CN213149697U

CN213149697U - All-in-one subregion heat radiation structure

Info

Publication number: CN213149697U
Application number: CN202022197693.1U
Authority: CN
Inventors: 尚洪财; 张志�
Original assignee: Tongnuo Ezhou Electronics Co ltd
Current assignee: Tongnuo Ezhou Electronics Co ltd
Priority date: 2020-09-29
Filing date: 2020-09-29
Publication date: 2021-05-07
Anticipated expiration: 2030-09-29

Abstract

The utility model discloses an all-in-one subregion heat radiation structure. The method comprises the following steps: the center, the mainboard structure, seted up on the center and held the chamber, hold and seted up first mounting groove on the chamber, second mounting groove and third mounting groove, first export has been seted up to the inner wall of first mounting groove, the second export has been seted up to the inner wall of second mounting groove, the third export has been seted up to the inner wall of third mounting groove, the mainboard structure includes first radiator, the second radiator, the mainboard, the shield cover, place first mounting groove in the first radiator in and seted up first louvre relatively first export, place the second mounting groove in the second radiator in and seted up the second louvre relatively second export, place the third louvre in the mainboard in and seted up relatively third export, first radiator, the both sides at the mainboard are connected respectively to the second radiator, the shield cover covers the surface at the mainboard. The utility model discloses can reduce and cover behind the all-in-one and set up a plurality of louvres to can play radiating effect.

Description

All-in-one subregion heat radiation structure

Technical Field

The utility model relates to an all-in-one computer technology field especially relates to an all-in-one subregion heat radiation structure.

Background

The all-in-one computer is sought by consumers due to the advantages of small volume, high integration level, proper price and the like, and a main board structure of the all-in-one computer generally integrates a CPU, a display card and other electrical components.

Generally, as the chinese utility model patent with application number 201520571302.4 discloses an all-in-one machine cooling system and all-in-one machine, the regional louvre of seting up that corresponds CPU, display card and power on all-in-one machine computer backshell solves the heat dissipation problem of all-in-one machine computer.

Such an arrangement may have the problem of requiring a large number of louvers to be formed in multiple regions of the rear housing surface.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is a need to provide a partitioned heat dissipation structure for an all-in-one machine, which solves the technical problem in the prior art that a large number of heat dissipation holes are formed in multiple regions on the surface of the rear housing for heat dissipation.

In order to achieve the above technical purpose, the technical scheme of the utility model provide an all-in-one subregion heat radiation structure, include:

the middle frame is provided with an accommodating cavity, the accommodating cavity is provided with a first mounting groove, a second mounting groove and a third mounting groove, the inner wall of the first mounting groove is provided with a first outlet, the inner wall of the second mounting groove is provided with a second outlet, and the inner wall of the third mounting groove is provided with a third outlet;

the mainboard structure, the mainboard structure includes first radiator, second radiator, mainboard, shield cover, place in the first radiator in first mounting groove is relative first louvre has been seted up to the first export, place in the second radiator in the second mounting groove is relative the second louvre has been seted up to the second export, place in the mainboard in the third mounting groove is relative the third louvre has been seted up to the third export, first radiator and second radiator are connected respectively the both sides of mainboard, the shield cover covers the surface of mainboard.

Furthermore, the first radiator and the second radiator respectively comprise a plurality of radiating fins and fans, the radiating fins are uniformly arranged to form a plurality of rectangular holes, one ends of the rectangular holes are communicated with the fans, and the other ends of the rectangular holes are abutted to the inner walls of the mounting grooves.

Furthermore, the mainboard structure still includes the wiring board, the wiring board relative first radiator the fan has seted up a plurality of first fresh air inlets, the wiring board relative the second radiator the fan has seted up a plurality of second fresh air inlets.

Furthermore, the third radiating holes are formed in one end, far away from the wiring board, of the shielding cover, and the third radiating holes are regularly arranged in a honeycomb shape.

Further, the first outlet and the second outlet are larger than the third outlet, the first outlet and the second outlet have the same size and are larger than the third outlet, and the first outlet, the second outlet and the third outlet are divided by a frame arranged on the middle frame.

Furthermore, a row of vent holes are uniformly formed in the two end edges of the middle frame, and the first outlet, the second outlet and the third outlet are respectively communicated with the vent holes.

Compared with the prior art, the beneficial effects of the utility model include: the middle frame structure of the all-in-one computer is internally provided with a first mounting groove, a second mounting groove and a third mounting groove which are adjacent to each other, one end of the first mounting groove is provided with a first outlet, one end of the second mounting groove is provided with a second outlet, one end of the third mounting groove is provided with a third outlet, a main board structure is respectively provided with a first heat dissipation hole, a second heat dissipation hole and a third heat dissipation hole, the first heat dissipation hole is arranged corresponding to the first outlet, the second heat dissipation hole is arranged corresponding to the second outlet, the third heat dissipation hole is arranged corresponding to the third outlet, the main board structure is also provided with a fan, the fan is communicated with the heat dissipation holes, two symmetrical side frames of the middle frame are uniformly provided with a plurality of air vents, the air vents penetrate through the inside of the first mounting groove, the second mounting groove and the third mounting groove, and heat generated by the hardware, it is possible to reduce the number of openings in the various regions of the rear housing.

Drawings

Fig. 1 is a three-dimensional structure diagram of the back of the all-in-one machine partition heat dissipation structure of the present invention;

FIG. 2 is a front three-dimensional structure diagram of the partition heat dissipation structure of the integrated machine of the present invention;

fig. 3 is a front three-dimensional structural diagram of the main board structure of the present invention;

fig. 4 is a front three-dimensional structural view of the middle frame of the present invention;

fig. 5 is a back three-dimensional structural view of the middle frame according to the present invention;

FIG. 6 is an enlarged partial schematic view at A in FIG. 2;

FIG. 7 is an enlarged partial schematic view at B of FIG. 2;

FIG. 8 is an enlarged partial schematic view at C of FIG. 4;

FIG. 9 is an enlarged partial schematic view at D of FIG. 4;

FIG. 10 is an enlarged partial schematic view at E in FIG. 5;

fig. 11 is a partially enlarged schematic view at F in fig. 6.

Detailed Description

The following detailed description of the preferred embodiments of the invention, which is to be read in connection with the accompanying drawings, forms a part of this application, and together with the embodiments of the invention, serve to explain the principles of the invention and not to limit its scope.

Referring to fig. 1, the present invention provides a partition heat dissipation structure for an integrated machine, including: middle frame 1, mainboard structure 2.

Offer on the center 1 and hold the chamber, hold and offer first mounting groove 11, second installation 12 grooves and third mounting groove 13 on the chamber for cut apart the mounting groove in the difference with structural electrical apparatus of mainboard and component subassembly.

Further, as shown in fig. 5 to 11, the inner wall of the first installation groove 11 is opened with a first outlet 14, the inner wall of the second installation groove 12 is opened with a second outlet 15, the inner wall of the third installation groove 13 is opened with a third outlet 16, and three different outlets are used as air outlets for heat.

As shown in fig. 3, the main board structure 2 includes a first heat sink 21, a second heat sink 22, a main board 23, and a shielding cover 24, wherein the first heat sink 21 is disposed in the first mounting groove 11 and has a first heat dissipating hole corresponding to the first outlet 14, the second heat sink 22 is disposed in the second mounting groove 12 and has a second heat dissipating hole corresponding to the second outlet 15, and the main board 23 is disposed in the third mounting groove 13 and has a third heat dissipating hole corresponding to the third outlet 16.

Further, the first heat sink 21 and the second heat sink 22 are connected to both sides of the main board 23, respectively, and the shield cover 24 covers the surface of the main board 24.

As shown in fig. 3, the heat dissipation implementation manner of the first heat sink 21 and the second heat sink 22 may include a plurality of heat dissipation fins and a fan, the plurality of heat dissipation fins are uniformly arranged to form a plurality of rectangular holes, one end of each of the plurality of rectangular heat dissipation holes is communicated with the fan, and the other end of each of the plurality of rectangular heat dissipation holes abuts against the inner wall of the mounting groove.

Specifically, taking the first heat sink as an example, as shown in fig. 6, the first heat sink 21 includes a plurality of heat dissipation fins 212 and a fan 211, the plurality of heat dissipation fins 212 are uniformly arranged to form a plurality of rectangles, one end of the first heat dissipation hole 21 is communicated with the fan 211, and the other end is abutted to the first outlet 14 on the inner wall of the first mounting groove 11.

As shown in fig. 3 and 7, the main board structure 2 further includes a wiring board 25, the wiring board 25 has a plurality of first air inlet holes corresponding to the fan of the first heat sink 21, and the wiring board 25 has a plurality of second air inlet holes corresponding to the fan of the second heat sink 22.

Further, one end of the shielding cover 24 is provided with a plurality of third heat dissipation holes, the plurality of third heat dissipation holes are regularly arranged in a honeycomb shape, and the third heat dissipation holes are used for heat dissipation of other accessories and electrical components.

As shown in fig. 8 to 11, the first outlet 14 and the second outlet 15 have the same size and are larger than the third air outlet 16, the first outlet 14, the second outlet 15 and the third outlet 16 are divided by a frame established on the middle frame, and the frame may be made of any one of metal and plastic.

Further, as shown in fig. 4, a row of vent holes 17 are uniformly formed in the two end edges of the middle frame 1, the first outlet 14, the second outlet 15 and the third outlet 16 are respectively communicated with the vent holes 17, and the vent holes 17 communicate the middle frame 1 with the main board structure 2.

The utility model discloses a concrete work flow, first fresh air inlet on the wiring board 25, the second fresh air inlet is corresponding with first radiator 21 and second radiator 22, through fan 211's effect, the air is respectively at first mounting groove 11, second mounting groove 12 and third mounting groove 13 form the convection current, and take CPU on the mainboard, the heat of production such as display card and relevant electrical components, respectively through first export 14, second export 15 and third export 16, the outside of all-in-one computer is arranged to last one row of air vent 17 through center 1.

Divide into three independent mounting groove through holding the chamber with in the center 1 like this to correspond and be provided with fresh air inlet and gas outlet, install different electrical components in the mainboard structure 2 at the mounting groove again, divide regional the discharge with the heat that mainboard structure 2 produced, can avoid the heat at all-in-one computer backshell mesocycle, still avoided offering the louvre of a large amount in a plurality of regions on backshell surface.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention.

Claims

1. The utility model provides an all-in-one subregion heat radiation structure which characterized in that includes:

2. The all-in-one machine partition heat dissipation structure of claim 1, wherein the first heat sink and the second heat sink respectively comprise a plurality of heat dissipation fins and fans, the plurality of heat dissipation fins are uniformly arranged to form a plurality of rectangular holes, one ends of the plurality of rectangular holes are communicated with the fans, and the other ends of the plurality of rectangular holes are abutted to the inner walls of the mounting grooves.

3. The all-in-one zoned heat dissipation structure of claim 2, wherein the motherboard structure further comprises a terminal block, the terminal block defining a first plurality of air inlet openings with respect to the fan of the first heat sink, the terminal block defining a second plurality of air inlet openings with respect to the fan of the second heat sink.

4. The all-in-one machine zoned heat dissipation structure of claim 3, wherein the third heat dissipation holes are formed at an end of the shielding case away from the wiring board, and a plurality of the third heat dissipation holes are regularly arranged in a honeycomb shape.

5. The all-in-one machine partition heat dissipation structure of claim 1, wherein the first outlet and the second outlet are the same in size and larger than the third outlet, and the first outlet, the second outlet and the third outlet are partitioned by a frame established on the middle frame.

6. The all-in-one machine partition heat dissipation structure of claim 5, wherein a row of vent holes are uniformly formed in the edges of the two ends of the middle frame, and the first outlet, the second outlet and the third outlet are respectively communicated with the vent holes.