JPH0611353U - Hermetically sealed package - Google Patents

Abstract

(57) [Abstract] [Purpose] In the hermetically sealed package, the purpose is to eliminate the process after the external leads are glass-sealed to the minimum necessary number and to eliminate extra connection points. A holder 21 to which a feedthrough capacitor 2 is attached is fixed to a stem 12 of a hermetically sealed package 1, and an end portion of a lead 22 of the feedthrough capacitor in which a deformed portion (221, for example) is formed in advance is The ends of the leads are used as the external leads 15 of the package by being glass-sealed while being inserted into the stem 12.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure of a hermetically sealed package used for a vehicle-mounted sensor or the like, and more particularly to a structure of a hermetically sealed package in which a through capacitor for noise removal is connected to its external lead.

[0002]

[Prior art]

 Generally, in a hermetically sealed package in which a wiring board such as a vehicle-mounted sensor (eg acceleration sensor) is housed, a feedthrough capacitor may be connected to the external lead in order to remove noise from the outside. In this case, since the holder to which the feedthrough capacitor is attached is rigidly fixed to the stem of the hermetically sealed package, if the ambient temperature range of the sensor is wide, the expansion and contraction due to heat increases accordingly. It is necessary to give the external leads an escape from heat stress.

FIG. 2 exemplifies the structure of this type of hermetically sealed package 1 in the prior art. Reference numeral 11 is a wiring board such as a sensor housed in the package, 12 is a stem of the package, and 13 is a stem. Melting the glass beads 14 after the external leads 15 '(having a crushed upper portion) of the package are inserted into the through holes 13 with a predetermined number of through holes provided in the stem 12. The outer lead 15 ′ is glass-sealed to the system 12 by the above. Reference numeral 16 is a wire for connecting a terminal on the wiring board to the external lead 15 ', and 17 is a cap.

Reference numeral 21 is a holder (having earth potential) to which the feedthrough capacitor 2 is attached by soldering, and an end portion 23 of the holder 21 is bent and fixed to the stem 12. Reference numeral 22 'is a lead of the capacitor penetrating through the feedthrough capacitor 2, and one end of the lead 22' is curved as indicated by 221 "in order to absorb the above-mentioned thermal stress. Above, the lead 22 'and the outer lead 15' are soldered (222 'shows the soldering part).

In this case, the outer leads 15 ′ are glass-sealed by first melting the glass beads 14, then the feedthrough capacitor 2 is soldered to the holder 21, and then the end portion of the holder 21. 23 is fixed to the stem 12 by welding or the like, and after these steps are completed, the lead 22 'of the feedthrough capacitor is soldered (retrofitted) to the external lead 15' at the portion 222 '. The other end of the lead 22 'of the feedthrough capacitor may be soldered to the motherboard 3 so as to be connected to the ECU side in the motherboard 3 in which the control circuit (ECU) to which the sensor is connected is mounted. It is fixed at the attachment part 31.

However, according to such a configuration, the outer lead of the package has to have a straight overall shape in order to have a crushed shape on the upper portion thereof, and thus the external lead is used to reduce the thermal stress. In order to absorb it, a step of bending (post-forming) the lead of the feedthrough capacitor as described above is required after the glass sealing step, and then the lead of the feedthrough capacitor is soldered to the external lead. There is also a problem that a step of connecting afterwards by attaching or welding is required, and the number of man-hours increases accordingly. Furthermore, when the lead of the feedthrough capacitor is bent after the glass has been sealed as described above (that is, when the forming is performed after the above description), the sealed glass portion may be broken, resulting in a package. There were also problems such as impairing the airtightness of.

[0007]

[Problems to be solved by the device]

 The present invention has been made in order to solve the above-mentioned problems, and the end portions of the lead of the feedthrough capacitor, which is partially deformed (forming) in advance, are glass-sealed in the stem of the package to obtain the feedthrough capacitor. The lead of the package also serves as the external lead of the package (that is, the lead of the feedthrough capacitor and the external lead are integrated), so that after the external lead is glass-sealed as in the prior art described above, The number of forming and post-mounting processes has been reduced, and the reliability of the package itself has also been improved by eliminating the glass breakage during such post-forming and the extra connection points caused by retrofitting.

[0008]

[Means for Solving the Problems]

 According to the present invention, in order to solve such a problem, a hermetically sealed package in which a holder having a feedthrough capacitor attached to a stem on which a wiring substrate is mounted is fixed, and a part of which is deformed in advance A hermetically sealed package in which the ends of the leads of the feedthrough capacitor are sealed while being inserted into the stem, so that the ends of the leads are the external leads of the package. Provided.

[0009]

[Action]

 According to the above configuration, it is possible to reduce the above-mentioned post-forming and post-mounting steps after the external leads are glass-sealed, and the sealing points are not cracked during the post-forming, and the extra forming caused by the post-mounting is performed. Since there are also no connecting points, the reliability of the package can be improved without impairing the airtightness of the package.

[0010]

【Example】

 FIG. 1 shows the structure of an airtightly sealed package as one embodiment of the present invention, and the portions common to those in FIG. The feature of the present invention is that the end of the lead 22 of the feedthrough capacitor, which is partially deformed in advance, is inserted into the stem 12 of the package in order to absorb the thermal stress. By the glass sealing in this state, the ends of the leads 22 serve as the external leads 15 of the package (that is, the lead 22 of the feedthrough capacitor and the external lead 15 of the package are unified. ) There is a point. As an example of deforming (forming) the lead, a deforming portion 221 is shown in FIG. 1 (A), and as another example, a deforming portion 221 'is shown in FIG. 1 (C). There is.

In addition, in FIG. 1B, as described above, the deformation portion 221 for absorbing the thermal stress is formed in advance, and the lead of the feedthrough capacitor integrated with the external lead 15 (that is, previously formed). The lead) 22 is inserted into the stem 12 of the package and glass-sealed with the glass beads 14 to show the situation. Here, the difference from the above-mentioned prior art is that, in the above-mentioned prior art, as shown in FIG. 2B, an outer lead 15 'having a shape with an upper part inserted is inserted from the upper part of the stem 12 (that is, the package side). In contrast to this, in the present invention, the lead (external lead and feedthrough capacitor lead) preformed as described above is inserted from the lower portion of the stem 12 (that is, the feedthrough capacitor side), and the lower portion (feedthrough capacitor side) is inserted. By inserting from the capacitor side), the forming lead (lead without the crushing of the upper portion as in the conventional example) can be glass-sealed on the stem. In this case, since the leads are formed in advance before the glass is sealed, it is possible to position the forming part of the leads near the lower surface of the stem, and the function of absorbing the thermal stress is provided. Can be fully achieved.

In this way, the deforming portion for absorbing thermal stress is formed in advance, and the external lead and the feedthrough capacitor lead are integrated into one lead. In addition to eliminating the need for a post-attachment step, the sealing glass portion will not be broken during such post-forming, and an extra connection point due to the post-attachment can be eliminated. Moreover, as described above, since the deformed portion is formed in the lead portion located near the lower surface of the stem, the function of absorbing thermal stress can be sufficiently exerted.

[0013]

[Effect of device]

 According to the present invention, in the hermetically sealed package, the number of steps after glass-sealing the external leads can be reduced to the minimum necessary number, and the hermeticity and reliability of the package can be improved. .

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a hermetically sealed package as one embodiment of the present invention.

FIG. 2 is a diagram illustrating a configuration of a hermetically sealed package as a conventional technique.

[Explanation of Codes] 1 ... Hermetically sealed package 11 ... Wiring substrate 12 ... Stem 14 ... Glass beads 15, 15 '... External lead 16 ... Wire 17 ... Cap 2 ... Feedthrough capacitor 21 ... Feedthrough capacitor holder 22, 22' ... Feedthrough capacitor leads 221, 221 ', 221 "... Lead deforming portion 222' ... Rear soldering portion 3 ... Motherboard

Claims (1)

[Scope of utility model registration request] 1. A hermetically sealed package having a holder on which a feedthrough capacitor is attached is fixed to a stem on which a wiring board is mounted, wherein an end portion of a lead of the feedthrough capacitor partially deformed in advance is provided. A hermetically sealed package, wherein the ends of the leads are external leads of the package by being sealed while being inserted into the stem.