JPH06120223A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent deterioration of interelement matching of a plurality of elements arranged in a function block, and enable reducing of the wiring regions of power supply wiring and earth wiring which connect a plurality of the function blocks. CONSTITUTION:In a semiconductor integrated circuit device wherein power supply wiring VCC and earth wiring GND are arranged on both side parts of a function block 1, and elements Q1-Q6 and R1-R4 are connected with the power supply wiring and the earth wiring through element wiring 2, each of the power supply wiring and the earth wiring is formed in a line type with arbitrary width, and the element wiring which connects elements in the function block is connected with the power supply wiring and the earth wiring, at one point of each wiring.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device of an analog circuit, and more particularly to a configuration of functional blocks used for automatic placement and routing by a computer.

[0002]

2. Description of the Related Art In recent large-scale analog integrated circuits, in order to shorten the design period and standardize the design, several tens of circuit elements are set as one functional block unit, and the layout and wiring of each functional block is performed by a computer. Is going. As shown in FIG. 3, the conventional functional block used for such automatic placement / wiring is a power supply wiring in which a part of the functional block frame 1A, which is a rectangular area, is formed by the same metal wiring layer as the element electrodes on the top and bottom sides. It has a VCC and a ground wiring GND. External terminals 11 are provided on both ends of these wirings, respectively.
~ 14 are provided. In addition, the layout design in the functional block is performed by selecting the transistors Q1 to Q1 according to the desired circuit element.
Q6, resistors R1 to R4, etc. are selected, and each element is arranged so that it fits within a predetermined rectangular area of the functional block frame 1A and wiring by the element wiring 2 is performed. An equivalent circuit of a circuit composed of this functional block is shown in FIG.

[0003]

In such a conventional semiconductor integrated circuit device, the emitter wirings of the transistors Q1 and Q2 forming the current mirror circuit are connected so as to have a common impedance with respect to the power supply wiring. However, since each emitter wiring is individually connected to a different position of the power supply wiring GND, when another functional block is connected to this functional block, each emitter is caused by the current of the other functional block. There may be a difference in the current of the wiring, which may deteriorate the matching between the elements.

Further, when the semiconductor integrated circuit device 10 in which a plurality of functional blocks A to G are arranged to connect the power supply wiring VCC and the ground wiring GND as shown in FIG. The total current value is limited by the wiring width of the functional blocks A and D closest to the bonding pad PD. Therefore, when the current capacity of the ground wiring in the functional blocks A and D is insufficient, the ground wiring 1 in FIG.
It is necessary to change the design such as increasing the minimum width of the second wiring (in this example, the width of the two-layer wiring 3 in which the ground wiring GND is connected by the through hole 4 in the middle), or the ground wiring of the functional block A. As in the case of GND, wires are singly laid up to the vicinity of the bonding pad, which has been a factor of increasing the wiring area. An object of the present invention is to provide a semiconductor integrated circuit device capable of preventing deterioration of matching between elements in a functional block and reducing a wiring area of a power supply and a ground wiring.

[0005]

According to the present invention, the power supply wiring and the ground wiring provided on both sides of the functional block are formed in a linear shape having an arbitrary width dimension, and the element wiring for connecting the elements in the functional block are The power supply wiring and the ground wiring are connected at one point each.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1 is a plan view of a functional block according to an embodiment of the present invention,
FIG. 2 is an equivalent circuit diagram thereof. In FIG. 1, PNP transistors Q1 and Q2 are provided in a rectangular area of the functional block frame 1.
And NPN transistors Q3 to Q6 and resistors R1 to R1.
Place R4. Further, a power supply line VCC and a ground line GND are linearly arranged above and below the functional block frame 1, respectively. The respective elements are connected to each other by the element wiring 2 to form the equivalent circuit of FIG. 2. The element wiring 2 uses the same metal wiring layer as the power wiring VCC and the ground wiring GND. Two-layer metal wiring may be used depending on the circuit configuration. In this embodiment, a part of the wiring is also composed of two-layer wiring 3. In addition, the power supply wiring VCC
And external terminals 11, 1 on both ends of the ground wire GND.
2 and 13, 14 are provided.

Here, the PNP transistors Q1 and Q
2 constitutes a current mirror circuit in the circuit of FIG. 2, the transistors Q1 and Q2 are arranged adjacent to each other, and the power source wiring connected to the emitter of each transistor is connected by the element wiring 2 together with the power source end of the resistor R1. They are unified and connected to the power supply wiring VCC at one point between the external terminals 11 and 12. Further, the ground ends of the resistors R2 to R4 are unified by the same element wiring 2, and the external terminal 1 of the ground wiring GND is connected at one point through the through hole 4 and the two-layer metal wiring 3.
It is connected between 3 and 14.

Therefore, in the transistors Q1 and Q2 forming the current mirror circuit, the emitter wiring is connected to the power supply wiring VCC at one point by the element wiring 2, so that the currents of other functional blocks are irrespective of the arrangement of the functional blocks. Does not degrade the integrity. Further, since the power supply wiring VCC and the ground wiring GND have a linear shape, it is possible to arbitrarily widen the wiring width toward the outside of the functional block, which facilitates wiring design such as electric capacitance.

[0009]

As described above, according to the present invention, the power supply wiring and the ground wiring provided on both sides of the functional block are formed in a linear shape having an arbitrary width dimension, and the element wiring for connecting the elements in the functional block is formed. Since the connection is made at each point of the power supply wiring and the ground wiring, the deterioration of the consistency due to the current of the other functional blocks is improved, and the widths of the power supply wiring and the ground wiring are arbitrarily extended to the outside of the functional block. Since the capacity can be increased, the wiring can be easily designed, and the function blocks can be used more effectively.

[Brief description of drawings]

FIG. 1 is a functional block plan view of an embodiment of a semiconductor integrated circuit device of the present invention.

FIG. 2 is an equivalent circuit diagram of the circuits of FIGS. 1 and 3.

FIG. 3 is a plan view of functional blocks of a conventional semiconductor integrated circuit device.

FIG. 4 is a schematic layout diagram of a semiconductor integrated circuit device configured by conventional functional blocks.

[Explanation of symbols]

 1 Functional Block 2 Element Wiring 3 2 Layer Wiring 4 Through Hole Q1 to Q6 Transistors R1 to R4 Resistance VCC Power Supply Wiring GND Ground Wiring

Claims (1)

[Claims] 1. A semiconductor integrated circuit device having power supply wiring and ground wiring on both sides of a functional block, wherein elements in the functional block are connected to the power supply wiring and the ground wiring by element wiring. A semiconductor integrated circuit device characterized in that the element wiring and the ground wiring are formed in a linear shape having an arbitrary width dimension, and the element wiring is connected at each one point of the power wiring and the ground wiring.