JPH1168373A - Heat-dissipating structure of subrack - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-dissipating structure which is compact in size and inexpensive to manufacture, used for a subrack in which a number of printed wiring boards are mounted and several of which are placed in a housing rack with a vertically stacked manner. SOLUTION: In this structure, the heat generated from the printed wiring boards are removed by the cooling air taken from a convection-inducing inlet 6 constituted by the respective front edges of two side plates 4, 4, bottom plate 2 and convection-inducing inclined plate 5. The cooling air is guided to the inside region 1 where the printed wiring boards are mounted, and exhausted from slits 9 provided in an upper plate 3. When the subracks are stacked vertically in a housing rack, the air exhausted from the region 1 where the printed wiring boards are mounted, is guided by the convection-inducing inclined plate 5 of another subrack of the same structure placed in an overhead stacked position, and is exhausted from the heated-air outlet 7 to the backside of the subrack.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small and low-cost subrack heat dissipation structure for a system or apparatus housing.

[0002]

2. Description of the Related Art Conventionally, in various systems or devices, for example, heat radiation in a housing of a communication device in which a large number of printed wiring boards are mounted has generally been structured as shown in FIGS. It is a target. FIG. 2 is an external perspective view showing the entire housing frame, and FIG. 3 is an exploded perspective view in which a part thereof is enlarged. As shown in FIG. 2, the heat dissipation structure of the housing frame includes a PWB mounting unit 12 in which a large number of printed wiring boards 11 are mounted, and a printed wiring board 11 mounted therein.
It is composed of a combination of two types of subracks of the convection induction duct portion 13 which takes in cooling air for radiating heat generated from the outside by convection. The above PWB mounting unit 1
The combination of the two and the convection induction duct 13 is attached to the housing framework 14 by screwing up and down in a vertical direction.
FIG. 3 shows the structure of the PWB mounting unit 12 and the convection guide duct 13. In the convection guide duct 13, the cold air sucked from the convection guide port 17 is guided upward by the convection guide inclined plate 18. The convection guide inclined plate 18 has a bottom plate attached with a rear portion inclined upward so as to guide the flow of the cold air upward, and the upper plate 19 is provided with the guided cooling air. Substantially the entire surface is hollowed out so as to send the airflow into the PWB mounting unit 2. As shown in FIG. 2, various printed wiring boards 11 having the same outer shape of the board are inserted and mounted on the PWB mounting unit 12 with the board surfaces left and right. The P
On the bottom plate 15 of the WB mounting unit 12, the printed wiring board 11 on which the cooling airflow from the convection guide duct 13 is mounted.
A large number of slits are formed so as to extend between them. Similarly, a slit is formed in the upper plate 16, and the airflow heated by the heat generated from the printed wiring board 11 mounted on the PWB mounting unit 12 is discharged from the slit of the upper plate 16 of the PWB mounting unit 12. It has become. This PWB
By mounting the convection guide duct 13 in close contact with the mounting unit 12, the cooling air flowing into the convection guide port 17 is cooled by the convection guide inclined plate 18 and the PWB mounting unit 12.
Is guided into the PWB mounting unit 12 by the ascending airflow, and absorbs the heat generated from the printed wiring board 11 so that the upper plate 1
6 is discharged upward from the slit. The warmed airflow discharged from the upper plate 16 of the PWB receiving unit 12 is
The air is discharged rearward by the convection guide inclined plate 18 of the other convection guide duct 13 in the upper stage of the B attachment unit 12.

[0003]

However, in the heat dissipation structure using the above-described subrack, each subrack is manufactured separately, and each subrack is fixed to the housing frame by screwing. For this reason, there are problems that the number of components and the number of assembling steps of the subrack increase, and the assembling work of the housing rack becomes complicated, thereby increasing the manufacturing cost. Also,
There was a drawback that the entire housing frame became large. The present invention has been made to solve the above problems,
It is an object of the present invention to provide a small, low-cost subrack having a heat dissipation structure that facilitates assembly work.

[0004]

According to the present invention, there is provided a heat radiation structure for a subrack comprising a printed wiring board mounting portion and a convection guiding portion. It is characterized in that the part has an integral structure.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. FIG. 1 is an external perspective view showing one embodiment of a printed wiring board mounted subrack having a heat dissipation structure according to the present invention. As shown in the figure,
According to the present invention, the conventional structure in which the mounting portion of the printed wiring board and the convection guide portion are separate subracks is integrated into a single structure, and a PW for mounting the printed wiring board is provided.
The B mounting part 1 includes a bottom plate 2, an upper plate 3, and side plates 4, 4. The convection of the cooling air flow is performed by a convection guide port 6 formed at the leading edge of each of the bottom plate 2 and the side plates 4 and 4 and the convection guide tilt plate 5 and a convection guide tilt plate attached to the side plates 4 and 4. 5. The arrows in the figure indicate the direction in which the cooling airflow is induced by the heat generated from the convection guide inclined plate 5 and the components of the printed wiring board. First, the cooling airflow sucked from the convection induction port 6 is supplied to the convection induction inclined plate 5.
The air is guided into the PWG mounting unit 1 through the slit 8 of the bottom plate 2 by the rising airflow in the PWB mounting unit 1. Next, the cooling airflow absorbs heat generated from the mounted printed wiring board and is discharged upward from the slit 9 of the upper plate 3. The subrack having the above structure is mounted on the housing frame in several stages in close proximity in the vertical direction, and the hot air flow from the slit 9 of the upper plate 3 causes the induction inclined plate of another subrack above the subrack. 5 and is discharged from the hot air outlet 7 to the back of the subrack.

[0006]

As described above, according to the heat radiation structure according to the present invention, the subrack conventionally manufactured separately is made into an integrated structure, so that the number of subrack components is reduced, and the assembling work is reduced. Becomes easier. Therefore, there is a remarkable effect that the housing frame can be reduced in size and the manufacturing cost can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an embodiment of a printed wiring board mounted subrack having a heat dissipation structure according to the present invention.

FIG. 2 is an external perspective view showing an example of a conventional housing rack.

FIG. 3 is an exploded perspective view of a conventional housing rack (part).

[Explanation of symbols]

(Signs of each part of the heat radiation structure according to the present invention) 1. PWB mounting part 2. Bottom plate 3
..Top plate, 4 ... side plate, 5. convection induction inclined plate, 6. convection induction port, 7. hot air flow outlet
8, 9 · · · slit (hereinafter, the reference number of each part of the conventional heat dissipation structure) 11 · · · printed wiring board, 12 · · · PWB mounting unit 13, 13 · · · convection induction duct section 14 · · ·
Frame, 15 ... Bottom plate, 16 ... Top plate, 17 ...
・ Convection induction port, 18 ・ ・ Convection induction inclined plate 19 ・ ・ Top plate

Claims (1)

[Claims] 1. A heat dissipation structure for a subrack comprising a printed wiring board mounting portion and a convection guiding portion, wherein a convection guiding portion is integrally formed on a bottom portion of the printed wiring board mounting portion. Black heat dissipation structure.