JPH0611529Y2 - 回路基板への塗布装置 - Google Patents
回路基板への塗布装置Info
- Publication number
- JPH0611529Y2 JPH0611529Y2 JP11782388U JP11782388U JPH0611529Y2 JP H0611529 Y2 JPH0611529 Y2 JP H0611529Y2 JP 11782388 U JP11782388 U JP 11782388U JP 11782388 U JP11782388 U JP 11782388U JP H0611529 Y2 JPH0611529 Y2 JP H0611529Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- coating
- pin
- rotating member
- along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 title claims description 54
- 238000000576 coating method Methods 0.000 title claims description 42
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 239000012943 hotmelt Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11782388U JPH0611529Y2 (ja) | 1988-09-07 | 1988-09-07 | 回路基板への塗布装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11782388U JPH0611529Y2 (ja) | 1988-09-07 | 1988-09-07 | 回路基板への塗布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0238771U JPH0238771U (enrdf_load_stackoverflow) | 1990-03-15 |
| JPH0611529Y2 true JPH0611529Y2 (ja) | 1994-03-23 |
Family
ID=31361618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11782388U Expired - Lifetime JPH0611529Y2 (ja) | 1988-09-07 | 1988-09-07 | 回路基板への塗布装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611529Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-09-07 JP JP11782388U patent/JPH0611529Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0238771U (enrdf_load_stackoverflow) | 1990-03-15 |
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