JPS61172674A - Soldering equipment - Google Patents

Abstract

PURPOSE:To provide the titled soldering equipment to perform surely a soldering without causing defective solderings by constituting it so as to perform a soldering with holding constantly at all times the solder feeding position of a solder feeding nozzle against a soldering iron. CONSTITUTION:A soldering iron 72 is moved 14 on the upper part of the prescribed position of the above of the electric circuit board 12 supported on a table 10. The tip of the iron 72 is brought into contact with the soldering position of the board 12 by descending a moving body 30 together with a movable body 44. In this case if the soldering position is located to the upper part than the prescribed position due to the deflection, etc. of the board 12 the moving body 30 is slightly descended further even after the tip of the iron 72 being brought into contact with the soldering position. The movement of the movable body 44 is therefore stopped due to a lost motion being caused between the movable body 44 and moving body 30 against the energizing force of a compressed coil spring 68 at this time. The optimal positioning is thus performed with holding the iron 72 and solder feeding nozzle 66 in a constant solder feeding state. The soldering is performed by rotating slightly in anticlockwise direction a roller 48 and by feeding to the tip tip of the iron 72 a wire solder 54 with passing through a nozzle 66.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a soldering device that can automatically perform soldering work using thread solder or the like.

[Prior Art] Conventionally, in this type of soldering apparatus, a soldering iron is moved toward an arbitrary soldering position on a workpiece supported on a table, and the tip of the soldering iron is brought into contact with the workpiece. If the top surface of the workpiece is located above the predetermined position due to warpage of the workpiece when it makes contact, the soldering iron may move further even after the tip of the soldering iron contacts the workpiece. Because of this movement, a pressure higher than a predetermined pressure is applied to the workpiece, which may damage the workpiece.

Therefore, in order to eliminate this drawback, the soldering iron is supported on a soldering iron moving body for moving the soldering iron through elastic means such as a compression coil spring, so that the tip of the soldering iron touches the workpiece. When the soldering iron is moved forward after contact, lost motion occurs between the soldering iron and the soldering iron moving body due to the elastic means, so that pressure exceeding a predetermined pressure is not applied to the workpiece. .

[Problems to be Solved by the Invention] As described above, in the soldering iron disposed on the soldering iron movable body via elastic means, there is a Since the solder supply nozzle is provided on the soldering iron moving body side, when the soldering iron is moved forward and comes into contact with the workpiece, and then further moved forward, the soldering iron and the soldering iron moving body are Even if lost motion occurs between
Since the solder supply nozzle does not move and the positional relationship between the tip of the soldering iron and the tip of the solder supply nozzle changes, solder is not reliably supplied to the tip of the soldering iron, resulting in poor soldering. Something happened.

[Object of the Invention] The present invention solves the above-mentioned conventional drawbacks, and eliminates soldering defects while always maintaining a constant supply state without changing the solder supply position of the solder supply nozzle with respect to the soldering iron. The purpose of the present invention is to ensure that soldering work is performed without causing problems such as the like.

[Means for Solving the Problems] In order to achieve the above object, in the present invention, the object is moved relative to an arbitrary position on the table and parallel to the top surface of the table, and is moved toward the workpiece. A movable body, which is normally pressed toward the table side by a pressing means, is supported so as to be slidable along the reciprocating direction, and a soldering iron and a soldering iron are attached to the movable body. A solder supply nozzle having an open end located near the tip of the soldering iron is fixed, and a supply means for supplying solder is disposed near the proximal end of the solder supply nozzle.

[Function] With the above-described configuration, the movable body moves relatively toward the workpiece at an arbitrary soldering position on the table, and the tip of the soldering iron contacts the workpiece, causing the movable body to move toward the workpiece at any soldering position on the table. When the movable body is moved further forward even after the movement of the movable body is blocked, lost motion occurs between the movable body and the movable body against the pressing means, and the soldering iron and the solder supply nozzle move together. Since the solder supply position of the solder supply nozzle with respect to the soldering iron is not changed, the soldering work can be performed reliably.

[Example] An example embodying the present invention will be described below with reference to the drawings.

As shown in FIG. 1, an electric circuit board 12 as a workpiece is installed on the table 10 so as to be parallel to the top surface of the table 10, and a transfer device 14 is located at the right end of the table 10 in FIG. is set up. Transfer device 114
a drive body 14C disposed along the right side edge and configured to move the first movable body 14b in the longitudinal direction (front and back direction in FIG. 1) by a DC servo motor (not shown); , the driving body 14G is driven by another DC servo motor (not shown) provided on the first moving body 14b.
The second movable body 14d is moved in the left-right direction perpendicular to the longitudinal direction of the second movable body 14d.

At the left end of the second moving body 14d in FIG.
A near rotary cylinder 18 is attached via a mounting member 16. Air 0-Tari cylinder 18 has its shaft 20
The shaft 20 is arranged so that its axis is perpendicular to the upper surface of the table 10, and the shaft 20 projects to both upper and lower sides of the near rotary cylinder 18. On the lower protrusion of this shaft 20,
The first arm 22 is fixed in a state extending in the radial direction of the shaft 20. The first arm 22 has a second arm 24
is fixed by two tightening bolts 26 so as to be rotatably adjustable.

A stepped through hole 25 is formed in the second arm 24 in the vertical direction in FIG. 1, that is, parallel to the shaft 20, and a guide rod 28, 28 is slidably inserted through the stepped through hole 25. Furthermore, a movable body 30, which will be described later, is fixed to the lower end of the guide rod 28,28. On the other hand, guide rod 2
A stopper nut 32.32 screwed onto the guide rod 28.28 and a receiver 33 slidably fitted into each guide rod 28.28 are disposed at the upper end of 8.28. At the same time, this receiver 33 and the stepped portion 25a of the through hole 25
A compression coil spring 34 is disposed between the movable body 30 and the movable body 30 to urge the moving body 30 to an upper non-active position.

Guide rod 28.28 at the upper end of the second arm 24
An air cylinder 58 is fixed to 11J, and when the air cylinder 58 is in operation, compression coil springs 34, 34
The movable body 30 is placed in the working position where the soldering work is performed against the action of
It is configured so that it can be moved. The downward movement limit of this moving body 30 is that the receiving body 33 is
By adjusting the screwing position of the stopper nut 32, 32 with respect to the guide rod 28° 28, the movement of the moving body 3
The lowering limit of 0 can be adjusted.

The movable body 30 includes a fixing member 36 to which the guide rods 28 and 28 are fixed, and a substantially U-shaped support member 40 fixed to the lower side of the fixing member 36 by a tightening bolt 38.
The guide body 42 is fixed to the support member 40 so as to extend in a direction perpendicular to the upper surface of the table 10.

A hollow movable body 44 is vibably supported by the guide body 42, and solder is applied to the movable body 44 via a soldering iron holding member 70 which is approximately U-shaped on the right side in FIG. A iron 72 is fixed.

Further, a motor 46 is fixed to the side surface of the movable body 44 as shown in FIG.
A roller 52 is rotatably supported via a substantially U-shaped support member 50 opposite to the roller 52 . A thread solder guide tube 56 for guiding the thread solder 54 is fixed on the upper side of the movable body 44, and the thread solder guide tube 56 guides the thread solder 54 so that it is held between the rollers 48.52111.

A solder wire reel 60, which is a supply source of the solder wire 54 sent by these solder supply means 46, 48, 52, is rotatably attached to a reel support frame 62 fixed to the upper end of the shaft 20 of the near rotary cylinder 18. Supported.

The upper end of a pipe-shaped solder supply nozzle 66 is fixed to the lower end of the movable body 44 via a fixing member 64. The solder supply nozzle 66 has a lower end bent toward the tip of the soldering iron 72, and is provided so as to guide the thread solder 54 supplied by the supply means 46, 48, 52 toward the soldering iron 72. It is being

In the movable body 44 and the movable body 30fil, a compression coil spring 68 is disposed on the guide rest 42 of the movable body 30, and always urges the movable body 44 downward.

The present embodiment is configured as described above, and its operation will be explained next.

First, the soldering iron 72 is first moved by the transfer device 114 to a predetermined position above the electric circuit board 12 supported on the table 10 . At this time, the near rotary cylinder 18 is operated according to the shape of the soldering part to change the direction of the soldering iron 72.

Next, when the air cylinder 58 is actuated, the movable body 44 and the movable body 30 are lowered against the urging force of the compression coil springs 34 and 34, and the tip of the soldering iron 72 is placed at the soldering position of the electric circuit board 12. be contacted. However, if the soldering part is located above the predetermined position due to warping of the electrical circuit board 12, etc., even after the tip of the soldering iron 72 contacts the soldering part 1, the movable body 30 may move slightly further. will be lowered to

Therefore, at this time, lost motion occurs between the movable body 44 and the movable body 30 against the biasing force of the compression coil spring 68, and the movement of the movable body 44 is stopped.

In this way, the soldering iron 72 and the solder supply nozzle 66 are positioned at optimal positions while maintaining a constant solder supply state. Thereafter, when the motor 46 is driven, the roller 48 is slightly rotated counterclockwise in FIG. The soldering iron 72 is supplied to the tip of the soldering iron 72 to perform soldering work.

When the soldering work is completed, the operation of the air cylinder 58 is released, the movable body 30 is raised by the biasing force of the compression coil spring 34, and the movable body 44 is returned to its position by the biasing force of the compression coil spring 68. Then, the soldering iron 72 is separated from the electric circuit board 12.

Thereafter, operations similar to those described above are repeated to perform a predetermined soldering operation.

[Effects of the Invention] As described in detail above, the present invention enables soldering work to be performed while the solder supply position of the solder supply nozzle with respect to the soldering iron is always held constant, thereby preventing soldering defects. This has the effect that soldering work can be performed reliably without any problems.

[Brief explanation of drawings]

FIG. 1 is a front view of a soldering device which is an embodiment of the present invention;
Figure 2 is an enlarged sectional view of the main part of Figure 1, Figure 3 is 3 in Figure 2.
- It is a 3-line sectional view. In the figure, 10 is a table, 12 is an electric circuit board (workpiece), 30 is a movable body, 44 is a movable body, 46, 48, 52 are motors and rollers constituting the supply means, 54 is thread solder, 6
6 is a solder supply nozzle, 68 is a compression coil spring (pressing means), and 72 is a soldering iron.

Claims (1)

[Claims] A workpiece (12) supported on the table (10) while being moved relative to an arbitrary position on the table (10) and parallel to the top surface of the table (10). a movable body (30) that is relatively reciprocated toward ) side, and the open end is located near the tip of a soldering iron (72) disposed on the movable body (44) and fixed to the movable body (44). a solder supply nozzle (66) for supplying and guiding solder (54) to the tip of the soldering iron (72); and a solder supply nozzle (66) on the movable body (44).
The solder supply nozzle (6) is disposed near the proximal end of the solder supply nozzle (6).
supply means (46,
48, 52), and when the movable body (30) is moved toward the workpiece (12), the tip of the soldering iron (72) contacts the workpiece (12). The movable body (44)
When the movable body (44) is further moved forward after the movement of the movable body (44) is blocked, the movable body (44) resists the pressing means (68).
) and a moving body (30).