JP3094631B2 - Heat dissipation device for enclosure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an enclosure having a heating element therein, and more particularly, to a heat dissipation device for an enclosure capable of discharging heat generated from the heating element to the outside.

[0002]

2. Description of the Related Art For example, electronic devices such as display devices such as OA devices and printer devices have a large number of heating elements inside their enclosures. Examples of the heating element include an IC mounted on a printed circuit board, a yoke of a cathode ray tube, and a heat sink.

In order to drive these devices normally and to avoid affecting other devices, the heat emitted from the heating element is effectively discharged to the outside of the enclosure, and the internal temperature of the device and the surface of the cover are reduced. It is necessary to keep the temperature low, but in the past it was necessary to reduce power consumption to reduce heat generation,
Means have been taken to provide ventilation holes by providing ventilation holes in the enclosure around the heating element, and to further provide a radiating fan inside the enclosure to forcibly circulate air and release heat.

[0004]

However, the above-mentioned conventional means have the following problems. Means for reducing power consumption is not a good measure because it necessitates a change in the design of the electronic circuit and also increases the cost. Means for providing ventilation holes and fans have various restrictions from the viewpoint of design or function, and it is difficult to provide ventilation holes and fans at the optimal position for discharging heat. It is difficult to do. Further, the installation of the fan involves other problems such as cost increase and noise. Therefore, the present invention aims to solve the above-mentioned various problems, and quickly and effectively discharges the heat generated from the heating element to the outside of the enclosure despite a simple improvement. It is an object of the present invention to provide a heat radiating device for an enclosure that can satisfy design and functional restrictions well and can be provided at a low cost.

[0005]

Means for Solving the Problems The present invention dissipating device enclosure by, in order to achieve the object as mentioned above, as shown in Principles of FIG. 1, upper and lower
In an enclosure having an internal heating element surrounded by the side surfaces and opposed, to the opposite of the enclosure 2
Ventilation holes 5 at predetermined positions of the upper side of the side surface 3 and the lower side of the side surfaces or the lower surface 4 of the enclosure.
Both the 6 Ru is provided, connecting the ventilation holes of the upper to the opposite
A partition wall 9 for dividing the inside of the enclosure into upper and lower regions 7 and 8 is provided at a position near the upper portion of the line.
In the lower region caused by the heat generated by the housed heating element 1
Due to convection, the lower or lower ventilation holes on both sides
Outside air as well as the hot air in the lower area.
The lower side of the partition wall is caused to collide with the partition wall and then to the side walls.
And discharged from the upper ventilation hole .

[0006]

When the heating element 1 inside the enclosure 2 generates heat, a temperature difference is generated in the internal air in the lower region 8 partitioned by the partition wall 9 inside the enclosure 2 as indicated by an arrow in the principle diagram of FIG. As a result, ascending airflow occurs, external cold air flows into the enclosure 2 from the lower ventilation holes 6 or the ventilation holes 6 on the bottom surface 4, and the inside hot air rises. However, the partition 9 covers the inside of the enclosure 2,
Upper and lower two areas 7, 8 much smaller than the original size
As a result, the rising hot air emitted from the heating element 1 in the lower region 8 collides with the lower surface of the partition 9 within a short period of time, and subsequently flows into the upper ventilation hole 5 along the partition 9. You will be guided. Since the upper ventilation hole 5 exists near the lower part of the partition wall 9, hot air is immediately discharged from the ventilation hole 5 to the outside. Therefore, unlike the prior art, the lower region 8
By generating a convection in which the displacement efficiency of the gas inside and outside the enclosure is aggressive and the air inside and outside is greatly enhanced, the hot air can be quickly and effectively discharged to the outside.

Further, the presence of the upper region 7 separated by the partition wall 9 makes it difficult to transmit the hot air in the lower region 8 to the cover surface, and suppresses a rise in the temperature of the cover surface.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a specific embodiment of a heat dissipation device for an enclosure according to the present invention will be described with reference to the drawings. FIG. 2 is a schematic cross-sectional view showing a specific example in which the enclosure heat radiating device of the present invention is applied to a display device, and FIG. 3 is a part showing a specific example of applying the enclosure heat radiating device of the present invention to a display device. FIG. 2 is a cutaway perspective view showing a display device 10 in which a cathode ray tube 11 and a radiator 12 (the radiator 12 is not shown in FIG. 2) are provided.
15 (only one side is shown in FIG. 2) and rear 16
Slit-shaped ventilation holes 17 and 18 are provided at a high position (upper position) and a low position (lower position), and a circular ventilation hole 20 is provided at a bottom surface 19.

In the enclosure 13, at a height position corresponding to a position slightly higher than the upper side of the ventilation hole 17 at the high position,
A partition wall 22 is provided at an interval above and below the cathode ray tube 11 and the upper surface 21 of the enclosure 13. This partition
22 is directed substantially horizontally forward from the rear surface 16 of the enclosure 13 and then bent in a U-shape along the shape of the upper surface of the front part 24 of the cathode ray tube 11 to form the enclosure 13.
And has a side shape similar to that of the upper surface 21 of the enclosure 13 and is suspended from the upper surface 21 of the enclosure 13 via a spacer 25. A and the lower region B. As shown in FIG. 3, the partition wall 22 has a size substantially equal to the vertical and horizontal dimensions of the upper surface 21 of the enclosure 13 at the portion where the yoke 11a and the radiator 12 of the cathode ray tube 11 are present. The front, rear, left and right edges are formed near the front surface 23 and the rear surface 16 of the enclosure 13, respectively. Further, a portion corresponding to the front portion 24 of the cathode ray tube 11 is formed to have a slightly smaller left and right width, and the left and right edges are close to the left and right side surfaces 14 and 15, respectively. There is a slight gap between the partition walls 22.

The CRT 11 inside the enclosure 13
When heat is generated from each heating element 26 such as the yoke 11 a and the radiator 12, a temperature difference occurs in the air inside the enclosure 13 and an ascending airflow occurs, and the ventilation holes 18 and the bottom surface 19 at a low position on the side surface 14, 15 or the back surface 16. As the outside air flows into the enclosure 13 from the ventilation holes 20, the inside hot air rises. However, since the partition wall 22 divides the inside of the enclosure 13 into upper and lower parts and divides the inside of the enclosure 13 into two upper and lower regions A and B which are much smaller than the original size, they are emitted from the heating element 26. The rising hot air collides with the lower surface of the partition wall 22 in a short time, and is subsequently guided along the partition wall 22 to the ventilation holes 17 at high positions on the side surfaces 14, 15 or the rear surface 16. The ventilation hole 17 at the high position is located at a position slightly lower than the partition wall 22 and the hot air guided to the partition wall 22 can be passed almost straight to the outside without any resistance. Then, the air is discharged to the outside from these ventilation holes 17. As described above, in the present invention, unlike the conventional case, the convection in the lower region B inside the enclosure 13 and the gas exchange efficiency of the inside and outside of the enclosure are remarkably increased, so that the extremely fast and effective It was possible to discharge hot air.

Further, the upper region A partitioned by the partition wall 22 makes it difficult for the hot air in the lower region B to be transmitted to the upper surface 21 of the enclosure 13, thereby suppressing a rise in the temperature of the cover surface of the enclosure 13.

Further, as shown in FIG. 3, the yoke 11 of the cathode ray tube 11 on the cover surface is used to test the heat discharging effect of the partition wall 22 and the ventilation holes 17, 18, and 20 as described above.
The surface temperature at the position corresponding to the part a (part α) and the position corresponding to the front part 24 of the cathode ray tube 11 (part β) are as follows:
The measurement was performed with and without the partition wall 22, respectively. Table 1 shows the results.

[Table 1]

In the experiment, the temperature of the cover surface was 5.9 ° C. lower in the α section than in the case without the partition 22 in the α section, and the temperature of the partition 22 was lower in the β section. When there was, the result was as low as 4.1 ° C., and when there was no partition 22, the result was as high as 2.0 ° C. On the other hand, in the β portion, when the partition wall 22 is present, compared with the case without the partition wall 22,
The result was that the temperature was higher by 0.2 ° C. and higher by 4.1 ° C. when the partition 22 was present for the α portion, and lower by 2.0 ° C. when the partition 22 was absent.

From the results of this experiment, the side surfaces 14, 15 and the back surface
In the α portion where the ventilation holes 17 are provided in the 16, the hot air emitted from the heating element 26 is quickly and effectively discharged as described above, so that the enclosure is compared with the case where there is no partition wall 22. It can be seen that the temperature rise on the upper surface 21 of 13 is successfully suppressed. On the other hand, in the β part having no ventilation hole on the side surface, since convection does not occur and heat is not smoothly discharged, the hot air stays at a high position in the lower region B and the partition wall 22 is provided. It can be seen that heat is transferred to the upper surface 21 of the enclosure 13 via the upper region A.

The heating element 1 in the present invention corresponds to the heating element 26 (yoke 11a, radiator 12) in the present embodiment, and similarly, the enclosure 2 is the enclosure 13 and the side 3 is the side.
14 and 15, the bottom 4 is on the bottom 19, the ventilation hole 5 is on the ventilation hole 17,
The ventilation hole 6 is in the ventilation holes 18 and 20, and the upper region 7 is in the upper region A.
The lower region 8 corresponds to the lower region B, and the partition 9 corresponds to the partition 22.

[0016]

As described above, according to the present invention,
Produce convection in the enclosure that is aggressive, and the exchange efficiency of gas inside and outside the enclosure is significantly higher,
The heat can be quickly and effectively discharged to the outside of the enclosure, and the temperature rise inside the enclosure and the surface of the enclosure can be suppressed well. In addition, a partition is provided in the enclosure, and the height or height is 2
With a simple improvement by simply providing a kind of ventilation hole, the intended purpose can be achieved, and the design and functional constraints can be satisfied well, not to mention that it can be provided at a low price.

[Brief description of the drawings]

FIG. 1 is an invention principle diagram showing a principle structure of a heat dissipation device of an enclosure of the present invention.

FIG. 2 is a schematic cross-sectional view of a specific example of a heat dissipation device for an enclosure according to the present invention.

FIG. 3 is a partially cutaway perspective view of a specific embodiment of a heat dissipation device for an enclosure according to the present invention.

[Explanation of symbols]

 1,26 Heating element 2,13 Enclosure 3,14,15 Side surface 4,19 Bottom surface 5,6,17,18,20 Ventilation hole 7, A Upper region 8, B Lower region 9,22 Partition wall 10 Display device 11 CRT 12 Heatsink 16 Back 21 Top 23 Top 24 Front 25 Spacer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model 63-153595 (JP, U) Japanese Utility Model 3-60805 (JP, U) Japanese Utility Model 2-11393 (JP, U) (58) Survey Field (Int.Cl. ⁷ , DB name) H05K 7/20 G12B 15/04

Claims (1)

(57) [Claims] 1. An enclosure having a heating element inside enclosed by upper and lower surfaces and opposing side surfaces, each upper position of the opposing side surfaces of the enclosure and each lower position of the both side surfaces or the enclosure thereof. both the in a predetermined position of the lower surface Ru provided respectively vents, vents the upper to the opposite
The enclosure will be provided a partition wall divided into upper and lower regions near the top position of a line connecting, yield a lower region
Convection in the lower area caused by heat generated by the heating element
The outer side of the lower side or the lower side of the ventilation hole
And the hot air in the lower region is
Collide with the lower surface of the wall and continue along the bulkhead
A heat dissipating device for an enclosure, wherein the heat is exhausted from a vent hole .