JPH06120360A - Semiconductor device holding package - Google Patents

Abstract

PURPOSE:To prevent corrosion of electrodes of a semiconductor device and bonding wires connected to the electrodes completely, and to make the device operate normally and stably over a long period of time. CONSTITUTION:This semiconductor device holding package is one made by gluing an insulating substrate 1 having a mounting part 1a for a semiconductor device 3 to be mounted on, with an insulating frame 2 surrounding the mounting part 1a and forming a void space for holding the semiconductor device 3 inside, through the medium of an adhesive agent 5a and 5b made from resin putting its external lead terminals 4 between them. And, the peripheral edges of the insulating frame 2 are positioned least 0.5mm more inside than those of the insulating substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a semiconductor element housing package for housing a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element housing package for housing a semiconductor element is made of an electrically insulating material such as alumina ceramics as shown in FIG. An insulating substrate 11 having a portion 11a, and an insulating substrate also made of an electrically insulating material.
An insulating frame 12 having an opening A in the center so as to surround the semiconductor element mounting portion 11a of 11 and a plurality of external lead terminals 13 for electrically connecting the semiconductor element housed inside to an external electric circuit. And a resin paste made of, for example, an epoxy resin, on the outer peripheral surface of the upper surface of the insulating base 11.
14a is printed and applied by a screen printing method, and then the external lead terminals 13 are placed on the upper surface of the insulating substrate 11 and heated to a temperature of about 150 ° C. to form the resin paste 14a.
The external lead terminals 13 are fixed to the upper surface of the insulating substrate 11 by thermosetting, and then the resin paste 14b also made of epoxy resin or the like is printed and applied to the lower surface of the insulating frame 12 and the external lead terminals 13 It is manufactured by placing the resin paste 14b on the upper surface of the insulating base 11 to which the 13 is fixed and thermally curing the resin paste 14b applied on the lower surface of the insulating frame 12 at a temperature of about 150 ° C.

In such a conventional package for accommodating semiconductor elements, the semiconductor element 15 is fixed to the semiconductor element mounting portion 11a of the insulating base 11 located in the opening A of the insulating frame 12, and each electrode of the semiconductor element 15 is bonded with a bonding wire. It is connected to the external lead terminal 13 via 16 and then the opening A of the insulating frame 12 is filled with a filling material such as epoxy resin to form a semiconductor element.
The semiconductor device as a final product is obtained by hermetically sealing 15.

Further, in the conventional package for accommodating semiconductor elements, one end of the external lead terminal 13 is bent so as to be properly electrically connected to an external electric circuit.
By electrically connecting one end of 13 to an external electric circuit, the semiconductor element 15 housed inside is connected to the external electric circuit.

[0005]

However, in this conventional package for accommodating semiconductor elements, the outer dimensions of the insulating base body 11 and the insulating frame body 12 are generally the same.
When the resin paste 14b is applied by printing onto the lower surface of the insulating base material 11 and is placed on the upper surface of the insulating base material 11 to which the external lead terminals 13 are fixed, and the insulating base material 1 and the insulating frame body 12 are bonded and fixed,
The resin paste 14b applied to the lower surface of the insulating frame 12 is pressed by the weight of the insulating frame 12 to the insulating base 11 and the insulating frame.
It flows out to the outside of 12 and causes a defective appearance of the package for housing the semiconductor element.

Further, when the resin flows out to the outside of the insulating base 11, when the external lead terminal 13 is bent so as to be properly connected to an external electric circuit, the bending force of the external lead terminal 13 is applied to the outside of the insulating base 11. The resin that has flowed out to the external lead terminal 13 is pulled and separated from the external lead terminal 13 to form a gap between the external lead terminal 13 and the resin. Therefore, in this semiconductor element accommodating package, it is connected to the electrodes of the semiconductor element and the semiconductor element through a gap formed between the external lead terminal 13 and the resin fixing the external lead terminal 13 to the insulating base 11 and the insulating frame 12. Moisture contained in the atmosphere may come into contact with the bonding wire to cause corrosion of the electrode of the semiconductor element or the bonding wire connected to the semiconductor element, and operate the semiconductor element normally and stably for a long period of time. It also had the drawback of not being able to.

[0007]

[Object] The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to prevent corrosion of each electrode of a semiconductor element or a bonding wire connected to the electrode, and to provide a semiconductor element for a long period of time. It is an object of the present invention to provide a package for accommodating a semiconductor element, which can operate normally and stably.

[0008]

According to the present invention, there is provided an insulating base body having a mounting portion on which a semiconductor element is mounted, and an insulating frame body surrounding the mounting portion and forming a void for accommodating the semiconductor element therein. A package for storing a semiconductor element, which is formed by adhering an external lead terminal between them with a resin adhesive, wherein the outer peripheral edge of the insulating frame is located at least 0.5 mm or more inside the outer peripheral edge of the insulating base body. It is characterized by that.

[0009]

Since the outer peripheral edge of the insulating frame is located at least 0.5 mm inside the outer peripheral edge of the insulating base, the insulating frame is adhered and fixed onto the insulating base through the resin paste printed on the insulating frame. When this is done, the resin paste does not flow out to the outside of the insulating base at all, and as a result, even if the external lead terminals are bent outside the insulating base, the resin firmly adheres to the external lead terminals without being pulled, As a result, it is possible to operate the semiconductor element normally and stably for a long period of time without contacting the electrodes of the semiconductor element and the bonding wires connected to the electrodes with moisture contained in the atmosphere.

[0010]

The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a package for accommodating semiconductor elements of the present invention, in which 1 is an insulating base made of an electrically insulating material, and 2 is an insulating base.
Is an insulating frame body also made of an electrically insulating material.

The insulating substrate 1 has a mounting portion 1a for mounting the semiconductor element 3 on the substantially central portion of its upper surface, and the semiconductor element 3 is mounted on the mounting portion 1a via an adhesive made of resin or the like. Adhesively fixed.

The insulating substrate 1 is made of an aluminum nitride sintered body, an aluminum oxide sintered body, a mullite sintered body,
In the case of an electrically insulating material such as a silicon carbide sintered body or a glass ceramics sintered body, for example, aluminum nitride ceramics, a raw material powder such as aluminum nitride powder or yttria powder is pressed into a shape corresponding to the insulating substrate 1. It is manufactured by filling in a mold and applying a constant pressure for molding, and then calcining the molded body at a temperature of about 1800 ° C.

An external lead terminal 4 is adhered and fixed to the upper surface of the insulating base 1 through a resin adhesive 5a, and each electrode of the semiconductor element 3 is bonded to one end of the external lead terminal 4 with a bonding wire. Electrically connected through 6,
The other end side is electrically connected to an external electric circuit.

The external lead terminal 4 is made of an iron alloy such as Kovar metal (iron-nickel-cobalt alloy) or 42 alloy (iron-nickel alloy), or a copper alloy such as copper, nickel, silicon or zinc. Ingot of (
The lump is formed into a predetermined plate shape by adopting a conventionally known metal processing method such as a rolling processing method or a punching processing method.

The surface of the external lead terminal 4 is plated with silver, aluminum or the like, by vapor deposition, or by a clad method.
It is deposited to a thickness of 0.5 to 20.0 μm so that the bonding wire 5 is firmly bonded to the external lead terminal 4.

The resin adhesive 5a for adhering and fixing the external lead terminals 4 to the upper surface of the insulating substrate 1 is bisphenol A type epoxy resin, novolac type epoxy resin, chrysidyl ester type epoxy resin, chrysidyl amine type epoxy resin, A chain aliphatic epoxy resin, an alicyclic epoxy resin, a heterocyclic epoxy resin, or another epoxy resin, or a resin such as polyimide, phenol resin, silicone, or urethane. A resin paste obtained by adding and mixing imidazole as a curing agent to a bisphenol A type epoxy resin is applied by printing using a screen printing method, and then an external lead terminal 4 is placed on the upper surface of the insulating substrate 1 and About 15
The external lead terminals 4 are adhesively fixed to the upper surface of the insulating substrate 1 by heating to a temperature of 0 ° C. and thermosetting the resin paste.

The insulating base 1 having the external lead terminals 4 adhered and fixed to the upper surface thereof further has the insulating frame body 2 adhered and fixed to the upper surface thereof through the resin adhesive 5b.

The insulating frame 2 has an opening B formed in the center thereof and has a frame shape surrounding the mounting portion 1a of the insulating base 1 to which the semiconductor element is fixed. The insulating frame body 2 forms a space for accommodating the semiconductor element 3 therein by the opening B at the center thereof and the upper surface of the insulating base body 1.

The insulating frame 2 is made of an electrically insulating material such as an aluminum nitride sintered body, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. A method similar to that of the insulating substrate 1, specifically, aluminum nitride powder, yttria powder and other raw material powders are filled into a press die having a shape corresponding to the insulating frame body 2 and a constant pressure is applied to perform molding. After that, the molded body is manufactured by firing at a temperature of about 1800 ° C.

Further, the insulating frame body 2 is
For example, a resin paste obtained by adding and mixing imidazole as a curing agent to a bisphenol A type epoxy resin is applied by printing using a screen printing method, and then this is applied on an insulating substrate 1 having external lead terminals 4 fixed to the upper surface. And the resin paste is heated to a temperature of about 150 ° C. and thermally cured, so that the resin paste is bonded and fixed to the upper surface of the insulating substrate 1.

Further, the insulating frame 2 has an outer dimension slightly smaller than that of the insulating base 1 so that the outer peripheral edge thereof is located inside the outer peripheral edge of the insulating base 1 by the width X.

The outer peripheral edge of the insulating frame 2 is the insulating base body 1.
Since it is positioned inside the outer peripheral edge of the insulating frame body 2 when the insulating frame body 2 is bonded and fixed onto the insulating base body 1,
The resin paste, which is the resin adhesive 5b printed and applied on the lower surface of 2, does not flow out to the outside of the insulating base 1 by the pressing force of the weight of the insulating frame 2 in a large amount. No defects will occur.

At the same time, since the resin adhesive 5b never flows out to the outside of the insulating substrate 1, even if the external lead terminals 4 are bent so as to be well connected to an external electric circuit, The resin adhesive 5b is not pulled by the force that bends the external lead terminal 4 and does not separate from the external lead terminal.As a result, the adhesion between the external lead terminal 4 and the resin adhesive 5b is strengthened, and the external lead It is possible to effectively prevent a gap from being formed between the terminal 4 and the resin adhesive 5b.

The outer edge of the insulating frame 2 is located inside the outer edge of the insulating substrate 1 by a width X. However, when the value of the width X is X <0.5 mm, the insulation is insulated. Base 1
When the insulation frame 2 is fixedly adhered to the insulation frame 2, the resin paste that is the resin adhesive 5b printed and applied on the lower surface of the insulation frame 2 is applied to the outside of the insulation substrate 1 by a large amount due to the pressing force of the weight of the insulation frame 2. It will flow out, causing a poor appearance and corrosion of the electrodes of the semiconductor element and the bonding wires connected to the electrodes. Therefore, the value of the width X is specified in the range of X ≧ 0.5 mm.

Thus, according to the package for accommodating a semiconductor element of the present invention, the semiconductor element 3 is fixed to the semiconductor element mounting portion 1a of the insulating substrate 1 with an adhesive and each electrode of the semiconductor element 3 is bonded with the bonding wire 6 The semiconductor device 3 is a final product by connecting to the external lead terminal 4 via the resin, and finally filling the resin filler 7 in the opening B of the insulating frame 2 and hermetically sealing the semiconductor element 3.

A resin filler 7 for hermetically sealing the semiconductor element 3 is made of a resin such as epoxy resin, polyimide, phenol resin or silicone, and resin such as epoxy resin is provided in the opening B of the insulating frame 2. The semiconductor element 3 is placed in the opening B of the insulating frame 2 so as to be hermetically sealed by filling the paste and thermosetting it at a temperature of about 150 ° C.

The resin filler 7 contains silicon oxide, aluminum oxide, having a particle size of 0.1 to 50.0 μm,
When 50 to 400 parts by weight of a filler made of an insulating powder such as aluminum nitride, calcium carbonate, magnesium oxide or the like is dispersed in 100 parts by weight of the resin, a resin filler is obtained.
The moisture permeability of 7 can be improved, and the semiconductor element housed inside can be more firmly protected from the external environment. Therefore, the resin filler 7 contains silicon oxide having a particle size of 0.1 to 50.0 μm,
It is preferable to disperse 50 to 400 parts by weight of filler made of insulating powder such as aluminum oxide, aluminum nitride, calcium carbonate, magnesium oxide, or other silicon oxide.

If necessary, the resin filler 7 may be colored by adding a colorant such as carbon black to the resin filler 7.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention. For example, the resin adhesives 5a and 5b can be replaced with carbon black. If coloring agents such as 0.5 to 3.0 parts by weight are added to 100 parts by weight of the resin and colored, the contrast between the resin adhesives 5a and 5b and the external lead terminals 4 becomes large, and the external leads are formed. The terminal 4 and the electrode of the semiconductor element 3 can be wire-bonded accurately and at high speed by using an automatic bonder.

Insulating powder of silicon oxide, aluminum oxide, aluminum nitride, calcium carbonate, magnesium oxide or the like having a particle size of 0.1 to 50.0 μm is added to 100 parts by volume of resin as a filler in the resin adhesives 5a and 5b. To 5
Resin adhesives 5a, 5b if 0 to 400 parts by volume are dispersed
The moisture permeability of can be significantly improved.

[0031]

According to the package for housing a semiconductor element of the present invention, the outer peripheral edge of the insulating frame is positioned at least 0.5 mm or more inside the outer peripheral edge of the insulating base, so that the insulating frame is bonded onto the insulating base. When fixing, the resin paste, which is a resin adhesive applied by printing on the lower surface of the insulating frame, does not flow out to the outside of the insulating base due to the pressure of the weight of the insulating frame. It is possible to effectively prevent the appearance defect from occurring in the package.

At the same time, since a large amount of resin adhesive does not flow out to the outside of the insulating substrate, even if the external lead terminals are bent so that they can be connected well to an external electric circuit, the resin adhesive will be bonded. The agent is not pulled by the force that bends the external lead terminal and does not peel off from the external lead terminal.As a result, the adhesion between the external lead terminal and the resin adhesive is strengthened, and the external lead terminal and the resin adhesive are It is possible to effectively prevent a gap from being formed between them.

Therefore, according to the package for accommodating a semiconductor element of the present invention, the electrode of the semiconductor element and the bonding wire connected to the electrode are not brought into contact with moisture contained in the atmosphere and the electrode of the semiconductor element is Since no corrosion is caused, it becomes possible to operate the semiconductor element normally and stably for a long period of time.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor element housing package of the present invention.

FIG. 2 is a cross-sectional view of a conventional semiconductor element housing package.

[Explanation of symbols]

 1 ... Insulating substrate 1a ... Semiconductor element mounting part 2 ... Insulating frame 3 ... Semiconductor element 4 ... External lead terminals 5a, 5b ... Resin adhesive

Claims (1)

[Claims] 1. An insulating base body having a mounting portion on which a semiconductor element is mounted, an insulating frame body surrounding the mounting portion and forming a space for accommodating the semiconductor element therein, and an external lead terminal provided therebetween. A package for housing a semiconductor element, which is sandwiched and adhered via a resin adhesive, wherein the outer peripheral edge of the insulating frame is positioned at least 0.5 mm or more inside the outer peripheral edge of the insulating base body. Storage package.