JPH0637082A - Spinning chuck - Google Patents

Abstract

PURPOSE:To obtain a spinning chuck which can tightly fix a semiconductor wafer by providing a fan for reducing a pressure in communication holes by rotating together with a chuck body and sucking the wafer via the holes. CONSTITUTION:A fan 35 of a spinning chuck is rotated together with its chuck body 30 to reduce a pressure of communication holes 31a of a table 31. Accordingly, a semiconductor wafer 1 placed on support pins 32 implanted to the table 31 is pressed at its outer peripheral end to stopper pins 33, sucked to the holes 31a of a pressure reduced state, pressed to the pins 32 at its rear surface to be tightly fixed to the body 30. Accordingly, the wafer can be treated for the purpose without damaging.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin chuck for horizontally rotating an object to be processed, for example, a semiconductor wafer, and more particularly to a spin chuck capable of securely fixing a semiconductor wafer.

[0002]

2. Description of the Related Art Next, a conventional spin chuck for horizontally rotating a semiconductor wafer will be described with reference to FIG.

3A and 3B are explanatory views of a conventional spin chuck. FIG. 3A is a schematic side sectional view of a main part of the spin chuck, and FIG. 3B is a schematic main part of the spin chuck. FIG. 3C is a plan view schematically showing the protrusion of the semiconductor wafer.

As shown in FIGS. 3 (a) and 3 (b), a conventional spin chuck (eccentric spin chuck) includes a chuck body 20 for mounting a semiconductor wafer 11 in a horizontal state,
The rotary shaft 24 is connected to a rotating device (not shown) such as a motor to rotate the chuck body 20 in the horizontal direction.

The chuck body 20 has a disk-shaped table 21 whose rear surface center is fixed to the tip of a rotary shaft 24, and a semiconductor wafer 11 which can be slid horizontally on the surface of the table 21. A plurality of support pins 22 that are supported on the table 21 and support pins that are erected in a dot array on the surface along the outer periphery of the table 21
It is composed of a stopper pin 23 having a height higher than 22.

Therefore, the semiconductor wafer 11 is placed horizontally on the support pins 22 of the chuck body 20, and the chuck body 20 is rotated in the arrow R direction, that is, the horizontal direction via the rotary shaft 24 connected to the above-mentioned motor. Then, the semiconductor wafer 11 is fixed to the chuck body 20 with its outer peripheral end face pressed against the stopper pin 23 after sliding on the support pin 22 by the centrifugal force as shown by the arrow L.

[0007]

The semiconductor wafer 11 having a warp (curvature) for some reason is placed on the support pin 22 with its convex surface facing downward, and the chuck body 20
Rotate the semiconductor wafer 11 as shown in Fig. 3 (c).
Occasionally, due to centrifugal force, it will get over the stopper pin 23 and jump out.

The present invention has been made to solve such a problem, and an object thereof is to provide a spin chuck capable of securely fixing a semiconductor wafer.

[0009]

The above-mentioned object is, as shown in the principle explanatory diagram of the present invention of FIG. 1, a flat plate-like table 31 having a communication hole 31a which is drawn from the front surface to the back surface, and this table.
Objects to be processed, such as semiconductor wafers, are planted on the surface of 31
Multiple support pins 32 for slidably supporting 11 horizontally
And a chuck body 30 composed of stopper pins 33 which are vertically erected on the surface along the outer periphery of the table 31 and are higher than the support pins 32, and are rotated about an axis center by a rotation device. And a rotation shaft 34 for rotating the chuck body 30 in the horizontal direction together with the semiconductor wafer 11, rotating with the chuck body 30 to reduce the pressure in the communication hole 31a, and a fan 35 for sucking the semiconductor wafer 11 by the communication hole 31a. Is achieved by a spin chuck.

In FIG. 1, FIG. 1 (a) is a schematic side sectional view of the main part of the spin chuck, FIG. 1 (b) is a schematic plan view of the main part of the spin chuck, and FIG. 1 (c) is It is a figure which shows the fixed state of a semiconductor wafer typically.

[0011]

As shown in the principle explanatory diagram of the present invention of FIG. 1, in the spin chuck of the present invention, the fan 35 rotates together with the chuck body 30 to depressurize the communication hole 31a of the table 31. Therefore, the support pins 32 set up on the table 31
The semiconductor wafer 11 placed on the top of the
It is pressed against the stopper pin 33 as shown by Fa, and the inside is sucked into the communication hole 31a in the depressurized state and the back surface is pressed against the support pin 32 as shown by the arrow Fb and firmly fixed to the chuck body 30. .

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A spin dry apparatus according to an embodiment of the present invention will be described below with reference to FIG. 2A and 2B are explanatory views of a spin dry apparatus according to an embodiment of the present invention. FIG. 2A is a schematic side sectional view of a main part of a spin chuck, and FIG. FIG. 6 is a schematic side sectional view of a main part of a spin dry device configured differently.

In this specification, the same parts, the same materials and the like are designated by the same reference numerals throughout the drawings. The spin dry apparatus of one embodiment of the present invention is shown in FIG.
As shown in (a), the chuck body 30 and the chuck body 30
A short pipe-shaped ring 41 fixed to the back surface along the outer periphery of the table 31, a motor 42 connected to the rotating shaft 34, an upper box 43 for accommodating the chuck body 30 therein, and a ceiling of the upper box 43 is opened. An opening / closing door 44 that opens and closes the loading / unloading port 43a, and a lower box 45 that houses the motor 42 and supports the upper box 43 from below are included.

Next, a method for scattering a liquid, such as water droplets, adhering to the surface of the semiconductor wafer 11 immediately after cleaning with a spin dry apparatus according to an embodiment of the present invention will be described with reference to FIG.
It will be explained with reference to (a).

First, the opening / closing door 44 is moved to the loading / unloading port 43a.
The semiconductor wafer 11 is loaded into the upper box 43 from the above, and the semiconductor wafer 11 is loaded on the chuck body 30 in the upper box 43.
To place.

Then, the opening / closing door 44 is returned to its original position to close the carry-in / carry-out port 43a, and then the motor 42 is started to rotate the rotary shaft 34.
The chuck body 30 is rotated in the direction of arrow R, that is, in the horizontal direction via.

As the chuck body 30 rotates, the semiconductor wafer 11 slides on the support pins 32 by centrifugal force to press the outer peripheral end surface of the semiconductor wafer 11 against the stopper pins 33, and the fan 35 rotates to reduce the pressure. It is sucked in the direction of the communication hole 31a of the table 31 and the back surface of the table 31 is pressed against the support pin 32 to be firmly fixed to the chuck body 30.

The chuck body 30 of the semiconductor wafer 11 described above
Simultaneously with the progress of the fixing to the semiconductor wafer 11, the water droplets 12 attached to the surface of the semiconductor wafer 11 are scattered toward the stopper pin 33 by the centrifugal force, and the surface of the semiconductor wafer 11 becomes a dry state in which there are no water droplets.

As shown in FIG. 2 (a), a sliding brush grounded on the rotary shaft 34 of the spin dry apparatus of one embodiment of the present invention.
By contacting 36, the support pin 32 and the stopper pin 33 are also grounded, and the semiconductor wafer 11 firmly fixed to the chuck body 30 as described above can also be grounded.

This semiconductor wafer is grounded by the support pins 32.
Alternatively, it is of course possible to ground either one of the stopper pins 33. In addition, the fan 35 fixed to the back surface of the table 31 of the chuck body 30 of the spin dry apparatus according to the embodiment of the present invention is removed, and the fan is attached to the rotary shaft 34.
A fan 37 other than 35 is fixed and the communication hole 31 of the table 31
Of course, it is also possible to decompress a.

[0021]

As described above, the present invention makes it possible to provide a spin chuck capable of securely fixing a semiconductor wafer.

Therefore, if the spin chuck of the present invention is used to construct a spin dry apparatus, a resist coating apparatus, etc., the intended processing can be performed without damaging the semiconductor wafer.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention,

FIG. 2 is an explanatory diagram of a spin drying apparatus according to an embodiment of the present invention,

FIG. 3 is an explanatory diagram of a conventional spin chuck.

[Explanation of symbols]

 11 is a semiconductor wafer (object to be processed), 30 is a chuck body, 31 is a table, 31a is a communication hole, 32 is a support pin, 33 is a stopper pin, 34 is a rotary shaft, and 35 is a fan. Are shown respectively.

Claims (1)

[Claims] 1. A flat plate-shaped table (31) having a communication hole (31a) which is formed from the front surface to the back surface, and a workpiece (11) which is planted on the surface of the table (31) and is slidable in a horizontal state. A plurality of support pins (32) that are supported on the table (31) and stopper pins (33) that are taller than the support pins (32) and are erected in a dot array on the surface along the outer periphery of the table (31). Chuck body (3
0), and a rotating shaft (34) which is rotated about an axis center by a rotating device to rotate the chuck body (30) in the horizontal direction together with the object to be processed (11). Rotate together with the body (30) to the communication hole (31
a) The inside pressure is reduced and the communication hole (31a) is used to
A spin chuck having a fan (35) for adsorbing (11).