JPH06105790B2 - Photo detector - Google Patents
Photo detectorInfo
- Publication number
- JPH06105790B2 JPH06105790B2 JP60123987A JP12398785A JPH06105790B2 JP H06105790 B2 JPH06105790 B2 JP H06105790B2 JP 60123987 A JP60123987 A JP 60123987A JP 12398785 A JP12398785 A JP 12398785A JP H06105790 B2 JPH06105790 B2 JP H06105790B2
- Authority
- JP
- Japan
- Prior art keywords
- opening hole
- package
- photodetector
- laminated substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 13
- 238000007789 sealing Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
Description
【発明の詳細な説明】 （発明の技術分野） 本発明は光信号処理を行う光検出装置に関し、特に複数
の集積回路素子等を備える所謂ハイブリッド型の光検出
装置に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a photodetector that performs optical signal processing, and more particularly to a so-called hybrid photodetector that includes a plurality of integrated circuit elements and the like.
（発明の背景） 従来、フォトダイオードやフォトトランジスタ等の光セ
ンサと、該光センサの検出信号を演算処理等する集積回
路素子等を同一の容器（パッケージ）に設置する場合
に、特願昭60−24057号公報に示すような構造としたい
た。(Background of the Invention) Conventionally, in a case where an optical sensor such as a photodiode or a phototransistor and an integrated circuit element or the like for processing a detection signal of the optical sensor are installed in the same container (package), Japanese Patent Application No. The structure is as shown in the publication of -24057.
第４図は、該公報に記載するハイブリッド型の装置の構
造を示す。FIG. 4 shows the structure of the hybrid type device described in this publication.
同図において、セラミックスやプラスチック等で形成さ
れた略立方体のパッケージ１に、方形の開口部a,bを互
いに水平面に並べて形成し、該開口部a,b内に所定の機
能を有する集積回路素子2,3を収容する。例えば、集積
回路素子２を光センサとし、集積回路素子３を該光セン
サの検出信号を処理する処理用素子とする。As shown in the figure, in a substantially cubic package 1 made of ceramics, plastic or the like, rectangular openings a and b are formed side by side in a horizontal plane, and the integrated circuit element having a predetermined function is provided in the openings a and b. Accommodates a few. For example, the integrated circuit element 2 is used as an optical sensor, and the integrated circuit element 3 is used as a processing element that processes a detection signal of the optical sensor.
そして、透明なガラスやプラスチック等からなる平板状
の封口板４にて開口部ａを密閉し、一方の開口部ｂを金
属板にて密閉する。Then, the opening a is sealed by the flat plate-shaped sealing plate 4 made of transparent glass or plastic, and the one opening b is sealed by the metal plate.
尚、パッケージ１には、不図示の配線用リードフレーム
等が形成されており、該リードフレームを介して集積回
路素子2,3がワイヤーボンディングや半田などにより電
気的に配線されるとともに、パッケージ１の外部に突出
する金属製リード端子６に配線されている。A wiring lead frame or the like (not shown) is formed in the package 1, and the integrated circuit elements 2 and 3 are electrically wired through the lead frame by wire bonding, soldering, or the like, and the package 1 Is wired to the metal lead terminal 6 projecting outside.
（発明が解決しようとする問題点） このような構成の装置にあっては、パッケージの同一平
面上に複数の素子を並設することから装置が大きくな
り、機器に実装するとき実装面積が大きくなる問題があ
った。(Problems to be Solved by the Invention) In a device having such a configuration, a plurality of elements are arranged side by side on the same plane of the package, so that the device becomes large, and the mounting area becomes large when mounted on a device. There was a problem.
又、光センサ等を有する光検出装置の場合、必然的に例
えば、光学機器に装着する際に光学系等との光軸の調整
等を行う必要が生じるが、実装面積が大きいこと及び矩
形であることで該装着の際の自由度が限定され、調整等
が困難となる問題があった。Further, in the case of a photodetector having an optical sensor or the like, it is inevitably necessary to adjust the optical axis with the optical system or the like when it is mounted on an optical device, but it requires a large mounting area and a rectangular shape. Due to this, there is a problem that the degree of freedom in mounting is limited, and adjustment and the like become difficult.
（発明の目的） 本願発明は、これらの欠点を解決し、実装面積を小さく
することで実装を容易に行うことができ、また精度の良
い位置合せを可能とする光検出装置を提供する事を目的
とする。(Object of the Invention) It is an object of the present invention to provide a photodetector that solves these drawbacks and that can be mounted easily by reducing the mounting area and that enables accurate positioning. To aim.
（発明の概要） かかる目的を達成するために、本発明は円筒型パッケー
ジを用い、円筒型パッケージが積層基板からなり、積層
基板の内部に配線用の金属パターンをプリント配線し、
積層基板の一方の面と他方の面に内側端の周囲に段部が
設けられた開口穴を形成し、一方の開口穴の底の部分に
前記センサ素子を配置し、他方の開口穴の底の部分に前
記処理装置を配置したものである。(Summary of the Invention) In order to achieve such an object, the present invention uses a cylindrical package, the cylindrical package is composed of a laminated substrate, and a wiring metal pattern is printed inside the laminated substrate,
An opening hole is formed in which a step portion is provided around the inner end on one surface and the other surface of the laminated substrate, the sensor element is arranged at the bottom of one opening hole, and the bottom of the other opening hole is formed. The processing device is arranged in the portion.
（実施例） 第１図、第２図は本発明による光検出装置の一実施例を
示す分解斜視図であって、第１図は上面視斜視図、第２
図は底面視斜視図であり、第１図において、セラミック
ス製の円筒型パッケージ７の上端側に方形の開口穴８が
形成され、該開口穴８の内側端の周囲には段部９が形成
されている。(Embodiment) FIGS. 1 and 2 are exploded perspective views showing an embodiment of the photodetector according to the present invention, and FIG. 1 is a top perspective view and FIG.
The figure is a bottom perspective view. In FIG. 1, a rectangular opening hole 8 is formed on the upper end side of a ceramic cylindrical package 7, and a step portion 9 is formed around the inner end of the opening hole 8. Has been done.
一方、第２図において、パッケージ７の底端に方形の開
口穴10が形成されている 11は信号等の入出力用リード端子であり、パッケージ７
の底端に突設されている。On the other hand, in FIG. 2, a rectangular opening 10 is formed at the bottom end of the package 7, and 11 is a lead terminal for inputting / outputting signals and the like.
Is projected at the bottom edge of the.
尚、パッケージ７は積層構造をしており、内部に配線用
の金属パターンがプリント配線されている。The package 7 has a laminated structure, and a metal pattern for wiring is printed inside.
次に、組み立て手順と共に構成を説明すると、パッケー
ジ７の上側開口穴８の底の部分に光センサ12を収容し、
所謂ワイヤーボンディグ等で前記金属パターン等に接続
配線する。次に、パッケージ７の裏側から、開口穴10の
底の部分に演算処理集積回路素子13やチップ抵抗14、コ
ンデンサ15等の電気部品を収容し、所謂ワイヤーボンデ
ィングや半田などで接続配線する。Next, the configuration will be described together with the assembling procedure. The optical sensor 12 is housed in the bottom portion of the upper opening hole 8 of the package 7,
Connection wiring is performed to the metal pattern or the like by a so-called wire bond dig. Next, from the back side of the package 7, electrical components such as the arithmetic processing integrated circuit element 13, the chip resistor 14 and the capacitor 15 are housed in the bottom portion of the opening hole 10 and connected and wired by so-called wire bonding or soldering.
次に、透明なガラス等の透明板からなる封口板16をパッ
ケージ７の段部９に嵌めてエポキシ系樹脂等の接着在に
て接着し、開口穴８を封止する。又、底端部には、金属
の平板からなる封口板17を、予め塗布しておいた金属ロ
ウ材でもって溶融固着し、該開口穴10を封止する。尚、
封口板17にセラミックスの平板等を用いてもよく、この
場合には接着剤で封止する。Next, a sealing plate 16 made of a transparent plate such as transparent glass is fitted into the step portion 9 of the package 7 and adhered with an adhesive such as epoxy resin to seal the opening hole 8. At the bottom end, a sealing plate 17 made of a flat metal plate is melted and fixed with a metal brazing material applied in advance to seal the opening hole 10. still,
A ceramic flat plate or the like may be used as the sealing plate 17, and in this case, sealing is performed with an adhesive.
第３図は第１図ないし第２図の組立て後の光検出装置の
縦断面図であり、パッケージ７は、重ね合わされた円盤
状の基板7a,7bに、開口穴8,10を構成するための中空部
を有する板材7c〜7fが積層され、基板7a,7bの平面部や
板材7c〜7fの平面部に所謂金属パターンが形成され、ボ
ンディングワイヤ18で配線されると共に、該金属パター
ンとを不図示のスルーホール等にて電気的に縦方向に接
続している。FIG. 3 is a vertical cross-sectional view of the assembled photodetector shown in FIGS. 1 and 2, in which the package 7 has the openings 8 and 10 formed in the disk-shaped substrates 7a and 7b which are superposed on each other. The plate members 7c to 7f having a hollow part are laminated, a so-called metal pattern is formed on the flat surface parts of the substrates 7a and 7b and the flat surface parts of the plate members 7c to 7f, and the metal patterns are wired together with the bonding wires 18. Electrical connections are made in the vertical direction through through holes (not shown).
尚、基板7a,7b、板材7c〜7fはセラミックス、ガラスエ
ポキシ材等やプラスチックで形成されている。The substrates 7a and 7b and the plate members 7c to 7f are made of ceramics, glass epoxy material or the like or plastic.
このように縦方向に基板の表裏面に設置した構造の光検
出装置であるので、実装面積を小さくすることができ、
円筒状の形状であることからパッケージの方向性がない
ので、機器等に装着して光軸合せ等の調整が容易であ
る。Since the photodetector is structured such that it is installed on the front and back surfaces of the substrate in the vertical direction, the mounting area can be reduced,
Since it has a cylindrical shape, there is no orientation of the package, so that it is easy to adjust the optical axis by mounting it on a device or the like.
（発明の効果） 以上説明したように、本発明の光検出装置によれば、光
センサと処理装置とを円筒型パッケージの積層基板の一
方の開口穴の底の部分と他方の開口穴の底の部分に配置
した構成をしているので、実装面積を小さくすることが
でき、特に光軸合せの調整の際に有利である。(Effects of the Invention) As described above, according to the photodetector of the present invention, the photosensor and the processing device are provided at the bottom of one opening hole and the bottom of the other opening hole of the laminated substrate of the cylindrical package. Since it is arranged in the portion, the mounting area can be reduced, which is particularly advantageous when adjusting the optical axis alignment.
第１図と第２図は本発明による光検出装置の一実施例を
示す分解斜視図、第３図は第１図の実施例の組立て後の
縦断面図、第４図は従来のハイブリッド型装置の構成を
示す説明図である。 7:パッケージ 7a,7b:基板 8:,10:開口穴 9:段部 11:リード端子 12:光センサ 13:演算処理集積回路素子 14:チップ抵抗 15:コンデンサ 16,17:封口板1 and 2 are exploded perspective views showing an embodiment of a photodetector according to the present invention, FIG. 3 is a longitudinal sectional view after assembly of the embodiment of FIG. 1, and FIG. 4 is a conventional hybrid type. It is explanatory drawing which shows the structure of an apparatus. 7: Package 7a, 7b: Substrate 8 :, 10: Open hole 9: Step 11: Lead terminal 12: Optical sensor 13: Arithmetic processing integrated circuit element 14: Chip resistor 15: Capacitor 16, 17: Seal plate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 25/18 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication H01L 25/18
Claims (1)
号を処理する処理装置とを同一の円筒型パッケージ内に
設置した光検出装置において、 前記円筒型パッケージは積層基板からなり、該積層基板
の内部に配線用の金属パターンをプリント配線し、積層
基板の一方の面と他方の面に内側端の周囲に段部が設け
られた開口穴を形成し、一方の開口穴の底の部分に前記
センサ素子を配置し、他方の開口穴の底の部分に前記処
理装置を配置したことを特徴とする光検出装置。1. A photodetector in which a photosensor element and a processing device for processing a detection signal from the photosensor element are installed in the same cylindrical package, wherein the cylindrical package comprises a laminated substrate, and the laminated substrate. Inside, the printed wiring metal pattern for wiring, forming an opening hole with a step around the inner edge on one surface and the other surface of the laminated substrate, and at the bottom of one opening hole A photodetection device, wherein the sensor element is arranged, and the processing device is arranged at a bottom portion of the other opening hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60123987A JPH06105790B2 (en) | 1985-06-07 | 1985-06-07 | Photo detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60123987A JPH06105790B2 (en) | 1985-06-07 | 1985-06-07 | Photo detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61281559A JPS61281559A (en) | 1986-12-11 |
| JPH06105790B2 true JPH06105790B2 (en) | 1994-12-21 |
Family
ID=14874237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60123987A Expired - Fee Related JPH06105790B2 (en) | 1985-06-07 | 1985-06-07 | Photo detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06105790B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432544U (en) * | 1990-07-13 | 1992-03-17 | ||
| JP3203788B2 (en) * | 1992-07-24 | 2001-08-27 | オムロン株式会社 | Physical quantity sensor and method of manufacturing the same |
| JPH09501533A (en) * | 1994-04-18 | 1997-02-10 | ガイ フレール バーント エ エクスポルタシオン ソシエテ アノニム | Electronic memory device for objects |
| JP4604301B2 (en) | 1999-04-28 | 2011-01-05 | 株式会社デンソー | Optical sensor |
| CN113098477B (en) * | 2021-03-10 | 2022-12-27 | 电子科技大学 | Current type photoelectric converter, device and method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5977245U (en) * | 1982-11-13 | 1984-05-25 | 富士電機株式会社 | semiconductor radiation detector |
| JPS60169850U (en) * | 1984-04-19 | 1985-11-11 | 株式会社東芝 | optical module |
-
1985
- 1985-06-07 JP JP60123987A patent/JPH06105790B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61281559A (en) | 1986-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |