JPH04264751A - Chip holding jig - Google Patents

Abstract

PURPOSE:To obtain a holding jig which can suck each chip in vacuum, prevent damage of a chip due to static electricity, minimize runaround of cleanser at a side for sucking in vacuum at the time of cleaning the chip, and hold a position of the chip even after the vacuum sucking is, after the chip is cleaned, released. CONSTITUTION:A chip holding jig is formed of a porous material 6, which has conductivity and is formed smaller than a chip size. Protrusions 7a each of which is narrower than an interval between chips, are provided, and a wider part than the interval between the chips including the protrusions is formed of a nonporous material 7.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip holding jig for holding semiconductor chips when cleaning them.

0002

2. Description of the Related Art FIG. 5 is a diagram showing a conventional chip cleaning method. In the figure, 1 is a beaker, 2 is a glass plate for supporting the wafer divided into chips, 3 is the wafer divided into chips, 4 is a cleaning agent for cleaning the chips, and 3' is separated from the glass plate 2. That's the tip.

Next, the cleaning method will be explained. First, as shown in FIG. 5(a), a beaker 1 is filled with a cleaning agent 4, and a wafer 3 with a glass plate 2 as a support substrate is placed therein. Then, as shown in FIG. 5(b), the wafer 3, which has been divided into chips from the glass plate 2, is left until it separates and falls off as chips 3'. After the separation, the cleaning agent 4 is replaced several times to wash the chips, and the chips 3' at the bottom of the beaker 1 are picked up and placed on a chip tray.

0004

[Problems to be Solved by the Invention] Conventional chip cleaning methods were carried out as described above, and as a result, the chips that had separated from the glass plate overlapped with each other, damaging the chip surface and damaging the overlapping parts of the chips. This caused poor cleaning. Furthermore, since the chips are separated and cleaned, it is not known where on the wafer the chips are formed, and sampling inspection cannot be performed. Furthermore, it is necessary to pick up the chips one by one from the beaker, and this process is complicated.

[0005] This invention was made to solve the above-mentioned problems, and the first invention aims to obtain a chip holding jig that can vacuum-hold each chip on a wafer that has been divided into chips. do. A second object of the invention is to obtain a chip holding jig that can prevent chip destruction due to static electricity. A third object of the present invention is to obtain a chip holding jig that can minimize the intrusion of cleaning liquid into the vacuum suction side during chip cleaning. Furthermore, a fourth object of the present invention is to obtain a chip holding jig that can maintain the position of the chip even after vacuum suction is released after cleaning the chip.

[0006]

[Means for Solving the Problems] In the chip holding jig according to the first aspect of the present invention, the material of the part that attracts the chip by vacuuming from the back side is a porous material. . Further, in the chip holding jig according to the second invention, the portion made of porous material is made to have electrical conductivity. Further, in the chip holding jig according to the third invention, the portion formed of a porous material is made smaller than the chip size. Furthermore, a chip holding jig according to a fourth invention,
A convex portion narrower than the interval between chips is provided, and the material of the portion wider than the interval between chips, including the convex portion, is made of a non-porous material.

[0007]

[Operation] In the chip holding jig according to the present invention, since the part that attracts the chips is formed of a porous material, vacuum suction is possible and each chip can be held individually. Furthermore, since the porous material is made of a conductive material, the influence of static electricity can be suppressed. Furthermore, since the porous material portion is made smaller than the chip size, the wafer divided into chips can be efficiently cleaned. Further, by providing a convex portion narrower than the gap between the chips, the position of the chips can be maintained even when the vacuum suction is released, so that the holding jig can also be used as a chip tray after cleaning.

[0008]

[Embodiments] Figs. 1(a), (b), and (c) are diagrams showing chip holding jigs according to first to third embodiments of the present invention, and Fig. 1(a) shows a chip holding jig. Plan view, Figure 1
(b) is a partially enlarged sectional view of the chip holding jig, and Figure 1 (c) is a partially enlarged cross-sectional view of the chip holding jig.
) is an enlarged view of area A in FIG. 1(a). Figure 1(d)
, (e) and (f) are views showing a chip holding jig according to a fourth embodiment of the present invention, FIG. 1(d) is a plan view of the chip holding jig, and FIG. 1(e) is a plan view of the chip holding jig. A partially enlarged sectional view of the jig, FIG. 1(f), is an enlarged view of region B in FIG. 1(d). In the figure, 5 is the entire chip holding jig;
6 is a porous material portion, 7 is a non-porous material portion, and 7a is a convex portion of the non-porous material portion 7. Figure 2
is a partially enlarged sectional view for explaining the operation flow of an embodiment of the present invention. In the figure, 2 is a glass plate, 9 is a divided semiconductor chip, and 8 is a part provided on the back side of the divided semiconductor chip 9. 10 is a chip protection film for protecting the surface of the semiconductor chip 9, and 11 is wax for bonding the semiconductor wafer to the glass plate 2. Note that 12 indicates the direction of evacuation for sucking the semiconductor chip 9. FIG. 3 is a diagram showing the operation flow of an embodiment of the present invention. In the figure, 100 is the alignment of the glass plate, the chip, and the jig, 101 is the vacuum suction on of the chip, 102 is the cleaning of the chip, and 103 is the process of cleaning the chip. is the chip drying and vacuum adsorption off. FIG. 4 is a partially enlarged view showing the relationship between the dimensions of the chip and the chip holding jig according to the fourth embodiment of the present invention. Dimensions of the convex portion 7a of 7,
c is the size of the chip, d is the porous material portion 6
The dimensions are

A first embodiment of the present invention is shown in FIGS. 1(a) and 1(b).
) and (c), the part of the chip holding jig with a flat surface that comes into contact with the chip is made of porous material, and the other parts are made of non-porous material. This is what I did. With such a configuration, each chip is attracted to the holding jig by drawing a vacuum from the back surface of the holding jig, and it becomes possible to securely hold each chip. In addition,
The porous portion can be realized by forming a sponge-like material, for example, from ceramic material or plastic.

Furthermore, in the second embodiment of the present invention, the portion 6 made of porous material in the first embodiment is made conductive, thereby preventing the chip from being damaged by static electricity. can. The provision of electrical conductivity can be achieved, for example, by forming a conductive resin layer on the surface of the porous part, or by covering this part with plating.

In addition, in the third embodiment of the present invention, the portion 6 made of porous material is made smaller than the chip size, which allows the wafer to be more strongly attracted and prevents cleaning liquid from entering during cleaning. can be kept to a minimum.

A fourth embodiment of the present invention is shown in FIG. 1(d).
, (e) and (f), a convex portion was provided in the non-porous portion, and the conditions shown in FIG. 4 were created between the non-porous portion 7 and the porous portion 6. It is something.

The dimensional conditions provided for the chip holding jig in this embodiment are as shown in FIG.
(a>b), and the dimension d of the porous material portion 6 is smaller than the chip dimension c (c>d)
The idea is to do so.

Next, the operation when cleaning a wafer using this embodiment apparatus will be explained. As shown in FIG. 2(a), the wafer that has been divided into chips in the semiconductor process is aligned so that the convex part of the chip holding jig is between the chips (see 100 in FIG. 3). (
b) Perform vacuum suction as shown in (see 101 in Figure 3). In this state, the wafer is placed in a cleaning solution and heated to separate the glass plate 2 and the chip. Then, as shown in Figure 2(c), the glass plate 2 is removed,
The chip is washed several times (see 102 in FIG. 3). Thereafter, drying is performed and vacuum suction is released (see 103 in FIG. 3). Even when the vacuum suction is released, the chip is supported in its original position because of the protrusion. Therefore, the chip holding jig can be used as it is as a chip tray.

Although the above embodiment uses a material that forms a non-porous portion, it can be replaced by covering only the same portion of the surface as the non-porous material portion 7 with a resin or the like.

[0016]

As described above, according to the first aspect of the present invention, since the part that holds the chip by vacuuming is formed of a porous material, the chip does not fall apart and the chip It is possible to prevent scratches caused by contact between the chips and chips during cleaning, and poor cleaning due to overlapping of chips. Furthermore, according to the second invention, since the porous material is made conductive, it is possible to suppress the effects of static electricity, thereby preventing static damage to dried chips or static electricity to the chips. It is possible to prevent adhesion due to electric attraction, making it easier to handle the chip. Further, according to the third invention, since the portion made of porous material is made smaller than the chip size, only the chip portion can be sucked, the suction power is improved, and movement of the chip can be prevented. It is possible to reduce the amount of cleaning liquid flowing into the vacuum side during chip cleaning. Furthermore, according to the fourth invention, the convex portions are provided narrower than the interval between the chips, and the portion including the convex portions that is wider than the interval between the chips is formed of a non-porous material. The position of the chip can be maintained even after the vacuum suction is released, and it can also function as a chip tray.

[Brief explanation of the drawing]

1 is a diagram showing a chip holding jig according to an embodiment of the present invention, FIG. 1(a) is a plan view of the first to third embodiments, FIG. 1(b) is a partially enlarged sectional view thereof, Figure 1(c)
is an enlarged view of area A in Fig. 1(a), and Fig. 1(d) is an enlarged view of area A in Fig. 1(d).
1(e) is a partially enlarged sectional view thereof, and FIG. 1(f) is an enlarged view of region B in FIG. 1(d).

FIG. 2 is a partially enlarged sectional view for explaining the operation flow of a fourth embodiment of the present invention.

FIG. 3 is a flow diagram for explaining a fourth embodiment of the invention.

FIG. 4 is a partially enlarged cross-sectional view showing the relationship between dimensions of a chip and a chip holding jig according to a fourth embodiment of the present invention.

FIG. 5 is a diagram showing a conventional chip cleaning method.

[Explanation of symbols] 1 Beaker 2 Glass plate 3 Wafer 3' Chip 4 Cleaning agent 5 Chip holding jig 6 Porous material portion 7 Non-porous material portion 8 Chip back metal 9 Semiconductor substrate 10 Chip protective film 11 Wax 12 Direction of vacuuming

Claims (4)

[Claims] 1. A chip holding jig characterized in that a portion for holding the chip by vacuuming from the back surface is formed of a porous material. 2. The chip holding jig according to claim 1, wherein the porous material has electrical conductivity. 3. The chip holding jig according to claim 1, wherein the portion formed of a porous material is smaller in size than the chip to be held. 4. Claim 1, characterized in that the device has a convex portion narrower than the distance between the chips to be held, and a portion including the convex portion that is wider than the distance between the chips is formed of a non-porous material. 3. The chip holding jig according to any one of 3 to 3.