JPH06111324A - Vapor deposition device - Google Patents

Abstract

PURPOSE:To regulate the vaporizing direction of a magnetic metal and to prevent the nonuniformity in the thickness of the magnetic metal deposited on a film. CONSTITUTION:A shielding cylinder 31 contg. an impeller 32 is provided between a crucible 17 and a shielding mechanism 19 placed close to a film 1. Meanwhie, a hole 31a is formed in the side face of the cylinder 31 to irradiate a magnetic metal 16 put in the crucible 17 with an electron beam 18a from an electron beam gun 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor deposition apparatus, and more particularly to a technique for preventing deposition of a vapor deposition material on an inner wall surface of the apparatus when the vapor deposition material is vapor deposited on the material to be vapor deposited.

[0002]

2. Description of the Related Art Conventionally, as an apparatus for manufacturing a magnetic recording medium such as a magnetic tape or a hard disk, an evaporation apparatus for heating and evaporating a magnetic metal on the surface of a film is known. In FIG. 4 showing such a conventional vapor deposition apparatus, the inside of the vacuum vapor deposition tank 11 of the vacuum vapor deposition apparatus 10 is continuously evacuated by a vacuum exhaust system 12 and maintained at a predetermined vacuum degree.

The unwinding roll 13, the cooling can 14, and the winding roll 15 in the vacuum vapor deposition tank 11 are in the shape of a cylinder that rotates around an axis, and are, for example, magnetic tape base materials.
The film 1 of the material to be vapor-deposited made of T (polyethylene terephthalate) is mounted on the unwinding roll 13, guided by the peripheral side surface of the cooling can 14, moved in the direction of the arrow, and taken up by the winding roll 15.

The crucible 17 is made of magnesia (MgO), for example.
And the like, and the magnetic metal 16 is disposed immediately below the rotation axis of the cooling can 14 so as to face a predetermined region of the film 1 on which vapor deposition is performed, and the magnetic metal 16 as a vapor deposition material is put therein. An electron beam 18a is emitted from the electron beam gun 18 toward the magnetic metal 16 in the crucible 17, and this serves as a vapor deposition source. In the vicinity of the vapor deposition surface of the film 1, a shielding mechanism 19 including a support frame 19a having an opening in the vapor deposition area of the film 1 and a movable plate 19b that can be opened and closed on the support frame 19a is arranged. Has been done. When the irradiation of the electron beam 18a is started, the movable plate 19b is closed, but when the magnetic metal 16 is heated and melted and the deposition rate becomes constant, the movable plate 19b is opened and the heated and evaporated magnetic metal 16 is supported. Film 1 through the opening of frame 19a
Is vapor-deposited on a predetermined area of.

[0005]

In the conventional vapor deposition apparatus, when the magnetic metal 16 is vapor-deposited on the surface of the film 1, the vaporized magnetic metal 16 evaporates straight toward a predetermined region on the surface of the film 1 to be vapor-deposited. Not limited to this, it also evaporates and adheres to the inner wall surface of the vacuum deposition tank 11. Although this amount of adhesion varies depending on the structure of the vapor deposition device 10, the magnetic metal 16 to be vapor deposited and the vapor deposition method, it is generally 10 times or more the amount of deposition on the film 1. Therefore, when the magnetic metal 16 used is expensive as well as cleaning the inside of the vacuum deposition tank 11, the recovery rate of the magnetic metal 16 is low, and the magnetic tape is accordingly expensive.

Further, in order to recover the magnetic metal 16, the crucible 17
A method of limiting the evaporation direction by providing a shielding tube between the support frame 19a and the support frame 19a is conceivable. However, the vapor of the magnetic metal 16 evaporated from the crucible 17 does not always evaporate toward the film 1 uniformly, and The film thickness of the magnetic metal 16 vapor-deposited on the film 1 becomes uneven. The present invention has been made in view of such conventional problems, the vapor deposition material does not adhere to the inner wall of the vapor deposition tank, and vapor deposition of a structure capable of preventing the film thickness unevenness of the vapor deposition material on the vapor deposition material The purpose is to provide a device.

[0007]

For this reason, the present invention provides a vapor deposition apparatus provided with a vapor deposition source of a vapor deposition material, and a can for guiding the vapor deposition material above the vapor deposition source. And a shield cylinder extending in a cylinder shape along the evaporation direction and having inside the cylinder a rotary blade for stirring the vapor of the vapor deposition material from the vapor deposition source.

[0008]

According to the above structure, the deposition of the deposition material other than the deposition target material is limited to almost the inside of the shield cylinder, and the deposition of the deposition material on the inner wall of the apparatus is prevented. The evaporated vapor of the vapor deposition material is agitated by a rotary blade to be homogenized and vapor deposited on the vapor deposition material. Therefore, the film thickness of the vapor deposition material vapor deposited on the vapor deposition target material becomes uniform.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same elements as those in FIGS. 4 and 5 are designated by the same reference numerals and the description thereof will be omitted. In FIG. 1 showing the present embodiment, a shielding cylinder 31 supports a crucible 17 in which a magnetic metal 16 which is a vapor deposition material is inserted, and a shielding mechanism 19 which is guided by the peripheral side surface of a cooling can 14 and is close to the film 1. It is interposed between the frame 19b and the frame 19b along the evaporation direction. Shield 31
Is made of a heat-resistant material so that it can withstand the high temperature caused by the magnetic metal 16 evaporated by heating. As the heat resistant material, a material having a heat resistant temperature of about 1000 ° C. or higher, for example, a metal such as iron or copper is used. The shield cylinder 31 has inside the cylinder a rotary blade 32 for stirring the vapor of the magnetic metal 16 evaporated from the crucible 17.

Next, the structure of the shield cylinder 31 will be described with reference to FIGS. 2, 3 and 4 are a plan view, a side view and a partial sectional view of FIG. 3, respectively, of the shielding cylinder 31. In FIG. 2, the rotary blade 32 is composed of, for example, four blades 32a to 32d, and each rotary blade 32a to 32d is connected to a circular rotary frame 33. The drive device 34 for the rotary vanes 32 is provided outside the shield cylinder 31 so as not to obstruct vaporization of the vapor of the magnetic metal 16. The shielding cylinder 31 is configured by connecting the shielding cylinders 31A and 31B with a cover 35, and the rotating frame 33 is a ball bearing.
It is carried by the shield cylinders 31A and 31B via 36a to 36d. The outer circumference of the rotating frame 33 is a gear, and the cover 35
Has an opening 35a, and the rotary frame 33 meshes with the gear 37 at this opening 35a. Then, the rotary frame 33 rotates by receiving power from the drive device 34 via the rotary shaft 38 and the gear 37.

On the side surface of the shield cylinder 31, the electron beam 18a
So that the magnetic metal 16 is irradiated from the electron beam gun 18,
A hole 31a is provided in a portion that serves as a passage for the electron beam 18a. Next, the operation will be described. The electron beam 18a from the electron beam gun 18 is irradiated onto the magnetic metal 16 in the crucible 17 through the hole 31a, and the rotary frame 33 is driven by the drive device 34 to rotate the rotary shaft 38 and gears.
Starting to rotate via 37, the rotary blade 32 in the shielding cylinder 31 also rotates. When the irradiation of the electron beam 18a is started, the movable plate 19b
Is closed. The movable plate 19b opens when the magnetic metal 16 is heated and melted and the deposition rate becomes constant, and the heated and evaporated magnetic metal 16 is deposited on a predetermined region of the film 1 through the opening of the support frame 19a.

The vapor of the magnetic metal 16, for example, which has evaporated from the crucible 17 toward the inner wall of the shield tube 31 at an angle is blocked by the shield tube 31 and prevented from adhering to the inner wall of the evaporation vacuum deposition tank 11. On the other hand, the vapor of the magnetic metal 16 is agitated by the rotation of the rotary blades 32 and made uniform. Therefore, the magnetic metal 16 is uniformly vapor-deposited on the film 1, the vapor-deposited film thickness is also uniform, and the film thickness unevenness is eliminated.

According to this structure, the magnetic metal 16 other than the film 1 is attached only to the inside of the shield cylinder 31 and is prevented from being attached to the inner wall of the vacuum vapor deposition tank 11. Also, the magnetic metal 16 evaporated by the rotation of the rotary blades 32 of the shield cylinder 31
Is agitated to be uniformized and deposited on the film 1. Therefore, the film thickness of the magnetic metal 16 on the film 1 becomes uniform, and the film thickness unevenness can be prevented.

In this embodiment, the electron beam evaporation method as shown in FIG. 1 was used to heat and evaporate the magnetic metal.
Not limited to this, a magnetic field deflection type in which an electron beam is deflected by a magnetic field or the like may be used. When this method is used, the position of the hole provided on the side surface of the shield cylinder is set in accordance with the passage of the electron beam with which the magnetic metal in the crucible is irradiated from the electron beam gun disposed under the crucible or the like. Of course, not only the electron beam evaporation method, but also other evaporation methods such as resistance heating evaporation,
A high frequency induction heating vapor deposition method or the like can also be used.

[0015]

As described above, according to the present invention, a shield cylinder having a rotary blade in the cylinder is provided between the vapor deposition source and the material to be vapor-deposited, so that the vapor deposition material on the inner wall surface of the apparatus can be prevented. Adhesion is prevented and cleaning etc. becomes easy. Further, by the rotation of the rotary blades, the vapor of the vapor deposition material is agitated and uniformized, and the vapor deposition material deposited on the vapor deposition target material has a uniform thickness, so that unevenness of the thickness can be prevented.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a plan view of the shield cylinder of FIG.

FIG. 3 is a side view of the shield cylinder of FIG.

FIG. 4 is a partial cross-sectional view of FIG.

FIG. 5 is a diagram of a conventional vapor deposition device.

[Explanation of symbols]

 1 film 10 vacuum deposition apparatus 11 vacuum deposition tank 16 magnetic metal 17 crucible 18 electron beam gun 19 shield mechanism 31 (31A, 31B) shield cylinder 32 (32a to 32d) rotary blade 33 rotary frame 34 drive unit

Claims (1)

[Claims] 1. A vapor deposition apparatus comprising a vapor deposition source of a vapor deposition material and a can for guiding the vapor deposition material above the vapor deposition source, wherein a tube is provided between the vapor deposition source and the can along an evaporation direction. A vapor deposition apparatus comprising a shield tube that extends in a circular shape and has a rotating blade inside the tube that agitates the vapor of the vapor deposition material from the vapor deposition source.