JPH06120297A - Electronic component - Google Patents

Abstract

PURPOSE:To obtain an electronic component excellent in moisture resistance and impact resistance and suitable for high density mounting by arranging bumps on the surface of electrode of a chip component and then entirely sealing the chip component with resin except the bumps. CONSTITUTION:In a bare IC chip 1, a plurality of Al electrodes 1b are provided on one surface of a silicon chip 1a where an integrated circuit is formed and the surface provided with the Al electrodes is coated with a passivation film 2 (e.g. silicon nitride film) except the central part of each Al electrode 1b (where a bump 3 is formed). A solder bump 3 is provided on the surface of each N electrode 1b of the bare IC chip 1 which is then entirely sealed with sealing resin 4 (e.g. epoxy resin of 0.05-0.5mum thick) except the bumps 3 thus constituting an IC 10. This constitution protects the electrode of chip component against corrosion and enhances moisture resistance.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to electronic components. Specifically, the present invention relates to an electronic component that is directly mounted on a substrate by a flip chip mounting method or the like.

[0002]

BACKGROUND ART FIGS. 2A and 2B show a structure of a conventional bare IC chip 31 and a flip chip mounting method for directly mounting the bare IC chip 31 on a substrate 34. In the conventional bare IC chip 31, a plurality of Al electrodes 31b are provided on one surface of the silicon chip 31a.
The surface provided with is covered with a passivation film 32 except for the central portion of the Al electrode 31b.

However, solder bumps 33 are formed on the surface of each Al electrode 31b exposed from the passivation film 32.
Are formed, the bumps 33 are aligned with the lands 34a of the substrate 34, and the bare IC chip 31 is mounted on the substrate 34. Then, the bumps 33 are melted by heating and bare I
Al electrode 31b of C chip 31 and land 34 of substrate 34
Join a.

[0004]

In such a mounting method, since the bare IC chip 31 is directly mounted, high-density mounting is possible and the device can be made compact, but on the other hand, the bare IC is not mounted. There is a problem in that the chip 31 is easily affected by moisture and impurities and has poor moisture resistance, for example, the Al electrode 31b is corroded.

Also, the silicon chip 31a may be chipped due to impact during mounting or use, or the bare IC chip 3 may be damaged.
The surface of No. 1 was easily damaged, and the impact resistance was low.

Therefore, such a mounting method can be applied only in a very limited field, and has been used only in a limited field such as a board for a vehicle or a board for a large computer.

The present invention has been made in view of the above-mentioned drawbacks of conventional examples, and an object of the present invention is to provide an electronic component capable of high-density mounting and excellent in moisture resistance and impact resistance. To provide.

[0008]

The electronic component of the present invention is characterized in that a bump is provided on the surface of the electrode of the chip component, and the entire portion of the chip component other than the bump is sealed with resin.

[0009]

In the electronic component of the present invention, since the entire portion of the chip component other than the bump is sealed with resin, the resin prevents moisture and impurities from entering the chip component from the outside. Corrosion of the chip electrodes can be prevented, and moisture resistance can be improved.

Further, since the chip component is protected by the resin wrapping the chip component, the impact at the time of mounting can be mitigated by the resin, chipping of the chip component can be prevented, and the surface of the chip component is damaged. Can be reduced and the impact resistance can be improved.

Further, since the electrodes are provided with bumps, they can be directly mounted on the substrate and can be mounted at a high density.

[0012]

1 (a) and 1 (b) show the structure of an IC (electronic component) 10 according to an embodiment of the present invention and a flip-chip mounting method for directly mounting the IC 10 on a substrate (for example, an alumina substrate) 5. In the IC 10 of this embodiment, a bump 3 is provided on the surface of each Al electrode 1b of the bare IC chip (chip component) 1 and only the bump 3 is exposed to expose the bare IC chip 1
The whole is sealed with a sealing resin 4.

More specifically, in the bare IC chip 1, a plurality of Al electrodes 1b are provided on one surface of a silicon chip 1a on which an integrated circuit is formed.
The surface of the chip 1 on which the Al electrodes 1b are provided is covered with a passivation film 2 (for example, a silicon nitride film) except for the central portion (the portion where the bumps 3 are formed) of each Al electrode 1b.

Solder bumps 3 are provided on the surface of each Al electrode 1b of the bare IC chip 1 and only the bumps 3 are exposed to seal the entire bare IC chip 1 with a resin 4 (for example, epoxy resin; (0.05 to 0.5 μm thick)
The IC 10 is configured by sealing with.

Therefore, as shown in FIG.
The chip 10 is chucked by a carrying tool such as a vacuum pad and carried to above the mounting position, and the bumps 3 provided on the IC 10 are aligned with the lands 5a provided on the substrate 5.

Then, as shown in FIG. 1B, the carrying tool is moved downward to gently mount the IC 10 on the substrate 5. Next, for example, the bumps 3 are melted by heating in a reflow furnace and cooled to bond the Al electrodes 1b and the lands 5a of the substrate 5 to finish the mounting.

According to this embodiment, only the bump 3 provided on the surface of the Al electrode 1b is exposed and the entire bare IC chip 1 is sealed with the sealing resin 4. Therefore, the bare IC chip 1 is exposed to the outside air. Can be protected from moisture and impurities, eg A
It is possible to prevent the l-electrode 1b from being corroded and the characteristics of the bare IC chip 1 from changing.

Further, for example, the shock when chucking with a carrying tool can be alleviated by the sealing resin 1, and the surface of the bare IC chip 1 is damaged or the silicon chip 1a is chipped due to the shock. Can be prevented.

Since the IC 10 is thicker than the bare IC chip 1 by the thickness of the sealing resin 4, it is mounted by the flip-chip mounting method so that another mounting method, for example, a mounting method using a molded package is used. , TA
It can be mounted at a higher density than by the B mounting method or the wire bonding mounting method.

[0020]

According to the electronic component of the present invention, the resin can prevent moisture and impurities from entering the chip component from the outside, for example, can prevent the electrode of the chip component from being corroded, and improve the moisture resistance. be able to.

Further, the resin can reduce the impact and reduce the damage to the surface of the chip component.
Impact resistance can be improved, and handling of chip components becomes easy.

Since the electrodes are provided with the bumps, they can be directly mounted on the substrate and can be mounted at a high density.

[Brief description of drawings]

1A and 1B are cross-sectional views showing a structure of an IC and a mounting method thereof according to an embodiment of the present invention.

2A and 2B are cross-sectional views showing a structure of a conventional bare IC chip and a mounting method thereof.

[Explanation of symbols]

 1 Bare IC Chip (Chip Component) 1b Al Electrode 3 Bump 4 Sealing Resin 5 Substrate 5a Land 10 IC (Electronic Component)

Claims (1)

[Claims] 1. An electronic component, characterized in that a bump is provided on a surface of an electrode of a chip component, and the entire portion of the chip component other than the bump is sealed with a resin.