JPH06104588A - Package mounting device - Google Patents

Abstract

PURPOSE:To provide a downsized package mounting device in which efficient heat dissipation is realized at low cost while reducing the space to be occupied by a fan or the like and the size of pack wire board. CONSTITUTION:Heat generated from packages 1a-1n containing high heating electronic components is dissipated efficiently by setting a first package 1a having a board mounting electronic components, and a second package 1b having a board concentrically mounting high heating electronic components with miniature fans 10a-10c being arranged at upper rear part of the board in unit frames 7a-7n which take in outer air through vents made through the front and upper/lower faces of the body and discharge hot air from the upper part of rear face.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package mounting apparatus for mounting a communication device, a computer or the like as a package, and more particularly, to dissipate heat generated from a mounted component by convection induction.

[0002]

2. Description of the Related Art Communication devices, computers, etc. are often mounted as packages. The shape of the electric components mounted in the unit frame as this package tends to be smaller year by year, and the mounting density in the unit frame is increasing. As the density increases, it becomes necessary to take measures to dissipate the heat generated from the mounted electrical components. As a method of forcibly dissipating heat generation, it has been widely practiced to attach a fan device to each unit frame.
This fan device was a large one having a plane area almost equal to that of the upper surface of the unit frame.

FIG. 3A is a perspective view of the unit frame 20, in which an inclined plate 21 for guiding convection is provided on the upper side of the unit frame 20.
Side plates 22 are provided on both sides of 1. The package 24 on which electric parts (not shown) are mounted is the unit frame 2
It is designed to be fixed via the package insertion grooves formed on the upper and lower surfaces of the inside of the 0. Ventilation holes 25 for heat dissipation are formed between the package insertion grooves.

A back wire board (not shown) for connecting the individual packages 24 is mounted on the rear surface of the unit frame 20. Thus, when the package 24 is mounted on the unit frame 20, the side surface and the rear surface of the unit frame 20 are hermetically sealed, the package insertion surface is hermetically sealed by a unit cover (not shown), and only the upper and lower surfaces serve as convection passages. Become.

FIG. 3B is a view taken in the direction of arrow X in FIG. 3A and is a front view of the fan device. The fan device is arranged in the space formed by the inclined plate 21 and the side plate 22 provided on the upper part of the unit frame 20.

FIG. 4 is a sectional view showing a state in which the unit frames 20a to 20n are stacked. As shown in the figure, the unit frames 20a to 20n are provided on the upper portions thereof with inclined plates 21a to 21 which are inclined from the lower portion on the package insertion surface side to the upper portion on the rear surface.
n and the fan devices 26a to 26n are arranged so as to be aligned in the vertical direction. Note that 27a to 27n are back wire boards. As for the lowermost unit frame 20a, the cool air (indicated by a broken line) forcibly sucked from the ventilation holes formed on the lower surface of the unit frame 20a by driving the fan device 26a is formed on the upper surface of the unit frame 20a. Passing through the ventilation hole, and guided to the rear surface side while being guided by the side plate 22a and the inclined plate 21a, the package 2
The heat generated from No. 4 is the fan device 26 attached to the rear surface side.
It is discharged to the outside by a.

As for the unit frame 20b above the lowermost unit frame 20a, the cool air is sucked into the unit frame 20b through the ventilation holes formed on the lower surface of the unit frame 20b along the inclined surface 21a. And is discharged to the outside by the fan device 26b. The same applies to each unit frame on the unit frame 20b. In this way, the heat generated in the other unit frame can be discharged to the outside without being taken into one unit frame.

[0008]

However, in the above-mentioned conventional package mounting apparatus, the fan device uniformly dissipates heat even if there is a difference in the heat generating portion of the package held in the unit frame. Therefore, there was a problem that heat could not be dissipated efficiently. In other words, there are high heat-generating components and non-heat-generating components in the electrical components mounted in the package, and the latter does not require heat dissipation. Further, the space formed by the side plate and the inclined plate provided in the fan device and in the vicinity of the fan device is about 1/2 of the volume of the unit frame, which is large, resulting in an increase in the size of the entire device. Also, in order to improve the convection induction efficiency, the height of the unit must be increased to a cylindrical shape, and with this, regardless of the package accommodation, a large unit with the same height as the unit frame height on the rear surface of the unit frame. However, there was a problem that the back wire board had to be provided, resulting in cost increase.

The present invention has been proposed to solve the above-mentioned problems, and realizes efficient heat dissipation, further reduces the space required for a fan device and the like, further reduces the back wire board, and It is an object of the present invention to provide a package mounting device that is downsized and costs are reduced.

[0010]

In order to achieve the above object, the present invention provides a unit frame in which ventilation holes formed in the front surface and the upper and lower surfaces of the main body are used as outside air intake and an upper portion of the rear surface is used as hot air discharge opening. In the package mounting device, a first package in which electrical components are mounted on a substrate and a second package in which high heat-generating electrical components are centrally mounted on the substrate and a small fan is provided on the upper rear portion of the substrate are mounted. is there.

[0011]

As described above, since the small fan is provided only in the specific package and the large fan device is not provided on the upper portion of the unit frame, efficient heat dissipation is possible and the entire device can be downsized. In addition, since a back wire board of any size that does not consider convection induction can be mounted, cost can be reduced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the package 1. Among the circuit components held in the package 1, those having a high heat generating property are gathered and held in one place. Figure 1
The portion 2 indicated by a broken line is a portion for holding a component having a high heat generation property, and is a position near the rear portion 3 of the package 1 and near the upper portion. In addition, an induction tool 5 is provided on the upper portion of a portion for holding a highly heat-generating component, which is inclined upward from the front portion 4 of the package 1 to the rear portion 3, and a small fan 6 is provided below the rear portion of the induction tool 5. Set up. It should be noted that the tip portion 5a of the guide tool 5 which is obliquely raised is located substantially at the same position as the upper space portion above the back wire board, which will be described later.

On the other hand, although not shown, the above-mentioned small fan is not provided in the package in which the electric parts which do not need to take heat generation into consideration are mounted. Therefore,
A package provided with a small fan and a package not provided with a small fan will be mounted in the unit frame. Therefore, the heat generated from the highly heat-generating component held in the package 1 in the unit frame (not shown) is guided along the guide 5 along with the flow of the outside air generated by driving the small fan 6. 1 It is forcibly guided to the upper rear part, and efficient heat dissipation can be realized.

FIG. 2 is a sectional view showing a state in which the units 1 are stacked. The operation of this embodiment will be described with reference to FIG. The stacked unit frames 7a to 7n are well known. On the rear surface of the unit frames 7a to 7n, there are provided back wire boards 8a to 8n in which a connector for connecting each package is mounted and which stores a connection pattern between the packages. The back wire boards 8a to 8n have a height of about ⅔ of the unit frame height, and an uppermost ⅓ is a space for heat generation and discharge described later.

Package 1a mounted in the unit frame
1n are provided with guides 9a to 9n and small fan devices 10a to 10n, respectively. Needless to say, if there is a package that does not require the small fan devices 10a to 10n in the unit frame, a package including only electrical components is mounted.

The broken line display shows the state of convection. First, looking at the unit frame 7a, the outside air taken in from a ventilation hole (not shown) formed in the lower portion of the unit frame is guided by the guide tool 9a and is accompanied by heat generation in the high heat-generating component part, so that the small fan 10a. Are forcibly sucked by and are discharged to the outside from the space above the back wire board 8a. Further, the outside air taken in from the front surface of the unit frame 7a passes through ventilation holes formed in the upper surface of the unit frame 7a and the lower surface of the unit frame 7b, and is forced by the small fan 10b of the package 1b mounted in the unit frame 7b. Is sucked into. The same applies to the other unit frames. Needless to say, it is not necessary to provide a cover on the front surface of the unit frame.

[0017]

As described above, according to the present invention, since the small fan is provided only in the necessary package, the heat generated in the high heat generating component can be efficiently and forcibly discharged to the outside of the unit. At the same time, since a large fan device is not provided between the units, the size of the entire device can be reduced to about 2/3 of the conventional size. In addition, the back wire board need only be large enough to accommodate the package mounting connector mounting space and the connection pattern space between packages without considering the convection induction.
The size is about 3 and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a unit according to the present invention.

FIG. 2 is a sectional view showing a state of convection in stacked units.

FIG. 3 is a perspective view of a unit according to a conventional example.

FIG. 4 is a sectional view showing a state of convection in stacked units.

[Explanation of symbols]

 1a-1n Package 7a-7n Unit frame 8a-8n Back wire board 9a-9n Guide tool 10a-10n Small fan

Claims (1)

[Claims] 1. A first package in which electric components are mounted on a substrate and a substrate in a unit frame in which ventilation holes formed on the front surface and the upper and lower surfaces of the main body are used as an outside air intake port and an upper portion of the rear surface is a hot air discharge port. A package mounting device characterized in that a high-heat-generating electric component is centrally mounted and a second package having a small fan provided on the upper rear portion of the substrate is mounted.