 + t2 が仮配線長の負
荷の遅延値と一致するようにされていたが、回路素子P
1−P2間、P2−P3間のそれぞれの遅延値も問題と
なる場合には、それぞれの回路素子間の遅延値が仮配線
長の負荷の遅延値(1)、(2)と一致するように、そ
れぞれの実配線の面積や経路を調整することもできる。
In this embodiment, the delay value from the terminal A to the terminal B is a problem, and the circuit elements P1 and P2 and P2 are connected to each other.
Since each delay value between −P3 was not a problem, the delay value t 1 + t 2 from the terminal A to the terminal B was made to match the delay value of the load of the tentative wiring length.
When the delay values between 1-P2 and between P2-P3 also pose a problem, the delay values between the respective circuit elements should match the delay values (1) and (2) of the load of the tentative wiring length. In addition, the area and route of each actual wiring can be adjusted.

【0014】[0014]

【発明の効果】本発明によれば、配置・配線後の配線容
量を、配置・配線前に予想された配線容量に合わせるよ
うにしたので、配置・配線前に行った仮配線長シミュレ
ーションだけで論理確認が終了する。従って、配置・配
線後の動作シミュレーションや、配置・配線の再実行、
回路修正などが不要となり、設計期間の短縮が可能とな
る。
According to the present invention, the wiring capacitance after the placement / wiring is adapted to the wiring capacitance expected before the placement / wiring. Therefore, only the tentative wiring length simulation performed before the placement / wiring is performed. The logic check ends. Therefore, operation simulation after placement / wiring, re-execution of placement / wiring,
No circuit modification is required, and the design period can be shortened.

【図面の簡単な説明】[Brief description of drawings]

【図1】従来のレイアウト手法を説明するための線図FIG. 1 is a diagram for explaining a conventional layout method.

【図2】本発明によるレイアウト手法の実施例を示す線
FIG. 2 is a diagram showing an example of a layout method according to the present invention.

【図3】前記実施例における実配線の面積と遅延値の関
係の例を示す線図
FIG. 3 is a diagram showing an example of a relationship between an area of actual wiring and a delay value in the embodiment.

【図4】同じく、端子A−B間の合計遅延値と回路要素
P1−P2間、P2−P3間の遅延値の関係の例を示す
線図
FIG. 4 is a diagram showing an example of a relationship between a total delay value between terminals A and B and a delay value between circuit elements P1 and P2 and between P2 and P3.

【符号の説明】[Explanation of symbols]

A、B…端子 P1、P2、P3…回路素子 t1 、 t2 …遅延値A, B ... terminal P1, P2, P3 ... circuit elements t 1, t 2 ... delay value

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】配置を決定すべき回路素子間に仮配線長を
与えて動作をシミュレーションした後、配置・配線を行
う半導体集積回路のレイアウト方法において、 配置・配線後の実配線長と前記仮配線長の間に差が生じ
たときは、両者の静電容量が一致するよう、実配線の面
積や経路を調整することを特徴とする半導体集積回路の
レイアウト方法。
1. A method of laying out a semiconductor integrated circuit, wherein a temporary wiring length is given between circuit elements whose layout is to be determined, and then an operation is simulated. A layout method of a semiconductor integrated circuit, wherein when a difference occurs between wiring lengths, the area and route of the actual wiring are adjusted so that the capacitances of the two match.
JP4283359A 1992-10-22 1992-10-22 Layout method of semiconductor integrated circuit Pending JPH06132400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4283359A JPH06132400A (en) 1992-10-22 1992-10-22 Layout method of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4283359A JPH06132400A (en) 1992-10-22 1992-10-22 Layout method of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH06132400A true JPH06132400A (en) 1994-05-13

Family

ID=17664470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4283359A Pending JPH06132400A (en) 1992-10-22 1992-10-22 Layout method of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH06132400A (en)

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