JPH0611529Y2 - Circuit board coating device - Google Patents

Circuit board coating device

Info

Publication number
JPH0611529Y2
JPH0611529Y2 JP11782388U JP11782388U JPH0611529Y2 JP H0611529 Y2 JPH0611529 Y2 JP H0611529Y2 JP 11782388 U JP11782388 U JP 11782388U JP 11782388 U JP11782388 U JP 11782388U JP H0611529 Y2 JPH0611529 Y2 JP H0611529Y2
Authority
JP
Japan
Prior art keywords
circuit board
coating
pin
rotating member
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11782388U
Other languages
Japanese (ja)
Other versions
JPH0238771U (en
Inventor
博志 今浦
道広 北
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP11782388U priority Critical patent/JPH0611529Y2/en
Publication of JPH0238771U publication Critical patent/JPH0238771U/ja
Application granted granted Critical
Publication of JPH0611529Y2 publication Critical patent/JPH0611529Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は、回路基板に取付けられたたとえばLSI(大
規模集積回路)などの電子部品の接続端子にホツトメル
トなどと称される電気絶縁性コーテング剤を塗布するた
めの回路基板への塗布装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention provides an electrically insulating coating agent called hot melt to a connection terminal of an electronic component such as an LSI (Large Scale Integrated Circuit) attached to a circuit board. The present invention relates to a coating device for coating a circuit board.

従来の技術 第9図は、典型的な先行技術の斜視図である。回路基板
1に実装されたLSI(大規模集積回路)などの電子部
品2の複数の端子3は、回路基板1から露出しており、
このような回路基板1から露出した端子3には塗布装置
4によつていわゆるホツトメルトなどと称される電気絶
縁性コーテング剤が塗布される。このようなコーイテン
グ剤を端子3に塗布しておくことによつて、端子3が他
の電子部品のリード線などに不所望に接触してシヨート
してしまうことを防止している。
PRIOR ART FIG. 9 is a perspective view of a typical prior art. A plurality of terminals 3 of an electronic component 2 such as an LSI (Large Scale Integrated Circuit) mounted on the circuit board 1 are exposed from the circuit board 1,
The terminal 3 exposed from the circuit board 1 is coated with an electrically insulating coating agent, which is so-called hot melt, by the coating device 4. By coating the terminal 3 with such a coating agent, it is possible to prevent the terminal 3 from undesirably coming into contact with a lead wire of another electronic component or the like and being short-circuited.

このような塗布作業は、手作業によつて行われており、
多数の電子部品2の端子3に人手によつてコーテイング
剤を塗布しなければならないために、多くの労力と手間
を要してしまうという問題があつた。
Such application work is performed manually,
Since the coating agent has to be manually applied to the terminals 3 of a large number of electronic components 2, there has been a problem that much labor and labor are required.

このような問題を解決するために従来では、第10図に
示される塗布装置5が用いられている。この塗布装置5
は、回転軸線1まわりに回転駆動するように構成され
ており、塗布装置5のノズル5aを端子3の近傍に配置
した状態で、第11図に示されるように塗布開始位置P
1から仮想線6で示す軌跡に沿つて円運動しつつコーテ
イング剤を噴出し、完了位置P2で塗布装置5の回転軸
線1まわりの回転運動を停止する。そしてノズル5a
が端子3から離反する方向に塗布装置5が上昇して初期
位置に復帰し、塗布動作が完了する。
In order to solve such a problem, the coating device 5 shown in FIG. 10 is conventionally used. This coating device 5
Is configured to be driven to rotate about the rotation axis 1, and in a state where the nozzle 5a of the coating device 5 is arranged in the vicinity of the terminal 3, the coating start position P as shown in FIG.
The coating agent is ejected while making a circular motion from 1 to a locus indicated by an imaginary line 6, and the rotary motion of the coating device 5 around the rotation axis 1 is stopped at the completion position P2. And the nozzle 5a
The coating device 5 rises in the direction away from the terminal 3 and returns to the initial position, and the coating operation is completed.

しかしながら、このような先行技術では、第12図に示
されるように、平面形状が長方形である電子部品7にお
いて、領域R1で示される範囲にある端子3にはコーテ
イング剤を塗布することが可能であるが、領域R2で示
される範囲の端子3にはコーテイング剤を塗布すること
ができない。そのため塗布装置5の回転半径を大きくし
て、軌跡6を仮想線6aで示される軌跡に沿つて塗布装
置5を回転駆動しても、領域R3内の端子3にはコーテ
イング剤を塗布することができないという問題があっ
た。
However, in such a prior art, as shown in FIG. 12, in the electronic component 7 having a rectangular planar shape, it is possible to apply the coating agent to the terminals 3 in the range indicated by the region R1. However, the coating agent cannot be applied to the terminal 3 in the range shown by the region R2. Therefore, even if the radius of gyration of the coating device 5 is increased and the coating device 5 is rotationally driven along the locus 6 along the locus indicated by the imaginary line 6a, the coating agent can be coated on the terminals 3 in the region R3. There was a problem that I could not.

考案が解決しようとする課題 したがつて本考案の目的は、塗布されるべき所望とする
部分の軌跡に沿つて、確実に塗布作業を行うことがで
き、塗布作業の効率を向上することができるようにした
回路基板への塗布装置を提供することである。
SUMMARY OF THE INVENTION Accordingly, the object of the present invention is to make it possible to reliably perform the coating work along the trajectory of the desired portion to be coated, and to improve the efficiency of the coating work. An object of the present invention is to provide a coating device for a circuit board.

課題を解決するための手段 本考案は、予め定められた軌跡に沿つて回路基板に塗布
作業を行う回路基板への塗布装置において、 モータと、該モータの出力軸に取付けられる回転部材
と、該回転部材上で前記出力軸から偏心した位置に回転
自在に取付けられ、前記出力軸方向にばね付勢された案
内ピンとを備える駆動手段と、 回路基板が乗載され、前記駆動手段の案内ピンが係合す
る支持部材と、 前記支持部材と回転部材との間に介在されて固定位置に
固定され、これらとは垂直方向に相互に離間した状態
で、前記案内ピンを内周面に沿つて案内する案内孔を有
する矯正部材と、 前記支持部材と連結ピンによつて連結され、水平面上で
相互に交差する直線方向に移動可能となるように前記支
持部材を支持する第1および第2移動部材と、 回路基板に上方から臨み、固定位置に配置された塗布手
段とを含むことを特徴とする回路基板への塗布装置であ
る。
Means for Solving the Problems The present invention is directed to a circuit board coating apparatus that performs coating work on a circuit board along a predetermined locus, a motor, a rotating member attached to an output shaft of the motor, and A drive unit, which is rotatably mounted on the rotating member at a position eccentric from the output shaft and includes a guide pin that is spring-biased in the output shaft direction, and a circuit board is mounted on the drive unit. The engaging support member and the support member and the rotating member are interposed and fixed at a fixed position, and the guide pins are guided along the inner peripheral surface in a state where they are vertically separated from each other. A straightening member having a guide hole, and first and second moving members that are connected to the support member by a connecting pin and support the support member so as to be movable in linear directions intersecting with each other on a horizontal plane. And times Faces from above the substrate, a coating device to the circuit board, characterized in that it comprises a coating means disposed in a fixed position.

作用 本考案に従えば、概略的に、回路基板を搭載した支持部
材に駆動手段によつて偏心回転運動を与え、この偏心回
転に対して第1および第2の移動部材によつて前記支持
部材を変位可能に支持するとともに、前記偏心回転を矯
正部材の案内孔で所定方向の変位に規制する。
According to the present invention, roughly, the eccentric rotation motion is given to the support member on which the circuit board is mounted by the driving means, and the eccentric rotation is caused by the first and second moving members. Is movably supported, and the eccentric rotation is restricted by a guide hole of the correction member so as to be displaced in a predetermined direction.

すなわち、モータの出力軸に回転部材を取付け、その回
転部材上で前記出力軸から偏心した位置において前記出
力軸方向にばね付勢して回転自在の案内ピンを取付け、
この案内ピンを前記支持部材に係合させる。前記支持部
材は、連結ピンによつて第1および第2移動部材に連結
される。これら第1および第2移動部材は水平面上で相
互に交差する直線方向、たとえばXY方向に前記支持部
材を移動可能に支持する。
That is, a rotating member is attached to the output shaft of the motor, and a guide pin that is urged by a spring in the output shaft direction and is rotatable at a position eccentric from the output shaft on the rotating member is attached.
The guide pin is engaged with the support member. The support member is connected to the first and second moving members by a connecting pin. The first and second moving members movably support the supporting member in a linear direction intersecting with each other on a horizontal plane, for example, an XY direction.

また前記支持部材は、前記駆動手段の案内ピンが該支持
部材と前記回転部材との間に介在されて固定位置に固定
されている強制部材の案内孔の内周面に沿つて案内され
ることによつて、その偏心回転変位が、たとえば前記X
Y方向の所定量の変位に分解されて規制される。
Further, the support member is guided along the inner peripheral surface of the guide hole of the forcing member in which the guide pin of the drive means is interposed between the support member and the rotating member and fixed at a fixed position. Therefore, the eccentric rotational displacement is
It is regulated by being disassembled into a predetermined amount of displacement in the Y direction.

こうして、たとえば前記XY方向に変位自在に支持され
る支持部材上に搭載された回路基板に向けて、塗布手段
から、電気絶縁性コーテイング剤などが塗布される。
In this way, for example, an electrically insulating coating agent or the like is applied from the applying means to the circuit board mounted on the support member that is supported so as to be displaceable in the XY directions.

したがって、支持部材、すなわち回路基板の変位は、矯
正部材の案内孔の形状に対応する経路に沿つて行われる
ので、回路基板を所望とする方向に連続的に変位させる
ことができ、所望とする軌跡に沿つて回路基板に前記コ
ーテイング剤などを塗布することが可能となる。
Therefore, the displacement of the support member, that is, the circuit board is performed along the path corresponding to the shape of the guide hole of the correction member, so that the circuit board can be continuously displaced in the desired direction, which is desired. The coating agent or the like can be applied to the circuit board along the locus.

実施例 第1図は本考案の一実施例の塗布装置10の平面図であ
り、第2図は第1図の切断面線II−IIから見た断面図で
あり、第3図は塗布装置10の全体平面図であり、第4
図は塗布装置10の分解斜視図である。塗布装置10
は、回路基板11が乗載される支持部材12と、支持部
材12に回転自在なピン13が一方向にばね付勢されて
設けられる回転部材14と、支持部材12と回転部材1
4との間に介在され、前記ピン13が内周面に沿つて案
内される案内孔20を有する矯正板15と、前記支持部
材12に着脱自在に嵌り込むピン16a,16bが設け
られ、相互に交差する方向にそれぞれ変位する第1移動
部材17および第2移動部材18と、回路基板11の上
方から臨み、固定位置に配置された塗布手段19とを含
む。
Embodiment FIG. 1 is a plan view of a coating apparatus 10 according to an embodiment of the present invention, FIG. 2 is a sectional view taken along section line II-II of FIG. 1, and FIG. 3 is a coating apparatus. FIG. 10 is an overall plan view of 10,
The figure is an exploded perspective view of the coating apparatus 10. Coating device 10
Is a supporting member 12 on which the circuit board 11 is mounted, a rotating member 14 on which a rotatable pin 13 is biased in one direction by a spring, and a supporting member 12 and the rotating member 1.
4, a straightening plate 15 having a guide hole 20 for guiding the pin 13 along the inner peripheral surface thereof, and pins 16a and 16b which are detachably fitted to the supporting member 12 are provided. It includes a first moving member 17 and a second moving member 18 which are respectively displaced in a direction intersecting with, and a coating means 19 which is located at a fixed position and faces from above the circuit board 11.

前記回路基板11には、LSI(大規模集積回路)など
の電子部品22が半田付けによつて回路基板11に予め
形成された回路配線に接続されている。電子部品22が
接続された回路基板11は、逆L字状の取付け部材23
にボルトなどを用いて固定されており、取付け部材23
は支持部材12に固着されている。電子部品22の複数
の端子24には、前記塗布手段19に備えられるノズル
25からホツトメルトなどと称される電気絶縁性を有す
るコーテイング剤が塗布される。このようなノズル25
を備えた塗布手段19は、駆動機構21によつて矢符Z
1,Z2方向に上下動される。
An electronic component 22 such as an LSI (Large Scale Integrated Circuit) is connected to the circuit board 11 by soldering to a circuit wiring previously formed on the circuit board 11. The circuit board 11 to which the electronic components 22 are connected has an inverted L-shaped mounting member 23.
Is fixed to the mounting member 23 with a bolt or the like.
Are fixed to the support member 12. A coating agent having an electrically insulating property called hot melt or the like is applied to a plurality of terminals 24 of the electronic component 22 from a nozzle 25 provided in the applying unit 19. Such a nozzle 25
The coating means 19 provided with the
It is moved up and down in the Z1 and Z2 directions.

このように回路基板11が取付けられた支持部材12に
は、前記第1移動部材17に立設されたピン16a,1
6bが嵌り込む。第1移動部材17には、開口26が形
成され、前記回転部材14に設けられたピン13は開口
26を挿通して支持部材12に嵌着されている。第1移
動部材17の下方には、前記矯正板15が配置される。
矯正板15は、枠体27に乗載される。枠体27は、上
板28と、上板28の周縁部に連なる側板29と、側板
29に連なり外方に屈曲された底板30とを有する。前
記矯正板15は、第5図に示されるように、上板28に
立設された位置決めピン31a,31bが着脱自在に嵌
り込んで、上板28上に位置決めされている。
In this way, the support member 12 to which the circuit board 11 is attached has the pins 16a, 1 provided upright on the first moving member 17.
6b fits in. An opening 26 is formed in the first moving member 17, and the pin 13 provided in the rotating member 14 is fitted into the support member 12 through the opening 26. The correction plate 15 is disposed below the first moving member 17.
The correction plate 15 is mounted on the frame 27. The frame 27 has an upper plate 28, a side plate 29 continuous with the peripheral portion of the upper plate 28, and a bottom plate 30 continuous with the side plate 29 and bent outward. As shown in FIG. 5, the correction plate 15 is positioned on the upper plate 28 by the positioning pins 31a and 31b standing on the upper plate 28 being detachably fitted.

上板28の下方には、前記回転部材14が配置され、回
転部材14のピン13は上板28に形成された開口32
を挿通して、矯正板15の案内孔20の内周面に弾発的
に当接している。
The rotating member 14 is disposed below the upper plate 28, and the pin 13 of the rotating member 14 has an opening 32 formed in the upper plate 28.
And is elastically abutted on the inner peripheral surface of the guide hole 20 of the correction plate 15.

枠体27は、第2移動部材18によつて外囲される。第
2移動部材18には、相互に平行をなして配置された一
対の軸棒32a,32bが設けられる。軸棒32a,3
2bの各両端部は、第2移動部材18に固定された支持
部材33a1,33a2;33b1,33b2によつて
支持されている。これらの軸棒32a,32bには、前
記第1移動部材17に固定された各一対の軸受34a
1,34a2;34b1,34b2によつて軸支され
る。これによつて第1移動部材17は、軸棒32a,3
2bの軸線方向に沿つて矢符X1方向および矢符X2方
向に変位自在である。またこの第2移動部材18には軸
受35a1,35a2;35b1,35b2が設けられ
る。軸受35a1,35a2;35b1,35b2は、
軸棒36a,36bがそれぞれ軸支される。軸棒36
a,36bの各両端部は、支持部材37a1,37a
2;37b1,37b2によつて支持されている。した
がつて第2移動部材18は、軸棒36a,36bの軸線
方向に沿つて矢符Y1方向および矢符Y2方向に変位自
在である。これらの支持部材37a1,37a2;37
b1,37b2には、第6図に示されるように基台38
上に相互に平行に立設されたフレーム39a,39b,
39c,39dによつて支持されている。
The frame 27 is surrounded by the second moving member 18. The second moving member 18 is provided with a pair of shaft rods 32a and 32b arranged in parallel with each other. Shaft rods 32a, 3
Both ends of 2b are supported by support members 33a1, 33a2; 33b1, 33b2 fixed to the second moving member 18. A pair of bearings 34a fixed to the first moving member 17 are provided on the shaft rods 32a and 32b.
1, 34a2; 34b1 and 34b2. As a result, the first moving member 17 has the shaft rods 32a, 3
It is displaceable in the arrow X1 direction and the arrow X2 direction along the axial direction of 2b. The second moving member 18 is provided with bearings 35a1, 35a2; 35b1, 35b2. The bearings 35a1, 35a2; 35b1, 35b2 are
The shaft rods 36a and 36b are pivotally supported, respectively. Shaft 36
Each end of a and 36b has support members 37a1 and 37a.
2; 37b1 and 37b2. Therefore, the second moving member 18 is displaceable in the arrow Y1 direction and the arrow Y2 direction along the axial direction of the shaft rods 36a and 36b. These support members 37a1, 37a2; 37
b1 and 37b2 are provided with a base 38 as shown in FIG.
Frames 39a, 39b, which are erected parallel to each other on the top,
It is supported by 39c and 39d.

第7図は回転部材14に関連して設けられる構成を示す
斜視図であり、第8図は第7図の切断面線VIII−VIIIか
ら見た断面図である。前記回転部材14のハウジング4
1には、底板42がボルト43によつて取付けられる。
底板42は、駆動モータ44の出力軸45が挿通する挿
通孔46を有し、挿通孔46に出力軸45が挿入された
状態でボルト47によつて出力軸45が底板42に固定
される。底板42上には圧縮コイルばね48によつて一
方側にばね付勢された移動体49が乗載される。移動体
49には、前記ピン13の基部が嵌り込む軸孔50が形
成されており、軸孔50にピン13の基部が嵌着された
状態で、ピン13はハウジング41に形成された開口5
1から外方に突出している。
FIG. 7 is a perspective view showing a structure provided in relation to the rotating member 14, and FIG. 8 is a sectional view taken along the section line VIII-VIII in FIG. Housing 4 of the rotating member 14
A bottom plate 42 is attached to the No. 1 by bolts 43.
The bottom plate 42 has an insertion hole 46 into which the output shaft 45 of the drive motor 44 is inserted, and the output shaft 45 is fixed to the bottom plate 42 by a bolt 47 in a state where the output shaft 45 is inserted into the insertion hole 46. On the bottom plate 42, a moving body 49, which is spring biased to one side by a compression coil spring 48, is mounted. The movable body 49 is formed with a shaft hole 50 into which the base portion of the pin 13 is fitted. When the base portion of the pin 13 is fitted into the shaft hole 50, the pin 13 has an opening 5 formed in the housing 41.
It projects outward from 1.

開口51から外方に突出したピン13には、一対のロー
ラ52がピン13の軸線まわりに回転自在に装着されて
いる。これらのローラ52はピン13に形成された嵌合
溝53に嵌り込むたとえばC字状のリング54によつて
ピン13からの抜け出しが防止されている。ローラ52
は、前記矯正板15に形成された案内孔20の内周面に
弾発的に当接している。したがつて駆動モータ44に駆
動電力が供給されて出力軸45がその回転軸線まわりに
回転駆動されると、回転部材14が出力軸45と同一方
向に回転駆動され、ピン13に設けられたローラ52が
案内孔20の内周面に沿つて転動する。これによつてピ
ン13は案内孔20の形状に対応した形状に移動するこ
とができる。
A pair of rollers 52 is attached to the pin 13 protruding outward from the opening 51 so as to be rotatable around the axis of the pin 13. These rollers 52 are prevented from coming off from the pins 13 by, for example, a C-shaped ring 54 fitted into a fitting groove 53 formed in the pins 13. Roller 52
Is elastically abutted on the inner peripheral surface of the guide hole 20 formed in the correction plate 15. Therefore, when drive power is supplied to the drive motor 44 and the output shaft 45 is rotationally driven around its rotation axis, the rotary member 14 is rotationally driven in the same direction as the output shaft 45, and the roller provided on the pin 13 is rotated. 52 rolls along the inner peripheral surface of the guide hole 20. As a result, the pin 13 can move to a shape corresponding to the shape of the guide hole 20.

以上のような構成を有する塗布装置10において、支持
部材12に電子部品22が接続された回路基板11が取
付けられると、塗布手段19のノズル25が矢符Z2方
向に下降して、ノズル25の先端部分が電子部品22の
端子24の近傍に配置される。この状態で、駆動モータ
44に駆動電力が供給されると、出力軸45はその回転
軸線まわりに回転駆動して、これによつて回転部材14
は出力軸45と共通な回転軸線まわりに回転動作を開始
する。このとき、駆動モータ44に近接して配置された
シリンダ55にたとえば圧縮空気が供給されると、ピス
トン棒56が縮退して回転部材14の係止状態が解除さ
れる。これによつて回転部材14は矢符R1方向に回転
動作を開始するとともに、ピン13は案内孔20に沿つ
て移動する。このようなピン13の移動によつて支持部
材12は、ピン13の移動方向に対応した方向に変位す
る。
In the coating device 10 having the above-described structure, when the circuit board 11 to which the electronic component 22 is connected is attached to the support member 12, the nozzle 25 of the coating means 19 descends in the arrow Z2 direction, and the nozzle 25 of the nozzle 25 moves. The tip portion is arranged near the terminal 24 of the electronic component 22. When drive power is supplied to the drive motor 44 in this state, the output shaft 45 is rotationally driven around its rotation axis, whereby the rotary member 14 is rotated.
Starts a rotation operation around a rotation axis common to the output shaft 45. At this time, when, for example, compressed air is supplied to the cylinder 55 arranged close to the drive motor 44, the piston rod 56 retracts and the locked state of the rotating member 14 is released. As a result, the rotary member 14 starts rotating in the arrow R1 direction, and the pin 13 moves along the guide hole 20. By such movement of the pin 13, the support member 12 is displaced in a direction corresponding to the moving direction of the pin 13.

このような支持部材12の変位は、ピン16a,16b
を介して第1移動部材17に伝達されるとともに、第2
移動部材18に伝達される。これらの移動部材17,1
8はそれぞれ、ピン13したがつて支持部材12の移動
方向に対応して矢符X1,X2および矢符Y1,Y2方
向にそれぞれ移動する。すなわち、第1移動部材17に
固定された軸受34a1,34a2;34b1,34b
2は、軸棒32a,32bに沿つてそれぞれ矢符X1,
X2方向に案内され、第2移動部材18に固定された軸
受35a1,35a2;35b1,35b2は軸棒36
a,36bにそれぞれ沿つて案内される。
Such displacement of the support member 12 is caused by the pins 16a and 16b.
Is transmitted to the first moving member 17 via
It is transmitted to the moving member 18. These moving members 17, 1
The pins 8 follow the pins 13 and move in the directions of arrow X1, X2 and arrow Y1, Y2, respectively, corresponding to the moving direction of the support member 12. That is, the bearings 34a1, 34a2; 34b1, 34b fixed to the first moving member 17
2 is an arrow mark X1 along the shaft rods 32a and 32b, respectively.
The bearings 35a1, 35a2; 35b1, 35b2 guided in the X2 direction and fixed to the second moving member 18 are the shaft rods 36.
Guided along a and 36b respectively.

このように第1および第2移動部材17,18によつ
て、前記ピン13の変位は、直交するX−Y座標系内の
変位に分解されて案内される。これによって回路基板1
1に接続された電子部品22の形状に対応して、正確に
端子24にコーテイング剤などをノズル25から塗布す
ることが可能となる。
As described above, the displacement of the pin 13 is decomposed into the displacement in the orthogonal XY coordinate system and guided by the first and second moving members 17 and 18. This allows the circuit board 1
Corresponding to the shape of the electronic component 22 connected to 1, it is possible to accurately apply the coating agent or the like from the nozzle 25 to the terminal 24.

考案の効果 本考案によれば、ピン位置が矯正部材の案内孔に沿つて
案内されるように構成されるので、希望する軌跡に沿つ
て回路基板に塗布作業を行うことができ、しかも一連の
動作によつて塗布すべき軌跡の全長にわたつて、一挙に
塗布作業を行うことが可能となる。これによつて塗布作
業の効率を格段に向上することができる。また矯正部材
の案内孔の形状を適宜変えることによつて、所望する形
状の軌跡に沿つて塗布作業を行うことができ、本考案を
広範囲に実施することが可能となり、利便性が向上され
る。
Effect of the Invention According to the present invention, since the pin position is configured to be guided along the guide hole of the correction member, it is possible to perform the coating work on the circuit board along a desired trajectory, and a series of By the operation, it is possible to perform the coating work all at once over the entire length of the locus to be coated. As a result, the efficiency of the coating operation can be significantly improved. Further, by appropriately changing the shape of the guide hole of the correction member, the coating work can be performed along the trajectory of the desired shape, and the present invention can be implemented in a wide range, which improves convenience. .

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の一実施例の塗布装置10の平面図、第
2図は第1図の切断面線II−IIから見た断面図、第3図
は塗布装置10の全体平面図、第4図は塗布装置10の
分解斜視図、第5図は矯正板27が乗載された枠体27
の斜視図、第6図はフレ−ム39a〜39dの斜視図、
第7図は回転部材14に関連して設けられる構成を示す
斜視図、第8図は第7図の切断面線VIII−VIIIから見た
断面図、第9図は典型的な先行技術の斜視図、第10図
は他の先行技術の断面図、第11図は従来の塗布動作を
説明するための図、第12図は従来の課題を説明するた
めの図である。 10…塗布装置、11…回路基板、12…支持部材、1
3,16a,16b…ピン、14…回転部材、15…矯
正板、17…第1移動部材、18…第2移動部材、19
…塗布手段、20…案内軌溝、22…電子部品、44…
駆動モータ
FIG. 1 is a plan view of a coating apparatus 10 according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the section line II-II of FIG. 1, and FIG. FIG. 4 is an exploded perspective view of the coating device 10, and FIG. 5 is a frame 27 on which a correction plate 27 is mounted.
FIG. 6 is a perspective view of frames 39a to 39d,
FIG. 7 is a perspective view showing a structure provided in relation to the rotating member 14, FIG. 8 is a sectional view taken along the section line VIII-VIII of FIG. 7, and FIG. 9 is a typical prior art perspective view. FIG. 10 is a cross-sectional view of another prior art, FIG. 11 is a view for explaining a conventional coating operation, and FIG. 12 is a view for explaining a conventional problem. 10 ... Coating device, 11 ... Circuit board, 12 ... Support member, 1
3, 16a, 16b ... Pin, 14 ... Rotating member, 15 ... Correction plate, 17 ... First moving member, 18 ... Second moving member, 19
... coating means, 20 ... guide rail groove, 22 ... electronic component, 44 ...
Drive motor

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】予め定められた軌跡に沿つて回路基板に塗
布作業を行う回路基板への塗布装置において、 モータと、該モータの出力軸に取付けられる回転部材
と、該回転部材上で前記出力軸から偏心した位置に回転
自在に取付けられ、前記出力軸方向にばね付勢された案
内ピンとを備える駆動手段と、 回路基板が乗載され、前記駆動手段の案内ピンが係合す
る支持部材と、 前記支持部材と回転部材との間に介在されて固定位置に
固定され、これらとは垂直方向に相互に離間した状態
で、前記案内ピンを内周面に沿つて案内する案内孔を有
する矯正部材と、 前記支持部材と連結ピンによつて連結され、水平面上で
相互に交差する直線方向に移動可能となるように前記支
持部材を支持する第1および第2移動部材と、 回路基板に上方から臨み、固定位置に配置された塗布手
段とを含むことを特徴とする回路基板への塗布装置。
1. A circuit board coating apparatus for coating a circuit board along a predetermined locus, comprising: a motor, a rotating member attached to an output shaft of the motor, and the output on the rotating member. A drive unit that is rotatably mounted at a position eccentric from the shaft, and includes a guide pin that is spring-biased in the output shaft direction; and a support member on which a circuit board is mounted and the guide pin of the drive unit engages. A correction having a guide hole that is interposed between the support member and the rotating member and is fixed at a fixed position, and that guides the guide pin along the inner peripheral surface in a state where they are vertically separated from each other. A member, first and second moving members that are connected to the supporting member by a connecting pin, and that support the supporting member so as to be movable in linear directions intersecting with each other on a horizontal plane; From the Coating device to the circuit board, characterized in that it comprises a coating means disposed at a fixed position.
JP11782388U 1988-09-07 1988-09-07 Circuit board coating device Expired - Lifetime JPH0611529Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11782388U JPH0611529Y2 (en) 1988-09-07 1988-09-07 Circuit board coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11782388U JPH0611529Y2 (en) 1988-09-07 1988-09-07 Circuit board coating device

Publications (2)

Publication Number Publication Date
JPH0238771U JPH0238771U (en) 1990-03-15
JPH0611529Y2 true JPH0611529Y2 (en) 1994-03-23

Family

ID=31361618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11782388U Expired - Lifetime JPH0611529Y2 (en) 1988-09-07 1988-09-07 Circuit board coating device

Country Status (1)

Country Link
JP (1) JPH0611529Y2 (en)

Also Published As

Publication number Publication date
JPH0238771U (en) 1990-03-15

Similar Documents

Publication Publication Date Title
JPH06334391A (en) Electronic component automatic mounting device
JP3282938B2 (en) Component mounting device
JP3376515B2 (en) Contact pin bending equipment
JPH0611529Y2 (en) Circuit board coating device
CN113102967B (en) Assembling equipment and assembling method
JP3233011B2 (en) Substrate positioning device
CN214603023U (en) High-speed high-precision motion platform
JPH0247877B2 (en)
JPS6150727A (en) Xy table device and operating machine with said device
JPH03221385A (en) Rectangular coordinate type robot
JPS63178582A (en) Apparatus for applying adhesive
CN220445296U (en) Auxiliary laser tin soldering processing device
JPS61172674A (en) Soldering equipment
JPS5838609Y2 (en) bonding equipment
JP2000308845A (en) Method and device for applying viscous liquid
JP2002273673A (en) Pick-and-place unit
JPH0517873Y2 (en)
JPS62107875A (en) Thrust receiving device
JPH0246071Y2 (en)
JP3462577B2 (en) Printed circuit board assembly equipment
JPH0639518Y2 (en) Positioning mechanism
JP3240853B2 (en) Apparatus and method for applying cream solder
JPH09307291A (en) Electronic parts installation device
SU1534642A1 (en) Device for assembly of magnetic circuit stack with rotor shaft
JPH0543519Y2 (en)