JPH0613136U - Semiconductor wafer holding mechanism in semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Summary] [Purpose] When a semiconductor wafer is placed on the rotor,
That is, the semiconductor wafer is drained and dried without rattling or dancing. [Structure] A desired number of semiconductor wafer support members 3 are arranged and fixed on the outer peripheral portion of a rotor 1. A plate-like gripping pin 4 is pivotally attached to each semiconductor wafer support 3 about a shaft 5 so as to be swingable. The gripping pin 4 has a claw portion 4b and a step surface 4a at the upper end,
A recess 4c is formed at the lower end. The semiconductor wafer 7 is placed on each step surface 4a. The rotation operation of the rotor 1 causes the upper end of the gripping pin 4 to tilt toward the center of the rotor, eliminating the rattling and dancing phenomenon of the semiconductor wafer, and smoothing the process of draining and drying the semiconductor wafer.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 In the present invention, when the semiconductor wafer is completed, the semiconductor wafer is rotated at a high speed when performing the chemical treatment or the water-drying process in various processes, so that the semiconductor wafer does not dance or jump out on the rotor. The present invention relates to a semiconductor wafer holding mechanism in a semiconductor manufacturing device.

[0002]

[Prior art]

 Conventionally, a semiconductor manufacturing process includes a liquid bath dipping process, a cleaning process, a draining and drying process, etc., and a semiconductor wafer is completed as a product. In the above draining and drying step, conventionally, a semiconductor wafer holding mechanism of this kind was drained and dried by, for example, placing the semiconductor wafer on a support base of a rotor and rotating the rotor.

In the conventional technique, a semiconductor wafer is held by a support pin fixed on a rotor, the semiconductor wafer is rotated by the rotation of the rotor, and the semiconductor wafer is drained and dried. However, when the rotor is rotated, a centrifugal force is generated on the semiconductor wafer, which causes the semiconductor wafer to rattle between the support pins and to cause a dance phenomenon. In the worst case, the semiconductor wafer is There was a problem that it jumped out from the support pin and the draining and drying process of the semiconductor wafer could not be performed at all.

[0004]

[Problems to be solved by the device]

 The present invention has been devised to solve such a problem, in which a desired number of supporting members are arranged on the outer peripheral edge of a disk-shaped rotor, and swingable gripping pins are axially attached to the supporting members. When the disc-shaped rotor is rotated by placing the semiconductor wafer on the pins, the upper ends of the gripping pins are tilted toward the center of the rotor, and the force for gripping the semiconductor wafer is increased. It is an object of the present invention to provide a semiconductor wafer holding mechanism in a novel semiconductor manufacturing apparatus in which a backlash or a dance phenomenon does not occur in a semiconductor wafer even when centrifugal force is applied to the wafer.

[0005]

[Means for Solving the Problems]

 SUMMARY OF THE INVENTION In order to solve the problems existing in the prior art, the present invention provides a rotor, a desired number of semiconductor wafer supports provided on the periphery of the rotor, and an upper end tilted by a desired angle toward the center of the rotor due to the rotation of the rotor. In order to efficiently complete the draining and drying process of the semiconductor wafer mounted on a desired number of gripping pins, which is composed of gripping pins that are axially attached to each of the semiconductor wafer supporters and on which the semiconductor wafer is mounted. I realized that.

[0006]

【Example】

 An embodiment of the semiconductor wafer holding mechanism in the semiconductor manufacturing apparatus according to the present invention will be described below. 1 to 4 are views showing respective parts of a semiconductor wafer holding mechanism according to the present invention. An embodiment of the present invention will be described with reference to these drawings. A rotor 1 is fixed to a rotary shaft 2 of a motor (not shown). The rotor 1 is formed, for example, in the shape of a disk, and has a desired number of perfect circular holes 1a formed therein.

A desired number of, for example, six semiconductor wafer supporting members 3 are arranged and fixed on the outer peripheral portion of the rotor 1. The semiconductor wafer support 3 has a cylindrical carrying member and is provided with split grooves 3a each having an appropriate depth in the vertical direction. The gripping pins 4 are fitted in the split grooves 3a. The gripping pin 4 is formed in a plate shape, and a step surface 4a and a claw portion 4b are formed at the upper end. The gripping pin 4 is swingably fixed to the semiconductor wafer support 3 by a shaft 5. The gripping pin 4 is configured to be tilted toward the center of the rotor 1.

A locking pin 6 is screwed onto the lower end portion 3b of the semiconductor wafer support 3. In addition, a recess 4c is formed at the lower end of the grip pin 4. The locking pin 6 is composed of a projecting piece such as a screw or a projecting rod, and when the gripping pin 4 tilts toward the center of the rotor 1, the front end 6a hits the wall surface 4d of the recess 4c and functions as a stopper. . As shown in FIG. 4, this action causes the gripping pin 4 to rotate in the central direction of the rotor 1 by a small angle θ, for example.

Reference numeral 7 denotes a semiconductor wafer, which is formed, for example, in a disk shape, and is placed on the step surface 4 a of the desired number of gripping pins 4. This semiconductor wafer 7 is formed by printing IC elements on a substrate. Then, the semiconductor wafer 7 is completed as a product through a liquid bath dipping step, a washing step and a draining and drying step. In the figure, reference numeral 8 is an O-ring, which holds the semiconductor wafer support 3 and the gripping pin 4 in place. Reference numeral 9 is a case containing a motor, and 10 is a base for fixing the case 9.

Next, the operation will be described. The semiconductor wafer 7 washed with water or the like is placed on the step surface 4a of each gripping pin 4. Then, when an electric signal is supplied to the motor, the rotor 1 rotates. Therefore, centrifugal force is induced in the outer peripheral portion of the rotor 1 by the rotational force. Thus, as shown in FIG. 4, the gripping pin 4 tilts about the shaft 5 in the direction of the center of the rotor 1 by a minute angle θ. That is, the grip pin 4 rotates from the solid line to the position indicated by the chain double-dashed line. Then, all of the claw portions 4b of the gripping pin 4 are tilted toward the center of the rotor 1, and eventually the semiconductor wafer 7 is firmly gripped so as to be sandwiched. Even when the rotor 1 is rotated at a high speed, the semiconductor wafer 7 does not rattle on the gripping pins 4 and does not show a dancing effect. Thus, the semiconductor wafer 7 to which water or the like is attached is completely drained and dried. Of course, the semiconductor wafer 7 does not jump out from each claw portion 4b of each gripping pin 4.

When the supply of the electric signal to the motor is stopped, the rotor 1 stops, the centrifugal force induced in the rotor 1 disappears, the gripping pin 4 returns to the position shown by the solid line in FIG. The semiconductor wafer 7 whose process has been completed can be easily taken out from the claw portion 4b. When the gripping pin 4 tilts toward the center of the rotor 1, the tip 6a of the locking pin 6 collides with the recess 4c of the gripping pin 4 and the tilting movement of the gripping pin 4 is restricted.

[0012]

[Effect of device]

 The present invention includes a rotor, a desired number of semiconductor wafer supports provided on the periphery of the rotor, and the upper end of which is tilted toward the center of the rotor by a desired angle by the rotation of the rotor. Since the semiconductor wafer holding mechanism in the semiconductor manufacturing equipment, which consists of the gripping pins for mounting the wafer, is provided, the semiconductor wafer does not rattle on the gripping pins even when the rotor is rotated at high speed, and the dance phenomenon does not occur. . Moreover, the semiconductor wafer does not jump out from the gripping pins. Thus, various special effects such as the process of draining and drying the semiconductor wafer being completed smoothly and quickly can be obtained.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a semiconductor wafer holding mechanism in a semiconductor manufacturing apparatus according to the present invention.

FIG. 2 is a perspective view showing a rotor, a semiconductor wafer support, and a gripping pin of a semiconductor wafer holding mechanism according to the present invention.

FIG. 3 is a side view showing a combined configuration of a semiconductor wafer support and a gripping pin of the semiconductor wafer holding mechanism according to the present invention.

4 is a cross-sectional view taken along the line AA of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 rotor 3 semiconductor wafer support 4 gripping pin 4a step surface 4b claw 4c recess 6 locking pin 7 semiconductor wafer 8 O-ring

Claims (1)

[Scope of utility model registration request] 1. A rotor, a desired number of semiconductor wafer supports provided on a peripheral portion of the rotor, and a shaft attached to each of the semiconductor wafer supports so that an upper end of the rotor is tilted by a desired angle toward a rotor center. Also, a semiconductor wafer holding mechanism in a semiconductor manufacturing apparatus, characterized in that it is configured with a gripping pin on which a semiconductor wafer is placed.