JPH06120185A - Jig for washing - Google Patents

Jig for washing

Info

Publication number
JPH06120185A
JPH06120185A JP27123292A JP27123292A JPH06120185A JP H06120185 A JPH06120185 A JP H06120185A JP 27123292 A JP27123292 A JP 27123292A JP 27123292 A JP27123292 A JP 27123292A JP H06120185 A JPH06120185 A JP H06120185A
Authority
JP
Japan
Prior art keywords
cleaned
substrate
cleaning
particles
cleaning jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP27123292A
Other languages
Japanese (ja)
Inventor
Shigeru Tabata
繁 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP27123292A priority Critical patent/JPH06120185A/en
Publication of JPH06120185A publication Critical patent/JPH06120185A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To reduce pattern defects by excluding particles stuck to the rears of the substrates washed from being transcribed to the surfaces of the other substrates washed. CONSTITUTION:At least two side walls 4, 4 are set up on the base plate 5. Then, a plurality of fixing parts 6, 6,... fixing and holding a plurality of substrates 2 washed are formed on the base plate 5. In addition thereto, the base plate 5 is provided with a plurality of partition plates 3, 3,... being located between the substrates washed 2, 2,... fixed and held by the fixing parts 6, 6,.... These partition plates 3, 3,... prevent sticking of particles to the other substrates washed 2, 2,....

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体装置や液晶表示
装置等の基板を洗浄するのに用いられる洗浄用冶具に関
し、特に、パーティクルの再付着対策に係るものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning jig used for cleaning a substrate of a semiconductor device, a liquid crystal display device or the like, and more particularly to measures for re-adhesion of particles.

【0002】[0002]

【従来の技術】近年、基板の洗浄工程は、半導体装置な
どの製造工程を中心に低発塵化が進められている。そこ
で、以下、図5および図6に基づいて、従来の洗浄用冶
具の一例について説明する。図5は、従来の洗浄用冶具
の断面構造を示すものである。この図5において、1は
洗浄用冶具、2は被洗浄基板であって、該洗浄用冶具1
は、側板4,4が底板5の両側に立設されると共に、該
底板5に凹状の固定部6,6,…が複数形成されて成
り、該固定部支持部6,6,…に上記被洗浄基板2が固
定支持されている。図6は、上記洗浄用治具1を備えた
洗浄装置の構成図である。この図6において、7は洗浄
槽であって、該洗浄槽7内には上記洗浄用冶具1が設置
されている。さらに、8は給水口、11は水面である。そ
して、上記給水口8より給水方向9に高純度の水を洗浄
槽7に導入し、被洗浄基板2を洗浄する一方、洗浄した
水は洗浄槽7の上部開口より排水方向10に排出されてい
る。
2. Description of the Related Art In recent years, in the substrate cleaning process, low dust generation has been promoted mainly in the manufacturing process of semiconductor devices and the like. Therefore, an example of a conventional cleaning jig will be described below with reference to FIGS. 5 and 6. FIG. 5 shows a cross-sectional structure of a conventional cleaning jig. In FIG. 5, 1 is a cleaning jig and 2 is a substrate to be cleaned.
The side plates 4 and 4 are erected on both sides of the bottom plate 5, and a plurality of concave fixing portions 6, 6, ... Are formed on the bottom plate 5, and the fixing portion supporting portions 6, 6 ,. The substrate 2 to be cleaned is fixedly supported. FIG. 6 is a configuration diagram of a cleaning device including the cleaning jig 1. In FIG. 6, 7 is a cleaning tank, and the cleaning jig 1 is installed in the cleaning tank 7. Further, 8 is a water supply port, and 11 is a water surface. Then, high-purity water is introduced into the cleaning tank 7 through the water supply port 8 in the water supply direction 9 to clean the substrate 2 to be cleaned, while the cleaned water is discharged from the upper opening of the cleaning tank 7 in the drainage direction 10. There is.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記の
ような構成の洗浄用治具1においては、該洗浄用治具1
に複数の被洗浄基板2,2,…を平行に隣接して保持し
ているのみであるので、被洗浄基板2の裏面に前工程の
搬送機構などで付着したパーティクルPが水中に浮遊
し、該パーティクルPが他の被洗浄基板2に再付着する
ことになる。この結果、該被洗浄基板2の表面に形成さ
れたパターンに欠陥を生じ、歩留まりが低下するという
問題点を有していた。
However, in the cleaning jig 1 having the above structure, the cleaning jig 1 is used.
, Only a plurality of substrates to be cleaned 2 are held in parallel and adjacent to each other. Therefore, the particles P attached to the back surface of the substrate to be cleaned 2 by the transport mechanism in the previous process float in water, The particles P will reattach to the other substrate 2 to be cleaned. As a result, there is a problem in that the pattern formed on the surface of the substrate to be cleaned 2 becomes defective and the yield is reduced.

【0004】本発明は、斯かる点に鑑みてなされたもの
で、被洗浄基板の裏面に付着したパーティクルが他の被
洗浄基板の表面に転写しないようにして、パターン欠陥
を低減する洗浄用冶具を提供することを目的とするのも
である。
The present invention has been made in view of the above problems, and a cleaning jig for reducing pattern defects by preventing particles adhering to the back surface of a substrate to be cleaned from being transferred to the surface of another substrate to be cleaned. It is also intended to provide.

【0005】[0005]

【課題を解決するための手段】上記の目的を達成するた
めに、請求項1に係る発明が講じた手段は、まず、底板
に少なくとも2つの側壁が立設されている。そして、該
底板には、複数の被洗浄基板を固定保持する複数個の固
定部が形成されている。加えて、上記底板には、固定部
に固定保持された被洗浄基板の間に位置して複数の仕切
り板が設けられた構成としている。また、請求項2に係
る発明が講じた手段は、上記請求項1の発明において、
仕切り板は、高抵抗流体との摩擦により帯電可能な材料
により形成された構成としている。また、請求項3に係
る発明が講じた手段は、上記請求項2の発明において、
仕切り板は、ポリテトラフルオロエチレン、ポリプロピ
レンまたはポリ塩化ビニルの何れかで形成された構成と
している。
In order to achieve the above object, in the means of the invention according to claim 1, at least two side walls are provided upright on the bottom plate. A plurality of fixing parts for fixing and holding a plurality of substrates to be cleaned are formed on the bottom plate. In addition, the bottom plate is provided with a plurality of partition plates located between the substrates to be cleaned that are fixedly held by the fixing portion. The means taken by the invention according to claim 2 is that in the invention according to claim 1,
The partition plate is made of a material that can be charged by friction with a high resistance fluid. The means taken by the invention according to claim 3 is the same as in the invention according to claim 2 above.
The partition plate is made of polytetrafluoroethylene, polypropylene or polyvinyl chloride.

【0006】[0006]

【作用】上記の構成により、本発明では、被洗浄基板の
洗浄時において、該被洗浄基板の背面に付着したパーテ
ィクルが洗浄水に浮遊することになるが、各被洗浄基板
間に仕切り板が位置するので、上記パーティクルが仕切
り板で受け止められ、該仕切り板に付着するか、または
排水されることになり、他の被洗浄基板の表面に再付着
することが防止される。特に、請求項2および3の発明
においては、上記仕切り板に静電気が帯電するので、上
記パーティクルが仕切り板に付着することになり、より
確実にパーティクルの再付着が防止される。
With the above structure, in the present invention, when the substrate to be cleaned is cleaned, particles attached to the back surface of the substrate to be cleaned float in the cleaning water. Since it is located, the particles are received by the partition plate and adhere to the partition plate or are drained, which prevents re-adhesion on the surface of another substrate to be cleaned. Particularly, in the inventions of claims 2 and 3, since the partition plate is charged with static electricity, the particles adhere to the partition plate, and the re-adhesion of the particles is more reliably prevented.

【0007】[0007]

【実施例】以下、本発明の一実施例の洗浄用冶具につい
て、図面に基づいて詳細に説明する。なお、従来と同一
構成部分については同一符号でもって示す。図1は、本
発明の実施例における洗浄用冶具の断面構造を示し、図
2は、該洗浄用治具の平面図である。1は洗浄用冶具
で、2は、該洗浄用冶具1に保持される被洗浄基板であ
る。該洗浄用治具1は、少なくとも2つの側壁4,4
と、被洗浄基板2を保持するための底板5と、被洗浄基
板2の間に位置する仕切り板3,3,…を備えている。
そして、上記側板4,4は、底板5の両側に立設されて
おり、該底板5の上面には、上記被洗浄基板2を保持す
るための逆V字の凹状の固定部6,6,…が所定間隔を
存して多数平行に形成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cleaning jig according to an embodiment of the present invention will be described in detail below with reference to the drawings. It should be noted that the same components as those of the related art are denoted by the same reference numerals. FIG. 1 shows a sectional structure of a cleaning jig in an embodiment of the present invention, and FIG. 2 is a plan view of the cleaning jig. Reference numeral 1 is a cleaning jig, and 2 is a substrate to be cleaned held by the cleaning jig 1. The cleaning jig 1 has at least two side walls 4, 4
, A bottom plate 5 for holding the substrate 2 to be cleaned, and partition plates 3, 3, ... Between the substrate 2 to be cleaned.
The side plates 4 and 4 are provided upright on both sides of the bottom plate 5, and the inverted V-shaped concave fixing portions 6, 6 for holding the substrate 2 to be cleaned are provided on the upper surface of the bottom plate 5. Are formed in parallel at a predetermined interval.

【0008】また、上記仕切り板3,3,…は、本発明
の特徴とするもので、上記固定部6,6,…の間の凸部
に連続して底板5に立設され、被洗浄基板2,2,…の
間に位置して該被洗浄基板2,2,…の間を仕切るよう
に設けられている。そして、該仕切り板3,3,…は、
高抵抗流体、例えば、水との摩擦に対して帯電しない材
料で、例えば、アルミニウムで形成されるか、または水
との摩擦により帯電する材料で、例えば、ポリテトラフ
ルオロエチレン(テフロン)、ポリプロピレンまたはポ
リ塩化ビニルの何れかで形成されている。
Further, the partition plates 3, 3, ... Are features of the present invention. The partition plates 3, 3, ... Are erected on the bottom plate 5 continuously with the convex portions between the fixing portions 6, 6 ,. It is located between the substrates 2, 2, ... And is provided so as to partition the substrate to be cleaned 2, 2. And, the partition plates 3, 3, ...
High resistance fluids, such as materials that are not charged to friction with water, such as materials formed of aluminum or that are charged to friction with water, such as polytetrafluoroethylene (Teflon), polypropylene or It is made of either polyvinyl chloride.

【0009】図3は、上記洗浄用治具1を備えた洗浄装
置の構成図である。この図3において、7は洗浄槽であ
って、該洗浄槽7内には上記洗浄用冶具1が設置されて
いる。さらに、8は給水口、11は水面である。そして、
上記洗浄槽7は、給水口8より給水方向9に高純度の水
が洗浄槽7に導入され、被洗浄基板2を洗浄する一方、
洗浄した水が洗浄槽7の上部開口より排水方向10に排出
されるように構成されている。
FIG. 3 is a block diagram of a cleaning device equipped with the cleaning jig 1. In FIG. 3, 7 is a cleaning tank, and the cleaning jig 1 is installed in the cleaning tank 7. Further, 8 is a water supply port, and 11 is a water surface. And
In the cleaning tank 7, high-purity water is introduced from the water supply port 8 in the water supply direction 9 into the cleaning tank 7 to clean the substrate 2 to be cleaned.
The washed water is discharged from the upper opening of the washing tank 7 in the drainage direction 10.

【0010】次に、以上のように構成された洗浄用冶具
1について、図1乃至図3に基づき洗浄動作を説明す
る。まず、洗浄槽1には、給水口8により洗浄水、例え
ば、高純度の水が導入されており、該水は、開放されて
いる洗浄槽7の上部より排水方向10に向って排出してい
る。一方、被洗浄基板2は、洗浄用冶具1に保持され、
具体的に、固定部6に固定支持されている。そして、該
各被洗浄基板2,2,…の間には、仕切り板3,3,…
が位置して各被洗浄基板2,2,…を仕切っている。こ
の状態において、上記高純度の水によって各被洗浄基板
2,2,…を洗浄しており、その際、被洗浄基板2,
2,…の裏面から一度洗い落とされたパーティクルP
が、水中に浮遊するが、該パーティクルPは仕切り板
3,3,…で遮断され、他の被洗浄基板2に再付着する
ことが低減される。以上のように本実施例によれば、水
中に浮遊したパーティクルPを仕切り板3,3,…で受
けとめるので、該パーティクルPが並列に置かれている
被洗浄基板2の表面に再付着することを低減することが
できる。この結果、上記被洗浄基板2の表面に形成され
たパターンを損傷させることがなく、歩留まりや信頼性
を向上させることができる。
Next, the cleaning operation of the cleaning jig 1 configured as described above will be described with reference to FIGS. 1 to 3. First, cleaning water, for example, high-purity water is introduced into the cleaning tank 1 through the water supply port 8, and the water is discharged from the upper portion of the opened cleaning tank 7 in the drainage direction 10. There is. On the other hand, the substrate 2 to be cleaned is held by the cleaning jig 1,
Specifically, it is fixedly supported by the fixed portion 6. The partition plates 3, 3, ... Are provided between the cleaning target substrates 2, 2 ,.
Is located to partition each substrate to be cleaned 2, 2, .... In this state, each of the substrates to be cleaned 2, 2, ... Is washed with the high-purity water.
Particles P washed off once from the back of 2, ...
Although suspended in water, the particles P are blocked by the partition plates 3, 3, ... And are prevented from reattaching to the other substrate 2 to be cleaned. As described above, according to the present embodiment, since the particles P suspended in water are received by the partition plates 3, 3, ..., The particles P should be reattached to the surface of the substrate 2 to be cleaned placed in parallel. Can be reduced. As a result, it is possible to improve the yield and reliability without damaging the pattern formed on the surface of the substrate to be cleaned 2.

【0011】次に、図1における仕切り板3の材料選定
について説明する。上述したように、上記仕切り板3
は、帯電しない材料を使用する場合と、帯電する材料を
使用する場合があり、例えば、アルミニウムとすると、
高純度の水流との摩擦では、静電気が発生しないが、例
えば、テフロンとすると、静電気が発生し、この静電気
が仕切り板3に帯電することになる。そこで、上記仕切
り板3をアルミニウムにした場合と、テフロンにした場
合とにおけるパーティクルPの付着量を従来例との比較
で説明すると、図4に示すように、被洗浄基板2の裏面
に10000以上のパーティクルPが付着している場
合、この状態において、例えば、10分間洗浄をする
と、従来の技術では、対向して置かれている被洗浄基板
2の表面に5000個程度のパーティクルPが再付着す
る。これに対し、本発明の洗浄用冶具1では、仕切り板
3をアルミニウムとして同条件下で洗浄すると、パーテ
ィクルPの再付着量をおよそ100個に低減することが
できる。さらに、仕切り板3をテフロンとすると、60
個に低減することができる。以上のように、上記洗浄冶
具1に被洗浄基板2,2,…の間に位置して仕切り板
3,3,…を設けることにより、被洗浄基板2の表面へ
のパーティクルPの再付着を低減することができ、特
に、該仕切り板3に帯電する材料であるテフロンなどを
用いると、さらにパーティクル遮断低減効果がある。
Next, selection of materials for the partition plate 3 in FIG. 1 will be described. As described above, the partition plate 3
May use a non-chargeable material or a chargeable material. For example, if aluminum is used,
Although static electricity is not generated by friction with a high-purity water stream, for example, in the case of Teflon, static electricity is generated and this static electricity charges the partition plate 3. Therefore, the adhesion amount of the particles P when the partition plate 3 is made of aluminum and when it is made of Teflon will be described in comparison with a conventional example. As shown in FIG. In this state, if cleaning is performed for 10 minutes, for example, about 5000 particles P are re-deposited on the surface of the substrate 2 to be cleaned which is placed facing each other. To do. On the other hand, in the cleaning jig 1 of the present invention, when the partition plate 3 is made of aluminum and cleaned under the same conditions, the reattachment amount of the particles P can be reduced to about 100 particles. Further, if the partition plate 3 is Teflon, it is 60
It can be reduced to individual pieces. As described above, by providing the cleaning jig 1 with the partition plates 3, 3, ... Positioned between the substrates 2, 2, ... To be reattached to the surface of the substrate 2 to be cleaned. When the partition plate 3 is made of a material that is electrically charged, such as Teflon, the effect of further reducing particles can be reduced.

【0012】なお、第1の実施例において、仕切り板
3,3,…は洗浄冶具1に固定としたが、仕切り板3,
3,…は、表面にパーティクルPが付着してもよい被洗
浄基板を用いてもよい。また、請求項1に係る発明にお
いては、仕切り板3,3,…の材料は実施例に限られる
ものではない。
Although the partition plates 3, 3, ... Are fixed to the cleaning jig 1 in the first embodiment, the partition plates 3, 3 ,.
3, a substrate to be cleaned may be used, on the surface of which particles P may adhere. In the invention according to claim 1, the material of the partition plates 3, 3, ... Is not limited to the embodiment.

【0013】[0013]

【発明の効果】以上のように、請求項1に係る発明によ
れば、洗浄用冶具に仕切り板を設けることにより、被洗
浄基板の表面へのパーティクルの付着を確実に低減する
ことができる。このため、半導体装置や液晶表示装置等
の歩留まりや信頼性を向上させることができる。また、
請求項2および3に係る発明によれば、仕切り板を帯電
する材料で形成しているので、帯電した静電気によって
パーティクルを仕切り板に吸着することができることか
ら、より確実に被洗浄基板の表面へのパーティクルの付
着を低減することができる。
As described above, according to the invention of claim 1, by providing the cleaning jig with the partition plate, it is possible to reliably reduce the adhesion of particles to the surface of the substrate to be cleaned. Therefore, the yield and reliability of semiconductor devices and liquid crystal display devices can be improved. Also,
According to the inventions according to claims 2 and 3, since the partition plate is formed of a material that is charged, particles can be adsorbed to the partition plate by the charged static electricity, so that the surface of the substrate to be cleaned can be more reliably transferred. Adhesion of particles can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例における洗浄用冶具の断面図で
ある。
FIG. 1 is a cross-sectional view of a cleaning jig according to an embodiment of the present invention.

【図2】本発明の実施例における洗浄用治具の平面図で
ある。
FIG. 2 is a plan view of a cleaning jig according to an embodiment of the present invention.

【図3】本発明の実施例における洗浄装置の構成図であ
る。
FIG. 3 is a configuration diagram of a cleaning device according to an embodiment of the present invention.

【図4】本発明と従来例とのパーティクル付着の特性図
である。
FIG. 4 is a characteristic diagram of particle adhesion between the present invention and a conventional example.

【図5】従来例における洗浄用冶具の断面図である。FIG. 5 is a cross-sectional view of a cleaning jig in a conventional example.

【図6】従来例における洗浄装置の構成図である。FIG. 6 is a configuration diagram of a cleaning device in a conventional example.

【符号の説明】[Explanation of symbols]

1 洗浄用冶具 2 被洗浄基板 3 仕切り板 4 側壁 5 底板 6 固定部 7 洗浄槽 8 給水口 9 給水方向 10 排水方向 11 水面 1 Cleaning jig 2 Substrate to be cleaned 3 Partition plate 4 Side wall 5 Bottom plate 6 Fixed part 7 Cleaning tank 8 Water supply port 9 Water supply direction 10 Drainage direction 11 Water surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 底板に少なくとも2つの側壁が立設さ
れ、 該底板には、複数の被洗浄基板を固定保持する複数個の
固定部が形成される一方、 上記底板には、固定部に固定保持された被洗浄基板の間
に位置して複数の仕切り板が設けられていることを特徴
とする洗浄用治具。
1. A bottom plate is provided with at least two side walls, and a plurality of fixing parts for fixing and holding a plurality of substrates to be cleaned are formed on the bottom plate, while the bottom plate is fixed to the fixing part. A cleaning jig, characterized in that a plurality of partition plates are provided between the held substrates to be cleaned.
【請求項2】 請求項1記載の洗浄用治具において、仕
切り板は、高抵抗流体との摩擦により帯電可能な材料に
より形成されていることを特徴とする洗浄用冶具。
2. The cleaning jig according to claim 1, wherein the partition plate is made of a material that can be charged by friction with a high resistance fluid.
【請求項3】 請求項2記載の洗浄用治具において、仕
切り板は、ポリテトラフルオロエチレン、ポリプロピレ
ンまたはポリ塩化ビニルの何れかで形成されていること
を特徴とする洗浄用冶具。
3. The cleaning jig according to claim 2, wherein the partition plate is made of any one of polytetrafluoroethylene, polypropylene or polyvinyl chloride.
JP27123292A 1992-10-09 1992-10-09 Jig for washing Withdrawn JPH06120185A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27123292A JPH06120185A (en) 1992-10-09 1992-10-09 Jig for washing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27123292A JPH06120185A (en) 1992-10-09 1992-10-09 Jig for washing

Publications (1)

Publication Number Publication Date
JPH06120185A true JPH06120185A (en) 1994-04-28

Family

ID=17497201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27123292A Withdrawn JPH06120185A (en) 1992-10-09 1992-10-09 Jig for washing

Country Status (1)

Country Link
JP (1) JPH06120185A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891727A (en) * 1986-12-18 1990-01-02 Mitsubishi Denki K.K. Memory device
US5868150A (en) * 1994-11-14 1999-02-09 Yieldup International Ultra-low particle semiconductor cleaner
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US6647998B2 (en) * 2001-06-20 2003-11-18 Taiwan Semiconductor Manufacturing Co. Ltd. Electrostatic charge-free solvent-type dryer for semiconductor wafers
JP2010056416A (en) * 2008-08-29 2010-03-11 Shin-Etsu Chemical Co Ltd Method of cleaning hybrid substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891727A (en) * 1986-12-18 1990-01-02 Mitsubishi Denki K.K. Memory device
US5868150A (en) * 1994-11-14 1999-02-09 Yieldup International Ultra-low particle semiconductor cleaner
US5873947A (en) * 1994-11-14 1999-02-23 Yieldup International Ultra-low particle disk cleaner
US5932027A (en) * 1994-11-14 1999-08-03 Yieldup International Cleaning and drying photoresist coated wafers
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US6647998B2 (en) * 2001-06-20 2003-11-18 Taiwan Semiconductor Manufacturing Co. Ltd. Electrostatic charge-free solvent-type dryer for semiconductor wafers
JP2010056416A (en) * 2008-08-29 2010-03-11 Shin-Etsu Chemical Co Ltd Method of cleaning hybrid substrate

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